JP2004312005A - 蓋で封止した集積回路パッケージから圧力を排出させるシステム及び方法 - Google Patents
蓋で封止した集積回路パッケージから圧力を排出させるシステム及び方法 Download PDFInfo
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Abstract
【解決手段】 蓋で封止されている集積回路パッケージから圧力を排出させるシステム及び方法を提供する。本発明によれば、半田を貫通して複数個の蒸気圧ベント(通気孔)を形成する複数個の半田マスクベント(通気孔)を具備する半田マスクを集積回路に設ける。該蒸気圧ベントは、半田付けした蓋をその半田付けした位置からずらさせるような蒸気圧の増加の発生を防止する。別の実施例によれば、エポキシにより蓋を取付けるために使用したエポキシ層を貫通して圧力を排出させる。
【選択図】 図3
Description
310 半田マスク
320 半田ボール
315 半田マスクベント(通気孔)
410 基板
420 集積回路ダイ
430 蓋
440 金属層
450 モールド化合物
Claims (28)
- 集積回路において、
上部表面と底部表面とを具備しており且つそれを貫通する開口を形成する部分を具備している基板、
複数個の電気的導体を形成する部分を具備している前記基板上の少なくとも1個の金属層、
前記基板を貫通する前記開口内に装着されており且つ前記少なくとも1個の金属層の前記複数個の電気的導体に電気的に接続されている集積回路ダイ、
前記基板の前記底部表面上の前記少なくとも1個の金属層の一部にわたって付着されている半田マスク、
を有しており、前記半田マスクが前記基板の前記底部表面上の前記開口周りの前記少なくとも1個の金属層の複数個の金属層部分を形成する複数個の半田マスクベントを具備して形成されていることを特徴とする集積回路。 - 請求項1において、更に、
上部表面と底部表面とを具備する蓋を有しており、前記蓋は前記開口に隣接して配置された場合に前記基板を貫通する前記開口を被覆することが可能であり、且つ前記基板の底部表面上の前記開口周りの前記少なくとも1個の金属層の前記複数個の金属部分へ半田付けすることにより前記開口を被覆するために半田付けさせることが可能であり、
前記複数個の半田マスクベントは前記蓋を前記複数個の金属層部分へ半田付けするために半田物質が使用される場合に前記半田物質を貫通する複数個の蒸気圧ベントを形成する、
ことを特徴とする集積回路。 - 請求項2において、前記半田物質を貫通する前記蒸気圧ベントが前記集積回路内のキャビティ内において発生する蒸気圧が増加することを防止することを特徴とする集積回路。
- 請求項2において、前記半田物質を貫通する前記蒸気圧ベントが、前記半田物質が加熱される場合に前記蓋が所望の半田付け位置からずれること、及び前記半田物質が加熱される場合に前記蓋の周りに溶融した半田が流れることのうちの1つの発生を防止することを特徴とする集積回路。
- 請求項2において、前記蓋が熱伝導性物質を有していることを特徴とする集積回路。
- 請求項2において、前記蓋が金属を有していることを特徴とする集積回路。
- 請求項2において、更に、回路基板への接続を形成するために前記基板の複数個の電気的導体と電気的に接続して複数個の半田ボールを有していることを特徴とする集積回路。
- 請求項2において、更に、前記基板の前記開口内の前記集積回路ダイと前記基板の前記上部表面とを封止するモールド化合物を有していることを特徴とする集積回路。
- 請求項1において、前記基板を貫通する前記開口の形状が正方形であり且つ前記集積回路ダイの形状が正方形であることを特徴とする集積回路。
- 請求項9において、前記複数個の半田マスクベントが前記正方形の集積回路ダイの各側部上に少なくとも1個の半田マスクベントを有していることを特徴とする集積回路。
- 集積回路の製造方法において、
上部表面と底部表面とを具備しており且つそれを貫通する開口を形成する部分を具備している基板を用意し、
複数個の電気的導体を形成する部分を具備している前記基板へ少なくとも1個の金属層を付与し、
前記基板を貫通する前記開口内に集積回路ダイを装着し且つ前記集積回路ダイを前記少なくとも1個の金属層の前記複数個の電気的導体へ電気的に接続し、
前記基板の前記底部表面上の前記少なくとも1個の金属層の一部にわたり半田マスクを付着する、
上記各ステップを有しており、前記半田マスクは前記基板の前記底部表面上の前記開口周りの前記少なくとも1個の金属層の複数個の金属層部分を形成する複数個の半田マスクベントを具備して形成されていることを特徴とする方法。 - 請求項11において、更に、
上部表面と底部表面とを具備する蓋を設け、前記蓋は前記開口に隣接して配置された場合に前記基板を貫通する前記開口を被覆することが可能であり、
前記基板の前記底部表面上の前記開口周りの前記少なくとも1個の金属層の前記複数個の金属層部分へ前記蓋を半田付けすることにより前記開口を被覆するために前記蓋を半田付けし、
前記複数個の金属層部分へ前記蓋を半田付けするために半田物質を使用する場合に前記半田物質を介して複数個の蒸気圧ベントを前記複数個の半田マスクベントで形成する、
上記各ステップを有していることを特徴とする方法。 - 請求項12において、更に、
前記集積回路内のキャビティにおいて発生する蒸気圧の増加を防止するために前記半田物質を貫通する前記蒸気圧ベントを介して蒸気圧を排出させる、
上記各ステップを有していることを特徴とする方法。 - 請求項12において、更に、
前記半田物質が加熱される場合に前記蓋が所望の半田付け位置からずれること及び前記半田物質が加熱される場合に前記蓋の周りに溶融した半田が流れることのうちの1つの発生を防止するために前記半田物質を貫通する前記蒸気圧ベントを介して蒸気圧を排出させる、
上記ステップを有していることを特徴とする方法。 - 請求項12において、前記蓋が熱伝導性物質を有していることを特徴とする方法。
- 請求項12において、前記蓋が金属を有していることを特徴とする方法。
- 請求項12において、更に、
複数個の半田ボールを前記基板の複数個の電気的導体と電気的に接続し、
前記複数個の半田ボールを回路基板と接続させる、
上記各ステップを有していることを特徴とする方法。 - 請求項12において、更に、
前記基板の前記上部表面及び前記基板の前記開口内の前記集積回路ダイをモールド化合物で封止する、
上記ステップを有していることを特徴とする方法。 - 請求項11において、前記基板を貫通する前記開口の形状が正方形であり且つ前記集積回路ダイの形状が正方形であることを特徴とする方法。
- 請求項19において、前記複数個の半田マスクベントが前記正方形の集積回路ダイの各側部上に少なくとも1個の半田マスクベントを有していることを特徴とする方法。
- 集積回路において、
上部表面と底部表面とを具備しており且つそれを貫通する開口を形成する部分を具備している基板、
複数個の電気的導体を形成する部分を具備しており前記基板上の少なくとも1個の金属層、
前記基板を貫通する前記開口内に装着されており且つ前記少なくとも1個の金属層の前記複数個の電気的導体に電気的に接続されている集積回路ダイ、
前記基板の前記底部表面上の前記少なくとも1個の金属層の部分にわたり付着されており複数個の蒸気圧ベントを具備すべく形成されているエポキシ層、
を有していることを特徴とする集積回路。 - 請求項21において、更に、
上記表面と底部表面とを具備しており、前記開口に隣接して配置された場合に前記基板を貫通する前記開口を被覆することが可能であり且つ前記開口を被覆するためにエポキシにより取付けることの可能な蓋、
を有しており、前記エポキシ層内の前記複数個の蒸気圧ベントが、前記エポキシ層が前記集積回路へエポキシにより前記蓋を取付けるために使用される場合に前記集積回路内のキャビティ内において発生する蒸気圧が増加することを防止することを特徴とする集積回路。 - 請求項22において、前記エポキシ層を貫通する前記複数個の蒸気圧ベントが、前記エポキシ層が加熱される場合に前記蓋が所望のエポキシ付けした位置からずれること及び前記エポキシ層が加熱される場合に前記蓋の周りに溶融したエポキシが流れることのうちの1つの発生を防止することを特徴とする集積回路。
- 請求項22において、前記蓋が熱伝導性物質を有していることを特徴とする集積回路。
- 集積回路の製造方法において、
上部表面と底部表面とを具備しており且つそれを貫通して開口を形成する部分を具備している基板を設け、
複数個の電気的導体を形成する部分を具備して前記基板へ少なくとも1個の金属層を付与し、
前記基板を貫通する前記開口内に集積回路ダイを装着し且つ前記集積回路ダイを前記少なくとも1個の金属層の前記複数個の電気的導体へ電気的に接続し、
前記基板の前記底部表面上の前記少なくとも1個の金属層の部分にわたり複数個の蒸気圧ベントを具備しているエポキシ層を付着させる、
上記各ステップを有していることを特徴とする方法。 - 請求項25において、更に、
上部表面と底部表面とを具備しており前記開口に隣接して配置された場合に前記基板を貫通する前記開口を被覆することが可能な蓋を設け、
エポキシによって前記蓋を前記開口を被覆するために取付け、
前記集積回路内のキャビティ内において蒸気圧が増加することを防止するために前記エポキシ層内の前記蒸気圧ベントを介して蒸気圧を排出させる、
上記各ステップを有していることを特徴とする方法。 - 請求項26において、更に、
前記エポキシ層が加熱される場合に前記蓋が所望のエポキシ付けした位置からずれること及び前記エポキシ層が加熱される場合に前記蓋の周りに溶融したエポキシが流れることのうちの1つの発生を防止するために前記エポキシ層における前記蒸気圧ベントを介して蒸気圧を排出させる、
上記ステップを有していることを特徴とする方法。 - 請求項26において、前記蓋が熱伝導性物質を有していることを特徴とする方法。
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US10/405,529 US7126210B2 (en) | 2003-04-02 | 2003-04-02 | System and method for venting pressure from an integrated circuit package sealed with a lid |
US10/405529 | 2003-04-02 |
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US20070001286A1 (en) | 2007-01-04 |
US20040195685A1 (en) | 2004-10-07 |
DE602004007843D1 (de) | 2007-09-13 |
EP1465249B1 (en) | 2007-08-01 |
US7126210B2 (en) | 2006-10-24 |
JP5265842B2 (ja) | 2013-08-14 |
EP1465249A2 (en) | 2004-10-06 |
EP1465249A3 (en) | 2004-10-20 |
US7534716B2 (en) | 2009-05-19 |
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