CN112859512A - Mask plate and manufacturing method thereof - Google Patents
Mask plate and manufacturing method thereof Download PDFInfo
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- CN112859512A CN112859512A CN202110166568.0A CN202110166568A CN112859512A CN 112859512 A CN112859512 A CN 112859512A CN 202110166568 A CN202110166568 A CN 202110166568A CN 112859512 A CN112859512 A CN 112859512A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 29
- 238000005323 electroforming Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 22
- 238000002679 ablation Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 14
- 229910017305 Mo—Si Inorganic materials 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- YHOAAZUHLXRENI-UHFFFAOYSA-N [O-2].[Fe+2].[Mo+4].[O-2].[O-2] Chemical compound [O-2].[Fe+2].[Mo+4].[O-2].[O-2] YHOAAZUHLXRENI-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910021344 molybdenum silicide Inorganic materials 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
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- General Physics & Mathematics (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention belongs to the technical field of mask plates, and particularly relates to a mask plate and a manufacturing method thereof, wherein the mask plate comprises a mask plate body, a mask plate frame and a mask plate substrate, the mask plate substrate is stacked at the back of the mask plate body, the mask plate substrate is bonded with the mask plate body, a sticking strip is embedded in the side edge of the mask plate body, and the mask plate body is bonded with the mask plate frame through the sticking strip; the mask plate frame is divided into a first preparation area and a second preparation area, the length of the first preparation area and the length of the second preparation area are larger than the width of the first preparation area and the second preparation area, and calibration patterns are engraved on the first preparation area and the second preparation area. Has the advantages that: the mask plate welding device has better controllability when the mask plate is subjected to net stretching and welding, so that the defective rate of the mask plate during operation is integrally reduced.
Description
Technical Field
The invention belongs to the technical field of masks, and particularly relates to a mask and a manufacturing method thereof.
Background
The organic light-emitting layer is generally divided into macromolecular organic materials and micromolecular organic materials, and in the process of manufacturing an organic light-emitting device by using a vacuum evaporation method, an evaporation mold-a mask plate is required to be used as a medium for carrying out evaporation of organic light-emitting pixel patterns, the mask plate is generally made of metal or metal alloy, commonly used invar alloy, and mainly comprises a mask body and a mask plate frame, wherein the mask body is provided with corresponding OLED light-emitting patterns.
The in-process that the mask plate was made needs processes such as net opening and welding, and the structural strength and the precision of the in-process mask plate at net opening have great influence to subsequent structure, simultaneously because the difference of material makes the intensity and the actual life of welding bonding when it welds inequality, and the welding is bad can directly lead to the whole of mask plate to scrap, has improved the rejection rate.
Therefore, we propose a mask and a method for making the same to solve the above problems.
Disclosure of Invention
The invention aims to solve the problems and provides a mask plate capable of reducing the defective rate in operation and a manufacturing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme: a mask plate comprises a mask plate body, a mask plate frame and a mask plate substrate, wherein the mask plate substrate is stacked on the back of the mask plate body, the mask plate substrate is bonded with the mask plate body, a strip is embedded in the side edge of the mask plate body, and the mask plate body is bonded with the mask plate frame through the strip;
the mask plate frame is divided into a first preparation area and a second preparation area, the length of the first preparation area and the length of the second preparation area are larger than the width of the first preparation area and the width of the second preparation area, and calibration patterns are engraved on the first preparation area and the second preparation area.
In the mask plate, the mask plate body comprises three layers, namely a middle layer, a substrate layer and a conducting layer, wherein the middle layer, the substrate layer and the conducting layer are sequentially overlapped, a covering layer is arranged on the top of the middle layer, the thickness of the covering layer is 2.0-3.5nm, and the conducting layer is 60.0-90.0 nm.
In the mask plate, the middle layer is composed of 35-45 layers of sheet plates, the sheet plates are made of Mo-Si materials, and the total thickness of the middle layer is controlled to be 24.8nm-32.0 nm.
In the mask plate, the sticking strip is embedded in the center of the side edge of the mask plate body and is arranged around the whole edge of the mask plate body.
In the mask plate, the width ratio of the first preparation area to the second preparation area is 2: 1.
In the mask plate, the calibration pattern is a plurality of calibration point groups, each calibration point group comprises two calibration points, and the depth of each calibration point is 1.0-2.0 nm.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the frame of the mask plate is gradually attached to and aligned with the mask plate body from top to bottom, and welding bonding is carried out through the attaching strips;
s2, pressing and flattening: pressing, flattening and aligning the upper end face of the whole attaching body of the mask plate body and the mask plate frame in the S1;
s3, template splicing: butting the mask plate body with an electroforming template, coating an ablation material layer, continuously exposing the ablation material layer, and then electroforming;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
In the manufacturing method of the mask plate, a cathode sheet and an anode sheet are arranged in the electroforming template, a closed module is arranged on the cathode sheet and the anode sheet, a plurality of electrifying holes are formed in the closed module, the electrifying holes are in a protruding taper hole shape, and the electrifying holes are respectively arranged at the edges of the upper end and the lower end of the closed module.
In the manufacturing method of the mask plate, the continuous exposure time is 1-3s, and the exposure times are 1-3.
In the manufacturing method of the mask plate, the through holes on the two groups of closed modules are identical in position and correspond to each other, and the ratio of the small aperture to the large aperture of the conical through holes is 1: 3.
Compared with the prior art, the mask plate and the manufacturing method thereof have the advantages that:
the invention can synchronously select by combining the electroforming method and the welding method, thereby enabling the mask plate to select different processing modes according to requirements in the processing process, and simultaneously utilizing the first preparation area and the second preparation area on the strip and the frame of the mask plate to preferentially achieve a calibration effect, thereby enabling the mask plate to have higher precision no matter the mask plate is operated by the welding or electroforming method, and enabling the mask plate to improve the yield when the mask plate is produced.
Drawings
FIG. 1 is a schematic structural diagram of a mask according to the present invention;
FIG. 2 is a cross-sectional view of the intermediate and substrate layers of FIG. 1;
FIG. 3 is a schematic top view of the mask frame of FIG. 1;
FIG. 4 is a cross-sectional view of the intermediate layer of FIG. 1;
FIG. 5 is an enlarged view of a portion of FIG. 1 at A;
FIG. 6 is a schematic flow chart of a mask manufacturing method according to the present invention.
In the figure, 1 a mask plate body, 2 mask plate frames, 3 mask plate substrates, 4 sticking strips, 5 a first preparation area, 6 a second preparation area, 7 a middle layer, 8 a substrate layer, 9 a conductive layer and 10 a covering layer.
Detailed Description
The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
Example 1
As shown in fig. 1 to 6, a mask comprises a mask body 1, a mask frame 2 and a mask substrate 3, wherein the mask substrate 3 is stacked on the back of the mask body 1, and the mask substrate 3 is of a frame structure and is attached to the edge close to the mask body 1.
The mask plate body 1 comprises three layers, namely a middle layer 7, a substrate layer 8 and a conducting layer 9, wherein the middle layer 7, the substrate layer 8 and the conducting layer 9 are sequentially overlapped, a covering layer 10 is RU arranged on the top of the middle layer 7, an absorbing layer is covered on the upper end of the covering layer 10 and is AR-TaN, the thickness of the covering layer 10 is 2.0-3.5nm, the middle layer 7 is composed of 35 layers of plates, the plates are tightly adhered to one another, the plates are made of Mo-Si materials, the total thickness of the middle layer 7 is controlled to be 24.8nm, and the conducting layer 9 is 60.0-90.0 nm;
the mask plate base 3 is bonded with the mask plate body 1, a sticking strip 4 is embedded in the side edge of the mask plate body 1, the sticking strip 4 is embedded in the center of the side edge of the mask plate body 1, the sticking strip 4 is made of chromium film iron oxide molybdenum silicide silicon, the sticking strip and the mask plate body 1 are subjected to mutual insulation treatment and are arranged around the whole edge of the mask plate body 1, and the mask plate body 1 is bonded with the mask plate frame 2 through the sticking strip 4;
the mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6, the first preparation area 5 and the second preparation area 6 are used for calibration check, welding accuracy check can be conducted in the process of welding, then the mask plate is operated actually, the length of the first preparation area 5 and the length of the second preparation area 6 are larger than the width of the first preparation area 5 and the width of the second preparation area 6, calibration patterns are engraved on the first preparation area 5 and the second preparation area 6, the width ratio of the first preparation area 5 to the width of the second preparation area 6 is 2:1, the calibration patterns are a plurality of calibration point groups, each calibration point group comprises two calibration points, the depth of the calibration points is 1.0-2.0nm, and the accuracy of the welding points is matched through calibration calculation errors of the calibration points.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body 1 is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame 2 is gradually attached to and aligned with the mask plate body 1 from top to bottom, and welding bonding is carried out through the attaching strips 4;
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body 1 and the mask plate frame 2 in the step S1;
s3, template splicing: butt-jointing a mask plate body 1 with an electroforming template and coating an ablation material layer, wherein a cathode sheet and an anode sheet are arranged in the electroforming template, closed modules are arranged on the cathode sheet and the anode sheet, a plurality of power-on holes are formed in each closed module and are in a protruding conical hole shape, the power-on holes are respectively arranged at the edges of the upper end and the lower end of each closed module, the power-on holes in the two groups of closed modules are identical in position and correspond to each other, the ratio of the small aperture to the large aperture of each conical power-on hole is 1:3, then, the ablation material layer is subjected to continuous exposure for 1-3s, the exposure times are 1-3 times, and then, electroforming is carried out;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
Example 2
As shown in fig. 1 to 6, a mask comprises a mask body 1, a mask frame 2 and a mask substrate 3, wherein the mask substrate 3 is stacked on the back of the mask body 1, and the mask substrate 3 is of a frame structure and is attached to the edge close to the mask body 1.
The mask plate body 1 comprises three layers, namely a middle layer 7, a substrate layer 8 and a conducting layer 9, wherein the middle layer 7, the substrate layer 8 and the conducting layer 9 are sequentially overlapped, a covering layer 10 is RU arranged on the top of the middle layer 7, an absorbing layer is covered on the upper end of the covering layer 10 and is AR-TaN, the thickness of the covering layer 10 is 2.0-3.5nm, the middle layer 7 is composed of 38-layer plates, the plates are tightly adhered to each other, the plates are made of Mo-Si materials, the total thickness of the middle layer 7 is controlled to be 27.0nm, and the conducting layer 9 is 60.0-90.0 nm;
the mask plate base 3 is bonded with the mask plate body 1, a sticking strip 4 is embedded in the side edge of the mask plate body 1, the sticking strip 4 is embedded in the center of the side edge of the mask plate body 1, the sticking strip 4 is made of chromium film iron oxide molybdenum silicide silicon, the sticking strip and the mask plate body 1 are subjected to mutual insulation treatment and are arranged around the whole edge of the mask plate body 1, and the mask plate body 1 is bonded with the mask plate frame 2 through the sticking strip 4;
the mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6, the first preparation area 5 and the second preparation area 6 are used for calibration check, welding accuracy check can be conducted in the process of welding, then the mask plate is operated actually, the length of the first preparation area 5 and the length of the second preparation area 6 are larger than the width of the first preparation area 5 and the width of the second preparation area 6, calibration patterns are engraved on the first preparation area 5 and the second preparation area 6, the width ratio of the first preparation area 5 to the width of the second preparation area 6 is 2:1, the calibration patterns are a plurality of calibration point groups, each calibration point group comprises two calibration points, the depth of the calibration points is 1.0-2.0nm, and the accuracy of the welding points is matched through calibration calculation errors of the calibration points.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body 1 is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame 2 is gradually attached to and aligned with the mask plate body 1 from top to bottom, and welding bonding is carried out through the attaching strips 4;
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body 1 and the mask plate frame 2 in the step S1;
s3, template splicing: butt-jointing a mask plate body 1 with an electroforming template and coating an ablation material layer, wherein a cathode sheet and an anode sheet are arranged in the electroforming template, closed modules are arranged on the cathode sheet and the anode sheet, a plurality of power-on holes are formed in each closed module and are in a protruding conical hole shape, the power-on holes are respectively arranged at the edges of the upper end and the lower end of each closed module, the power-on holes in the two groups of closed modules are identical in position and correspond to each other, the ratio of the small aperture to the large aperture of each conical power-on hole is 1:3, then, the ablation material layer is subjected to continuous exposure for 1-3s, the exposure times are 1-3 times, and then, electroforming is carried out;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
Example 3
As shown in fig. 1 to 6, a mask comprises a mask body 1, a mask frame 2 and a mask substrate 3, wherein the mask substrate 3 is stacked on the back of the mask body 1, and the mask substrate 3 is of a frame structure and is attached to the edge close to the mask body 1.
The mask plate body 1 comprises three layers, namely a middle layer 7, a substrate layer 8 and a conducting layer 9, wherein the middle layer 7, the substrate layer 8 and the conducting layer 9 are sequentially overlapped, a covering layer 10 is RU arranged on the top of the middle layer 7, an absorbing layer is covered on the upper end of the covering layer 10 and is AR-TaN, the thickness of the covering layer 10 is 2.0-3.5nm, the middle layer 7 is composed of 40 layers of plates, the plates are tightly adhered to each other, the plates are made of Mo-Si materials, the total thickness of the middle layer 7 is controlled to be 28.4nm, and the conducting layer 9 is 60.0-90.0 nm;
the mask plate base 3 is bonded with the mask plate body 1, a sticking strip 4 is embedded in the side edge of the mask plate body 1, the sticking strip 4 is embedded in the center of the side edge of the mask plate body 1, the sticking strip 4 is made of chromium film iron oxide molybdenum silicide silicon, the sticking strip and the mask plate body 1 are subjected to mutual insulation treatment and are arranged around the whole edge of the mask plate body 1, and the mask plate body 1 is bonded with the mask plate frame 2 through the sticking strip 4;
the mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6, the first preparation area 5 and the second preparation area 6 are used for calibration check, welding accuracy check can be conducted in the process of welding, then the mask plate is operated actually, the length of the first preparation area 5 and the length of the second preparation area 6 are larger than the width of the first preparation area 5 and the width of the second preparation area 6, calibration patterns are engraved on the first preparation area 5 and the second preparation area 6, the width ratio of the first preparation area 5 to the width of the second preparation area 6 is 2:1, the calibration patterns are a plurality of calibration point groups, each calibration point group comprises two calibration points, the depth of the calibration points is 1.0-2.0nm, and the accuracy of the welding points is matched through calibration calculation errors of the calibration points.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body 1 is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame 2 is gradually attached to and aligned with the mask plate body 1 from top to bottom, and welding bonding is carried out through the attaching strips 4;
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body 1 and the mask plate frame 2 in the step S1;
s3, template splicing: butt-jointing a mask plate body 1 with an electroforming template and coating an ablation material layer, wherein a cathode sheet and an anode sheet are arranged in the electroforming template, closed modules are arranged on the cathode sheet and the anode sheet, a plurality of power-on holes are formed in each closed module and are in a protruding conical hole shape, the power-on holes are respectively arranged at the edges of the upper end and the lower end of each closed module, the power-on holes in the two groups of closed modules are identical in position and correspond to each other, the ratio of the small aperture to the large aperture of each conical power-on hole is 1:3, then, the ablation material layer is subjected to continuous exposure for 1-3s, the exposure times are 1-3 times, and then, electroforming is carried out;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
Example 4
As shown in fig. 1 to 6, a mask comprises a mask body 1, a mask frame 2 and a mask substrate 3, wherein the mask substrate 3 is stacked on the back of the mask body 1, and the mask substrate 3 is of a frame structure and is attached to the edge close to the mask body 1.
The mask plate body 1 comprises three layers, namely a middle layer 7, a substrate layer 8 and a conducting layer 9, wherein the middle layer 7, the substrate layer 8 and the conducting layer 9 are sequentially overlapped, a covering layer 10 is RU arranged on the top of the middle layer 7, an absorbing layer is covered on the upper end of the covering layer 10 and is AR-TaN, the thickness of the covering layer 10 is 2.0-3.5nm, the middle layer 7 is composed of 40 layers of plates, the plates are tightly adhered to each other, the plates are made of Mo-Si materials, the total thickness of the middle layer 7 is controlled to be 30.0nm, and the conducting layer 9 is 60.0-90.0 nm;
the mask plate base 3 is bonded with the mask plate body 1, a sticking strip 4 is embedded in the side edge of the mask plate body 1, the sticking strip 4 is embedded in the center of the side edge of the mask plate body 1, the sticking strip 4 is made of chromium film iron oxide molybdenum silicide silicon, the sticking strip and the mask plate body 1 are subjected to mutual insulation treatment and are arranged around the whole edge of the mask plate body 1, and the mask plate body 1 is bonded with the mask plate frame 2 through the sticking strip 4;
the mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6, the first preparation area 5 and the second preparation area 6 are used for calibration check, welding accuracy check can be conducted in the process of welding, then the mask plate is operated actually, the length of the first preparation area 5 and the length of the second preparation area 6 are larger than the width of the first preparation area 5 and the width of the second preparation area 6, calibration patterns are engraved on the first preparation area 5 and the second preparation area 6, the width ratio of the first preparation area 5 to the width of the second preparation area 6 is 2:1, the calibration patterns are a plurality of calibration point groups, each calibration point group comprises two calibration points, the depth of the calibration points is 1.0-2.0nm, and the accuracy of the welding points is matched through calibration calculation errors of the calibration points.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body 1 is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame 2 is gradually attached to and aligned with the mask plate body 1 from top to bottom, and welding bonding is carried out through the attaching strips 4;
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body 1 and the mask plate frame 2 in the step S1;
s3, template splicing: butt-jointing a mask plate body 1 with an electroforming template and coating an ablation material layer, wherein a cathode sheet and an anode sheet are arranged in the electroforming template, closed modules are arranged on the cathode sheet and the anode sheet, a plurality of power-on holes are formed in each closed module and are in a protruding conical hole shape, the power-on holes are respectively arranged at the edges of the upper end and the lower end of each closed module, the power-on holes in the two groups of closed modules are identical in position and correspond to each other, the ratio of the small aperture to the large aperture of each conical power-on hole is 1:3, then, the ablation material layer is subjected to continuous exposure for 1-3s, the exposure times are 1-3 times, and then, electroforming is carried out;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
Example 5
As shown in fig. 1 to 6, a mask comprises a mask body 1, a mask frame 2 and a mask substrate 3, wherein the mask substrate 3 is stacked on the back of the mask body 1, and the mask substrate 3 is of a frame structure and is attached to the edge close to the mask body 1.
The mask plate body 1 comprises three layers, namely a middle layer 7, a substrate layer 8 and a conducting layer 9, wherein the middle layer 7, the substrate layer 8 and the conducting layer 9 are sequentially overlapped, a covering layer 10 is RU arranged on the top of the middle layer 7, an absorbing layer is covered on the upper end of the covering layer 10 and is AR-TaN, the thickness of the covering layer 10 is 2.0-3.5nm, the middle layer 7 is composed of 42 layers of sheet plates, the sheet plates are tightly adhered to one another, the sheet plates are made of Mo-Si materials, the total thickness of the middle layer 7 is controlled to be 32.0nm, and the conducting layer 9 is 60.0-90.;
the mask plate base 3 is bonded with the mask plate body 1, a sticking strip 4 is embedded in the side edge of the mask plate body 1, the sticking strip 4 is embedded in the center of the side edge of the mask plate body 1, the sticking strip 4 is made of chromium film iron oxide molybdenum silicide silicon, the sticking strip and the mask plate body 1 are subjected to mutual insulation treatment and are arranged around the whole edge of the mask plate body 1, and the mask plate body 1 is bonded with the mask plate frame 2 through the sticking strip 4;
the mask plate frame 2 is divided into a first preparation area 5 and a second preparation area 6, the first preparation area 5 and the second preparation area 6 are used for calibration check, welding accuracy check can be conducted in the process of welding, then the mask plate is operated actually, the length of the first preparation area 5 and the length of the second preparation area 6 are larger than the width of the first preparation area 5 and the width of the second preparation area 6, calibration patterns are engraved on the first preparation area 5 and the second preparation area 6, the width ratio of the first preparation area 5 to the width of the second preparation area 6 is 2:1, the calibration patterns are a plurality of calibration point groups, each calibration point group comprises two calibration points, the depth of the calibration points is 1.0-2.0nm, and the accuracy of the welding points is matched through calibration calculation errors of the calibration points.
A manufacturing method of a mask plate comprises the following steps:
s1, combining and connecting: the mask plate body 1 is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame 2 is gradually attached to and aligned with the mask plate body 1 from top to bottom, and welding bonding is carried out through the attaching strips 4;
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body 1 and the mask plate frame 2 in the step S1;
s3, template splicing: butt-jointing a mask plate body 1 with an electroforming template and coating an ablation material layer, wherein a cathode sheet and an anode sheet are arranged in the electroforming template, closed modules are arranged on the cathode sheet and the anode sheet, a plurality of power-on holes are formed in each closed module and are in a protruding conical hole shape, the power-on holes are respectively arranged at the edges of the upper end and the lower end of each closed module, the power-on holes in the two groups of closed modules are identical in position and correspond to each other, the ratio of the small aperture to the large aperture of each conical power-on hole is 1:3, then, the ablation material layer is subjected to continuous exposure for 1-3s, the exposure times are 1-3 times, and then, electroforming is carried out;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
Table one: influence of number and thickness of intermediate layers on connection strength
| Group of | Number of intermediate layers | Thickness of | Strength of connection | Yield of |
| 1 | 35 | 24.8nm | 121％ | 98.8％ |
| 2 | 38 | 27.0nm | 127％ | 99.1％ |
| 3 | 40 | 28.4nm | 134％ | 98.0％ |
| 4 | 40 | 30.0nm | 151％ | 99.3％ |
| 5 | 42 | 32.0nm | 167％ | 99.8％ |
From the above experimental data, the mask connection structure obtained under the parameters of example 5 has the best strength and the highest yield.
Although the terms mask body 1, mask frame 2, mask substrate 3, strip 4, first preparation area 5, second preparation area 6, intermediate layer 7, substrate layer 8, conductive layer 9, cover layer 10, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (10)
1. A mask plate comprises a mask plate body (1), a mask plate frame (2) and a mask plate substrate (3), wherein the mask plate substrate (3) is stacked at the back of the mask plate body (1), and is characterized in that the mask plate substrate (3) is bonded with the mask plate body (1), a strip (4) is embedded in the side edge of the mask plate body (1), and the mask plate body (1) is bonded with the mask plate frame (2) through the strip (4);
mask plate frame (2) is gone up to be divided into first preparation district (5) and second preparation district (6), first preparation district (5) and second preparation district (6) length are greater than its width, be carved with the calibration pattern on first preparation district (5) and the second preparation district (6).
2. A mask according to claim 1, wherein the mask body (1) comprises three layers, namely a middle layer (7), a substrate layer (8) and a conductive layer (9), the middle layer (7), the substrate layer (8) and the conductive layer (9) are sequentially stacked, a covering layer (10) is arranged on the top of the middle layer (7), the thickness of the covering layer (10) is 2.0-3.5nm, and the conductive layer (9) is 60.0-90.0 nm.
3. A mask according to claim 2, wherein the intermediate layer (7) is composed of 35-45 layers of sheet plates, the sheet plates are made of Mo-Si material, and the total thickness of the intermediate layer (7) is controlled to be 24.8nm-32.0 nm.
4. A mask plate according to claim 1, wherein the attachment strip (4) is embedded in the center of the side edge of the mask plate body (1) and arranged around the whole edge of the mask plate body (1).
5. A mask according to claim 1, wherein the first preparation area (5) and the second preparation area (6) have a width ratio of 2: 1.
6. A mask according to claim 5, wherein the calibration pattern is a plurality of calibration dot groups, each calibration dot group includes two calibration dots, and the depth of the calibration dots is 1.0-2.0 nm.
7. A manufacturing method of a mask plate is applied to the manufacturing method of the mask plate of any one of claims 1 to 6, and is characterized by comprising the following steps:
s1, combining and connecting: the mask plate body (1) is tiled and clamped, the clamping position is located at the bottommost part of the mask plate body, the mask plate frame (2) is gradually attached to and aligned with the mask plate body (1) from top to bottom, and welding and bonding are carried out through the attaching strips (4);
s2, pressing and flattening: pressing, flattening and aligning the upper end faces of the whole attaching body of the mask plate body (1) and the mask plate frame (2) in the step S1;
s3, template splicing: butting the mask plate body (1) with an electroforming template, coating an ablation material layer, continuously exposing the ablation material layer, and then electroforming;
s4, splitting: and separating the electroforming layer from the electroforming template in the step S3 to obtain the mask plate.
8. A manufacturing method of a mask according to claim 7, wherein a cathode plate and an anode plate are arranged in the electroforming template, a closed module is arranged on the cathode plate and the anode plate, a plurality of power-on holes are formed in the closed module, the power-on holes are in a protruding taper hole shape, and the power-on holes are respectively arranged at the edges of the upper end and the lower end of the closed module.
9. A manufacturing method of a mask according to claim 7, wherein the duration of exposure is 1-3s, and the number of exposures is 1-3.
10. A manufacturing method of a mask according to claim 8, wherein the through holes on the two groups of closing modules are identical in position and correspond to each other, and the ratio of the small aperture to the large aperture of the tapered through holes is 1: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110166568.0A CN112859512A (en) | 2021-02-04 | 2021-02-04 | Mask plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110166568.0A CN112859512A (en) | 2021-02-04 | 2021-02-04 | Mask plate and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN112859512A true CN112859512A (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110166568.0A Pending CN112859512A (en) | 2021-02-04 | 2021-02-04 | Mask plate and manufacturing method thereof |
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| CN (1) | CN112859512A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103171247A (en) * | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Method for electrotyping electrode printing mask plate of solar battery |
| CN109652759A (en) * | 2017-10-12 | 2019-04-19 | 上海和辉光电有限公司 | A kind of production method and metal mask plate of metal mask plate |
| CN109811301A (en) * | 2017-11-22 | 2019-05-28 | 麦克赛尔控股株式会社 | Deposition mask and its manufacturing method |
| KR20200045385A (en) * | 2018-10-22 | 2020-05-04 | 주식회사 오럼머티리얼 | Producing method of mask, producing method of template for supporting mask and producing method of mask integrated frame |
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2021
- 2021-02-04 CN CN202110166568.0A patent/CN112859512A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103171247A (en) * | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Method for electrotyping electrode printing mask plate of solar battery |
| CN109652759A (en) * | 2017-10-12 | 2019-04-19 | 上海和辉光电有限公司 | A kind of production method and metal mask plate of metal mask plate |
| CN109811301A (en) * | 2017-11-22 | 2019-05-28 | 麦克赛尔控股株式会社 | Deposition mask and its manufacturing method |
| KR20200045385A (en) * | 2018-10-22 | 2020-05-04 | 주식회사 오럼머티리얼 | Producing method of mask, producing method of template for supporting mask and producing method of mask integrated frame |
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