JP2006044156A - Mold, micromold, mold manufacturing method and micromold manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold which can prevent an adhesive from being melted into a molded object, a micromold, a mold manufacturing method and a micromold manufacturing method. <P>SOLUTION: The mold has a base material 11 and a micromold 1 with a micropattern 1a arranged on the base material 11 and a fixture 12 which presses the micromold 1 to the base material 11 covering the peripheral edge of the micromold 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mold, a fine mold, a mold manufacturing method, and a fine mold manufacturing method.

  A mold for forming a microstructure is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-25647. 11 and 12 are schematic cross-sectional views showing the configuration of a mold disclosed in Japanese Patent Application Laid-Open No. 2004-25647 and a nesting used for the mold.

  Referring to FIG. 11, the mold 120 is configured to include a detachable insert 110. Referring to FIG. 12, the insert 110 includes a thin plate 101 having a fine uneven pattern 101 a on the surface, and a base 111 fixed to the back surface of the thin plate 101 with an adhesive 115.

Referring to FIG. 11, molten resin or the like is filled in cavity 120 a of mold 120, and pressurization, cooling, and solidification are performed, whereby the entire shape is formed by mold 120, and fine pattern 101 a of insert 110 is formed. Thus, a molded product in which a fine pattern is partially formed is obtained.
JP 2004-25647 A

  However, when a molten resin or the like is molded using the mold disclosed in the above publication, there is a problem that the adhesive 115 dissolves into the molten resin. When the adhesive 115 melts into the molten resin in this way, there arises a problem that the relative dielectric constant of the composite piezoelectric material cannot be lowered when the composite piezoelectric material is manufactured using, for example, the molten resin.

  Therefore, an object of the present invention is to provide a mold, a fine mold, a method for producing a mold, and a method for producing a fine mold, which can prevent the adhesive from melting into the molding.

  The mold of the present invention includes a base material, a fine mold disposed on the base material and having a fine pattern, and a jig for pressing the fine mold against the base material while covering the periphery of the fine mold. Yes.

  According to the mold of the present invention, since the jig presses the fine mold against the base material, the fine mold can be fixed to the base material without using an adhesive. Therefore, the adhesive does not melt into the molding.

  In the above mold, the base material and the fine mold are preferably fixed with an adhesive.

  By using an adhesive, a fine mold having a large area can be firmly fixed to the base material. Even if the base material and the fine mold are fixed by the adhesive, since the jig covers the periphery of the fine mold, the adhesive can be prevented from leaking between the jig and the fine mold. . Therefore, it is possible to prevent the adhesive from melting into the molding.

  Preferably, in the above mold, the adhesive includes one or more selected from the group consisting of an epoxy resin adhesive, a ceramic adhesive, an inorganic heat resistant adhesive, and an anaerobic impregnation adhesive.

  Since the above adhesive has heat resistance, even if heat is applied to the fine mold by performing thermosetting mold, the adhesive strength of the adhesive does not decrease.

  In the above mold, the fine pattern of the fine mold preferably has a fine structure of 50 μm or less.

  Thereby, it becomes possible to give a fine process to a molded object.

  Preferably, in the above mold, the fine mold has a first conductive film having a fine pattern on the surface and one of tensile stress and compressive stress inside, and a back surface of the first conductive film. And a second conductive film having one of tensile stress and compressive stress formed therein.

  Thereby, the warp of the first conductive film can be reduced as will be described later.

  The fine mold of the present invention is formed on the back surface of the first conductive film having a fine pattern on the surface and having either one of tensile stress and compressive stress inside, and And a second conductive film having either one of tensile stress and compressive stress therein.

  When the first conductive film has any one of tensile stress and compressive stress therein, the first conductive film may be warped. According to the fine mold of the present invention, the second conductive film having a stress opposite to that of the first conductive film is formed on the back surface of the first conductive film. Occurrence can be prevented, and even when warping occurs, the warping can be reduced.

  In the above fine mold, preferably, the material of the fine mold includes at least one selected from the group consisting of matte nickel (Ni), nickel (Ni) -manganese (Mn) alloy, and bright nickel (Ni). .

  Matte nickel exhibits tensile stress, and nickel-manganese alloy and bright nickel exhibit compressive stress. Therefore, the combination of these can reduce the warp of the first conductive film.

  In the fine mold described above, the second conductive film is preferably configured by laminating a plurality of layers.

  When the internal stress of the first conductive film is large, the internal stress of the second conductive film (stress opposite to that of the first conductive film) is also used in order to suppress the warpage of the first conductive film. It needs to be bigger. However, in this case, stress concentration may occur at the interface between the first conductive film and the second conductive film, and the first conductive film and the second conductive film may be separated. Therefore, in the present invention, a plurality of layers are stacked to form the second conductive film, and each internal stress in the plurality of layers is changed stepwise to concentrate stress at the interface. Can be reduced and peeling can be prevented.

  The mold manufacturing method of the present invention includes a step of forming a fine mold having a fine pattern, a step of placing the fine mold on a base material, and a jig so as to cover the periphery of the fine mold. And a step of pressing and fixing the fine mold against the base material with the jig.

  According to the mold manufacturing method of the present invention, since the jig presses the fine mold against the base material, the fine mold can be fixed to the base material without using an adhesive. Therefore, it is possible to prevent the adhesive from melting into the molding.

  In the above mold manufacturing method, preferably, the fine pattern of the fine mold is formed by lithography.

  Thus, by forming a fine pattern by lithography, the fine pattern can be made into a fine structure of 50 μm or less.

  The method for producing a fine mold of the present invention comprises a step of forming a first conductive film having a fine pattern on the surface and having either a tensile stress or a compressive stress inside by plating, and a tensile stress inside. And a step of forming a second conductive film having one of compression stress and the other on the back surface of the first conductive film by plating.

  According to the method for manufacturing a fine mold of the present invention, the second conductive film having a stress opposite to that of the first conductive film is formed on the back surface of the first conductive film. The occurrence of warping can be prevented, and even when warping occurs, the warping can be reduced.

  In the above-described fine mold manufacturing method, preferably, the current density when the second conductive film is formed by plating is changed in order to control the warp of the first conductive film.

  Since the internal stress of the plating film can be changed by changing the current density of plating, depending on the internal stress of the first conductive film, by changing the current density during plating of the second conductive film, The internal stress of the second conductive film can be controlled, and the warp of the first conductive film can be effectively reduced.

  As described above, according to the present invention, it is possible to obtain a mold, a fine mold, a method for producing a mold, and a method for producing a fine mold, which can prevent the adhesive from being dissolved into the molding object.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view schematically showing a configuration of a mold according to Embodiment 1 of the present invention. Referring to FIG. 1, the mold in the present embodiment includes a fine mold 10, a base material 11, a jig 12, and a screw 13. The fine mold 10 is made of, for example, a thin plate 1 made of nickel, and has a fine pattern 1 a formed on the surface of the thin plate 1. Further, the outer side of the formation area of the fine pattern 1a in the fine mold 10 constitutes a flange portion 1b. The fine mold 10 is arranged so as to be in direct contact with the surface of the base material 11. In this state, the jig 12 presses the flange portion 1 b of the fine mold 10 against the base material 11 while covering the periphery of the fine mold 10. The jig 12 is fastened to the base material 11 by, for example, screws 13.

  The fine pattern 1a is formed by lithography as described later, and has a fine pattern structure of 50 μm or less.

  Next, the manufacturing method of this embodiment will be described.

  2-5 is schematic sectional drawing which shows the manufacturing method of the metal mold | die in Embodiment 1 of this invention in order of a process. Referring to FIG. 2, at least one surface (pattern forming surface) of glass master 21 is cleaned after being polished. On one surface of the glass master 21, a conductive film (not shown) such as nickel (Ni) or silver (Ag) is formed by sputtering, vapor deposition, electroless plating, or the like. Photoresist 22 is applied on the conductive film and exposed by exposure light transmitted through photomask 30. The photomask 30 includes a transparent substrate 31 and a patterned light shielding film 32, and the photoresist 22 is exposed by exposure light transmitted through a region where the light shielding film is not formed. Note that the photoresist 22 may be exposed by intermittently irradiating laser light without using a photomask.

  Referring to FIG. 3, by developing photoresist 22 after this exposure, when photoresist 22 is a positive type, a portion exposed by exposure of photoresist 22 is removed by development. Thereby, a resist pattern 22 is formed, and a fine resist structure including the resist pattern 22 and the glass master 21 is formed.

  Referring to FIG. 4, by using a conductive film formed on glass master 21 as one electrode and performing electroforming using a plating solution on a fine resist structure, a plated conductive film 1 made of, for example, nickel. Is formed on the resist pattern 22. Since the conductive film 1 is formed so as to be embedded in the cavity of the resist pattern 22, a fine pattern of 50 μm or less that matches the fine pattern of the resist pattern 22 is formed on the conductive film 1.

  Referring to FIG. 5, after forming conductive film 1, glass master disc 21 is peeled from conductive film 1, and resist pattern 22 is removed by ashing or the like. Thereby, the fine metal mold | die 10 which consists of the electrically conductive film 1 which has a fine pattern of 50 micrometers or less on the surface is formed.

  Referring to FIG. 1, after cutting the peripheral portion of fine mold 10 so that ridge portion 1 b remains, fine mold 10 is placed on a base 11 made of a nickel plate having a thickness of 5 mm, for example. A jig 12 is fixed to the base material 11 with screws 13 so as to press the flange portion 1b of the fine mold 10 toward the base material 11 side. At this time, it is preferable that the jig 12 covers the entire peripheral edge of the fine mold 10. Thereby, the metal mold | die of this Embodiment is manufactured.

  When a composite piezoelectric material is manufactured by LIGA (Lithographie Galvanoformung Abformung), a mold is manufactured by synchrotron radiation (SR) light, a resin mold is manufactured by molding the mold, and PZT (titanium) is formed on the resin mold. After the resin mold is removed by ashing, PZT is baked and combined to form a composite piezoelectric material. At this time, by irradiating the PZT with ashing plasma, the PZT surface can be modified and the relative dielectric constant of the composite piezoelectric material can be lowered. Therefore, the inventor of the present application injects PZT using a resin mold molded using a mold using an adhesive as disclosed in JP-A-2004-25647, removes the resin mold by ashing, and then ashes the PZT. The relative dielectric constant was attempted to be reduced by irradiating the plasma (250, 300 W), but the relative dielectric constant did not decrease. This is considered to be because the adhesive component of the mold oozes out into the resin and the component also enters PZT, which adversely affects the PZT characteristics.

  According to the present embodiment, since the jig 12 presses the fine mold 10 against the base material 11, the fine mold 10 can be fixed to the base material 11 without using an adhesive. Therefore, the adhesive does not melt into the molded object, and the above-described deterioration of the characteristics of the molded object does not occur.

  In the above description, the case where no adhesive is used between the fine mold 10 and the base material 11 has been described. However, in the present embodiment, the fine mold 10 and the base material 11 are bonded as shown in FIG. It may be fixed by the agent 15.

  According to the present embodiment, since the jig 12 covers the entire periphery of the fine mold 10, the adhesive 15 can be prevented from leaking from between the jig 12 and the fine mold 10. Therefore, it can prevent that the adhesive agent 15 melts into the molding object. Further, by using the adhesive 15, the fine mold 10 having a large area can be firmly fixed to the base material 11.

  The adhesive 15 is preferably made of a single substance or an arbitrary combination of an epoxy resin adhesive, a ceramic adhesive, an inorganic heat resistant adhesive, and an anaerobic impregnation adhesive. By selecting the above material as the material of the adhesive 15, it is possible to suppress a decrease in the adhesive force of the adhesive 15 even if heat is applied to the fine mold 10 by performing thermosetting molding.

(Embodiment 2)
When the fine mold 10 is formed by a plating method, it is conceivable that internal stress due to plating is generated in the fine mold 10 and warping occurs in the fine mold 10. For example, when the fine mold 10 is formed by matte nickel plating, there is a possibility that a tensile stress is generated in the fine mold 10 and warpage occurs. Thus, the present embodiment aims to suppress the occurrence of such warpage.

  FIG. 7 is a cross-sectional view schematically showing the configuration of the fine mold in the second embodiment of the present invention. Referring to FIG. 7, fine mold 10 includes conductive film 1 formed by, for example, matte nickel plating, and conductive film 2 formed by plating of at least one of nickel-manganese alloy and bright nickel. Have. A fine pattern 1a is formed on the surface of the conductive film 1, and a flange portion 1b is formed outside the fine pattern 1a. The conductive film 1 has a tensile stress inside by being formed by matte nickel plating. The conductive film 2 is formed on the back surface of the conductive film 1 and has a compressive stress inside by being formed by plating of at least one of a nickel-manganese alloy and bright nickel. That is, the conductive film 2 has a stress opposite to the internal stress of the conductive film 1.

  Similar to the first embodiment, the fine pattern 1a is formed by lithography, and has a fine pattern structure of 50 μm or less. Further, the outer side of the formation area of the fine pattern 1a in the fine mold 10 constitutes a flange portion 1b.

  Matte nickel means nickel plated with a nickel sulfamate solution, and bright nickel is plated with a solution of butynediol and saccharin as a brightener to a nickel sulfamate solution. Means nickel. The nickel-manganese alloy is formed by plating using a solution obtained by adding butynediol, saccharin, and manganese to a nickel sulfamate solution.

  As in the first embodiment, the fine mold 10 is disposed so as to be in direct contact with the surface of the base 11 as shown in FIG. In this state, the jig 12 presses the flange portion 1 b of the fine mold 10 against the base material 11 while covering the periphery of the fine mold 10. The jig 12 is fastened to the base material 11 by, for example, screws 13.

  Next, the manufacturing method of this embodiment will be described.

  The manufacturing method of the present embodiment first undergoes the same steps as those of the first embodiment shown in FIGS. At this time, the conductive film 1 shown in FIG. 4 is formed by plating matte nickel using, for example, a nickel sulfamate solution. For this reason, for example, tensile stress is generated in the conductive film 1. After the conductive film 1 is formed, polishing is performed to flatten the plated surface of the conductive film. After this polishing, the glass master 21 is peeled off, and the register pattern 22 is removed by ashing or the like.

  Referring to FIG. 7, after forming conductive film 1, a pretreatment for sulfuric acid plating is performed to remove the nickel oxide film layer on the polished surface, and then conductive film 2 is formed on the back surface of conductive film 1 by plating. The The conductive film 2 may be formed, for example, by plating bright nickel using a solution obtained by adding butynediol and saccharin as a brightener to a nickel sulfamate solution. It may be formed by plating a nickel-manganese alloy using a solution obtained by adding nickel and manganese. As a result, a stress opposite to that of the conductive film 1, that is, a compressive stress is generated inside the conductive film 2.

  Further, when the conductive film 2 is plated, the internal stress of the conductive film 2 can be controlled by changing the current density. Thereby, the internal stress of the conductive film 2 can be controlled in accordance with the internal stress of the conductive film 1.

  After this plating, the back surface of the conductive film 2 is flattened by polishing.

  Thus, the fine mold 10 composed of the conductive film 1 and the conductive film 2 is formed.

  Referring to FIG. 8, after the fine mold 10 is formed, the fine mold 10 is made of a nickel plate having a thickness of 5 mm, for example, after cutting the peripheral portion of the fine mold 10 so that the flange portion 1b remains. It is arranged on the base material 11. A jig 12 is fixed to the base material 11 with screws 13 so as to press the flange portion 1b of the fine mold 10 toward the base material 11 side. At this time, it is preferable that the jig 12 covers the entire peripheral edge of the fine mold 10. Thereby, the metal mold | die of this Embodiment is manufactured.

  According to the present embodiment, since the fine mold 10 has the conductive film 2 having the internal stress opposite to the internal stress of the conductive film 1 formed on the back surface of the conductive film 1, It can be suppressed by the conductive film 2.

  Since the jig 12 presses the fine mold 10 against the base material 11, the fine mold 10 can be fixed to the base material 11 without using an adhesive. Therefore, the adhesive does not melt into the molded object, and the above-described deterioration of the characteristics of the molded object does not occur.

  In the above description, the conductive film 1 has a tensile stress and the conductive film 2 has a compressive stress. However, the conductive film 1 has a compressive stress, and the conductive film 2 has a tensile stress. Good.

  In the above description, the case where no adhesive is used between the fine mold 10 and the base material 11 has been described. However, in the present embodiment, the fine mold 10 and the base material 11 are bonded as shown in FIG. It may be fixed by the agent 15.

  According to the present embodiment, since the jig 12 covers the entire periphery of the fine mold 10, the adhesive 15 can be prevented from leaking from between the jig 12 and the fine mold 10. Therefore, it can prevent that the adhesive agent 15 melts into the molding object. Further, by using the adhesive 15, the fine mold 10 having a large area can be firmly fixed to the base material 11.

  The adhesive 15 is preferably made of a single substance or an arbitrary combination of an epoxy resin adhesive, a ceramic adhesive, an inorganic heat resistant adhesive, and an anaerobic impregnation adhesive. By selecting the above material as the material of the adhesive 15, it is possible to suppress a decrease in the adhesive force of the adhesive 15 even if heat is applied to the fine mold 10 by performing thermosetting molding.

  When the internal stress of the conductive film 1 is large, it is necessary to increase the internal stress of the conductive film 2 (stress opposite to that of the conductive film 1) in order to suppress warping of the conductive film 1. However, in this case, stress concentration may occur at the interface between the conductive film 1 and the conductive film 2, and the conductive film 1 and the conductive film 2 may be separated.

  Therefore, as shown in FIG. 10, a plurality of layers (for example, two layers 2a and 2b) are stacked to form a conductive film 2, and each internal stress in the plurality of layers (for example, two layers 2a and 2b) is measured. By changing in a stepwise manner (that is, making the internal stress of the layer 2a relatively small and making the internal stress of the layer 2b relatively large), stress concentration at the interface is reduced and peeling is prevented. Can do. In addition, although illustrated about the case of 2 layers 2a and 2b as a some layer, it is not limited to this, The electrically conductive film 2 may be 3 or more layers.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be particularly advantageously applied to a mold having a fine pattern of 50 μm or less, a fine mold, a method for producing a mold, and a method for producing a fine mold.

It is sectional drawing which shows schematically the structure of the metal mold | die in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 1st process of the manufacturing method of the metal mold | die in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 2nd process of the manufacturing method of the metal mold | die in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 3rd process of the manufacturing method of the metal mold | die in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the 4th process of the manufacturing method of the metal mold | die in Embodiment 1 of this invention. It is a schematic sectional drawing which shows a mode that the fine metal mold | die and the base material were fixed with the adhesive agent in Embodiment 1 of this invention. It is sectional drawing which shows schematically the structure of the fine metal mold | die in Embodiment 2 of this invention. It is sectional drawing which shows schematically the structure of the metal mold | die in Embodiment 2 of this invention. It is a schematic sectional drawing which shows a mode that the fine metal mold | die and the base material were fixed with the adhesive agent in Embodiment 2 of this invention. It is a schematic sectional drawing which shows a mode that the electrically conductive film 2 was formed by lamination | stacking of multiple layers in Embodiment 2 of this invention. It is a schematic sectional drawing which shows the structure of the metal mold | die disclosed by Unexamined-Japanese-Patent No. 2004-25647. It is a schematic sectional drawing which shows the structure of the nest used for the metal mold | die disclosed by Unexamined-Japanese-Patent No. 2004-25647.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Conductive film (thin plate), 1a fine pattern, 1b ridge part, 2 conductive film, 2a, 2b layer, 10 fine mold, 11 base material, 12 jig, 13 screw, 15 adhesive, 21 glass master disk, 22 photo Resist (resist pattern), 30 photomask, 31 transparent substrate, 32 light shielding film.

Claims (12)

Base material,
A fine mold disposed on the base material and having a fine pattern;
A mold comprising: a jig for pressing the fine mold against the base material while covering a peripheral edge of the fine mold.   The mold according to claim 1, wherein the base material and the fine mold are fixed by an adhesive.   3. The adhesive according to claim 2, wherein the adhesive includes one or more selected from the group consisting of an epoxy resin adhesive, a ceramic adhesive, an inorganic heat resistant adhesive, and an anaerobic impregnation adhesive. Mold.   The mold according to claim 1, wherein the fine pattern of the fine mold has a fine structure of 50 μm or less. The fine mold is
A first conductive film having the fine pattern on the surface and having either one of tensile stress and compressive stress inside;
5. A second conductive film formed on the back surface of the first conductive film and having either one of a tensile stress and a compressive stress therein. 5. Mold. A first conductive film having a fine pattern on the surface and having either one of tensile stress and compressive stress inside;
A fine mold comprising: a second conductive film formed on a back surface of the first conductive film and having either one of a tensile stress and a compressive stress therein.   The fine mold according to claim 6, wherein the material of the fine mold includes at least one selected from the group consisting of matte nickel, nickel-manganese alloy, and bright nickel.   The fine mold according to claim 6 or 7, wherein the second conductive film is formed by laminating a plurality of layers. Forming a fine mold having a fine pattern;
Placing the fine mold on a base material;
A method of manufacturing a mold, comprising: arranging a jig so as to cover a peripheral edge of the fine mold, and pressing and fixing the fine mold against the base material with the jig.   The method of manufacturing a mold according to claim 9, wherein the fine pattern of the fine mold is formed by lithography. Forming a first conductive film having a fine pattern on the surface and having either one of tensile stress and compressive stress inside by plating; and
And a step of forming a second conductive film having either one of tensile stress and compressive stress inside by plating on the back surface of the first conductive film.   12. The method for manufacturing a fine mold according to claim 11, wherein the current density at the time of forming the second conductive film is changed by plating in order to control the warp of the first conductive film. .

Images