JP2004526869A5 - - Google Patents

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Publication number
JP2004526869A5
JP2004526869A5 JP2002591550A JP2002591550A JP2004526869A5 JP 2004526869 A5 JP2004526869 A5 JP 2004526869A5 JP 2002591550 A JP2002591550 A JP 2002591550A JP 2002591550 A JP2002591550 A JP 2002591550A JP 2004526869 A5 JP2004526869 A5 JP 2004526869A5
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JP
Japan
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JP2002591550A
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JP4686113B2 (ja
JP2004526869A (ja
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Priority claimed from DE10124631A external-priority patent/DE10124631C1/de
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Publication of JP2004526869A publication Critical patent/JP2004526869A/ja
Publication of JP2004526869A5 publication Critical patent/JP2004526869A5/ja
Application granted granted Critical
Publication of JP4686113B2 publication Critical patent/JP4686113B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002591550A 2001-05-18 2002-05-13 非導電基板の直接電解金属被膜 Expired - Fee Related JP4686113B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10124631A DE10124631C1 (de) 2001-05-18 2001-05-18 Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
PCT/EP2002/005250 WO2002095091A2 (en) 2001-05-18 2002-05-13 Direct electrolytic metallization of non-conducting substrates

Publications (3)

Publication Number Publication Date
JP2004526869A JP2004526869A (ja) 2004-09-02
JP2004526869A5 true JP2004526869A5 (ja) 2005-12-22
JP4686113B2 JP4686113B2 (ja) 2011-05-18

Family

ID=7685522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002591550A Expired - Fee Related JP4686113B2 (ja) 2001-05-18 2002-05-13 非導電基板の直接電解金属被膜

Country Status (15)

Country Link
US (1) US7025867B2 (ja)
EP (1) EP1390568B1 (ja)
JP (1) JP4686113B2 (ja)
KR (1) KR100863161B1 (ja)
CN (1) CN1329557C (ja)
AT (1) ATE272730T1 (ja)
BR (1) BR0209331B1 (ja)
CA (1) CA2437105A1 (ja)
DE (2) DE10124631C1 (ja)
ES (1) ES2225785T3 (ja)
HK (1) HK1060753A1 (ja)
MX (1) MXPA03010344A (ja)
MY (1) MY126221A (ja)
TW (1) TW555893B (ja)
WO (1) WO2002095091A2 (ja)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US7365007B2 (en) * 2004-06-30 2008-04-29 Intel Corporation Interconnects with direct metalization and conductive polymer
US20060105453A1 (en) * 2004-09-09 2006-05-18 Brenan Colin J Coating process for microfluidic sample arrays
EP1782075B1 (en) * 2004-08-04 2023-10-04 Life Technologies Corporation Method for differentially coating a substrate
JP4851707B2 (ja) * 2004-12-15 2012-01-11 セイコーインスツル株式会社 アルカリ電池の製造方法
JP4919961B2 (ja) * 2005-09-02 2012-04-18 荏原ユージライト株式会社 触媒付与増強剤
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US7354870B2 (en) 2005-11-14 2008-04-08 National Research Council Of Canada Process for chemical etching of parts fabricated by stereolithography
EP1870491B1 (de) * 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
JP2008021942A (ja) * 2006-07-14 2008-01-31 Rohm & Haas Electronic Materials Llc 銅と樹脂の複合体製造方法
DE102006042076A1 (de) * 2006-09-05 2008-03-20 Goldschmidt Tib Gmbh Ein neues Additiv für Chromelektrolyte
JP5236648B2 (ja) * 2006-09-07 2013-07-17 エンソン インコーポレイテッド 電解めっき銅金属配線で絶縁性基板の表面を金属配線するための方法
EP1897974B1 (en) * 2006-09-07 2012-08-01 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
EP1918426A1 (de) 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
US8840967B2 (en) * 2006-10-11 2014-09-23 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing printed circuit board including flame retardant insulation layer
US20080142478A1 (en) * 2006-11-01 2008-06-19 Microchem Corp. Epoxy removal process for microformed electroplated devices
CN101029409B (zh) * 2006-11-24 2011-03-16 江苏工业学院 印制线路板直接孔金属化的前处理溶液及方法
EP1978582A1 (en) * 2007-04-05 2008-10-08 Atotech Deutschland Gmbh Process for the preparation of electrodes for use in a fuel cell
US20110064954A1 (en) * 2008-05-22 2011-03-17 Ebara-Udylite Co., Ltd. Method for conditioning insulating resin and its use
US8318265B2 (en) * 2008-06-12 2012-11-27 General Electric Company Plasma mediated processing of non-conductive substrates
EP2180770A1 (en) 2008-10-21 2010-04-28 Atotech Deutschland Gmbh Method to form solder deposits on substrates
EP2244285A1 (en) 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
CN101696323B (zh) * 2009-10-30 2012-03-21 华南师范大学 一种用于超级电容器的聚苯胺/二氧化锰复合材料的制备方法
EP2405469B1 (en) 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Method to form solder alloy deposits on substrates
EP2405468A1 (en) 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
EP2601822B1 (en) 2010-08-02 2019-07-10 ATOTECH Deutschland GmbH Method to form solder deposits and non-melting bump structures on substrates
EP2506690A1 (en) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Method to form solder deposits and non-melting bump structures on substrates
EP2416634A1 (en) 2010-08-02 2012-02-08 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
PL2447296T3 (pl) 2010-10-29 2018-06-29 Macdermid Enthone Inc. Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych
WO2016116876A1 (en) * 2015-01-20 2016-07-28 Enthone Inc. Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrates
EP2602357A1 (en) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
CN104204294B (zh) * 2012-03-29 2018-12-07 德国艾托特克公司 促进介电衬底与金属层之间粘着度的方法
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
EP2645830B1 (en) * 2012-03-29 2014-10-08 Atotech Deutschland GmbH Method for manufacture of fine line circuitry
CN104145537A (zh) * 2012-03-29 2014-11-12 德国艾托特克公司 细线电路的制造方法
ES2556981T3 (es) 2012-04-24 2016-01-21 Enthone Inc. Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico
ES2573137T3 (es) 2012-09-14 2016-06-06 Atotech Deutschland Gmbh Método de metalización de sustratos de célula solar
KR101294229B1 (ko) * 2012-12-10 2013-08-07 와이엠티 주식회사 인쇄회로기판의 쓰루 홀 또는 비아 홀 내벽에 전도성폴리머층을 형성하는 방법
CN104284527A (zh) * 2013-07-01 2015-01-14 深圳市环基实业有限公司 印刷电路板及其制作方法
CN104427744A (zh) * 2013-08-30 2015-03-18 富葵精密组件(深圳)有限公司 电路板及其制作方法
WO2015044091A1 (en) 2013-09-26 2015-04-02 Atotech Deutschland Gmbh Novel adhesion promoting process for metallisation of substrate surfaces
EP2937446B1 (en) * 2013-10-22 2018-06-13 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin material
JP6406841B2 (ja) 2014-03-24 2018-10-17 アトテック・ドイチュラント・ゲーエムベーハーＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ Ｇｍｂｈ 金属層形成方法およびプリント回路基板製造方法
CN104080278B (zh) * 2014-06-24 2017-06-06 柏承科技(昆山)股份有限公司 线路板高分子导电膜孔工艺及其搭配图形电镀的生产工艺
JP6562651B2 (ja) * 2015-02-20 2019-08-21 キヤノン株式会社 半導体装置の製造方法
CN105132977B (zh) * 2015-08-31 2017-12-29 广东东硕科技有限公司 一种用于线路板制造的调整液及其制备方法
EP3228729A1 (en) 2016-04-04 2017-10-11 COVENTYA S.p.A. Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath
US10151035B2 (en) 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
ES2708341T3 (es) 2016-11-22 2019-04-09 Macdermid Enthone Gmbh Grabado exento de cromo para un galvanizado sobre plástico
CN107723764A (zh) * 2017-10-31 2018-02-23 电子科技大学 一种在绝缘基材上直接电镀的方法
CN108601235A (zh) * 2017-12-28 2018-09-28 广东光华科技股份有限公司 绝缘基材表面电镀金属的方法
CN108645822A (zh) * 2018-06-19 2018-10-12 华电电力科学研究院有限公司 一种自动测定油品破乳化度的装置及测定方法
CN108977862B (zh) * 2018-08-30 2022-08-05 广东东硕科技有限公司 绝缘基材表面电镀金属的方法
CN111171356B (zh) 2018-10-24 2021-06-22 电子科技大学 一种制备复合型导电聚合物的方法
US11919036B1 (en) 2023-04-21 2024-03-05 Yield Engineering Systems, Inc. Method of improving the adhesion strength of metal-organic interfaces in electronic devices
US11818849B1 (en) 2023-04-21 2023-11-14 Yield Engineering Systems, Inc. Increasing adhesion of metal-organic interfaces by silane vapor treatment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE111294T1 (de) * 1988-03-03 1994-09-15 Blasberg Oberflaechentech Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
DE59010565D1 (de) * 1989-09-14 1996-12-19 Atotech Deutschland Gmbh Verfahren zur direkten Metallisierung von Leiterplatten
DE3939676C2 (de) * 1989-11-28 1994-01-27 Schering Ag Metallisierung von Nichtleitern
GB2243838A (en) * 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
DE59206858D1 (de) * 1991-04-26 1996-09-05 Blasberg Oberflaechentech Mittel zur selektiven ausbildung einer dünnen oxidierenden schicht
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
JP2587166B2 (ja) * 1992-05-14 1997-03-05 住友軽金属工業株式会社 曲面ハニカムパネル
ATE171560T1 (de) * 1993-03-09 1998-10-15 Koninkl Philips Electronics Nv Herstellungsverfahren eines musters von einem elektrisch leitfähigen polymer auf einer substratoberfläche und metallisierung eines solchen musters
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition
JPH07179578A (ja) * 1993-12-24 1995-07-18 Mitsubishi Heavy Ind Ltd 導電性組成物の製法
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
EP0731192B2 (en) * 1995-03-10 2003-01-02 Shipley Company LLC Electroplating process and composition
DE19527056C1 (de) * 1995-07-25 1996-11-28 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer)
US6007824A (en) 1998-07-09 1999-12-28 Duckett; Melvin J. Natural composition and method for the treatment of sexual dysfunction
DE19903108A1 (de) * 1999-01-27 2000-08-03 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten

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