JP2005008872A - 発光装置及び蛍光体 - Google Patents

発光装置及び蛍光体 Download PDF

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Publication number
JP2005008872A
JP2005008872A JP2004152324A JP2004152324A JP2005008872A JP 2005008872 A JP2005008872 A JP 2005008872A JP 2004152324 A JP2004152324 A JP 2004152324A JP 2004152324 A JP2004152324 A JP 2004152324A JP 2005008872 A JP2005008872 A JP 2005008872A
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JP
Japan
Prior art keywords
light
rare earth
phosphor
earth element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004152324A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005008872A5 (enExample
Inventor
Tetsuo Murayama
徹郎 村山
Mitsuko Yabe
晃子 矢部
Kanji Shimizu
完二 清水
Takayuki Shoda
孝行 庄田
Masahiko Yoshino
正彦 吉野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2004152324A priority Critical patent/JP2005008872A/ja
Publication of JP2005008872A publication Critical patent/JP2005008872A/ja
Publication of JP2005008872A5 publication Critical patent/JP2005008872A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2004152324A 2003-05-22 2004-05-21 発光装置及び蛍光体 Pending JP2005008872A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004152324A JP2005008872A (ja) 2003-05-22 2004-05-21 発光装置及び蛍光体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003144388 2003-05-22
JP2004152324A JP2005008872A (ja) 2003-05-22 2004-05-21 発光装置及び蛍光体

Publications (2)

Publication Number Publication Date
JP2005008872A true JP2005008872A (ja) 2005-01-13
JP2005008872A5 JP2005008872A5 (enExample) 2007-06-28

Family

ID=34106514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004152324A Pending JP2005008872A (ja) 2003-05-22 2004-05-21 発光装置及び蛍光体

Country Status (1)

Country Link
JP (1) JP2005008872A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074932A1 (en) * 2005-12-27 2007-07-05 Showa Denko K.K. Light guide member, flat light source device, and display device
JP2007210900A (ja) * 2006-02-07 2007-08-23 Akita Univ カルボン酸−ジケトン複合系希土類金属錯体
JP2007250629A (ja) * 2006-03-14 2007-09-27 Toshiba Corp 発光装置及びその製造方法、並びに蛍光パターン形成物
JP2008303196A (ja) * 2007-06-11 2008-12-18 Orient Chem Ind Ltd β−ジケトン希土類金属錯体、その製造方法および製造中間体、ならびにβ−ジケトン希土類金属錯体を含むインキ組成物
JP2009200350A (ja) * 2008-02-22 2009-09-03 Hitachi Chem Co Ltd 光ドーピング用材料を含むワニス及びこれを用いてなる光導波路アンプ
US7839072B2 (en) 2006-05-24 2010-11-23 Citizen Electronics Co., Ltd. Translucent laminate sheet and light-emitting device using the translucent laminate sheet
JP2017079181A (ja) * 2015-10-21 2017-04-27 コニカミノルタ株式会社 光変換材料、光変換フィルム、及び発光素子
CN112384518A (zh) * 2018-07-10 2021-02-19 国立大学法人北海道大学 稀土配合物、发光材料、发光体、发光装置、夹层玻璃用中间膜、夹层玻璃、车辆用挡风玻璃、波长转换材料以及安全材料

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634782A (en) * 1979-08-31 1981-04-07 Asahi Chem Ind Co Ltd Novel energy converting substance and illuminant
JPH01302144A (ja) * 1988-03-21 1989-12-06 Jouko J Kankare 溶液中での電気発生のルミネセンスに基づく分析方法
JP2000256251A (ja) * 1999-03-09 2000-09-19 New Japan Chem Co Ltd 希土類金属担持ナノサイズ（ホスト−ゲスト）複合体
JP2002088282A (ja) * 2000-09-13 2002-03-27 Mitsubishi Chemicals Corp 有機ランタノイド錯体を含有する蛍光性印刷用インク

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634782A (en) * 1979-08-31 1981-04-07 Asahi Chem Ind Co Ltd Novel energy converting substance and illuminant
JPH01302144A (ja) * 1988-03-21 1989-12-06 Jouko J Kankare 溶液中での電気発生のルミネセンスに基づく分析方法
JP2000256251A (ja) * 1999-03-09 2000-09-19 New Japan Chem Co Ltd 希土類金属担持ナノサイズ（ホスト−ゲスト）複合体
JP2002088282A (ja) * 2000-09-13 2002-03-27 Mitsubishi Chemicals Corp 有機ランタノイド錯体を含有する蛍光性印刷用インク

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074932A1 (en) * 2005-12-27 2007-07-05 Showa Denko K.K. Light guide member, flat light source device, and display device
US7914197B2 (en) 2005-12-27 2011-03-29 Showa Denko K.K. Light guide member, flat light source device, and display device
JP2007210900A (ja) * 2006-02-07 2007-08-23 Akita Univ カルボン酸−ジケトン複合系希土類金属錯体
JP2007250629A (ja) * 2006-03-14 2007-09-27 Toshiba Corp 発光装置及びその製造方法、並びに蛍光パターン形成物
US7839072B2 (en) 2006-05-24 2010-11-23 Citizen Electronics Co., Ltd. Translucent laminate sheet and light-emitting device using the translucent laminate sheet
JP2008303196A (ja) * 2007-06-11 2008-12-18 Orient Chem Ind Ltd β−ジケトン希土類金属錯体、その製造方法および製造中間体、ならびにβ−ジケトン希土類金属錯体を含むインキ組成物
JP2009200350A (ja) * 2008-02-22 2009-09-03 Hitachi Chem Co Ltd 光ドーピング用材料を含むワニス及びこれを用いてなる光導波路アンプ
JP2017079181A (ja) * 2015-10-21 2017-04-27 コニカミノルタ株式会社 光変換材料、光変換フィルム、及び発光素子
CN112384518A (zh) * 2018-07-10 2021-02-19 国立大学法人北海道大学 稀土配合物、发光材料、发光体、发光装置、夹层玻璃用中间膜、夹层玻璃、车辆用挡风玻璃、波长转换材料以及安全材料
CN112384518B (zh) * 2018-07-10 2023-10-20 国立大学法人北海道大学 稀土配合物、发光材料、发光体、发光装置、夹层玻璃用中间膜、夹层玻璃、车辆用挡风玻璃、波长转换材料以及安全材料
US12312369B2 (en) 2018-07-10 2025-05-27 National University Corporation Hokkaido University Rare-earth complex, light-emitting material, light-emitting object, light-emitting device, interlayer for laminated glass, laminated glass, windshield for vehicle, wavelength conversion material, and security material

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