KR20190092123A - Method for separating mask adhere to frame and method for replacing mask adhere to frame - Google Patents

Abstract

The present invention relates to a method of separating a mask adhered to a frame, and a method of replacing a mask adhered to a frame. The method of separating a mask (100) adhered to a frame (200) according to the present invention comprises: a step (a) of providing frame-integrated masks (100, 200) to which a mask (100) is adhered to at least a part of the upper part of the frame (200) by through an adhesion part (EM) including metal; a step (b) of applying at least one of a predetermined temperature and a predetermined pressure (HP) to the adhesion part (EM); and a step (c) of separating the mask (100) from the frame (200). It is possible to separate and replace the mask easily.

Description

How to remove the mask attached to the frame and how to replace the mask attached to the frame {METHOD FOR SEPARATING MASK ADHERE TO FRAME AND METHOD FOR REPLACING MASK ADHERE TO FRAME}

The present invention relates to a method of detaching a mask adhered to a frame and a method of replacing a mask adhered to a frame. More specifically, the present invention relates to a method of separating a mask adhered to a frame and a method of replacing a mask adhered to a frame, which can prevent deformation of the frame in the process of removing and replacing the mask from the frame.

Recently, studies on electroforming methods have been underway in thin plate manufacturing. The electroplating method is to immerse the positive electrode and the negative electrode in the electrolyte, and to apply the power to electrodeposit the metal thin plate on the surface of the negative electrode, it is possible to manufacture the ultra-thin plate, it is a method that can be expected to mass production.

Meanwhile, as a technology of forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method of depositing an organic material at a desired position by closely attaching a thin metal mask to a substrate is mainly used.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the large area has a problem that the mask is struck or warped by load.

In the case of ultra-high-definition OLED, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is higher than 860 PPI, ~ 1600 PPI, etc. It has a resolution of. As such, considering the pixel size of the ultra-high-definition OLED, the alignment error between each cell should be reduced to several μm, and the error beyond this may lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

On the other hand, if the mask is not fixed in some alignment, or if a defect occurs in the mask, the mask has to be separated, but there was a problem that the alignment of the other mask in the process of removing and replacing the welded mask.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, the mask is bonded to the frame that can facilitate the separation and replacement of the mask in the frame-integrated mask in which the mask and the frame form an integral structure It is an object of the present invention to provide a separation method and a replacement method of a mask adhered to a frame.

It is also an object of the present invention to provide a separation method of a mask adhered to a frame and a replacement method of a mask adhered to a frame, which can prevent deformation of the frame and the like and to make the alignment clear.

The above object of the present invention is a method of separating a mask adhered to a frame, comprising the steps of: (a) providing a frame-integrated mask to which the mask is adhered to at least a portion of the upper portion of the frame by means of an adhesive comprising a metal; (b) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion; And (c) detaching the mask from the frame.

The adhesive portion may comprise an alloy of at least two metals.

In step (b), at least a portion of the bond can change from a solid phase to a liquid phase.

In step (b), the adhesion between the frame and the mask may weaken as at least a portion of the adhesive portion changes from a solid phase to a liquid phase.

The bonding part may include a first metal selected from any one of In, Bi, Sn, and Au; And a second metal selected from any one of In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, and Ge, and different from the first metal.

The adhesive part is selected from any one of Bi, Sn, Ag, Cu, Cd, and may further include a third metal different from the first metal and the second metal.

The adhesive part is selected from any one of Cu and Sb, and may further include a fourth metal different from the first metal, the second metal, and the third metal.

In addition, the above object of the present invention, a method for replacing the mask bonded to the frame, comprising the steps of: (a) providing a frame-integrated mask to which the mask is adhered to at least a portion of the upper portion of the frame via an adhesive comprising a metal; (b) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion; (c) separating the mask from the frame; (d) forming an adhesive comprising a metal on at least a portion of the upper portion of the frame, and at least a portion of an edge of the replacement mask corresponding to the adhesive; (e) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion; And (f) releasing the application of at least one of a predetermined temperature and a predetermined pressure, thereby adhering the replacement mask and the frame.

According to the present invention configured as described above, there is an effect that can facilitate the separation and replacement of the mask in the frame-integrated mask in which the mask and the frame form an integral structure.

In addition, according to the present invention, there is an effect that can prevent the deformation, such as distortion of the frame and to make the alignment clear.

1 is a schematic view showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of adhering a conventional mask to a frame.
3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing the tension form of the mask and the state in which the mask corresponds to the cell region of the frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a process of adhering a mask to a frame according to an embodiment of the present invention and a partially enlarged cross-sectional view illustrating an adhered form.
8 and 9 are schematic views illustrating a process of manufacturing a frame-integrated mask according to an embodiment of the present invention.
10 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
11 is a schematic diagram illustrating a process of separating a mask from a frame according to an embodiment of the present invention.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 is a schematic diagram showing a conventional mask for depositing OLED pixels 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick type or a plate type. The mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.

2 is a schematic diagram illustrating a process of adhering the mask 10 to the frame 20. 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2). A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 should be flattened. The stick mask 10 is unfolded by applying tensile forces F1 to F2 in the major axis direction of the stick mask 10. In this state, the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape. The cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20. The frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2 (c) shows the side surface of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3, in spite of finely adjusting the tensile force F1 to F2 applied to each side of the stick mask 10, there is a problem in that the alignment of the mask cells C1 to C3 is not good. For example, the distances D1 to D1 ″ and D2 to D2 ″ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3. The stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6, and has a very thin thickness of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that each cell (C1 ~ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to align perfectly so that the error is 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 10 and the plurality of cells C of the stick masks 10 while connecting the plurality of stick masks 10 of about 6 to 20 to each of the frames 20, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

Accordingly, the present invention provides a frame-integrated mask that can prevent deformation of the mask 100, such as knocking or twisting, to clarify the alignment in the frame 200, to significantly reduce the manufacturing time, and to significantly increase the yield. Suggest a method.

4 is a front view showing a frame-integrated mask according to an embodiment of the present invention. 5 is a front view (FIG. 5A) and a side cross-sectional view (FIG. 5B) illustrating a frame 200 according to an embodiment of the present invention. FIG. 5 (b) shows a side cross-sectional view in the A-A 'direction of FIG. 5 (a).

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been adhered to.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. In order to form a thin thickness, the mask 100 may be formed by electroforming. The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as).

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. It is desirable to be.

In addition, the frame 200 may include at least one first grid frame portion 220 extending in a first direction (horizontal direction). The first grid frame part 220 may be formed in a straight line shape and both ends thereof may be connected to the edge frame part 210. When the frame 200 includes a plurality of first grid frame parts 220, each of the first grid frame parts 220 may be equally spaced apart.

In addition, the frame 200 may include at least one second grid frame part 230 extending in a second direction (vertical direction). The second grid frame part 230 may be formed in a straight shape so that both ends thereof may be connected to the edge frame part 210. Since the first grid frame part 220 and the second grid frame part 230 are perpendicular to each other, they may cross each other. When the frame 200 includes a plurality of second grid frame portions 230, each of the second grid frame portions 230 may be equally spaced apart.

The shape of the cross section perpendicular to the longitudinal direction of the first and second grid frame portions 220 and 230 may be a quadrangular shape such as a triangle and a parallelogram (see FIG. 5 (b)), and the edges and corners are partially rounded. May be

By combining the edge frame unit 210 and the first and second grid frame units 220 and 230, the frame unit 200 may include a plurality of mask cell regions CR 11 to CR56. The mask cell region CR may refer to an empty region having a hollow shape except for an area occupied by the edge frame portion 210 and the first and second grid frame portions 220 and 230 in the frame portion 200. Can be. As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, although one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200, for the sake of clarity, a few cells C of about 2-3 may be used. It is preferable to correspond to the mask 100 having.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 corresponds to a mask pattern portion (corresponding to cell C) on which a plurality of mask patterns P are formed, and a dummy portion (mask portion 110 except for cell C) around the mask pattern portion. ] May be included. The dummy part may include only the mask film 110 or the mask film 110 in which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. The mask pattern portion may correspond to the mask cell region CR of the frame 200, and part or all of the dummy portion may be bonded to the frame 200. Accordingly, the mask 100 and the frame 200 may form an integrated structure.

Hereinafter, a process of manufacturing the frame integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. The frame 200 may be manufactured by connecting the first grid frame unit 220 and the second grid frame unit 230 to the edge frame unit 210. In the present specification, five first grid frame parts 220 and four second grid frame parts 230 are connected to the edge frame part 210 to form a 6 × 5 mask cell area (CR: CR11 to CR56). It demonstrates taking the example which formed.

Next, a mask 100 having a plurality of mask patterns P may be provided. As described above, it is possible to manufacture a mask 100 made of Invar and Super Invar using a pre-plating method, and one cell C may be formed in the mask 100. The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the mask cell regions CR11 to CR56, respectively. ) Can also be provided in plurality.

FIG. 6 is a view illustrating a tensile form of the mask 100 (FIG. 6A) and a mask 100 corresponding to the cell region CR of the frame 200 according to an embodiment of the present invention (FIG. 6). (b)] is a schematic diagram.

Next, referring to FIG. 6A, the mask 100 may correspond to one mask cell region CR of the frame 200. As shown in FIG. 6A, in the corresponding process, both sides of the mask 100 are stretched along the uniaxial direction of the mask 100 to form the mask cell C in a flat state. ) May correspond to the mask cell region CR. On one side, the mask 100 may be grasped and tensioned by several points (eg, 1 to 3 points in FIG. 6). In addition, not only one axis but also all sides of the mask 100 can be stretched F1 to F4 along all the axial directions.

For example, the tensile force applied on each side of the mask 100 may not exceed 4N. The tensile force applied according to the size of the mask 100 may be the same or different. In other words, since the mask 100 of the present invention has a size including one mask cell C, the tensile force required is the same as that of the conventional stick mask 10 including the plurality of cells C1 to C6. At least, it is likely to shrink. Considering that 9.8 N means a gravity force of 1 kg, since 1 N is a force less than 400 g of gravity force, even if the mask 100 is attached to the frame 200 after the mask 100 is tensioned, the mask 100 remains in the frame 200. The tension applied to the mask or, conversely, the tension applied by the frame 200 to the mask 100 is very small. Thus, deformation of the mask 100 and / or the frame 200 due to tension may be minimized to minimize alignment errors of the mask 100 (or mask pattern P).

In addition, since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 of FIG. 1 has a long length, whereas the mask 100 of the present invention includes one cell C to have a short length. As a result, the degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention According to the reduction of the relative length (corresponding to the reduction of the number of cells (C)) may be 1 / n of the above error range. For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced by 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 is within a range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, it is preferable to provide as few cells C as possible in the mask 100.

While the mask 100 is flat, the alignment force F1 to F4 may be adjusted to correspond to the mask cell region CR, and the alignment state may be confirmed in real time through a microscope. In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state checked, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. Compared with the conventional method (see FIG. 2), the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and simultaneously confirming the alignment of the six cells C1 to C6.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 steps of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56, respectively, results in six cells (C1). 5 masks 10 (see FIG. 2 (a)) each comprising ˜C6) may appear much higher than the conventional product yield in five steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is much more cumbersome and difficult, the product yield is low.

Meanwhile, after the mask 100 corresponds to the frame 200, the mask 100 may be temporarily fixed to the frame 200 through a predetermined adhesive. Subsequently, the bonding step of the mask 100 using the eutectic adhesive part EM may be performed.

7 is a schematic view [FIG. 7 (a)] illustrating a process of bonding the mask 100 to the frame 200 according to an embodiment of the present invention, and a partially enlarged cross-sectional view illustrating the bonded form [FIG. 7B] )]to be. (B) of FIG. 7 corresponds to the B-B 'cross section of FIG.

Next, referring to FIG. 7A, a part or all of the edge of the mask 100 may be attached to the frame 200. The adhesion may be performed by interposing the adhesive part EM between the mask 100 and the frame 200, and preferably, the adhesive part EM may be formed of an eutectic material. Since the eutectic adhesive part (EM) has a metal material such as the mask 100 / frame 200, it can be connected with high adhesiveness, and since it is a metal material, there is a low possibility of deformation. In FIG. 7B, for convenience of explanation, the thickness and width of the adhesive part EM are shown to be exaggerated slightly, and the part where the adhesive part EM is interposed is hardly protruded, and the mask 100 and the frame ( 200).

Bonding of the mask 100 should be performed as close as possible to the edge of the frame 200 to minimize the excited space between the mask 100 and the frame 200 and to increase the adhesion. The adhesive part EM may be a medium that is integrally connected to the mask 100 and the frame 200 by being interposed in a line or spot form.

Referring to FIG. 7B, one edge of two neighboring masks 100 forms an adhesive portion EM on an upper surface of the first grid frame portion 220 (or the second grid frame portion 230). The bonded form is shown through each other. The width and thickness of the first grid frame portion 220 (or the second grid frame portion 230) may be formed about 1 to 5 mm, and to improve product productivity, the first grid frame portion 220 [ Alternatively, it is necessary to reduce the width where the edges of the second grid frame part 230 and the mask 100 overlap with each other by about 0.1 to 2.5 mm.

The shape of the cross section perpendicular to the longitudinal direction of the first and second grid frame parts 220 and 230 may be a triangle 200a, but the cross-section is rectangular in order to better support the load and tension of the mask 100. For example, parallelograms] may be formed, and the edges and edges may be partially rounded.

When the mask 100 is bonded to the frame 200, the mask 100 is in the direction of the frame 200 (or the edge frame portion 210, the first and second grid frame portions 220 and 230), or the outside thereof. It can be bonded in a state receiving a tensile force (F1 ~ F2 or F1 ~ F4) in the direction. Thus, the mask 100 pulled taut to the frame 200 is temporarily bonded to the frame 200. In this state, when the adhesion is performed by the adhesive part EM, the mask 100 may be adhered to the upper portion of the frame 200 while receiving the tensile force F1 to F4 outward. Therefore, the mask 100 can be maintained in a state in which the mask 100 is pulled tightly to the frame 200 without being knocked or twisted by a load.

Next, when the process of adhering one mask 100 to the frame 200 is completed, the remaining masks 100 are sequentially corresponded to the remaining mask cells C, and the process of adhering to the frame 200 is repeated. can do. Since the mask 100 already adhered to the frame 200 may present a reference position, the time required to sequentially correspond the remaining masks 100 to the cells C and check the alignment state may be significantly reduced. There is an advantage to this. In addition, the pixel position accuracy (PPA) between the mask 100a adhered to one mask cell region and the mask 100b adhered to the mask cell region adjacent thereto does not exceed 3 μm, so that the alignment is very high. There is an advantage that a mask for forming an OLED pixel can be provided.

8 and 9 are schematic diagrams illustrating a process of manufacturing the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 8A, a conductive substrate 41 is prepared to perform electroforming. A mother plate 40 including the conductive substrate 41 may be used as a cathode in electroplating.

As the conductive material, in the case of metal, metal oxides may be formed on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that prevent the electric field from being uniformly formed on the surface of the base plate 40 (or the substrate 41), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to the defect, a uniform electric field may not be applied to the cathode body of the above-described material, so that a part of the plating film (mask 100) may be unevenly formed.

Non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. Since the pattern width of the FMM and the shadow mask can be formed in the size of several to several tens of micrometers, preferably smaller than 30 micrometers, even a defect of several micrometers is large enough to occupy a large proportion in the pattern size of the mask.

In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Therefore, the present invention can use the base material 41 of a single crystal silicon material. In order to have conductivity, the substrate 41 may be subjected to high concentration doping of 10 ¹⁹ or more. Doping may be performed on the entirety of the substrate 41, or may be performed only on the surface portion of the substrate 41.

Since the doped single crystal silicon is free from defects, there is an advantage in that a uniform plating film (mask 100) can be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel. In addition, since an additional process of eliminating and eliminating defects does not have to be performed, process costs are reduced and productivity is improved.

In addition, as the silicon substrate 41 is used, there is an advantage in that the insulating portion 45 may be formed only by a process of oxidizing and nitriding the surface of the substrate 41 as needed. The insulating portion 45 serves to prevent the electrodeposition of the plating film (mask 100) to form a pattern (mask pattern P) on the plating film.

Next, referring to FIG. 8B, an insulating part 45 may be formed on at least one surface of the base 41. The insulating portion 45 may be formed with a pattern, and preferably has a tapered or inverse tapered pattern. The insulating part 45 may be silicon oxide, silicon nitride, or the like based on the conductive base 41, and a photoresist may be used. When forming a tapered pattern using the photoresist, a multiple exposure method, a method of varying the exposure intensity for each region, and the like can be used. Accordingly, the mother plate 40 can be manufactured.

Next, referring to FIG. 8C, a cathode body (not shown) facing the mother plate 40 (or the cathode body 40) is prepared. The positive electrode (not shown) may be immersed in the plating liquid (not shown), and the mother plate 40 may be partially or partially immersed in the plating liquid (not shown). Due to the electric field formed between the base plate 40 (or the negative electrode body 40) and the opposite positive electrode body, a plating film (mask 100) may be electrodeposited on the surface of the base plate 40. However, since the plating film is generated only on the exposed surface of the conductive substrate 41, and the plating film is not generated on the surface of the insulating part 45, a pattern (mask pattern P [see FIG. 4]) may be formed on the plating film. .

The plating liquid may be a material of the plating film that will constitute the mask 100 as an electrolyte solution. In one embodiment, when an Invar thin plate made of iron nickel alloy is manufactured as the plating film 100, a mixed solution of a solution containing Ni ions and a solution containing Fe ions may be used as the plating solution. In another embodiment, when a super invar thin plate made of iron nickel cobalt alloy is manufactured as the plating film 100, a mixed liquid of a solution containing Ni ions, a solution containing Fe ions, and a solution containing Co ions May be used as the plating solution. Inva thin plate, super inva thin plate can be used as a fine metal mask (FMM), a shadow mask (Shadow Mask) in the manufacture of OLED. And, Invar thin plate has a thermal expansion coefficient of about 1.0 X 10 ^-6 / ℃, Super Inba thin plate has a thermal expansion coefficient of about 1.0 X 10 ^-7 / ℃ Since it is so low, there is little possibility that the pattern shape of a mask is deformed by thermal energy, and it is mainly used in high-resolution OLED manufacturing. In addition to this, the plating solution for the desired plating film 100 can be used without limitation, and in the present specification, the manufacturing of the Invar thin plate 100 is assumed as a main example, and the plating film 100 and the mask 100 are used together Will be explained.

Since the plating film 100 is thickened from the surface of the base material 41 as it is electrodeposited, it is preferable to form the plating film 100 only before the upper end of the insulating portion 45 is crossed. That is, the thickness of the plating film 100 may be smaller than the thickness of the insulating portion 45. Since the plating film 100 is filled and electrodeposited in the pattern space of the insulating part 45, the plating film 100 may be formed to have a taper or inverse taper shape having a phase opposite to that of the pattern of the insulating part 45.

Next, referring to FIG. 9A, an upper portion of the frame 200 (which may be the first and second grid frame portions 220 and 230 or the edge frame portion 210) may be used. Place the structure of c) upside down.

An adhesive part EA made of a eutectic material may be formed on an upper portion of the frame 200 (first and second grid frame parts 220 and 230) to which the mask 100 contacts. Since the mask 100 and the frame 200 may be adhered to each other by applying a predetermined temperature and pressure to the adhesive part EA, at least a part of the edge 100b of the mask 100 may correspond to the adhesive part EA. have.

The adhesive part EA may include metal and may have various shapes such as a film, a line, and a bundle shape. Since the adhesive part EA has a thin thickness of about 10 to 30 μm, even if interposed between the mask 20 and the frame 30, the step is hardly affected.

In more detail, the adhesive part EA may include an alloy of at least two metals. Since the adhesive part EA is made of a metal material and is not treated with other organic adhesives on the surface, the adhesive part EA may have insufficient adhesive force for bonding the mask 100 and the frame 200 in the state of FIG. Can be. Accordingly, the mask 100 and the frame 200 may be temporarily fixed to each other by applying a predetermined load so that the corresponding contact may not be distorted by using the adhesive portion EA as a medium. Alternatively, a clipping means (not shown) may be used to temporarily fix the positions of the mask 100 and the frame 200.

The bonding portion EA of the eutectic material may be at least two metal solid phases and have a eutectic point point. That is, the adhesive part EA includes at least two metal solid phases, and at the eutectic point of a specific temperature / pressure, both metal solid phases may be in a liquid phase. And, beyond the eutectic point can again become two metal solids. Accordingly, through the phase change of the solid phase-> liquid-> solid phase it is possible to perform a role as an adhesive.

The adhesive part EA may have an alloy form of two metals. In this case, the first metal selected from any one of In, Bi, Sn, Au, and the second metal selected from any one of In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, Ge, and different from the first metal. Metal may be included.

In addition, the adhesive part EA may have an alloy form of three metals. In this case, a second metal selected from any one of In, Bi, Sn, Au, In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, Ge, and a second metal different from the first metal And Bi, Sn, Ag, Cu, Cd, and may include a third metal different from the first metal and the second metal.

In addition, the adhesive part EA may have an alloy form of four metals. In this case, a second metal selected from any one of In, Bi, Sn, Au, In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, Ge, and a second metal different from the first metal Is selected from any one of Bi, Sn, Ag, Cu, Cd, and is different from the first metal and the second metal, and is selected from any of Cu, Sb, and the first metal, the second metal, and the third. It may comprise a fourth metal different from the metal.

[Table 1] below is an example of materials that can form the adhesive portion (EA).

Element 1 and Wt% Element 2 and Wt% Element 3 and Wt% Element 4 and Wt% Solidus ℃ Liquidus ℃ In 44 Sn 42 CD 14 93 93 In 51.5 Bi 32 Sn 16.5 95 95 In 52 Sn 48 120 122 Bi 57 Sn 42 Ag One 138 140 Bi 57 Sn 43 139 139 In 97 Ag 3 144 144 In 100 156 156 Sn 88.5 In 8 Ag 3 Cu 0.5 195 201 Sn 91.2 Zn 8.8 199 199 Sn 93.5 Bi 5 Ag 1.5 200 225 Sn 93.3 Ag 3.1 Bi 3.1 Cu 0.5 209 212 Sn 92 Bi 4.7 Ag 3.3 210 215 Sn 96.3 Ag 2.5 Cu 0.7 Sb 0.5 210 216 Sn 95 In 5 215 222 Sn 96.5 Ag 3 Cu 0.5 217 218 Sn 95.5 Ag 3.9 Cu 0.6 217 218 Sn 96 Ag 3.5 Cu 0.5 217 218 Sn 96.5 Ag 3.5 221 221 Sn 95 Ag 5 221 240 Sn 99.3 Cu 0.7 227 227 Sn 97 Cu 3 227 300 Sn 100 232 232 Sn 97 Sb 3 232 240 Sn 65 Ag 25 Sb 10 233 233 Au 80 Sn 20 278 278 Au 79 Sn 21 278 290 Au 78 Sn 22 280 303 Au 88 Ge 12 356 356

Next, referring to FIG. 9B, a predetermined temperature / pressure HP may be applied to the utero adhesive portion EA. The metal of the adhesive part EA may be subjected to temperature and pressure for changing from a solid phase to a liquid phase. Since the temperature of the eutectic point is illustrated in [Table 1], an appropriate temperature and pressure can be selected according to the metal constituting the adhesion part EA.

On the other hand, a predetermined pressure may be applied to prevent voids, and a separate device (not shown) for supplying an antioxidant gas / inert gas (vacuum, etc.) may be used to prevent oxidation of the eutectic. Under application of a predetermined temperature and pressure, the metals of the adhesion part EA may change into a liquid phase while melting in a solid phase.

Next, referring to FIG. 9C, when the predetermined temperature / pressure HP is released, the liquid eutectic adhesive portion EA is changed back to the solid state EM while the mask 100 and the frame 200 are removed. ) Can be bonded. That is, the mask 100 and the frame 200 may function as a solid utic adhesive portion EM.

The eutectic adhesive (EM) does not contain any volatile organic materials unlike the general organic adhesive. Therefore, when performing the pixel deposition process by installing the frame integrated mask in the OLED pixel deposition apparatus 200, it is possible to prevent the volatile organic material of the organic adhesive reacts with the process gas to adversely affect the pixels of the OLED. In addition, an outgas such as an organic material included in the organic adhesive itself may contaminate the chamber of the OLED pixel deposition apparatus 200 or prevent adverse effects from being deposited on the OLED pixel as impurities.

In addition, since the eutectic adhesive part EM is a solid, it is possible to have corrosion resistance without being cleaned by the OLED organic cleaning liquid. Thus, even when the frame integrated masks 100 and 200 are repeatedly used in the OLED pixel process, the adhesive part EM can maintain the adhesive function.

In addition, since the adhesive part EM includes two or more metals, the adhesive part EM may be connected to the mask 100 and the frame 200 having the same metal material as the organic adhesive with high adhesiveness. That is, since the bonding force on the surface between the mask 100, the frame 200, which is a metal material such as Inbar, is good, it can be connected with a high adhesiveness, it is a metal material has the advantage of low deformation potential.

In total, the adhesive part EM of the present invention is excellent in process stability compared to the organic adhesive, and exhibits the effect of firmly bonding the two components between the mask 100 and the frame 200. Accordingly, the alignment reliability of the frame integrated masks 100 and 200 can be further improved.

Meanwhile, when the adhesive part EM is changed from the liquid phase to the solid phase in step (c) of FIG. 9, when the mask 100 and the frame 200 are adhered to each other, the mask 100 is in the frame 200 or outward direction. It can be bonded under tension. The smaller volume of the solid phase than the liquid phase can also contribute to the effect of tensile force. Since the mask 100 is tensioned in the outward direction and can be stretched to the frame 200, the alignment of the mask pattern P is not disturbed even by a temperature change.

FIG. 10 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame integrated masks 100 and 200 according to an exemplary embodiment.

Referring to FIG. 10, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. In the target substrate 900, the frame-integrated masks 100 and 200 (or FMMs) for allowing the organic material 600 to be deposited pixel by pixel may be closely attached or very close to each other. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 can act as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited as a whole.

11 is a schematic diagram illustrating a process of separating the mask 100 from the frame 200 according to an embodiment of the present invention.

Meanwhile, when a defect such as foreign matter is interposed in the mask 100 adhered to the frame 200 or damage occurs in the mask pattern P, it is necessary to replace the mask 100. Alternatively, even when the mask 100 is adhered to the frame 200 so that some alignment of the mask pattern P is not clear, it is necessary to replace only the mask 100 to make the alignment clear.

In the related art (see FIG. 2), the stick mask 10 is separated from the frame 20 by applying a physical force to the stick mask 10 welded to the frame 20. For example, the stick mask 10 is removed from the frame 20 through pliers, nippers, etc. In this process, a force may be applied to the frame 20 to cause fine deformation in the frame 20. Even fine deformation at a μm level may cause a misalignment between the mask cells C: C1 to C6 of the stick masks 10.

In the present invention, since the mask 100 and the frame 200 are adhered to each other through the eutectic adhesive part EM, the mask 100 may be applied only by applying a predetermined temperature and pressure HP without applying a physical force. It can be separated from the frame 200.

Referring to FIG. 11A, a frame-integrated mask 100 and 200 to which a mask 100 to be replaced is attached is prepared. The adhesive part EM is in a state in which the adhesive part EM is interposed between the mask 100 and the frame 200.

Next, referring to FIG. 11B, a predetermined temperature / pressure HP may be applied to the utic adhesive portion EM. The metal of the adhesive part EM may apply a temperature and pressure to change from a solid phase to a liquid phase. Since the temperature of the eutectic point is illustrated in [Table 1], an appropriate temperature and pressure can be selected according to the metal constituting the adhesion part EA. The adhesive part EM may change from the solid phase EM to the liquid phase EA only by applying heat of about 100 ° C to 300 ° C.

Next, referring to FIG. 11C, the mask 100 may be separated from the frame 200. Since at least a portion of the adhesive part EM changes from the solid phase EM to the liquid phase EA, the adhesive force between the mask 100 and the frame 200 is weakened, and thus only the degree of lifting the mask 100 without applying a strong external force is required. It is possible to separate from the frame 200. Meanwhile, the adhesive part EA remaining on the frame 200 may be removed by cleaning.

After removing the mask 100 from the frame 200, a replacement mask (not shown) to be replaced may be prepared. As described above with reference to FIG. 9, a process of adhering the replacement mask to the frame 200 again may be performed by using the eutectic adhesive unit EA.

As described above, the present invention has an advantage in that the mask 100 can be separated and replaced without applying a physical force only by applying a predetermined temperature and pressure HP. Thus, since no external force is applied to the frame 200 during the separation / replacement process of the mask 100, the frame 200 may be prevented from being deformed and the alignment of the mask pattern P may be prevented from being misaligned.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

40: bed
41: conductive substrate
45: insulation
100: mask
110: mask film
200: frame
210: border frame portion
220: first grid frame portion
230: second grid frame portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
EA, EM: eutectic bond
F1 to F4: Tensile force
HP: temperature / pressure applied
P: mask pattern
W: welding

Claims (14)

As a method of separating the mask adhered to the frame,
(a) providing a frame-integrated mask having a mask adhered to at least a portion of the upper portion of the frame by means of an adhesive comprising a metal;
(b) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion; And
(c) separating the mask from the frame
Including, the separation method of the mask bonded to the frame. The method of claim 1,
And the bond portion comprises an alloy of at least two metals. The method of claim 2,
and in step (b), at least a portion of the adhesive portion changes from a solid phase to a liquid phase. The method of claim 3,
and in step (b), at least a portion of the adhesive portion changes from a solid phase to a liquid phase so that the adhesion between the frame and the mask is weakened. The method of claim 1,
The adhesive part,
A first metal selected from any one of In, Bi, Sn, Au; And
A second metal selected from any one of In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, Ge, and different from the first metal.
Including, the separation method of the mask bonded to the frame. The method of claim 5,
The adhesive part,
A third metal selected from any one of Bi, Sn, Ag, Cu, Cd, and different from the first metal and the second metal
Further comprising, the method of separation of the mask bonded to the frame. The method of claim 6,
The adhesive part,
A fourth metal selected from any one of Cu, Sb, and different from the first metal, the second metal, and the third metal
Further comprising, the method of separation of the mask bonded to the frame. As a method of replacing the mask bonded to the frame,
(a) providing a frame-integrated mask having a mask adhered to at least a portion of the upper portion of the frame by means of an adhesive comprising a metal;
(b) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion;
(c) separating the mask from the frame;
(d) forming an adhesive comprising a metal on at least a portion of the upper portion of the frame, and at least a portion of an edge of the replacement mask corresponding to the adhesive;
(e) applying at least one of a predetermined temperature and a predetermined pressure to the bonding portion; And
(f) releasing at least one of a predetermined temperature and a predetermined pressure to bond the replacement mask and the frame.
Included, the method of replacing the mask bonded to the frame. The method of claim 8,
And the glue portion comprises an alloy of at least two metals. The method of claim 8,
in step (e), at least a portion of the bond changes from a solid phase to a liquid phase,
and in step (f), the replacement mask and the frame are adhered to each other while the liquid phase of the bonding portion changes to a solid phase again. The method of claim 8,
The adhesive part,
A first metal selected from any one of In, Bi, Sn, Au; And
A second metal selected from any one of In, Bi, Sn, Ag, Cu, Zn, Bi, Sb, Ge, and different from the first metal.
Included, the method of replacing the mask bonded to the frame. The method of claim 11,
The adhesive part,
A third metal selected from any one of Bi, Sn, Ag, Cu, Cd, and different from the first metal and the second metal
Further comprising, the method of replacing the mask bonded to the frame. The method of claim 12,
The adhesive part,
A fourth metal selected from any one of Cu, Sb, and different from the first metal, the second metal, and the third metal
Further comprising, the method of replacing the mask bonded to the frame. The method of claim 8,
(b) and (e) are performed in an inert gas atmosphere.

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