US6480359B1
(en)
*
|
2000-05-09 |
2002-11-12 |
3M Innovative Properties Company |
Hard disk drive suspension with integral flexible circuit
|
JP3663345B2
(ja)
*
|
2000-09-04 |
2005-06-22 |
アルプス電気株式会社 |
磁気ヘッド装置
|
JP3766585B2
(ja)
*
|
2000-09-04 |
2006-04-12 |
アルプス電気株式会社 |
磁気ヘッド装置の製造方法
|
JP3738679B2
(ja)
|
2000-09-12 |
2006-01-25 |
Tdk株式会社 |
ヘッドジンバルアセンブリ
|
JP3988420B2
(ja)
*
|
2001-09-19 |
2007-10-10 |
Tdk株式会社 |
薄膜磁気ヘッド用配線部材、ヘッドジンバルアセンブリ、ヘッドジンバルアセンブリの検査方法及びヘッドジンバルアセンブリの製造方法
|
US6940697B2
(en)
*
|
2001-12-05 |
2005-09-06 |
Samsung Electronics Co., Ltd. |
Interconnection scheme for head arms of disk drive actuator
|
JP3929319B2
(ja)
*
|
2002-02-01 |
2007-06-13 |
富士通株式会社 |
サスペンション及び磁気記録読出装置
|
US7130157B2
(en)
*
|
2002-08-14 |
2006-10-31 |
Seagate Technology Llc |
Head suspension having a displacement limiter
|
CN100476981C
(zh)
*
|
2003-03-17 |
2009-04-08 |
新科实业有限公司 |
制造硬盘驱动器悬架挠性梁的系统与方法
|
JP4222882B2
(ja)
*
|
2003-06-03 |
2009-02-12 |
日東電工株式会社 |
配線回路基板
|
JP2005011387A
(ja)
*
|
2003-06-16 |
2005-01-13 |
Hitachi Global Storage Technologies Inc |
磁気ディスク装置
|
US7004441B1
(en)
*
|
2003-07-24 |
2006-02-28 |
Rutland Michael D |
Clippable plastic note
|
US7006331B1
(en)
*
|
2003-09-30 |
2006-02-28 |
Western Digital Technologies, Inc. |
Head gimbal assembly including a trace suspension assembly backing layer with a conductive layer formed upon a gimbal having a lower oxidation rate
|
US6903891B1
(en)
*
|
2003-11-24 |
2005-06-07 |
Seagate Technology Llc |
Photoconductive optical write driver for magnetic recording
|
WO2005114658A2
(en)
*
|
2004-05-14 |
2005-12-01 |
Hutchinson Technology Incorporated |
Method for making noble metal conductive leads for suspension assemblies
|
US20060158784A1
(en)
*
|
2005-01-18 |
2006-07-20 |
Arya Satya P |
Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension
|
JP4611075B2
(ja)
*
|
2005-03-29 |
2011-01-12 |
日東電工株式会社 |
配線回路基板
|
TWI290093B
(en)
*
|
2005-03-31 |
2007-11-21 |
Nippon Steel Chemical Co |
Laminate for HDD suspension and process for producing the same
|
US7523549B1
(en)
*
|
2005-04-15 |
2009-04-28 |
Magnecomp Corporation |
Dimensionally stabilized flexible circuit fabrication method and product
|
US20090035541A1
(en)
*
|
2005-04-18 |
2009-02-05 |
Mitsui Chemicals, Inc. |
Metal laminate, method for manufacturing same and use thereof
|
US7379271B1
(en)
*
|
2005-05-16 |
2008-05-27 |
Magnecomp Corporation |
Multilayer gimbal suspension element manufacture with co-etchable layers
|
JP4619214B2
(ja)
*
|
2005-07-04 |
2011-01-26 |
日東電工株式会社 |
配線回路基板
|
JP4640802B2
(ja)
*
|
2005-07-07 |
2011-03-02 |
日東電工株式会社 |
回路付サスペンション基板
|
CN100546432C
(zh)
*
|
2005-10-25 |
2009-09-30 |
比亚迪股份有限公司 |
一种挠性印刷线路板的制造方法
|
JP4615427B2
(ja)
*
|
2005-12-01 |
2011-01-19 |
日東電工株式会社 |
配線回路基板
|
JP4588622B2
(ja)
*
|
2005-12-08 |
2010-12-01 |
日東電工株式会社 |
配線回路基板の製造方法
|
US7518830B1
(en)
*
|
2006-04-19 |
2009-04-14 |
Hutchinson Technology Incorporated |
Dual sided electrical traces for disk drive suspension flexures
|
JP2008034639A
(ja)
*
|
2006-07-28 |
2008-02-14 |
Nitto Denko Corp |
配線回路基板
|
JP4865453B2
(ja)
*
|
2006-08-30 |
2012-02-01 |
日東電工株式会社 |
配線回路基板およびその製造方法
|
US7710687B1
(en)
|
2006-09-13 |
2010-05-04 |
Hutchinson Technology Incorporated |
High conductivity ground planes for integrated lead suspensions
|
US7929252B1
(en)
*
|
2006-10-10 |
2011-04-19 |
Hutchinson Technology Incorporated |
Multi-layer ground plane structures for integrated lead suspensions
|
US7832082B1
(en)
*
|
2006-10-10 |
2010-11-16 |
Hutchinson Technology Incorporated |
Method for manufacturing an integrated lead suspension component
|
US7903376B2
(en)
*
|
2007-04-16 |
2011-03-08 |
Hitachi Global Storage Technologies Netherlands, B.V. |
Integrated lead suspension for vibration damping in magnetic storage device
|
JP2008282995A
(ja)
*
|
2007-05-10 |
2008-11-20 |
Nitto Denko Corp |
配線回路基板
|
JP4640852B2
(ja)
*
|
2007-11-12 |
2011-03-02 |
日東電工株式会社 |
配線回路基板の製造方法
|
JP4640853B2
(ja)
*
|
2007-11-12 |
2011-03-02 |
日東電工株式会社 |
配線回路基板
|
US8169746B1
(en)
|
2008-04-08 |
2012-05-01 |
Hutchinson Technology Incorporated |
Integrated lead suspension with multiple trace configurations
|
US20090274834A1
(en)
*
|
2008-05-01 |
2009-11-05 |
Xerox Corporation |
Bimetallic nanoparticles for conductive ink applications
|
JP5091810B2
(ja)
*
|
2008-09-03 |
2012-12-05 |
日東電工株式会社 |
配線回路基板およびその製造方法
|
JP5142951B2
(ja)
*
|
2008-11-10 |
2013-02-13 |
日東電工株式会社 |
配線回路基板およびその製造方法
|
US8045297B2
(en)
*
|
2008-11-25 |
2011-10-25 |
Hitachi Global Storage Technologies, Netherlands B.V. |
Flex cable and method for lowering flex cable impedance
|
US8542465B2
(en)
|
2010-03-17 |
2013-09-24 |
Western Digital Technologies, Inc. |
Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
|
US8885299B1
(en)
|
2010-05-24 |
2014-11-11 |
Hutchinson Technology Incorporated |
Low resistance ground joints for dual stage actuation disk drive suspensions
|
US8665567B2
(en)
|
2010-06-30 |
2014-03-04 |
Western Digital Technologies, Inc. |
Suspension assembly having a microactuator grounded to a flexure
|
JP5583539B2
(ja)
*
|
2010-10-01 |
2014-09-03 |
日本発條株式会社 |
フレキシャの配線構造
|
JP5762119B2
(ja)
*
|
2011-05-06 |
2015-08-12 |
日東電工株式会社 |
回路付きサスペンション基板およびその製造方法
|
JP5938223B2
(ja)
*
|
2012-02-10 |
2016-06-22 |
日東電工株式会社 |
配線回路基板およびその製造方法
|
US9001469B2
(en)
|
2012-03-16 |
2015-04-07 |
Hutchinson Technology Incorporated |
Mid-loadbeam dual stage actuated (DSA) disk drive head suspension
|
US9093117B2
(en)
|
2012-03-22 |
2015-07-28 |
Hutchinson Technology Incorporated |
Ground feature for disk drive head suspension flexures
|
US8861141B2
(en)
|
2012-08-31 |
2014-10-14 |
Hutchinson Technology Incorporated |
Damped dual stage actuation disk drive suspensions
|
US8681456B1
(en)
|
2012-09-14 |
2014-03-25 |
Hutchinson Technology Incorporated |
Co-located gimbal-based dual stage actuation disk drive suspensions
|
JP6356682B2
(ja)
|
2012-10-10 |
2018-07-11 |
ハッチンソン テクノロジー インコーポレイテッドHutchinson Technology Incorporated |
二段作動構造を有するサスペンション
|
US8941951B2
(en)
|
2012-11-28 |
2015-01-27 |
Hutchinson Technology Incorporated |
Head suspension flexure with integrated strain sensor and sputtered traces
|
US8891206B2
(en)
|
2012-12-17 |
2014-11-18 |
Hutchinson Technology Incorporated |
Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
|
US8896969B1
(en)
|
2013-05-23 |
2014-11-25 |
Hutchinson Technology Incorporated |
Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
|
US8717712B1
(en)
|
2013-07-15 |
2014-05-06 |
Hutchinson Technology Incorporated |
Disk drive suspension assembly having a partially flangeless load point dimple
|
US8792214B1
(en)
|
2013-07-23 |
2014-07-29 |
Hutchinson Technology Incorporated |
Electrical contacts to motors in dual stage actuated suspensions
|
US8675314B1
(en)
|
2013-08-21 |
2014-03-18 |
Hutchinson Technology Incorporated |
Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors
|
US8896970B1
(en)
|
2013-12-31 |
2014-11-25 |
Hutchinson Technology Incorporated |
Balanced co-located gimbal-based dual stage actuation disk drive suspensions
|
US8867173B1
(en)
|
2014-01-03 |
2014-10-21 |
Hutchinson Technology Incorporated |
Balanced multi-trace transmission in a hard disk drive flexure
|
US9070392B1
(en)
|
2014-12-16 |
2015-06-30 |
Hutchinson Technology Incorporated |
Piezoelectric disk drive suspension motors having plated stiffeners
|
US9318136B1
(en)
|
2014-12-22 |
2016-04-19 |
Hutchinson Technology Incorporated |
Multilayer disk drive motors having out-of-plane bending
|
US9296188B1
(en)
|
2015-02-17 |
2016-03-29 |
Hutchinson Technology Incorporated |
Partial curing of a microactuator mounting adhesive in a disk drive suspension
|
US9734852B2
(en)
|
2015-06-30 |
2017-08-15 |
Hutchinson Technology Incorporated |
Disk drive head suspension structures having improved gold-dielectric joint reliability
|
JP6688667B2
(ja)
*
|
2016-04-18 |
2020-04-28 |
日東電工株式会社 |
配線回路基板およびその製造方法
|
US9646638B1
(en)
|
2016-05-12 |
2017-05-09 |
Hutchinson Technology Incorporated |
Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
|
TWI646637B
(zh)
*
|
2018-02-13 |
2019-01-01 |
頎邦科技股份有限公司 |
薄膜覆晶封裝結構及其可撓性基板
|