JP2004535306A5 - - Google Patents
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- Publication number
- JP2004535306A5 JP2004535306A5 JP2003513743A JP2003513743A JP2004535306A5 JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5 JP 2003513743 A JP2003513743 A JP 2003513743A JP 2003513743 A JP2003513743 A JP 2003513743A JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive article
- wear indicator
- abrasive
- fixed abrasive
- composite element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002131 composite material Substances 0.000 claims 3
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/910,425 US20020077037A1 (en) | 1999-05-03 | 2001-07-20 | Fixed abrasive articles |
PCT/US2002/021940 WO2003008151A1 (en) | 2001-07-20 | 2002-07-12 | Fixed abrasive articles with wear indicators |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004535306A JP2004535306A (ja) | 2004-11-25 |
JP2004535306A5 true JP2004535306A5 (es) | 2006-01-05 |
Family
ID=25428766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003513743A Withdrawn JP2004535306A (ja) | 2001-07-20 | 2002-07-12 | 摩耗インジケータを有する固定研磨物品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20020077037A1 (es) |
EP (1) | EP1409201A1 (es) |
JP (1) | JP2004535306A (es) |
KR (1) | KR20040017328A (es) |
CN (1) | CN1535197A (es) |
TW (1) | TW565488B (es) |
WO (1) | WO2003008151A1 (es) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US6991526B2 (en) | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
US6837983B2 (en) * | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
US20050176251A1 (en) * | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
KR101165114B1 (ko) * | 2004-10-06 | 2012-07-12 | 라지브 바자즈 | 향상된 화학 기계적 평탄화 작업용 장치 및 방법 |
CN102513920B (zh) * | 2004-11-01 | 2016-04-27 | 株式会社荏原制作所 | 抛光设备 |
US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US20140120807A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
WO2007005452A1 (en) | 2005-06-29 | 2007-01-11 | Saint-Gobain Abrasives, Inc. | High performance resin for abrasive products |
US7494519B2 (en) * | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
JP4756583B2 (ja) * | 2005-08-30 | 2011-08-24 | 株式会社東京精密 | 研磨パッド、パッドドレッシング評価方法、及び研磨装置 |
US8262757B2 (en) * | 2006-04-04 | 2012-09-11 | Saint-Gobain Abrasives, Inc. | Infrared cured abrasive articles |
US20070243798A1 (en) * | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
US7410413B2 (en) * | 2006-04-27 | 2008-08-12 | 3M Innovative Properties Company | Structured abrasive article and method of making and using the same |
US7422982B2 (en) * | 2006-07-07 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
BRPI0814178A2 (pt) * | 2007-07-27 | 2015-01-27 | Saint Gobain Abrasives Inc | Produtos abrasivos com marcas de junção e detecção automática de junções |
US20090110890A1 (en) * | 2007-10-30 | 2009-04-30 | 3M Innovative Properties Company | Color changing wear indicator |
WO2009123659A1 (en) * | 2008-04-01 | 2009-10-08 | Innopad, Inc. | Polishing pad with controlled void formation |
US20090307986A1 (en) * | 2008-06-12 | 2009-12-17 | Hung-Hui Huang | Polishing composition and making method thereof for polishing a substrate |
US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
US20100227141A1 (en) * | 2009-03-05 | 2010-09-09 | Gm Global Technology Operations, Inc. | Protective coating for industrial parts |
US20110021114A1 (en) * | 2009-07-27 | 2011-01-27 | Mcardle James L | Abrasive article with preconditioning and persistent indicators |
SG187536A1 (en) * | 2010-08-31 | 2013-03-28 | Hoya Corp | Method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk |
CN102229099A (zh) * | 2011-05-22 | 2011-11-02 | 浙江省天台祥和实业有限公司 | 密封件研磨清洗机 |
CN102499604A (zh) * | 2011-11-01 | 2012-06-20 | 常熟新诚鑫织造有限公司 | 带使用提示装置的毛巾面料 |
US9746129B2 (en) | 2012-09-28 | 2017-08-29 | Momentive Performance Materials Inc. | Puck wear detection |
JP5373171B1 (ja) * | 2012-10-20 | 2013-12-18 | 株式会社ナノテム | 砥石およびそれを用いた研削・研磨装置 |
KR101506613B1 (ko) | 2013-05-13 | 2015-03-27 | 이화다이아몬드공업 주식회사 | 와이어 절삭공구 및 그 제조방법 |
KR200478500Y1 (ko) | 2013-10-01 | 2015-10-14 | 김도영 | 양면 연마장치용 연마패드 |
GB2537161B (en) * | 2015-04-10 | 2019-06-19 | Reckitt Benckiser Brands Ltd | Novel material |
CN109068930A (zh) * | 2016-04-29 | 2018-12-21 | 3M创新有限公司 | 包括形成印刷说明的擦洗主体的清洁制品 |
DE102016115770A1 (de) * | 2016-08-25 | 2018-03-01 | Smiths Heimann Gmbh | Strahlenschutzelement mit integrierter Austauschanzeige |
JP6732381B2 (ja) * | 2016-10-03 | 2020-07-29 | 株式会社ディスコ | 切削装置 |
US10344993B2 (en) * | 2017-06-29 | 2019-07-09 | Deere & Company | Extractor fan with wear indicator |
WO2019014282A1 (en) | 2017-07-10 | 2019-01-17 | Osborn, A Unit Of Jason Incorporated | ABRASIVE POLISHING OR BUFFLAGE ARTICLE WITHOUT COMPOUND |
CN107685288B (zh) * | 2017-09-05 | 2019-05-10 | 南京航空航天大学 | 一种游离磨粒轨迹检测方法 |
CN109420973B (zh) * | 2017-09-05 | 2020-11-17 | 联华电子股份有限公司 | 晶片研磨盘与其使用方法 |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
CN108127582B (zh) * | 2017-12-13 | 2019-12-31 | 湖北鼎汇微电子材料有限公司 | 一种制备抛光层的模具及制备方法 |
CN109108800A (zh) * | 2018-08-13 | 2019-01-01 | 芜湖九鼎电子科技有限公司 | 一种全自动仪表镜面磨光机 |
EP3616840A1 (en) * | 2018-09-03 | 2020-03-04 | 3M Innovative Properties Company | Abrasive article |
US11911871B2 (en) * | 2018-10-31 | 2024-02-27 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing composite article |
WO2020128716A1 (en) | 2018-12-18 | 2020-06-25 | 3M Innovative Properties Company | Abrasive article maker with differential tooling speed |
WO2020128853A1 (en) | 2018-12-18 | 2020-06-25 | 3M Innovative Properties Company | Tooling splice accommodation for abrasive article production |
CN113195162A (zh) * | 2018-12-18 | 2021-07-30 | 3M创新有限公司 | 图案化磨料基底和方法 |
CN109454547A (zh) * | 2018-12-27 | 2019-03-12 | 杭州众硅电子科技有限公司 | 一种用于cmp抛光垫寿命在线检测的系统和方法 |
CN111896407A (zh) * | 2020-06-09 | 2020-11-06 | 河北招岳聚氨酯制品有限公司 | 一种筛板磨损监测系统 |
CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
WO2023248086A1 (en) * | 2022-06-22 | 2023-12-28 | 3M Innovative Properties Company | Abrasive articles, systems and methods of use |
EP4364945A1 (en) * | 2022-11-01 | 2024-05-08 | Roller Bearing Company of America, Inc. | Machinable molded fretting buffer |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5014468A (en) * | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
AT396213B (de) * | 1990-04-11 | 1993-07-26 | Swarovski Tyrolit Schleif | Schleifscheibe |
US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
JP3286941B2 (ja) * | 1991-07-09 | 2002-05-27 | 株式会社日立製作所 | ダイヤモンド研削砥石のツルーイング法 |
US5437754A (en) * | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
US5243790A (en) * | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
US6022264A (en) * | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
US5454844A (en) * | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
US5536202A (en) * | 1994-07-27 | 1996-07-16 | Texas Instruments Incorporated | Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
US5527424A (en) * | 1995-01-30 | 1996-06-18 | Motorola, Inc. | Preconditioner for a polishing pad and method for using the same |
JP3438383B2 (ja) * | 1995-03-03 | 2003-08-18 | ソニー株式会社 | 研磨方法およびこれに用いる研磨装置 |
JP3708167B2 (ja) * | 1995-05-17 | 2005-10-19 | 株式会社荏原製作所 | 研磨布及び該研磨布を備えたポリッシング装置 |
US5868605A (en) * | 1995-06-02 | 1999-02-09 | Speedfam Corporation | In-situ polishing pad flatness control |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
JP2830907B2 (ja) * | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | 半導体基板研磨装置 |
US5743784A (en) * | 1995-12-19 | 1998-04-28 | Applied Materials, Inc. | Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process |
US5624303A (en) * | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
US6090475A (en) * | 1996-05-24 | 2000-07-18 | Micron Technology Inc. | Polishing pad, methods of manufacturing and use |
US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
JPH106218A (ja) * | 1996-06-27 | 1998-01-13 | Minnesota Mining & Mfg Co <3M> | ドレッシング用研磨材製品 |
JPH1015807A (ja) * | 1996-07-01 | 1998-01-20 | Canon Inc | 研磨システム |
US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US6080215A (en) * | 1996-08-12 | 2000-06-27 | 3M Innovative Properties Company | Abrasive article and method of making such article |
US5725417A (en) * | 1996-11-05 | 1998-03-10 | Micron Technology, Inc. | Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates |
KR100210840B1 (ko) * | 1996-12-24 | 1999-07-15 | 구본준 | 기계 화학적 연마 방법 및 그 장치 |
US5842910A (en) * | 1997-03-10 | 1998-12-01 | International Business Machines Corporation | Off-center grooved polish pad for CMP |
US5944583A (en) * | 1997-03-17 | 1999-08-31 | International Business Machines Corporation | Composite polish pad for CMP |
US5899745A (en) * | 1997-07-03 | 1999-05-04 | Motorola, Inc. | Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor |
US5904615A (en) * | 1997-07-18 | 1999-05-18 | Hankook Machine Tools Co., Ltd. | Pad conditioner for chemical mechanical polishing apparatus |
US5913713A (en) * | 1997-07-31 | 1999-06-22 | International Business Machines Corporation | CMP polishing pad backside modifications for advantageous polishing results |
US6168508B1 (en) * | 1997-08-25 | 2001-01-02 | Lsi Logic Corporation | Polishing pad surface for improved process control |
US6121143A (en) * | 1997-09-19 | 2000-09-19 | 3M Innovative Properties Company | Abrasive articles comprising a fluorochemical agent for wafer surface modification |
US5916010A (en) * | 1997-10-30 | 1999-06-29 | International Business Machines Corporation | CMP pad maintenance apparatus and method |
JP3295888B2 (ja) * | 1998-04-22 | 2002-06-24 | 株式会社藤森技術研究所 | ケミカルマシンポリッシャの研磨盤用研磨ドレッサ |
US6106661A (en) * | 1998-05-08 | 2000-08-22 | Advanced Micro Devices, Inc. | Polishing pad having a wear level indicator and system using the same |
JPH11347919A (ja) * | 1998-06-09 | 1999-12-21 | Oki Electric Ind Co Ltd | 半導体素子の研磨平坦化装置及び研磨平坦化方法 |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
US6093085A (en) * | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
GB2345657B (en) * | 1999-01-13 | 2001-08-15 | United Microelectronics Corp | Lifetime self-indicated polishing pad |
US6244935B1 (en) * | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
US6238592B1 (en) * | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
US6264533B1 (en) * | 1999-05-28 | 2001-07-24 | 3M Innovative Properties Company | Abrasive processing apparatus and method employing encoded abrasive product |
-
2001
- 2001-07-20 US US09/910,425 patent/US20020077037A1/en not_active Abandoned
-
2002
- 2002-07-12 KR KR10-2004-7000826A patent/KR20040017328A/ko not_active Application Discontinuation
- 2002-07-12 WO PCT/US2002/021940 patent/WO2003008151A1/en active Application Filing
- 2002-07-12 JP JP2003513743A patent/JP2004535306A/ja not_active Withdrawn
- 2002-07-12 CN CNA028147529A patent/CN1535197A/zh active Pending
- 2002-07-12 EP EP02746972A patent/EP1409201A1/en not_active Withdrawn
- 2002-07-19 TW TW091116153A patent/TW565488B/zh active
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