KR20190096578A - Method for separating mask adhere to frame - Google Patents

Abstract

The present invention relates to a method of separating a mask adhered to a frame. The method of separating the mask adhered to the frame according to the present invention comprises: a step (a) of providing a frame-integrated mask (100, 200) in which a mask (100) is adhered to at least a part of the upper part of a frame (200) including a border frame part (210) and a mask cell sheet part (200) having a plurality of mask cell regions (CR) and connected to the border frame part (210); a step (b) of pressing the outer part on at least one edge (102a) of the adhered mask (100a); and a step (c) of applying external force (SP) to the one edge (102a) of the mask (100a) and separating the mask (100) from the frame (200). It is possible to separate and replace the mask easily.

Description

How to detach the mask bonded to the frame {METHOD FOR SEPARATING MASK ADHERE TO FRAME}

The present invention relates to a method of detaching a mask adhered to a frame. More specifically, the present invention relates to a method of detaching a mask adhered to a frame, which can prevent deformation of the frame in the process of removing and replacing the mask from the frame.

Recently, studies on electroforming methods have been underway in thin plate manufacturing. The electroplating method is to immerse the positive electrode and the negative electrode in the electrolyte, and to apply the power to electrodeposit the metal thin plate on the surface of the negative electrode, it is possible to manufacture the ultra-thin plate, it is a method that can be expected to mass production.

Meanwhile, as a technology of forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method of depositing an organic material at a desired position by closely attaching a thin metal mask to a substrate is mainly used.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the large area has a problem that the mask is struck or warped by load.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛. It has a resolution of. As such, considering the pixel size of the ultra-high-definition OLED, the alignment error between each cell should be reduced to several μm, and the error beyond this may lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

On the other hand, if the mask is not fixed in some alignment, or if a defect occurs in the mask, the mask has to be separated, but there was a problem that the alignment of the other mask in the process of removing and replacing the welded mask.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, the mask is bonded to the frame that can facilitate the separation and replacement of the mask in the frame-integrated mask in which the mask and the frame form an integral structure It is an object to provide a separation method.

It is also an object of the present invention to provide a method of detaching a mask adhered to a frame, which can prevent deformation of the frame and the like and to make the alignment clear.

The above object of the present invention is a method of separating a mask adhered to a frame, comprising: (a) a mask cell sheet portion having a border frame portion and a plurality of mask cell regions and connected to the border frame portion; Providing a frame-integrated mask having a mask adhered to at least a portion thereof; (b) pressing the outer portion of at least one edge of the bonded mask; And (c) detaching the mask from the frame by applying an external force to one edge of the mask.

The mask cell sheet unit may include a plurality of mask cell regions in at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet portion includes an edge sheet portion; At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion, and both ends connected to the edge sheet portion.

Each mask may correspond to each mask cell region.

The mask includes a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell, and at least a part of the dummy may be adhered to the mask cell sheet portion.

The mask includes one mask cell, and each mask may correspond to each mask cell region of the mask cell sheet portion.

The mask may include a plurality of mask cells, and each mask may correspond to each mask cell region of the mask cell sheet part.

In step (b), the upper surface and the lower surface of the mask cell sheet portion disposed outside the one edge of the mask may be compressed.

The upper surface of the edge of the mask cell sheet portion corresponding to the one edge of the mask may be pressed with the pressing bar.

The support formed on the upper surface of the frame support groove corresponding to the frame shape may be disposed under the frame.

In step (a), the dummy of the mask is welded to the upper portion of the mask cell sheet to bond the mask to the frame.In step (c), one edge of the mask is removed from the frame by applying an external force to one edge of the mask. The mask can be detached from the frame while applying the external force to the other edge opposite the one side of the mask to remove the other edge from the frame.

In step (a), the mask is adhered to the frame via an adhesive portion comprising an alloy of at least two metals, and in step (c), at least one of a predetermined temperature and a predetermined pressure may be applied to the adhesive portion in addition to the external force. have.

 In step (c), at least a portion of the bond can change from a solid phase to a liquid phase.

In step (a), the mask is adhered to the frame by means of an adhesive plating, and in step (c), one side edge of the mask is removed from the frame by applying an external force to one edge of the mask, and then the other side facing one side of the mask. The mask can be detached from the frame while the other edge is removed from the frame by applying external force to the edge.

According to the present invention configured as described above, there is an effect that can facilitate the separation and replacement of the mask in the frame-integrated mask in which the mask and the frame form an integral structure.

In addition, according to the present invention, there is an effect that can prevent the deformation, such as distortion of the frame and to clarify the alignment.

1 is a schematic view showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of adhering a conventional mask to a frame.
3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing the tension form of the mask and the state in which the mask corresponds to the cell region of the frame according to an embodiment of the present invention.
9 is a schematic diagram illustrating a process of bonding a mask according to an embodiment of the present invention corresponding to a cell region of a frame.
10 is a partially enlarged cross-sectional view illustrating a form in which a mask is adhered to a frame according to various embodiments of the present disclosure.
11 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
12 is a schematic diagram illustrating a process of separating a mask from a frame integrated mask according to an embodiment of the present invention.
13 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to another embodiment of the present invention.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 is a schematic diagram showing a conventional mask for depositing OLED pixels 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick type or a plate type. The mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.

2 is a schematic diagram illustrating a process of adhering the mask 10 to the frame 20. 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2). A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 should be flattened. The stick mask 10 is unfolded by applying tensile forces F1 to F2 in the major axis direction of the stick mask 10. In this state, the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape. The cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20. The frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2 (c) shows the side surface of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3, in spite of finely adjusting the tensile force F1 to F2 applied to each side of the stick mask 10, there is a problem in that the alignment of the mask cells C1 to C3 is not good. For example, the distances D1 to D1 ″ and D2 to D2 ″ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3. The stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6, and has a very thin thickness of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that each cell (C1 ~ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to align perfectly so that the error is 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 10 and the plurality of cells C of the stick masks 10 while connecting the plurality of stick masks 10 of about 6 to 20 to each of the frames 20, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

Thus, the present invention proposes a frame 200 and a frame integrated mask that allow the mask 100 to form an integrated structure with the frame 200. The mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.

4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) which show a frame.

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been adhered to.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone. In order to form a thin thickness, the mask 100 may be formed by electroforming. The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The thickness of the mask may be formed to about 2 to 50㎛.

The frame 200 is formed to bond the plurality of masks 100. The frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area to which the mask 100 is to be bonded on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. Preferably, the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210. Like the mask 100, the mask cell sheet part 220 may be formed by electroplating, or may be formed using another film forming process. In addition, the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing or etching on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210. In the present specification, a plurality of mask cell regions CR are first formed in the mask cell sheet unit 220 and then connected to the edge frame unit 210.

The mask cell sheet part 220 may include at least one of the edge sheet part 221 and the first and second grid sheet parts 223 and 225. The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes the plurality of first grid sheet portions 223, each of the first grid sheet portions 223 may be equally spaced apart.

In addition, in addition, the second grid sheet part 225 may be formed to extend in a second direction (vertical direction). The second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has an equal interval.

Meanwhile, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C. FIG.

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the cross section perpendicular to the longitudinal direction has a rectangular shape such as a rectangle and a parallelogram [Fig. 5 (b). And FIG. 10], a triangular shape, and the like, and some edges and edges may be partially rounded. The cross-sectional shape is adjustable in the process of laser scribing, etching and the like.

The thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, a process of manufacturing a substantially thick sheet is difficult, and if it is too thick, a path through which the organic source 600 (see FIG. 10) passes through the mask 100 in an OLED pixel deposition process is used. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet part 220 is thinner than the thickness of the edge frame part 210, but preferably thicker than the mask 100. The mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm. In addition, the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C in which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have. The dummy may include only the mask layer 110 or the mask layer 110 in which a predetermined dummy pattern having a similar shape to the mask pattern P is formed. The mask cell C may correspond to the mask cell region CR of the frame 200, and part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.

Hereinafter, a process of manufacturing the frame integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, an edge frame unit 210 is provided. The edge frame portion 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet unit 220 may be manufactured by fabricating a planar sheet using pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. have. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210. In the corresponding process, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 to the edge sheet part 221 to the border frame part 210. It can respond. On one side, the mask cell sheet portion 220 may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 6B). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral directions.

Next, when the mask cell sheet part 220 corresponds to the edge frame part 210, the edge cell part 221 of the mask cell sheet part 220 may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the edge sheet portion 221. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot form, and may have the same material as the mask cell sheet portion 220 and integrate the edge frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the edge frame part 210. However, the embodiment of FIG. After adhesion to 210, a mask cell region CR is formed.

First, as shown in FIG. 6A, the edge frame part 210 including the hollow area R is provided.

Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet portion 220 ′) may correspond to the edge frame portion 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the corresponding process, all sides of the mask cell sheet part 220 'may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened. On one side, the mask cell sheet portion 220 'may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 ′ corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220 ′ may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot shape, and may have the same material as the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. When the mask cell region CR is formed, the portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet part 220 having the sheet part 225 may be configured.

6 and 7 illustrate an embodiment in which the edge frame portion 210 and the mask cell sheet portion 220 are bonded by welding (W), but are not necessarily limited thereto, and will be described later in FIG. 10. Adhesion may be performed by a method using a tick adhesive part EM, an electroplating part 150, and other organic / inorganic adhesives.

FIG. 8 illustrates a state in which the mask 100 is tensioned (FIG. 8A) and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention (FIG. 8). (b)] is a schematic diagram.

Next, a mask 100 having a plurality of mask patterns P may be provided. As described above, it is possible to manufacture a mask 100 made of Invar and Super Invar using a pre-plating method, and one cell C may be formed in the mask 100.

The mother plate used as a cathode in electroplating is made of a conductive material. As the conductive material, in the case of metal, metal oxides may be formed on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to the defect, a uniform electric field may not be applied to the cathode body of the above-described material, so that a part of the plating film (mask 100) may be unevenly formed.

Non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. Since the pattern width of the FMM and the shadow mask can be formed in the size of several to several tens of micrometers, preferably smaller than 30 micrometers, even a defect of several micrometers is large enough to occupy a large proportion in the pattern size of the mask.

In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Therefore, the present invention can use a mother plate (or a negative electrode body) made of a single crystal silicon material. In order to have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

Since the doped single crystal silicon is free from defects, there is an advantage in that a uniform plating film (mask 100) can be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel. In addition, since an additional process of eliminating and eliminating defects does not have to be performed, process costs are reduced and productivity is improved.

In addition, according to the use of the silicon substrate, there is an advantage that the insulating portion can be formed only by a process of oxidizing and nitriding the surface of the mother substrate as needed. The insulating portion may be formed using a photoresist. Electrodeposition of the plating film (mask 100) is prevented in the part in which the insulation part was formed, and a pattern (mask pattern P) is formed in a plating film.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the mask cell regions CR11 to CR56, respectively. ) Can also be provided in plurality.

Referring to FIG. 8A, the mask 100 may correspond to one mask cell region CR of the frame 200. As shown in FIG. 8A, in the corresponding process, both sides of the mask 100 are stretched along the uniaxial direction of the mask 100 to form the mask cell C in a flat state. ) May correspond to the mask cell region CR. On one side, the mask 100 may be grasped and tensioned by several points (eg, 1 to 3 points in FIG. 8). In addition, not only one axis but also all sides of the mask 100 can be stretched F1 to F4 along all the axial directions.

For example, the tensile force applied on each side of the mask 100 may not exceed 4N. The tensile force applied according to the size of the mask 100 may be the same or different. In other words, since the mask 100 of the present invention has a size including one mask cell C, the tensile force required is the same as that of the conventional stick mask 10 including the plurality of cells C1 to C6. At least, it is likely to shrink. Considering that 9.8 N means a gravity force of 1 kg, since 1 N is a force less than 400 g of gravity force, even if the mask 100 is attached to the frame 200 after the mask 100 is tensioned, the mask 100 remains in the frame 200. The tension applied to the mask or, conversely, the tension applied by the frame 200 to the mask 100 is very small. Thus, deformation of the mask 100 and / or the frame 200 due to tension may be minimized to minimize alignment errors of the mask 100 (or mask pattern P).

In addition, since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 of FIG. 1 has a long length, whereas the mask 100 of the present invention includes one cell C to have a short length. As a result, the degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention According to the reduction of the relative length (corresponding to the reduction of the number of cells (C)) may be 1 / n of the above error range. For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced by 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 is within a range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells as possible.

While the mask 100 is flat, the alignment force F1 to F4 may be adjusted to correspond to the mask cell region CR, and the alignment state may be confirmed in real time through a microscope. In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state checked, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. Compared with the conventional method (see FIG. 2), the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and simultaneously confirming the alignment of the six cells C1 to C6.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 steps of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56, respectively, results in six cells (C1). 5 masks 10 (see FIG. 2 (a)) each comprising ˜C6) may appear much higher than the conventional product yield in five steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is much more cumbersome and difficult, the product yield is low.

Meanwhile, after the mask 100 corresponds to the frame 200, the mask 100 may be temporarily fixed to the frame 200 through a predetermined adhesive. Thereafter, the bonding step of the mask 100 may be performed.

9 is a schematic diagram illustrating a process of bonding the mask 100 according to an embodiment of the present invention corresponding to the cell region CR of the frame 200. FIG. 10 is a cross-sectional view taken along line B-B 'of FIG. 9, and is a partially enlarged cross-sectional view illustrating a form in which a mask 100 is adhered to a frame 200 (first grid sheet portion 223) according to various embodiments of the present disclosure.

Next, referring to FIGS. 9 and 10 (a) and (b), some or all of the edges of the mask 100 may be attached to the frame 200. The adhesion can be carried out by welding W, preferably by laser welding W. The welded portion W may have the same material as the mask 100 / frame 200 and be integrally connected.

When the laser is irradiated onto the edge portion (or the dummy) of the mask 100, a portion of the mask 100 may be melted and welded to the frame 200. Welding (W) should be performed as close as possible to the edge of the frame 200 as possible to reduce the excited space between the mask 100 and the frame 200 as much as possible to increase the adhesion. The welding (W) part may be generated in the form of a line or a spot, and may be a medium having the same material as the mask 100 and integrally connecting the mask 100 and the frame 200. .

One edges of two neighboring masks 100 are bonded to the upper surface of the first grid sheet unit 223 (or the second grid sheet unit 225). The width and thickness of the first grid sheet portion 223 (or the second grid sheet portion 225) may be formed to about 1 to 5 mm, and to improve product productivity, the first grid sheet portion 223 [ Alternatively, it is necessary to reduce the width where the edges of the second grid sheet part 225 and the mask 100 overlap with each other as much as about 0.1 to 2.5 mm.

The shape of the cross section perpendicular to the length direction of the first and second grid sheet parts 223 and 225 may be a rectangle having a low height, a parallelogram, or the like.

The welding (W) method is only one method of adhering the mask 100 to the frame 200, but is not limited to this embodiment.

As another example, as shown in FIG. 10C, the mask 100 may be adhered to the frame 200 by using an adhesive part EM of a utero material. The adhesive part EM of the utero material is an adhesive including at least two metals, and may have various shapes such as a film, a line, and a bundle, and may have a thin thickness of about 10 to 30 μm. For example, the bonding portion EM of the eutectic material may include at least one metal from a group of In, Sn, Bi, Au, and the like, and a group of Sn, Bi, Ag, Zn, Cu, Sb, and Ge. . The eutectic adhesive EM comprises at least two metal solid phases, and at the eutectic point of a certain temperature / pressure both metal solid phases can be in liquid phase. . And beyond the eutectic point, it can again become two metallic solids. Accordingly, through the phase change of the solid phase-> liquid-> solid phase it can serve as an adhesive.

The eutectic adhesive (EM) does not contain any volatile organic materials unlike the general organic adhesive. Therefore, the volatile organic material of the adhesive reacts with the process gas to adversely affect the pixels of the OLED, or to prevent the adverse effects of outgassing of organic materials, such as organic materials included in the adhesive itself, contaminating the pixel processing chamber or deposited on the OLED pixels as impurities. You can do it. In addition, since the eutectic adhesive part EM is a solid, it is possible to have corrosion resistance without being cleaned by the OLED organic cleaning liquid. In addition, since it includes two or more metals, it can be connected to the mask 100, the frame 200, which is the same metal material as compared to the organic adhesive with high adhesiveness, and has a low possibility of deformation since it is a metal material.

As another example, as illustrated in FIG. 10D, the adhesive plating part 150 of the same material as the mask 100 may be further formed to adhere the mask 100 to the frame 200. After the mask 100 is made to correspond to the frame 200, an insulating part such as PR may be formed in the lower surface direction of the mask 100. In addition, the adhesive plating part 150 may be electrodeposited on the rear surface of the mask 100 and the frame 200 which are not covered by the insulating part.

While the adhesive plating unit 150 is electrodeposited on the exposed surface of the mask 100 and the frame 200, the adhesive plating unit 150 may be a medium for integrally connecting the mask 100 and the frame 200. At this time, since the adhesive plating unit 150 is integrally connected to the edge of the mask 100 and electrodeposited, the adhesive plating unit 150 may support the mask 100 in a state of applying a tensile force in an inner direction or an outer direction of the frame 200. Thus, the mask 100, which is pulled toward the frame 200, may be integrally formed with the frame 200 without the need of separately tensioning and aligning the mask.

In FIG. 10, for convenience of description, the thickness and width of the welded portion and the adhesive portion EM portion of the eutectic material are shown to be exaggerated. In fact, the portion is hardly protruded and is disposed on the mask 100. It may be a part connecting the frame 200 in the included state.

Next, when the process of adhering one mask 100 to the frame 200 is completed, the remaining masks 100 are sequentially corresponded to the remaining mask cells C, and the process of adhering to the frame 200 is repeated. can do. Since the mask 100 already adhered to the frame 200 may present a reference position, the time required to sequentially correspond the remaining masks 100 to the cell region CR and check the alignment state is significantly reduced. There is an advantage that can be. In addition, the pixel position accuracy (PPA) between the mask 100 adhered to one mask cell region and the mask 100 adhered to the mask cell region adjacent thereto does not exceed 3 μm, so that the alignment is very high. There is an advantage that a mask for forming an OLED pixel can be provided.

11 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 11, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. In the target substrate 900, the frame-integrated masks 100 and 200 (or FMMs) for allowing the organic material 600 to be deposited pixel by pixel may be closely attached or very close to each other. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 can act as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited as a whole.

12 is a schematic diagram illustrating a process of separating the mask 100 from the frame-integrated masks 100 and 200 according to an embodiment of the present invention. FIG. 12A is a plan view of two mask cells C11 and C12, and FIGS. 12B to 12D are schematic diagrams along the line D-D 'of FIG. In FIG. 12, a process of separating the mask 100 adhered to the frame 200 by welding W is described, but this is performed through the adhesive plating part 150 (see FIG. 10D). It is substantially the same as the process of separating the mask 100 adhered to.

Meanwhile, when a defect such as foreign matter is interposed in the mask 100 adhered to the frame 200 or damage occurs in the mask pattern P, it is necessary to replace the mask 100. Alternatively, even when the mask 100 is adhered to the frame 200 so that some alignment of the mask pattern P is not clear, it is necessary to replace only the mask 100 to make the alignment clear.

In the related art (see FIG. 2), the stick mask 10 is separated from the frame 20 by applying a physical force to the stick mask 10 welded to the frame 20. For example, the stick mask 10 is removed from the frame 20 through pliers, nippers, etc. In this process, a force may be applied to the frame 20 to cause fine deformation in the frame 20. Even fine deformation at a μm level may cause a misalignment between the mask cells C: C1 to C6 of the stick masks 10.

The present invention proposes a method of separating the mask 100 that can prevent the frame 200 from being deformed in the process of separating / replacing the mask 100 from the frame 200.

Referring to FIGS. 12A and 12B, the frame-integrated masks 100 and 200 to which the mask 100a to be replaced due to defects are prepared are prepared. It is assumed that the mask 100a including the mask cell C11 is separated. The mask 100a assumes that the left edge 101a and the right edge 102a are welded (W) and adhered to the frame 200 (mask cell sheet portion 220). Of course, all four corners of the mask 100 may be welded (W) and bonded to the frame 200 (mask cell sheet portion 220). In this case, the one edge of one of the four corners is peeled off. When cutting, the remaining edges need to be squeezed.

After removing one side edge 102a (the right edge) of the mask 100a including the mask cell C11 from the frame 200, the other edge 101a (the left edge) may be removed from the frame 200. In detail, one side edge 102a of the mask 100a may be in a state bonded to the first grid sheet portion 223a that is the right edge of the mask cell area CR11. Thus, when the external force SP is applied to and removed from one edge 102a of the mask 100a, the first grid sheet portion is formed by the adhesive force between the mask 100a and the frame 200 (first grid sheet portion 223a). There is a problem that deformation is issued at part of 223a. Therefore, it is necessary to remove the mask 100a after fixing the frame 200 (first grid sheet portion 223a) firmly.

In order to firmly fix the frame 200 with respect to the external force SP, an outer portion of one edge 102a of the mask 100a directly acting on the external force SP may be compressed. That is, the first grid sheet portion 223a to which the mask 100a is attached and / or the left edge portion 101b of the mask 100b adjacent to the right side of the mask 100a may be compressed. As the upper and lower surfaces of the left edge portion 101b of the first grid sheet portion 223a and / or the mask 100b are compressed, they can be firmly fixed to the external force SP.

In the upper portion, the first grid sheet portion 223a and the upper surface of the left edge portion 101b of the mask 100b may be compressed through the pressing bar 260. The lower surface of the left edge portion 101b of the first grid sheet portion 223a and the mask 100b may be compressed through a pressing bar (not shown) at the bottom. In FIG. 12, although there is a step at the end contacting the crimping bar 260, the first grid sheet part 223a, and the mask 100b, the thickness and the width are exaggerated for convenience of description. Since the thickness of the mask 100b is about several μm, and the welded portion is hardly protruded and is included in the mask 100, the end of the pressing bar 260 may be understood to be flat.

On the other hand, the supporter 250 for supporting the frame 200 can be used without using a crimping bar (not shown). The supporter 250 may support the lower portion of the frame 200. The support member 250 may have a plate shape to support the frame 200, and may be formed to be substantially the same as or smaller than the area of the frame 200. The support member 250 preferably uses the same material as the frame 200 in consideration of the coefficient of thermal expansion, but may be a material having high rigidity.

Frame support grooves 251 and 253 corresponding to the shape of the frame 200 may be formed on the support 250. The frame support grooves 251 and 253 include an edge support groove 251 and a grid support groove 253. The edge support groove 251 may be a groove having a shape corresponding to the edge frame portion 210 and the edge sheet portion 221. The grid support groove 253 may be formed in a first direction (x direction) and a second direction (y direction) corresponding to the first and second grid sheet portions 223 and 225. The grid support groove 253 is formed in a straight shape so that both ends may be connected to the edge support groove 251. Like the first and second grid sheet portions 223 and 225, each of the grid support grooves 253 may be equally spaced. The shape of the cross section perpendicular to the longitudinal direction of the grip support groove 253 may be a groove having a shape corresponding to the first and second grid sheet portions 223 and 235.

Since the thickness of the edge frame portion 210 and the edge sheet portion 221 may be thicker than the thicknesses of the first and second grid sheet portions 223 and 225, the edge supporting groove 251 is deeper than the grid supporting groove 253. It may be formed in a thickness.

The frame 200 may be accommodated in the frame support grooves 251 and 253 of the support 250 to be seated and supported. The top surface of the frame 200, that is, the surface to which the mask 100 is bonded, may be the same or higher than the top surface of the support body 250 while the frame 200 is seated and supported by the support body 250. Thus, the support 250 can support only the frame 200 without affecting the mask 100.

Next, referring to FIG. 12C, an external force SP may be applied to one edge 102a of the mask 100a to be detached from the first grid sheet part 223a. At this time, the pressing bar 260 compresses the upper surface of the first grid sheet portion 223a, which is the outer side of the one corner 102a, and the upper left corner 101b of the mask 100b at the upper portion, and the support 250 at the lower portion thereof. ) Receives the frame 200 (first grid sheet portion 223a) in the supporting grooves 251 and 253 and stably supports the frame 200 (first grid sheet portion) even when the external force SP is applied. 223a)] can be prevented from being deformed.

In addition, since the pressing bar 260 ′ also compresses the other edge 101a and the edge sheet portion 221a of the mask 100a, only the right edge 102b can be peeled off by the external force SP. Of course, in addition to the other corner 101a, the pressing bar (not shown) may be pressed on the upper and lower corners.

Next, referring to FIG. 12D, an external force SP may be applied to the other edge 101a of the mask 100a to be detached from the edge sheet portion 221a. At this time, the pressing bar 260 "compresses the upper surface of the edge sheet portion 221a, which is the outer side of the other edge 101a, and the support 250 is supported by the support grooves 251 and 253 in the lower portion. ) (Border sheet portion 221a) is accommodated and supported stably, so that the frame 200 (border sheet portion 221a) can be prevented from being deformed even when external force SP is applied.

13 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to another embodiment of the present invention. FIG. 13A is a plan view of two mask cells C11 and C12, and FIGS. 13B to 13D are schematic views taken along the line D-D 'of FIG. Hereinafter, only the difference from FIG. 12 is demonstrated.

Referring to (a) and (b) of FIG. 13, the frame-integrated masks 100 and 200 to which the mask 100a to be replaced due to defects are prepared are prepared. It is assumed that the mask 100a including the mask cell C11 is separated. The mask 100a is adhered to the frame 200 (mask cell sheet portion 220) via a eutectic adhesive (EM) comprising an alloy of at least two metals at the left edge 101a and the right edge 102a. Imagine being in a state. Of course, all four edges of the mask 100 may be bonded to the frame 200 (mask cell sheet 220) by interposing the adhesive part EM. In this case, one edge of the four edges may be bonded. When removing, the remaining edges need to be squeezed.

In the upper portion, the first grid sheet portion 223a and the upper surface of the left edge portion 101b of the mask 100b may be compressed through the pressing bar 260. The lower surface of the left edge portion 101b of the first grid sheet portion 223a and the mask 100b may be compressed through a pressing bar (not shown) at the bottom. In FIG. 13, it is shown that there is a step at an end contacting the crimping bar 260, the first grid sheet part 223a, and the mask 100b, but the thickness and width are exaggerated for convenience of description. Since the thickness of the mask 100b is about several micrometers, and the portion of the eutectic adhesive part EM hardly protrudes, the end of the pressing bar 260 may be understood to be flat.

On the other hand, the supporter 250 for supporting the frame 200 can be used without using a crimping bar (not shown). The frame 200 may be accommodated in the frame support grooves 251 and 253 of the support 250 to be seated and supported.

Next, referring to FIG. 13C, a predetermined temperature / pressure HP may be applied to the utic adhesive portion EM positioned at one edge 102a of the mask 100a. The metal of the adhesive part EM may apply a temperature and pressure to change from a solid phase to a liquid phase. Appropriate temperature and pressure can be selected according to the metal which comprises the adhesion part EA. The adhesive part EM may change from a solid phase to a liquid state only by applying heat of about 100 ° C to 300 ° C.

Here, the external force SP may be applied to one edge 102a of the mask 100a to be detached from the first grid sheet portion 223a. At this time, the pressing bar 260 compresses the upper surface of the first grid sheet portion 223a, which is the outer side of the one corner 102a, and the upper left corner 101b of the mask 100b at the upper portion, and the support 250 at the lower portion thereof. ) Receives the frame 200 (first grid sheet portion 223a) in the supporting grooves 251 and 253 and stably supports the frame 200 (first grid sheet portion) even when the external force SP is applied. 223a)] can be prevented from being deformed. In addition, since the adhesive force EM is changed to a liquid state, and thus the adhesive force is very weak, one side edge 102a of the mask 100a may be separated from the first grid sheet portion 223a even with a small external force SP. It is possible to further prevent the frame 200 (first grid sheet portion 223a) from being deformed.

In addition, since the pressing bar 260 ′ also compresses the other edge 101a and the edge sheet portion 221a of the mask 100a, only the right edge 102b can be peeled off by the external force SP. Of course, in addition to the other corner 101a, the pressing bar (not shown) may be pressed on the upper and lower corners.

Next, referring to FIG. 13D, a predetermined temperature / pressure HP may be applied to the eutectic adhesive part EM positioned at the other edge 101a of the mask 100a. The eutectic adhesive part EM may change from a solid phase to a liquid phase. In addition, the external force SP may be applied to the other edge 101a of the mask 100a to be detached from the edge sheet portion 221a. At this time, the pressing bar 260 "compresses the upper surface of the edge sheet portion 221a, which is the outer side of the other edge 101a, and the support 250 is supported by the support grooves 251 and 253 in the lower portion. ) (Border sheet portion 221a) is accommodated and supported stably, so that the frame 200 (border sheet portion 221a) can be prevented from being deformed even when external force SP is applied.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

100: mask
110: mask film
150: adhesive plating
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
250: support
260: compression bar
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
EM: Adhesive Bonding
F1 to F4: Tensile force
R: Hollow area of the border frame portion
P: mask pattern
W: welding

Claims (14)

As a method of separating the mask adhered to the frame,
(a) providing a frame-integrated mask having a mask adhered to at least a portion of an upper portion of the frame, the mask cell sheet portion having a border frame portion and a plurality of mask cell regions and connected to the border frame portion;
(b) pressing the outer portion of at least one edge of the bonded mask; And
(c) detaching the mask from the frame by applying external force to one edge of the mask;
Including, the separation method of the mask bonded to the frame. The method of claim 1,
The mask cell sheet portion is provided with a plurality of mask cell regions in at least one of a first direction and a second direction perpendicular to the first direction, wherein the mask adhered to the frame. The method of claim 1,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And
At least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion, and both ends connected to the edge sheet portion;
Including, the separation method of the mask bonded to the frame. The method of claim 1,
A method of detaching a mask bonded to a frame, wherein each mask corresponds to a respective mask cell area. The method of claim 4, wherein
The mask is,
A mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell,
And at least a portion of the dummy is bonded to the mask cell sheet portion. The method of claim 1,
And the mask comprises one mask cell, each mask corresponding to each mask cell region of the mask cell sheet portion, wherein the mask is bonded to the frame. The method of claim 1,
And the mask comprises a plurality of mask cells, each mask corresponding to each mask cell region of the mask cell sheet portion, wherein the mask is bonded to the frame. The method of claim 1,
In step (b), the mask and the method of separating the mask adhered to the frame, which compresses the upper surface and the lower surface of the mask cell sheet portion disposed outside the one side edge of the mask. The method of claim 8,
A method of detaching a mask bonded to a frame by pressing a corner upper surface of a mask cell sheet portion corresponding to one edge of a mask with a pressing bar. The method of claim 9,
And a support formed on the upper surface of the frame support groove corresponding to the frame shape is disposed below the frame. The method of claim 1,
In step (a), the dummy of the mask is welded to the upper portion of the mask cell sheet portion so that the mask is adhered to the frame,
In step (c), one edge of the mask is removed from the frame by applying an external force to one edge of the mask, and then the mask is detached from the frame while the other edge is removed from the frame by applying an external force to the other edge opposite to one side of the mask. The separation method of the mask bonded to the frame. The method of claim 1,
in step (a), the mask is adhered to the frame via an adhesive comprising at least two metal alloys,
and in step (c), at least one of a predetermined temperature and a predetermined pressure is applied to the bonding portion in addition to the external force. The method of claim 12,
and in step (c), at least a portion of the adhesive portion changes from a solid phase to a liquid phase. The method of claim 1,
In step (a), the mask is adhered to the frame via the adhesive plating,
In step (c), one edge of the mask is removed from the frame by applying an external force to one edge of the mask, and then the mask is detached from the frame while the other edge is removed from the frame by applying an external force to the other edge opposite to one side of the mask. The separation method of the mask bonded to the frame.

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