JP6904852B2 - Mother mold for electric casting and its manufacturing method - Google Patents

Description

The present invention relates to an electroforming master mold used for electroforming a metal mask used in processes such as vapor deposition, printing, and solder ball mounting.

A thin-film deposition mask method is often used as a method for forming a light emitting layer of an organic EL (Electroluminescence) element. In this thin-film deposition mask method, in order to deposit and form an organic luminescent substance at a desired position on a substrate made of a transparent material such as glass, a thin-film deposition mask in which a portion corresponding to a vapor deposition portion of the substrate is removed and perforated is used.
Since it is necessary to form such a thin-film deposition mask thinly and to form a large number of thin-film deposition holes through which a vapor-deposited substance passes with high accuracy, it has been recently proposed to form such a vapor deposition mask by using electroforming.

In mask formation by electroforming, resists are placed in advance at many locations that serve as thin-film deposition holes on the surface of the master mold, and then electrodeposition made of an electroformed metal such as nickel that forms a mask on the surface of the master mold by electroforming. A layer is formed, and at the same time, a state in which a large number of vapor-deposited through holes are provided in a predetermined pattern is generated. If necessary, the reinforcing frame is integrated by plating or the like to obtain a desired mask structure, and then the master mold is separated to complete the vapor deposition mask.
As an example of a conventional vapor deposition mask manufactured by using such electroforming, there is one disclosed in Japanese Patent Application Laid-Open No. 2005-15908.

Japanese Unexamined Patent Publication No. 2005-15908

The conventional thin-film deposition mask has the configuration shown in the above-mentioned patent document, and by appropriately integrating the frame body with the mask body by using the electroforming method, the mask can be used as a mask when heat is applied in the vapor deposition process. It is possible to suppress the relative deformation of the substrate and prevent the deterioration of the positional accuracy of the thin-film deposition product.

However, in the recent market, there is a demand for higher precision of thin-film deposition products, and the mask has been made thinner and the through-hole pattern has been made finer. It is extremely large.

In the case of mask formation by electrocasting, when the mask is separated from the master mold, the thickness of the master mold is usually larger than the thickness of the mask. When the mask is deformed in a direction away from the electrodeposition layer, an excessive force is applied to the electrodeposition layer to permanently deform a part of the electrodeposition layer, which may deteriorate the accuracy.

For this reason, the master mold used for electrodeposition has a laminated structure, and each layer of the master die is sequentially separated from the electrodeposition layer as a mask from the side far from the electrodeposition layer, so that an excessive force is applied to the electrodeposition layer. In recent years, there have been proposals that can prevent deformation due to the addition of.

In the master mold having such a laminated structure, it is necessary to maintain the adhesively integrated state of each layer forming the master mold until the mask and the master mold are separated after the mask is formed. However, if a general adhesive is used to bond the layers forming the master mold, it is difficult to uniformly control the thickness of the adhesive layer. Therefore, the primary electrodeposition layer formed on the master mold ( The flatness of the mask) could not be ensured, which could adversely affect the accuracy of the mask. Therefore, it has been proposed to use a dry film resist having a predetermined adhesive strength as an adhesive when it is not exposed.

The dry film resist is in the form of a sheet having a uniform thickness, and when used for adhesion, the flatness of the primary electrodeposition layer can be ensured without any problem. However, since the dry film resist is used as it is unexposed for adhesion and the dry film resist is not in a stable cured state after exposure between the layers forming the master mold, it is in the form of the master mold. If the time elapses, volume changes such as shrinkage due to the outflow of some components such as volatile matter may occur, and the primary electrodeposition layer (mask) formed on the matrix is adversely affected by misalignment. There was a problem that there was a risk.

The present invention has been made to solve the above problems, and suppresses volume changes such as shrinkage of the adhesive layer in the master mold of the laminated structure to avoid a situation in which the changes affect each part of the master mold, and on the master mold. To provide a master mold for electric casting and a method for manufacturing the master mold, which can prevent the time-dependent change of the master mold, which appears as a misalignment of the mask body formed by electrocasting, and improve the accuracy of the mask. With the goal.

The electric casting master mold according to the disclosure of the present invention is a plate-shaped base portion having at least one surface flat in the electric casting master mold used for manufacturing a mask provided with a large number of through holes by electric casting. And, a sheet-like adhesive layer arranged on the flat surface of the base portion, and a single or multiple laminated structure, which is adhered to the base portion via the adhesive layer, is conductive. An intermediate portion of the adhesive layer, which is provided with a sheet-like conductive layer having properties and is surrounded by a frame-shaped portion in a predetermined range from the outer peripheral edge of the adhesive layer, has a smaller volume changeability with time than the frame-shaped portion. Moreover, the adhesive force for adhering the base portion and the conductive layer is reduced.

As described above, according to the disclosure of the present invention, the state in which the volume does not easily change with time in the central portion other than the frame-shaped portion within a predetermined range from the outer peripheral edge of the adhesive layer is such that the adhesive force is generated at least in the frame-shaped portion. By stabilizing the structure of the adhesive layer as a whole while maintaining it, the base and the conductive layer can be stably fixed and integrated with the adhesive layer that reduces the volume change with the passage of time, and the volume of the adhesive layer changes. The accompanying displacement of the conductive layer and the displacement of the electrodeposited layer formed on the conductive layer can be suppressed, and the accuracy of the mask formed by using the master mold can be prevented from deteriorating.

In addition, while ensuring sufficient adhesive strength in the frame-shaped portion within a predetermined range from the outer peripheral edge of the adhesive layer, the adhesive strength of the intermediate portion in the adhesive layer is suppressed, so that the base forms a master mold in the electroplating process. While ensuring the integration of the part and the conductive layer, the base part and the conductive layer can be separated with a smaller force at the adhesive layer position after the electroplating is completed, and the base part and the conductive layer can be separated after the electroplating. Are sequentially separated from the mask side to easily and efficiently separate and remove the master mold from the mask, and the force applied to the mask side during the separation of the master mold is reduced, which also has an adverse effect such as deformation of the mask body. It can be suppressed.

Further, in the electrocasting master mold according to the disclosure of the present invention, the adhesive layer is arranged in contact with the base portion, if necessary, and at least the frame-shaped portion within a predetermined range from the outer peripheral edge has adhesiveness. A first resist in an uncured state and a second resist in an uncured state that is arranged in contact with the conductive layer and has a frame-like portion in a predetermined range from the outer peripheral edge having adhesiveness. The intermediate portion of at least one of the first resist and the second resist surrounded by the frame-shaped portion is in a cured state having no adhesiveness and no change in volume with time.

As described above, according to the disclosure of the present invention, the intermediate portion of at least one of the two resists forming the adhesive layer is in a cured state, and the intermediate portion of the adhesive layer is stable in that the volume does not easily change with time. By bringing it closer to the above state, even if time has passed since the base portion and the conductive layer were fixed and integrated by the adhesive layer, the volume change in the adhesive layer was suppressed, and the displacement of the conductive layer and the accompanying electrodeposition layer on the conductive layer were suppressed. It is possible to prevent the displacement of the mask and manufacture a high-precision mask. Further, by setting the intermediate portion of at least one of the two resists forming the adhesive layer in a cured state so that the adhesive force is not exhibited, the separation between the base portion and the conductive layer after the completion of electrocasting is started from the adhesive layer. It can be executed with less force, and the separation and removal of the matrix from the mask can proceed smoothly.

Further, in the electrocasting master mold according to the disclosure of the present invention, the adhesive layer is arranged in contact with the base portion, if necessary, and at least the frame-shaped portion within a predetermined range from the outer peripheral edge has adhesiveness. A first resist in an uncured state and a second resist in an uncured state that is arranged in contact with the conductive layer and has a frame-like portion in a predetermined range from the outer peripheral edge having adhesiveness. The intermediate portion of at least one of the first resist and the second resist surrounded by the frame-shaped portion is in a semi-cured state in which the adhesiveness and the volume change with time are smaller than those of the frame-shaped portion.

As described above, according to the disclosure of the present invention, the intermediate portion of at least one of the two resists forming the adhesive layer is in a semi-cured state, and the volume of the intermediate portion of the adhesive layer is unlikely to change with time. By setting the state, even if time elapses from the fixed integration of the base portion and the conductive layer by the adhesive layer, the volume change in the adhesive layer is suppressed, and the displacement of the conductive layer and the accompanying electrodeposition layer on the conductive layer are suppressed. It is possible to prevent misalignment and manufacture a highly accurate mask. In addition, the intermediate portion of at least one of the two resists forming the adhesive layer is in a semi-cured state to weaken the adhesive force, so that the adhesive layer can be separated from the base portion and the conductive layer after the completion of electrocasting. It can be executed with a smaller force as a starting point, and the separation and removal of the matrix from the mask can proceed smoothly.

Further, in the electrocasting master mold according to the disclosure of the present invention, the first resist in the adhesive layer is surrounded by the frame-shaped portion while making the frame-shaped portion uncured, if necessary. The intermediate portion is in a semi-cured state, and the second resist in the adhesive layer is such that the frame-shaped portion is in an uncured state and the intermediate portion surrounded by the frame-shaped portion is in a cured state. be.

As described above, according to the disclosure of the present invention, of the two layers of resist forming the adhesive layer, the intermediate portion of the first resist is in a semi-cured state and the intermediate portion of the second resist is in a cured state for adhesion. By keeping the middle part of the layer in a stable state where the volume does not change over time, the volume change in the adhesive layer is appropriate even after a lapse of time from the fixed integration of the base part and the conductive layer by the adhesive layer. It is possible to obtain a highly accurate mask by preventing the conductive layer and the electrodeposited layer on it from shifting. In addition, in the middle part of the two layers of resist forming the adhesive layer, the base part and the conductive layer starting from the adhesive layer after the completion of electrocasting should be separated reasonably and smoothly so that the adhesive force is hardly exerted. This makes it possible to greatly improve the efficiency of the work of separating the mask and the master mold.

Further, the method for manufacturing an electric casting master mold according to the disclosure of the present invention is a predetermined flat metal in the method for manufacturing an electric casting master mold used for manufacturing a mask provided with a large number of through holes by electric casting. A conductive layer forming step of forming one or a plurality of sheet-like conductive layers at predetermined positions on a substrate, and an adhesive layer forming step of forming an adhesive layer having an adhesive function on the conductive layer were formed. The conductive layer and the adhesive layer are arranged on the flat surface of the plate-shaped base portion by the adhesive force of the adhesive layer, and include a transfer step of separating from the substrate in the adhesive layer forming step. Of the adhesive layer, the intermediate portion surrounded by the frame-shaped portion in a predetermined range from the outer peripheral edge of the adhesive layer has a smaller volume change with time than the frame-shaped portion, and the base portion and the conductive layer are adhered to each other. It is formed so that the adhesive force to be applied is reduced.

As described above, according to the disclosure of the present invention, a conductive layer is formed on a metal substrate, an adhesive layer is formed on the conductive layer, and an integral conductive layer and an adhesive layer are combined with each other by the adhesive force of the adhesive layer. While attaching to the base part with, and separating these conductive layer and adhesive layer from the substrate to manufacture a master mold composed of the conductive layer, the adhesive layer, and the base part, a frame within a predetermined range from the outer peripheral edge of the adhesive layer. By forming an adhesive layer so that the intermediate part other than the shaped part is less likely to change with time and has a small adhesive force, the adhesive layer with a small volume change with the passage of time is used as the base part. The conductive layer can be stably fixed and integrated, and the displacement of the conductive layer due to the volume change of the adhesive layer and the misalignment of the electrodeposited layer formed on the conductive layer can be suppressed. It is possible to prevent a decrease in the accuracy of the formed mask.

Further, in the electroplating process using the manufactured master mold, the adhesive force is secured in the frame-shaped portion within a predetermined range from the outer peripheral edge of the adhesive layer, while the adhesive force in the intermediate portion in the adhesive layer is suppressed. After the electroplating is completed, the base part and the conductive layer can be easily separated with a smaller force at the position of the adhesive layer while maintaining the integration between the base part forming the base and the conductive layer. Deformation of the mask body by reducing the force applied to the mask side during the separation of the master mold while efficiently advancing the separation and removal of the master mold, which is performed by sequentially separating the base and conductive layer after casting from the mask side. Etc. are also suppressed.

Further, in the method for producing a mother die for electric casting according to the disclosure of the present invention, one resist, which is an unexposed negative dry film resist, is placed on the conductive layer in the adhesive layer forming step, if necessary. Then, the frame-shaped portion within a predetermined range from the outer peripheral edge of the one resist is not exposed and remains unexposed, while the intermediate portion of the one resist surrounded by the frame-shaped portion is exposed. The intermediate portion is cured, and another resist, which is an unexposed negative dry film resist, is placed on one resist in which the intermediate portion is cured, and the frame-shaped portion within a predetermined range from the outer peripheral edge of the other resist is formed. Is left unexposed without being exposed, while the intermediate portion of the other resist surrounded by the frame-shaped portion is semi-exposed with a smaller exposure amount than the exposure to the intermediate portion of one resist. One resist and the other resist are used as the adhesive layer.

As described above, according to the disclosure of the present invention, as an adhesive layer forming step, one resist which is a dry film resist forming an adhesive layer and another resist are laminated and arranged, and one resist is placed on the conductive layer. Leaves the frame-shaped portion within a predetermined range from the outer peripheral edge unexposed, while the intermediate portion is cured by exposure, and the other resist placed on one resist is predetermined from the outer peripheral edge. While the frame-shaped portion of the range is left unexposed, the intermediate portion is subjected to semi-exposure with a small exposure amount, so that the volume of the intermediate portion of the formed adhesive layer is less likely to change with time. By keeping it in a stable state, the volume change in the adhesive layer can be appropriately suppressed even after a lapse of time from the integration of the base portion and the conductive layer by the adhesive layer, and the influence on the conductive layer is prevented. A high-precision mask can be formed by electric casting with a master mold. Further, by obtaining a state in which the adhesive force is hardly exerted in the intermediate portion of the adhesive layer, the formed mask and the master mold can be efficiently separated after the manufactured master mold is used for electric casting.

It is the schematic sectional drawing of the master mold for electric casting which concerns on 1st Embodiment of this invention. It is a schematic plan view of the vapor deposition mask manufactured by using the electroforming master mold which concerns on 1st Embodiment of this invention. FIG. 5 is an explanatory diagram of a main part configuration of a vapor deposition mask manufactured by using the electroforming master mold according to the first embodiment of the present invention. It is explanatory drawing of the outer frame resist formation process in manufacturing of the master mold for electric casting which concerns on 1st Embodiment of this invention. It is explanatory drawing of the conductive layer formation process in manufacturing of the electroplating base mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the first half of the adhesive layer formation process in manufacturing of the base mold for electric casting which concerns on 1st Embodiment of this invention. It is explanatory drawing of the latter half of the adhesive layer forming process in manufacturing of the base mold for electric casting which concerns on 1st Embodiment of this invention. It is explanatory drawing of the transfer process to the base part of the adhesive layer and the conductive layer in manufacturing of the electroplating base mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the primary pattern resist formation process in the vapor deposition mask manufacturing process using the electroforming master mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the primary electrodeposition layer formation process in the vapor deposition mask manufacturing process using the electroforming master mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the secondary pattern resist formation process in the vapor deposition mask manufacturing process using the electroforming master mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the frame body adhesion and electrodeposition metal layer formation process in the vapor deposition mask manufacturing process using the electroforming master mold which concerns on 1st Embodiment of this invention. It is explanatory drawing of the separation process of a part of the base part and the conductive layer of the mother die in the vapor deposition mask manufacturing process using the electroforming master die which concerns on 1st Embodiment of this invention. It is explanatory drawing of the conductive layer residue separation process of the mother mold in the vapor deposition mask manufacturing process using the electroforming mother mold which concerns on 1st Embodiment of this invention, and the unnecessary part removal state removal state from the vapor deposition mask. It is explanatory drawing of the adhesive layer formation completion state in the manufacturing process of the electroplating base mold which concerns on 2nd Embodiment of this invention, and the transfer completion state to the base part of an adhesive layer and a conductive layer. It is explanatory drawing of the other adhesive layer formation completion state in the manufacturing process of the electroplating base mold which concerns on 2nd Embodiment of this invention, and the transfer completion state to the base part of an adhesive layer and a conductive layer. It is explanatory drawing of the adhesive layer formation completion state in the manufacturing process of the electroplating base mold which concerns on 3rd Embodiment of this invention, and the transfer completion state to the base part of an adhesive layer and a conductive layer. It is explanatory drawing of the other adhesive layer formation completion state in the manufacturing process of the electroplating base mold which concerns on 3rd Embodiment of this invention, and the transfer completion state to the base part of an adhesive layer and a conductive layer. It is an explanatory view of the completion state of formation of still another adhesive layer and the state of completion of transfer of the adhesive layer and the conductive layer to the base portion in the manufacturing process of the electroplating master mold according to the third embodiment of the present invention. It is explanatory drawing of the adhesive layer formation process in manufacturing of the master mold for electric casting which concerns on 4th Embodiment of this invention. It is explanatory drawing of the adhesive layer formation completion state in the manufacturing process of the electroplating base mold which concerns on 4th Embodiment of this invention, and the transfer completion state to the base part of an adhesive layer and a conductive layer.

(First Embodiment of the present invention)
Hereinafter, the electrocasting master mold according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 14. In this embodiment, an example in which a vapor deposition mask for an organic EL element is applied to a master mold for forming by electroforming will be described.

In each of the drawings, the electroforming master mold 10 according to the present embodiment includes a base portion 11 which is a conductive metal flat plate, a sheet-shaped adhesive layer 12 which is arranged on the base portion 11 in an overlapping manner. It is configured to include a sheet-shaped conductive layer 13 having a laminated structure of a plurality of sheets, which is adhered to the base portion 11 via the adhesive layer 12.

The base portion 11 is made of a stainless steel material such as SUS430 or a metal plate-like body such as brass or steel. The thickness of the base portion is preferably about 1 mm.
The base portion 11 can also be made of a material having a low coefficient of thermal expansion such as 42 alloy (42% nickel-iron alloy), Invar (36% nickel-iron alloy), or SUS430. Further, the base portion 11 may have a metal film made of a conductive metal such as chromium or titanium formed on the surface of an insulating substrate such as a glass plate or a resin plate.

The adhesive layer 12 has a two-layer structure including a first resist 12a and a second resist 12b, and the base portion 11 and the conductive layer 13 are bonded and integrated.
In the first resist 12a, the frame-shaped portion 12c in a predetermined range from the outer peripheral edge, for example, the frame-shaped portion in the range of 20 mm width from the outer peripheral edge is in an uncured state having adhesiveness, and the other intermediate portion 12d is uncured. It is configured to be arranged in contact with the base portion 11 as a semi-cured state in which the adhesiveness and the change in volume with time are smaller than those in the state.

Similar to the first resist 12a, the second resist 12b is in an uncured state in which the frame-shaped portion 12e in a predetermined range from the outer peripheral edge has adhesiveness, and the other intermediate portion 12f is in a cured state in which the volume does not change with time. , It is configured to be arranged in contact with the conductive layer 13.

In the first resist 12a and the second resist 12b, in detail, a negative type photosensitive dry film resist is placed on the site to be adhered, and a frame-shaped portion within a predetermined range from the outer peripheral edge is covered with a photomask 71. It is formed by exposing or semi-exposing the intermediate portion in a state of being covered with 72.

The dry film resist has adhesiveness in an unexposed state, and has a property of being cured by exposure and shifting to a stable state in which the volume does not change with time and is not adhesive. Further, the dry film resist is in a semi-cured state in which the curing is partially advanced when half-exposure is performed to reduce the exposure amount by limiting the light transmittance in the photomask at the time of exposure or shortening the exposure time. .. In this semi-cured state, the degree of change in adhesiveness and volume with time is smaller than in the uncured state, and the adhesive force as an adhesive layer is also reduced as the adhesiveness is lowered.

The dry film resist has an adhesive resist film formed by applying a resist solution to the surface of a carrier film and drying it, and is supplied with a cover film arranged on the resist film. .. After removing the cover film, this dry film resist is placed so that the resist film is in contact with the surface of the installation target portion. Then, after exposing the necessary portion through the carrier film to form a cured portion, the carrier film is also peeled off and removed.

The adhesive layer 12 has a two-layer structure composed of a first resist 12a and a second resist 12b, and each resist is a photosensitive dry film resist, but if it is in the form of a sheet and has an adhesive function, it can be used. It does not have to be a dry film resist. However, those having photosensitivity are preferable in that they are excellent in handleability, such as being able to easily perform a process for adjusting from an uncured state to a semi-cured state or a cured state.

The conductive layer 13 is formed by stacking three thin metal sheets 13a, 13b, and 13c suitable for electroforming such as nickel.
The thickness of each of the sheets 13a, 13b, and 13c forming the conductive layer 13 is set to decrease as the distance from the adhesive layer 12 increases, and is, for example, 60 μm, 40 μm, and 20 μm from the side closer to the adhesive layer.

The sheets 13a, 13b, and 13c are subjected to a predetermined surface treatment that promotes separation on the boundary surface of the sheets so that each sheet can be peeled off from the mask side when the master mold is removed after the mask is completed.

The conductive layer 13 has a laminated structure composed of three sheets, but the present invention is not limited to this, and a plurality of sheets other than the three sheets may be laminated, such as two sheets or four or more sheets. .. In addition, the conductive layer may be in the form of a single sheet that does not have a laminated structure.

The thin-film deposition mask 1 formed by using the mother mold 10 of the present embodiment includes a plurality of mask bodies 2 in which a large number of thin-film deposition holes 8 are provided in a predetermined pattern, and a frame body 3 arranged around the mask body 2. It is a configuration including.

The mask body 2 is formed in a sheet shape by electroforming from a nickel alloy such as nickel or nickel cobalt or other electrodeposited metal, and is provided with a large number of independent thin-film deposition holes 8 through which a vapor-deposited substance passes in a predetermined pattern. It is a configuration that can be used.

The mask main body 2 includes an internal pattern forming region 2a provided with a large number of thin-film vapor deposition holes 8 and an outer peripheral edge 2b integrally joined with the frame body 3 via a metal layer 7 formed by plating. In the pattern forming region 2a, a large number of thin-film deposition holes 8 are arranged in rows in a plurality of holes arranged linearly in the front-rear direction for forming a light emitting layer, and the plurality of rows are arranged in parallel in the left-right direction. The matrix-like vapor deposition pattern 9 is formed.

The frame body 3 is a rectangular frame shape having a plate-like body thicker than the mask body 2, is arranged so as to surround the outside of the mask body 2 for reinforcement of the mask body 2, and is connected to the mask body 2. It is a structure that is integrated. Specifically, the frame body 3 is formed in a grid pattern as a whole, and the mask body 2 is located in each of the opening regions partitioned inside the frame body 3 and is integrated with the frame body 3 via the metal layer 7. It is a composition.

The frame 3 is formed of a material having a low coefficient of thermal expansion, for example, a material such as an Invar material which is a nickel-iron alloy or a superinvar material which is a nickel-iron-cobalt alloy. Then, the frame body 3 is connected and integrated with the outer peripheral edge 2b of the pattern forming region 2a of the mask body 2 so as not to be separated from each other by the metal layer 7 formed by plating.

When an Invar material or a Super Invar material is used as the material of the frame body 3, the coefficient of thermal expansion thereof is extremely small, so that the dimensional change of the mask body 2 due to the thermal influence in the vapor deposition process can be satisfactorily suppressed. That is, even if the coefficient of thermal expansion of the mask body 2 is larger than the coefficient of thermal expansion of general glass such as nickel, which is a substrate to be vapor-deposited (not shown), the coefficient of thermal expansion due to high temperature during vapor deposition. Due to the difference, there is no discrepancy between the through-hole position with respect to the substrate when the vapor deposition mask 1 is aligned with the substrate to be vapor-deposited at room temperature and the vapor deposition position of the vapor-deposited material during actual vapor deposition, and the mask is masked. Due to the small coefficient of thermal expansion of the frame 3 that holds the main body 2, the dimensional change and shape change caused by the expansion of the mask main body 2 during temperature rise are well suppressed, and the matching accuracy at room temperature is improved during vapor deposition. It can be kept good at times.

As the material of the frame body 3, a material having a low coefficient of thermal expansion close to that of glass or the like, which is a substrate to be vapor-deposited, for example, glass or ceramic can also be used. In this case, conductivity is imparted to at least the surface of these materials.

In the thin-film deposition mask 1, a primary pattern resist 14 is provided on the surface of the master mold 10 so as to correspond to a non-arranged portion of the primary electrodeposition layer 15, and then primary electroforming is performed on the master mold 10 by electroforming an electrodeposited metal. After the deposition layer 15 is formed, the secondary pattern resist 16 covering the pattern forming region 2a corresponding portion of the primary electrodeposition layer 15 is formed, and the frame body 3 is further arranged so as to surround the primary electrodeposition layer 15. A metal layer 7 is formed by plating so as to cover the surface of the frame 3 and the outer peripheral edge 2b surface of the primary electrodeposition layer 15, and the primary electrodeposition layer 15 and the frame 3 are formed through the metal layer 7. It is manufactured by separating the primary electrodeposition layer 15, the frame body 3, the metal layer 7, and the master mold 10 in a state of being integrally connected so as not to be separated.

When the metal layer 7 is formed on the master mold 10 by plating (see FIG. 12 (C)), the master mold 10 is separated and removed from these (see FIGS. 13 and 14). The master mold 10 is physically peeled off from the vapor deposition mask side by applying a force to remove it, and in detail, each layer forming the master mold 10 is separated. That is, the base portion 11 and the conductive layer 13 are separated from the mask side in this order, and the sheets 13a, 13b, and 13c forming the conductive layer 13 are separated one by one from the far side from the mask side.

The primary electrodeposition layer 15 is made of a nickel alloy such as nickel or nickel-cobalt suitable for electroforming, and is formed by electroforming on a portion of the master die 10 where there is no primary pattern resist 14. In the thin-film deposition mask 1, the primary electrodeposition layer 15 is formed as a mask body 2 that covers the surface of the thin-film deposition substrate, excluding the thin-film deposition through holes 8 corresponding to the vapor deposition target points such as the light emitting layer on the vapor-deposited substrate. The Rukoto.

The primary pattern resist 14 is formed of an insulating material having solubility resistance to an electrolytic solution used in electroforming of the primary electrodeposition layer 15, and is not set in advance on the master mold 10. It is arranged so as to correspond to the arranged portion, and is removed after the formation of the primary electrodeposition layer 15 (see FIGS. 9 and 10).

The primary pattern resist 14 is disposed on the master mold 10 prior to the formation of the primary electrodeposition layer 15, and a photosensitive resist, for example, a negative type photosensitive dry film resist, is applied to the master mold 10 to a predetermined thickness. For example, it is arranged so as to have a thickness of about 20 μm, and ultraviolet irradiation is performed with a photomask 41 having a predetermined pattern corresponding to the two positions of the mask body of the vapor deposition mask 1, that is, the arrangement position of the primary electrodeposition layer 15. It is formed into a shape corresponding to the non-arranged portion of the primary electrodeposition layer 15 through treatments such as curing by exposure to the above and development to remove the resist in the non-irradiated portion.

The secondary pattern resist 16 is formed of an insulating material having solubility resistance to the electrolytic solution used for plating the metal layer 7, and is arranged so as to correspond to a preset non-arranged portion of the metal layer 7. , Is removed after the formation of the metal layer 7 and the separation of the matrix 10 (see FIGS. 11, 12, and 14).

In this secondary pattern resist 16, a photosensitive resist, for example, a negative type photosensitive dry film resist is adhered and arranged on the master mold 10 and the already arranged primary electrodeposition layer 15, and the metal layer of the vapor deposition mask 1 is formed. A series of steps of exposure by ultraviolet irradiation with a photomask 42 having a predetermined pattern corresponding to 7 and the 3 positions of the frame are placed once or a plurality of times to obtain a required resist thickness, and then exposure. It is formed in a shape corresponding to the non-arranged portion (pattern forming region 2a of the mask body 2) of the metal layer 7 through a process such as development for removing the photosensitive material of the non-irradiated portion.

The secondary pattern resist 16 (resist layer 18), the first resist 12a (other resist 64) and the second resist 12b (one resist 63) forming the adhesive layer 12, and the primary pattern resist 14 If the same resist is used for the (resist layer 17), the specification conditions (variation in dimensions due to exposure, etc.) can be made the same, which is more preferable.

The metal layer 7 is formed by plating, is made of nickel, a nickel-cobalt alloy, or the like, and is a secondary pattern resist 16 on the master mold 10, the already arranged primary electrodeposition layer 15, and the frame 3. Is formed by plating on the exposed portion where is not arranged.

The metal layer 7 joins the outer peripheral edge 2b of the pattern forming region 2a of the mask body 2 and the frame body 3. The metal layer 7 is laminated on the upper surface of the mask body 2 related to the outer peripheral edge 2b of the pattern forming region by plating. Specifically, the metal layer 7 is formed in the upper surface of the outer peripheral edge 2b of the pattern forming region 2a, the upper surface of the frame body 3 and the side surface on the pattern forming region 2a side, and the gap portion between the mask body 2 and the frame body 3. With this, the outer peripheral edge 2b of the pattern forming region 2a and the opening peripheral edge of the frame body 3 are integrally connected so as not to separate from each other.

Next, the manufacturing process of the master mold and the manufacturing process of the vapor deposition mask using the master mold according to the present embodiment will be described.
First, the manufacturing process of the master mold 10 will be described.
A resist 61, which is an unexposed negative dry film, is arranged on a predetermined flat substrate 60 surface made of a metal suitable for electrocasting (for example, a stainless steel material such as SUS304) so as to have a required thickness. After covering the area other than the preset outer peripheral portion of the resist with the photomask 70, the outer peripheral portion of the resist 61 not covered with the photomask 70 is cured by the exposure step, and the outer peripheral portion other than the cured outer peripheral portion is removed. , An outer frame resist 62 for electrocasting is formed (see FIG. 4).

Then, sheets are sequentially formed by electroplating on the inner portion of the substrate 60 surrounded by the outer frame resist 62 to obtain a conductive layer 13 composed of three layers of sheets 13a, 13b, and 13c (see FIG. 5). The sheets 13a, 13b, and 13c forming the conductive layer 13 are formed by changing the thickness setting value so as to be thicker than before each time the layers are formed. Further, each of the sheets 13a, 13b, and 13c is subjected to a surface treatment that facilitates peeling at the time of removing the mother mold each time a layer is formed.

An adhesive layer 12 is formed on the obtained conductive layer 13. Specifically, one resist 63, which is an unexposed negative dry film resist, is placed on the conductive layer 13, and a frame-shaped portion within a predetermined range from the outer peripheral edge of the resist is covered with a photomask 71. .. Then, the intermediate portion of one resist 63 that is not covered with the photomask 71 is exposed to cure the intermediate portion. In this way, from one resist 63, a second resist 12b is obtained in which the outer peripheral frame-shaped portion 12e is in an unexposed state and the intermediate portion 12f surrounded by the frame-shaped portion 12e is cured (see FIG. 6).

Another resist 64, which is an unexposed negative dry film resist having the same thickness as one resist 63, is placed on the second resist 12b on which the intermediate portion 12f is cured, and a frame within a predetermined range from the outer peripheral edge of the resist is placed. It is assumed that the shaped portion is covered with the photomask 72. Then, the intermediate portion of the other resist 64 that is not covered with the photomask 72 is subjected to semi-exposure with the exposure amount smaller than the exposure of the intermediate portion of one resist 63, and the intermediate portion is put into a semi-cured state. In this way, from the other resist 64, a first resist 12a is obtained in which the outer peripheral frame-shaped portion 12c is in an unexposed state and the intermediate portion 12d surrounded by the frame-shaped portion 12c is in a semi-cured state (FIG. 7). reference).

Half-exposure to the other resist 64 is performed so that the exposure amount is 1/2 to 1/50 of the exposure amount (integrated light amount) at the time of normal exposure. For example, with respect to the exposure amount 200 mJ / cm ² at the time of ordinary exposure, the half exposure is to an exposure amount 10 mJ / cm ² of 1/20.

In forming the adhesive layer 12, the first resist 12a and the second resist are formed by leaving a carrier film covering the intermediate portion of one resist 63 or a cover film covering the intermediate portion of the other resist 64. A film may be interposed between the intermediate portions of 12b, and by preventing the resist intermediate portions from adhering to each other with the film, the separation operation starting from the resists of the adhesive layer 12 can be further facilitated. Can be done.

A transfer step (see FIG. 8) is performed in which the conductive layer 13 and the adhesive layer 12 which are laminated and integrated are attached and arranged on the base portion 11 which is a metal flat plate by the adhesive force of the adhesive layer 12 and separated from the substrate 60. After that, the mother mold 10 is completed.

In the master mold 10, the adhesive layer 12 composed of the first resist 12a and the second resist 12b is unexposed in the intermediate portions 12d and 12f surrounded by the frame-shaped portions 12c and 12e within a predetermined range from the outer peripheral edge thereof. In a stable state in which the change in volume with time is smaller than that of the frame-shaped portions 12c and 12e, the influence of the change in volume of the adhesive layer 12 with time is conductive in the electroplating process using the master mold 10. It is possible to prevent a situation in which the primary electrodeposition layer 15 is reached through the layer 13. Further, the adhesive layer 12 has a reduced adhesive force for adhering the base portion 11 and the conductive layer 13 in the intermediate portions 12d and 12f, so that the conductivity of the base portion 11 in the final separation step of the master mold is reduced. The separation work from the layer 13 can be easily performed.

Subsequently, the manufacturing process of the vapor deposition mask will be described.
First, the resist layer 17 is arranged on the master die 10 in correspondence with the vapor deposition through holes 8 of the mask body 2, that is, the non-arranged portion of the primary electrodeposition layer 15 which is preset on the master die 10 (FIG. 9). Specifically, a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposition layer 15 forming, for example, a negative type photosensitive dry film resist on the surface side of the master mold 10, that is, on the conductive layer 13. ), And one or several sheets are laminated to form a resist layer 17 by thermocompression bonding (see FIG. 9A).

Then, a photomask (for example, a glass mask) 41 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15 is adhered to the surface of the resist layer 17, such as having a light-transmitting hole 41a corresponding to the vapor deposition through hole 8. After that, exposure by ultraviolet irradiation with an exposure apparatus (ultraviolet irradiation apparatus) is performed (see FIGS. 9B and 9C).

In the exposure step for the resist layer 17, the master mold 10 on which the resist layer 17 is formed reaches the inside of the exposure apparatus in the exposure step using, for example, a hot plate or a preheating furnace before the exposure is performed by the exposure apparatus. Preheat to a predetermined preheating temperature, for example, 27.0 ° C ± 0.3 ° C, which is preset as a possible temperature.

Further, the photomask 41 arranged on the surface of the resist layer 17 is also set in the exposure apparatus in a state of being arranged on the dummy master mold (master mold + resist layer) before the exposure, and the exposure apparatus is actually exposed. By dummy exposure in the same operating state as in the above, the preheating temperature is the same as in the case of the master die 10, for example, 27.0 ° C. ± 0.3 ° C.

In addition, regarding the stage where the master mold 10 in the exposure apparatus is installed, before formal exposure, the exposure target such as the master mold is not accommodated in the apparatus, or the dummy master mold is set on the stage before exposure. The apparatus is preheated to the same preheating temperature as in the case of the master mold 10, for example, 27.0 ° C. ± 0.3 ° C. by dummy exposure that puts the apparatus in the same operating state as the actual exposure.

In this way, after preheating the master mold 10, the photomask 41, and the inside of the exposure apparatus (stage) to the same temperature, the photomask 41 is arranged on the surface of the resist layer 17 on the master mold 10, and these are placed on the stage of the exposure apparatus. Installed in and officially exposed.

Explaining the reason why the master mold 10, the photomask 41, and the inside of the exposure apparatus (stage) are preheated to a temperature that can be reached during the exposure work in this exposure, the heat of the master mold 10, the resist layer 17, and the photomask 41 will be explained. The expansion coefficients are different from each other, and when these are housed in the device and exposed at a temperature lower than the internal temperature when the exposure device is actually exposed, for example, at room temperature, ultraviolet irradiation is performed. As the master mold 10 and the like are heated and thermally expanded by the heat generated in the exposure apparatus, the relative positional relationship between the master mold 10, the resist layer 17, and the photomask 41 is displaced.

Due to such deviation, the position accuracy of the primary pattern resist 14 obtained after exposure with respect to the master die 10 and the accuracy of the shape of the primary pattern resist 14 are lowered. If the position accuracy of the primary pattern resist 14 is lowered or the shape is defective, the process of forming the primary electrodeposition layer 15 (mask body 2) by electrocasting is affected, and the mask body 2 with the accuracy as designed is formed. It may not be possible.

On the other hand, the master mold 10 (including the resist layer 17), the photomask 41, and the exposure apparatus (stage) are preheated to a temperature that can be reached during the exposure work, and then the exposure apparatus is used for exposure. Therefore, in addition to the fact that new thermal expansion of the master mold 10 and the like due to the temperature rise does not occur in the exposure apparatus, the inside of the exposure apparatus can be maintained at a stable temperature, and the master mold 10 and the like in the apparatus are affected by the temperature change. The exposure proceeds without any problem.

As a result, the accuracy related to the position and shape of the primary pattern resist 14 on the master mold 10 after exposure can be improved, and the primary electrodeposition layer 15 (mask body 2) is also stable based on the accuracy of the primary pattern resist 14. It can be formed with high accuracy, and the reproduction accuracy and the vapor deposition accuracy of the vapor deposition layer by the mask body 2 can be improved. The lower the preheating temperature, the more the thermal expansion can be suppressed. Therefore, it is preferable that the preheating temperature is a standard temperature (23 ° C.) or even a lower temperature (for example, 0 ° C.). Since it occurs, there is a limit to lowering the preheating temperature. When the main purpose is to avoid the influence of thermal expansion due to heat generated during exposure as described above, it is preferable to set the maximum temperature reached in the exposure apparatus during exposure as the preheating temperature.

In addition, when considering the thermal expansion in each process after exposure, the maximum temperature among the temperatures in the exposure apparatus (exposure temperature), the plating tank (plating temperature), and the vapor deposition apparatus (deposited temperature) is set as the preheating temperature. Is preferable.

After the exposure, each process such as development and drying for removing the resist of the masked unexposed (non-irradiated) portion on the master die 10 is performed. In this way, the primary pattern resist 14 corresponding to the non-arranged portion of the primary electrodeposition layer 15 is obtained on the master die 10 (see FIG. 10 (A)).

The primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other method, and the forming method is not limited to the above.

The master mold 10 having the primary pattern resist 14 is placed in an electroformed tank built under predetermined conditions and is not covered with the primary pattern resist 14 of the master mold 10 within the thickness range of the primary pattern resist 14. A primary electrodeposition layer 15 serving as a mask body 2 having a thickness of, for example, 12 μm is formed on the surface (exposed region) by electroforming an electrodeposited metal such as a nickel alloy (see FIG. 10B).

After that, by dissolving and removing the primary pattern resist 14, a primary electrodeposition layer 15 serving as a mask body 2 provided with a large number of independent vapor deposition through holes 8 forming a predetermined thin film deposition pattern 9 can be obtained (FIG. 10 (FIG. 10). See C)).

After the primary electrodeposition layer 15 is obtained, the resist layer 18 is arranged on the entire surface of the master mold 10 including the formed portion of the primary electrodeposition layer 15. Specifically, for example, one or several negative type photosensitive dry film resists are laminated on the surface side of the master mold 10 according to a predetermined thickness set in advance, and the resist layer 18 is formed by thermocompression bonding. (See FIG. 11 (A)).

Then, as shown in FIG. 11B, a photomask 42 having a light-transmitting hole 42a corresponding to the pattern forming region 2a of the mask body 2 is brought into close contact with the surface of the resist layer 18, and then exposed by ultraviolet irradiation. (See FIGS. 11 (B) and 11 (C)). As a result, the portion corresponding to the pattern forming region 2a becomes the resist layer 18a cured by exposure, and the other portion becomes the unexposed resist layer 18b.
After that, a process of dissolving and removing the unexposed resist layer 18b exposed on the surface is performed to form a secondary pattern resist 16 covering the pattern forming region 2a (see FIG. 12A).

After the secondary pattern resist 16 is formed in this way, the adhesive layer 19 is arranged in advance on the lower surface side of the frame body 3 that has been formed through the frame body forming step, and is placed at a preset location on the primary electrodeposition layer 15. Align and arrange (see FIG. 12B).

The frame body 3 in this state can be temporarily fixed on the primary electrodeposition layer 15 so as not to easily move due to the adhesiveness of the adhesive layer 19.
The temporarily fixed frame body 3 is subjected to a step of applying a load from above the frame body 3 and crimping the frame body 3 as necessary to make the frame body 3 more difficult to separate from the primary electrodeposition layer 15. You can also.

After that, the upper surface of the primary electrodeposition layer 15 that is not covered by the secondary pattern resist 16 and is exposed on the surface of the outer peripheral edge 2b of the pattern forming region 2a, the primary electrodeposition layer 15a on the lower side of the frame body 3 and its side. A metal layer 7 is formed by plating an electrodeposited metal on each exposed surface of the master die 10 exposed to the surface and on the surface of the frame body 3 (see FIG. 12C). The metal layer 7 allows the primary electrodeposition layer 15 and the frame body 3 to be integrally connected so as not to separate from each other.

In this case, the metal layer 7 is the upper surface of the primary electrodeposition layer 15 exposed on the surface of the outer peripheral edge 2b of the pattern forming region 2a, or the matrix exposed on the surface between the primary electrodeposition layer 15 and the frame 3. The thickness of the metal layer 7 on the surface of the frame 3 is formed thinner than the thickness on the surface of 10. This difference in thickness is caused only when the metal layers 7 are sequentially laminated from the surfaces of the master mold 10 and the primary electrodeposition layer 15 and reach the frame body 3 beyond the height dimension of the adhesive layer 19 to reach the frame body 3. This is because the base metal 10 and the primary electrodeposition layer 15 are in a conductive state, and the metal layer 7 is started to be formed on the surface of the frame body 3.

When the formation of the metal layer 7 is completed, as a final step, the master mold 10 is separated from the integrated primary electrodeposition layer 15, the frame body 3, and the metal layer 7. This separation is performed in order from the base portion 11 of the master mold, and the base portion 11 is first peeled off from the conductive layer 13. In this case, the base portion 11 is peeled off from between the first resist 12a and the second resist 12b of the adhesive layer 12. Since the intermediate portion 12c of the first resist 12a of the adhesive layer 12 is in a semi-cured state and the intermediate portion 12d of the second resist 12b is in a cured state, the adhesive layer portion can be peeled off and separated without difficulty ( See FIG. 13 (A)).
When the base portion 11 is peeled off, the primary electrodeposition layer 15 is adversely affected by deformation or the like because the remaining portion obtained by adding the conductive layer 13 to the primary electrodeposition layer 15 has a sufficient thickness. There is no.

After separating the base portion 11 (including the first resist 12a portion of the adhesive layer 12), the sheets forming the conductive layer 13 are separated one by one from the side away from the primary electrodeposition layer 15 (FIG. 13). (B), see FIGS. 14 (A) and 14 (B)). Since the sheet is surface-treated for each layer, it can be separated without difficulty by applying a force to peel it off. The sheets 13a, 13b, and 13c forming the conductive layer 13 become thinner as they approach the primary electrodeposition layer 15 and the like, so that the load on the primary electrodeposition layer 15 and the like is small and the primary electrodeposition layer 15 is deformed. Can be separated without.

Even when the sheets 13a, 13b, and 13c forming the conductive layer 13 are peeled off, the remaining sheets of the conductive layer 13 are integrally contacted with the primary electrodeposition layer 15 to be in a reinforced state, so that the primary electrodeposition layer is reinforced. No adverse effect such as deformation is exerted on 15.

Further, since the sheets 13a, 13b, 13c forming the conductive layer 13 become thinner as they approach the primary electrodeposition layer 15 and the like, the last sheet 13a of the conductive layer 13 is directly separated from the primary electrodeposition layer and the like. In this case, the force applied to the primary electrodeposition layer 15 and the like can be suppressed to the minimum necessary, and the primary electrodeposition layer 15 can be separated without being deformed.

When all the sheets 13a, 13b, 13c forming the conductive layer 13 are peeled off and the separation of the master mold 10 is completed, the primary electrodeposition layer 15a existing under the frame 3 is removed together with the adhesive layer 19, and then the second By removing the next pattern resist 16, the production of the vapor deposition mask 1 is completed. If the adhesive layer 19 remains on the lower side of the frame body 3, it is removed when the secondary pattern resist 16 is removed. Further, the removal of the secondary pattern resist 16 may be performed before the separation of the master die 10.

As described above, the electrocasting master mold according to the present embodiment is in a state in which the volume of the adhesive layer 12 as a whole is less likely to change with time in the central portion other than the frame-shaped portion within a predetermined range from the outer peripheral edge. By stabilizing the structure of the above, the base portion 11 and the conductive layer 13 can be stably fixed and integrated with the adhesive layer that reduces the volume change with the passage of time, and the conductive layer 13 with the volume change of the adhesive layer 12 can be stably integrated. Displacement and misalignment of the primary electrodeposition layer 15 formed on the conductive layer 13 can be suppressed, and the accuracy of the mask body 2 formed by using the master die 10 can be prevented from being lowered.

Further, by ensuring sufficient adhesive force in the frame-shaped portion within a predetermined range from the outer peripheral edge of the adhesive layer 12, while suppressing the adhesive force in the intermediate portion in the adhesive layer 12, the master mold 10 is used in the electroplating process. After the electroplating is completed, the base portion 11 and the conductive layer 13 can be separated from each other with a smaller force starting from the position of the adhesive layer while reliably maintaining the integration of the base portion 11 and the conductive layer 13 forming the above. After electroplating, the base portion 11 and the conductive layer 13 are sequentially separated from the mask side so that the master mold 10 can be easily and efficiently separated and removed from the mask, and the force applied to the mask side during the separation of the master mold is applied. By making it smaller, adverse effects such as deformation of the mask body 2 can be suppressed.

The electrocasting master mold according to the above embodiment is a mother for forming a vapor deposition mask 1 having a structure in which a mask body 2 and a frame 3 are integrated with a metal layer 7 among vapor deposition masks for organic EL elements. Although it is configured as a mold, it is not limited to this, and a metal mask having another structure, for example, a mask having only a mask body without a frame, or a mask having a mask body and a frame, but these are bonded together. A mask having an integrated structure, which also has a mask body and a frame, can also be used to form a mask having a structure in which they are joined and integrated via a gauze (mesh). Further, a master mold for forming a printing mask, a mask for mounting a solder ball, or the like other than the vapor deposition mask may be used.

(Second Embodiment of the present invention)
In the production of the electrocasting master mold according to the first embodiment, in the adhesive layer forming step, the intermediate portion of one resist 63 placed on the conductive layer 13 is exposed and on the one resist 63. A second resist 12b and the intermediate portion 12d, which are in a cured state in which the intermediate portion 12f has no adhesiveness and the volume does not change with time, are subjected to semi-exposure to the intermediate portion of the other resist 64 placed on the resist 64. The first resist 12a, which is in a semi-cured state with less adhesiveness and less change in volume with time, is obtained from the unexposed portion, and the first resist 12a and the second resist 12b are used as the adhesive layer 12. However, not limited to this, as a second embodiment, as shown in FIG. 15, in the adhesive layer forming step, both the intermediate portion of one resist 63 and the intermediate portion of the other resist 64 are exposed. In both the first resist 12a and the second resist 12b forming the adhesive layer 12, the intermediate portions 12d and 12f may be configured to obtain a cured state in which the intermediate portions 12d and 12f do not have adhesiveness and the volume does not change with time.

In this case as well, as in the above embodiment, the central portion of the adhesive layer 12 other than the frame-shaped portion within a predetermined range from the outer peripheral edge can be made into a state in which the volume does not easily change with time, and the adhesive layer 12 has the base portion 11 and the conductive layer 13. In the state of the master mold 10 in which the two are bonded and integrated, the displacement of the conductive layer 13 due to the volume change of the adhesive layer 12 and the misalignment of the primary electrodeposition layer 15 (mask body 2) formed on the conductive layer 13 are observed. It is suppressed, and a high-precision mask can be formed using the master mold 10. Further, the frame-shaped portion within a predetermined range from the outer peripheral edge of the adhesive layer 12 is maintained as unexposed to maintain adhesiveness, and while ensuring sufficient adhesive strength, the adhesiveness of the intermediate portion is suppressed to reduce the adhesive strength. In the electric casting process, the adhesive layer 12 ensures that the base portion 11 forming the master mold 10 and the conductive layer 13 are integrated, and after the electric casting is completed, the base portion 11 and the conductive layer 13 are held at the adhesive layer position. It can be separated with a small force, and the master mold 10 can be easily and efficiently separated and removed from the mask.

The exposure to the intermediate portions of both resists 63 and 64 in the adhesive layer forming step is not limited to the method of giving an exposure amount at which the resist reaches a completely cured state, and in addition to this, FIG. As shown in the above, in the adhesive layer forming step, both the intermediate portion of one resist 63 and the intermediate portion of the other resist 64 are subjected to semi-exposure with a reduced exposure amount to form the first resist forming the adhesive layer 12. Both the 12a and the second resist 12b are configured to obtain a semi-cured state in which the intermediate portions 12d and 12f have less adhesiveness and volume change with time than the unexposed frame-shaped portions 12c and 12e on the outside thereof. You can also do it.

(Third Embodiment of the present invention)
In the production of the die for electric casting according to the first embodiment, another resist 64 is placed on one resist 63 after the intermediate portion is exposed in the adhesive layer forming step, and the other resist 64 is placed on the resist 63. By performing semi-exposure on the intermediate portion of the resist 64 of the above, the first resist 12a in which the intermediate portion 12d is in a semi-cured state in which the adhesiveness and the volume change with time is smaller than that of the unexposed frame-shaped portion 12c is obtained. However, the third embodiment is an unexposed negative dry film resist on one resist 63 after the intermediate portion is exposed, as shown in FIG. After the resist 64 is placed, the other resist 64 is not exposed, and the first resist 12a can be obtained in an unexposed state as a whole.

In this case as well, in the second resist 12b of the adhesive layer 12, the intermediate portion 12f is in a cured state without adhesiveness and the volume does not change with time. Therefore, as in the above embodiment, the adhesive layer as a whole Is in a state where the volume does not easily change with time in the central portion thereof, and in the state of the master mold 10 in which the base portion 11 and the conductive layer 13 are bonded and integrated in the adhesive layer 12, it accompanies the volume change of the adhesive layer 12. The displacement of the conductive layer 13 and the misalignment of the primary electrodeposition layer 15 (mask body 2) formed on the conductive layer 13 can be suppressed. Further, the adhesive force for integrating the base portion 11 and the conductive layer 13 in the intermediate portion of the adhesive layer 12 is smaller than that of the outer frame-shaped portion, and the base starts from the adhesive layer 12 after the completion of electrocasting. It is possible to promote easy and quick separation between the portion 11 and the conductive layer 13.

It should be noted that the second resist 12b in which the intermediate portion 12f is in a cured state without adhesiveness and the volume does not change with time after exposure and the first resist 12a in which the whole is in an unexposed state are adhered to each other. As for the combination as the layer 12, in addition to making the resists 12a and 12b thin (for example, a thickness of a dozen μm) and having the same thickness as in the first embodiment as shown in FIG. As shown, the second resist 12b in which the intermediate portion 12f is in a cured state is arranged with a thickness larger than that of the first resist 12a (for example, several tens of μm in thickness), or is shown in FIG. As described above, the first resist 12a and the second resist 12b may be combined with a larger thickness (for example, several tens of μm) than in the case of thinness. However, if the resists 12a and 12b are thinner, the amount of change can be made relatively small even if the volume changes with the passage of time, and the effect on the conductive layer and the like can be reduced. It is suppressed and more preferable.

(Fourth Embodiment of the present invention)
In the production of the electrocasting master mold according to the first embodiment, in the adhesive layer forming step, the intermediate portion of the one resist 63 placed on the conductive layer 13 is exposed, and then the one resist is exposed. The intermediate portion of the other resist 64 placed on 63 was semi-exposed, and the second resist 12b in which the intermediate portion 12f was cured by exposure and the intermediate portion 12d were semi-cured by semi-exposure. The first resist 12a is obtained, but the present invention is not limited to this, and as a fourth embodiment, as shown in FIGS. 20 and 21, the resist 12a is placed on the conductive layer 13 in the adhesive layer forming step. The resist 63 is left unexposed without being exposed, while the other resist 64 placed on one resist 63 is exposed or semi-exposed in the intermediate portion, and such exposure is performed. It is also possible to obtain a first resist 12a in which the intermediate portion 12d is in a cured or semi-cured state through the steps, and a second resist 12b in which the entire intermediate portion 12d is in an unexposed state.

In this case as well, in the first resist 12a of the adhesive layer 12, the intermediate portion 12d is in a cured state or a semi-cured state in which the adhesiveness and the change in volume with time are reduced. The volume of the entire layer is unlikely to change with time in the central portion thereof, and in the state of the master mold 10 in which the base portion 11 and the conductive layer 13 are bonded and integrated in the adhesive layer 12, the volume of the adhesive layer 12 is formed. It is possible to suppress the displacement of the conductive layer 13 due to the change and the displacement of the primary electrodeposition layer 15 (mask body 2) formed on the conductive layer 13. Further, the adhesive force for integrating the base portion 11 and the conductive layer 13 in the intermediate portion of the adhesive layer 12 is smaller than that of the outer frame-shaped portion, and the base starts from the adhesive layer 12 after the completion of electrocasting. It is possible to promote easy and quick separation between the portion 11 and the conductive layer 13.

In the production of the electrocasting master mold according to the first to fourth embodiments, in the adhesive layer forming step, the frame shape of one resist 63 and the other resist 64 within a predetermined range from the outer peripheral edge of the resist. The portion is not exposed, and each frame-shaped portion of the second resist 12b and the first resist 12a is maintained in an adhesive and uncured state, but the present invention is not limited to this. , The frame-shaped portion of one resist 63 is exposed or semi-exposed so as to obtain a second resist 12b in which the frame-shaped portion 12e is in a cured or semi-cured state, or the frame-shaped portion of another resist 64 is obtained. It is also possible to perform exposure or semi-exposure to obtain the first resist 12a in which the frame-shaped portion 12c is in a cured or semi-cured state.

In this case, the intermediate portion of the one resist 63 may be exposed or half-exposed to the frame-shaped portion to be exposed or semi-exposed to the one resist 63, and the exposure should not be performed. The intermediate portion 12f of the obtained second resist 12b may be in a cured state, a semi-cured state, or an uncured state. On the other hand, when the frame-shaped portion of the other resist 64 is exposed, the intermediate portion of the other resist 64 is half-exposed or not exposed, and is intermediate between the first resists 12a obtained. It is preferable that the portion 12d is in a semi-cured state or an uncured state. Further, when half-exposure is performed on the frame-shaped portion of another resist 64, either exposure or semi-exposure may be performed on the intermediate portion of the other resist 64, or exposure may not be performed. The intermediate portion 12d of the first resist 12a that can be obtained may be in a cured state, a semi-cured state, or an uncured state.

In addition, there is no particular need to match the properties of the frame-shaped portion 12c of the first resist 12a and the frame-shaped portion 12e of the second resist 12b. For example, the frame-shaped portion 12c of the first resist 12a When in the cured state, the frame-shaped portion 12e of the second resist 12b can be in a different state, such as being in a semi-cured state or an uncured state.

1 Vapor deposition mask 2 Mask body 2a Pattern formation area 2b Outer peripheral edge 3 Frame body 7 Metal layer 8 Vapor deposition through hole 9 Vapor deposition pattern 10 Master mold 11 Base part 12 Adhesive layer 12a First resist 12b Second resist 12c, 12e Frame shape Part 12d, 12f Intermediate part 13 Conductive layer 13a Sheet 13b Sheet 13c Sheet 14 Primary pattern resist 15, 15a Primary electrodeposition layer 16 Secondary pattern resist 17 Resist layer 18 Resist layer 18a, 18b Resist layer 19 Adhesive layer 41 Photomask 41a Transparent Optical hole 42 Photomask 42a Transparent hole 60 Substrate 61 Resist 62 Outer frame resist 63, 64 Resist 70 Photomask 71, 72 Photomask

Claims (4)

In the electric casting master mold used for manufacturing by electric casting of masks provided with a large number of through holes.
A plate-shaped base with at least one flat surface and
A sheet-like adhesive layer that is layered on the flat surface of the base and
It is provided with a single or multiple laminated structure, a conductive sheet-like conductive layer, which is adhered to the base portion via the adhesive layer.
The adhesive layer is arranged in contact with the base portion, and is arranged in contact with the conductive layer with a first dry film resist in which at least a frame-shaped portion within a predetermined range from the outer peripheral edge is in an uncured state having adhesiveness. It is provided with a second dry film resist in which at least a frame-shaped portion within a predetermined range from the outer peripheral edge is in an uncured state having adhesiveness.
The intermediate portion of at least one of the first dry film resist and the second dry film resist surrounded by the frame-shaped portion is characterized in that it is in a cured state having no adhesiveness and no change in volume with time. Mother mold for electric casting. In the electric casting master mold used for manufacturing by electric casting of masks provided with a large number of through holes.
A plate-shaped base with at least one flat surface and
A sheet-like adhesive layer that is layered on the flat surface of the base and
It is provided with a single or multiple laminated structure, a conductive sheet-like conductive layer, which is adhered to the base portion via the adhesive layer.
The adhesive layer is arranged in contact with the base portion, and is arranged in contact with the conductive layer with a first dry film resist in which at least a frame-shaped portion within a predetermined range from the outer peripheral edge is in an uncured state having adhesiveness. It is provided with a second dry film resist in which at least a frame-shaped portion within a predetermined range from the outer peripheral edge is in an uncured state having adhesiveness.
The intermediate portion of at least one of the first dry film resist and the second dry film resist surrounded by the frame-shaped portion is in a semi-cured state having less adhesiveness and volume change with time than the frame-shaped portion. A master mold for electric casting that features. In the electrocasting master mold according to claim 1 or 2,
The first dry film resist in the adhesive layer has the frame-shaped portion in an uncured state and the intermediate portion surrounded by the frame-shaped portion in a semi-cured state.
The second dry film resist in the adhesive layer is characterized in that the frame-shaped portion is in an uncured state and the intermediate portion surrounded by the frame-shaped portion is in a cured state. Type. In the method for manufacturing a master mold for electric casting, which is used for manufacturing a mask provided with a large number of through holes by electric casting.
A conductive layer forming step of forming one or a plurality of sheet-shaped conductive layers at predetermined positions on a predetermined flat metal substrate, and
An adhesive layer forming step of forming an adhesive layer having an adhesive function on the conductive layer,
The formed conductive layer and adhesive layer are arranged on a flat surface of a plate-shaped base portion by the adhesive force of the adhesive layer, and include a transfer step of separating from the substrate.
In the adhesive layer forming step, one resist, which is an unexposed negative dry film resist, is placed on the conductive layer, and the frame-shaped portion within a predetermined range from the outer peripheral edge of the one resist is not exposed and is not exposed. While leaving the exposure as it is, the intermediate portion of one resist surrounded by the frame-shaped portion is exposed to cure the intermediate portion.
Another resist, which is an unexposed negative dry film resist, is placed on one resist in which the intermediate portion is cured, and the frame-shaped portion within a predetermined range from the outer peripheral edge of the other resist is not exposed and is not exposed. While the exposure is left as it is, the intermediate portion of the other resist surrounded by the frame-shaped portion is subjected to a semi-exposure in which the exposure amount is smaller than the exposure to the intermediate portion of one resist.
A method for manufacturing a master mold for electric casting, wherein the one resist and the other resist are used as the adhesive layer.

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