JP2004363304A5 - - Google Patents

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Publication number
JP2004363304A5
JP2004363304A5 JP2003159576A JP2003159576A JP2004363304A5 JP 2004363304 A5 JP2004363304 A5 JP 2004363304A5 JP 2003159576 A JP2003159576 A JP 2003159576A JP 2003159576 A JP2003159576 A JP 2003159576A JP 2004363304 A5 JP2004363304 A5 JP 2004363304A5
Authority
JP
Japan
Prior art keywords
chip
defect
inspection
respect
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2003159576A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004363304A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003159576A priority Critical patent/JP2004363304A/ja
Priority claimed from JP2003159576A external-priority patent/JP2004363304A/ja
Priority to US10/859,189 priority patent/US6992499B2/en
Publication of JP2004363304A publication Critical patent/JP2004363304A/ja
Publication of JP2004363304A5 publication Critical patent/JP2004363304A5/ja
Abandoned legal-status Critical Current

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JP2003159576A 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置 Abandoned JP2004363304A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003159576A JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置
US10/859,189 US6992499B2 (en) 2003-06-04 2004-06-03 Test method and test apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003159576A JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置

Publications (2)

Publication Number Publication Date
JP2004363304A JP2004363304A (ja) 2004-12-24
JP2004363304A5 true JP2004363304A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-06-23

Family

ID=33562194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003159576A Abandoned JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置

Country Status (2)

Country Link
US (1) US6992499B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2004363304A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082859A1 (en) 2002-07-01 2004-04-29 Alan Schaer Method and apparatus employing ultrasound energy to treat body sphincters
KR101673574B1 (ko) 2009-10-30 2016-11-07 레코 메디컬, 인코포레이티드 경피적 초음파 신장 신경차단술을 통해 고혈압을 치료하기 위한 장치 및 방법
JP2017062263A (ja) * 2012-03-16 2017-03-30 株式会社堀場製作所 試料分析装置及び試料分析プログラム
US10156512B2 (en) * 2013-03-01 2018-12-18 Futurewei Technologies, Inc. System and method for measuring thermal reliability of multi-chip modules
WO2014159276A1 (en) 2013-03-14 2014-10-02 Recor Medical, Inc. Ultrasound-based neuromodulation system
EP2971232A1 (en) 2013-03-14 2016-01-20 ReCor Medical, Inc. Methods of plating or coating ultrasound transducers
JP2014229635A (ja) * 2013-05-17 2014-12-08 株式会社東芝 半導体検査方法および半導体検査装置
CN108169651B (zh) * 2017-11-22 2021-05-11 北京无线电计量测试研究所 一种时钟晶体振荡器检测方法
KR101972745B1 (ko) * 2017-12-15 2019-04-25 남정훈 반도체칩 카운팅 방법
CN109712912B (zh) * 2018-12-06 2023-07-18 通富微电子股份有限公司 一种芯片倒装设备及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1251364A2 (en) 1994-12-23 2002-10-23 Digirad Corporation Semiconductor gamma-ray camera and medical imaging system
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
JPH10214870A (ja) 1997-01-29 1998-08-11 Hitachi Ltd 半導体装置の製造方法
JPH10313026A (ja) 1997-05-13 1998-11-24 Seiko Epson Corp 半導体装置の異物検査装置および異物検査方法
JP2000243795A (ja) * 1999-02-22 2000-09-08 Ando Electric Co Ltd バーンインテスタにおける電源電流測定回路
JP3802716B2 (ja) 1999-09-17 2006-07-26 株式会社日立製作所 試料の検査方法及びその装置
JP2002026102A (ja) 2000-06-30 2002-01-25 Hitachi Ltd 検査情報処理方法及びその検査システム
US6657453B2 (en) * 2002-03-15 2003-12-02 Infineon Technologies Ag Semiconductor wafer testing system and method

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