JP2004306140A - ソルダ・リフローオーブン - Google Patents
ソルダ・リフローオーブン Download PDFInfo
- Publication number
- JP2004306140A JP2004306140A JP2004115169A JP2004115169A JP2004306140A JP 2004306140 A JP2004306140 A JP 2004306140A JP 2004115169 A JP2004115169 A JP 2004115169A JP 2004115169 A JP2004115169 A JP 2004115169A JP 2004306140 A JP2004306140 A JP 2004306140A
- Authority
- JP
- Japan
- Prior art keywords
- reflow
- solder
- zone
- workpiece
- plenum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
- F27B9/10—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated heated by hot air or gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
- F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
- F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace being carried by a conveyor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/36—Arrangements of heating devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
- F27D5/0006—Composite supporting structures
- F27D5/0012—Modules of the sagger or setter type; Supports built up from them
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/007—Cooling of charges therein
- F27D2009/0072—Cooling of charges therein the cooling medium being a gas
- F27D2009/0075—Cooling of charges therein the cooling medium being a gas in direct contact with the charge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】ワーク32を、加熱空気を用いてソルダのリフローに有効な温度に加熱するリフローゾーンを有している。リフローゾーンは拡散ベーン84を備えたノズル80を有し、該ノズルは、剪断層90を隣接ゾーンに向けることにより、ワークをソルダ・リフロー温度に加熱する距離を増大させる。
【選択図】図4
Description
本発明の好ましい実施形態によれば、図2〜図4に示すように、ワーク32を加熱してマイクロ電子アセンブリを形成するソルダ・リフローオーブン30が提供される。ワーク32は、プリント回路板34および1つ以上の電子部品38を有している。プリント回路板34は複数のボンドパッド36を有し、このボンドパッド36にはソルダペースト40が付着されている。ソルダペースト40は、気化可能なビヒクル内に分散されたソルダアロイの粒子を有している。液体ソルダによるボンドパッドおよび部品の濡れ性を高めるため、ペーストに適当なフラックスを含めてもよい。アセンブリの準備に際し、ペースト40がボンドパッドに付着され、かつソルダペーストに接触するようにして電子部品38がプリント回路板上に配置される。次に、ワーク32が、オーブンを通るワークの取扱いおよび搬送を容易にするパレット42上に装填される。
以上、本発明をその或る実施形態に関連して説明したが、本発明はこの実施形態に限定されるものではなく、特許請求の範囲の記載によってのみ制限されるものである。
32 ワーク
50 空気分配パイプ
62 プレナム
80 ノズル
82 くびれ部分
84 拡散ベーン
85 補助ベーン
90 剪断ゾーン(剪断層)
Claims (1)
- ソルダを備えたワークをソルダのリフローに有効な温度に加熱するリフローゾーンと、該リフローゾーンの回りのプレ・リフローゾーンおよびポスト・リフローゾーンとを有するソルダ・リフローオーブンであって、
ワークを、プレ・リフローゾーン、リフローゾーンおよびポスト・リフローゾーンを通して連続的に移動方向に搬送するコンベアと、
加熱空気をリフローゾーンに供給するプレナムとを有し、
該プレナムは、移動方向を横切る方向に互いに間隔を隔てた関係に配置された前側壁および後側壁を備えかつこれらの両側壁間にプレナム開口を形成しており、該プレナム開口は前記移動方向の第1の寸法を有し、
プレナムから加熱空気を受入れかつ該加熱空気をコンベアに向けるノズルを更に有し、
該ノズルは、拡散関係をなしている前方ベーンおよび後方ベーンを備え、両ベーンは、コンベアに隣接しかつ前記第1の寸法以下の移動方向の第2の寸法をもつノズル開口を備えている、
ことを特徴とするソルダ・リフローオーブン。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/410,081 US6794616B1 (en) | 2003-04-09 | 2003-04-09 | Solder reflow oven |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004306140A true JP2004306140A (ja) | 2004-11-04 |
Family
ID=32990287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004115169A Pending JP2004306140A (ja) | 2003-04-09 | 2004-04-09 | ソルダ・リフローオーブン |
Country Status (3)
Country | Link |
---|---|
US (1) | US6794616B1 (ja) |
JP (1) | JP2004306140A (ja) |
DE (1) | DE102004018640B4 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026582B2 (en) * | 2003-05-07 | 2006-04-11 | Visteon Global Technologies, Inc. | Vector transient reflow of lead free solder for controlling substrate warpage |
US8299393B2 (en) * | 2010-08-17 | 2012-10-30 | International Business Machines Corporation | Selective thermal conditioning components on a PCB |
US11224927B2 (en) | 2015-11-25 | 2022-01-18 | International Business Machines Corporation | Circuit card attachment for enhanced robustness of thermal performance |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3515330A (en) * | 1968-01-30 | 1970-06-02 | Collins Radio Co | Continuous flow mass pin-to-board hot air soldering device |
EP0023107B1 (en) | 1979-07-09 | 1983-09-07 | Electrovert Ltd. | Method and apparatus for vapour phase soldering |
US4805827A (en) | 1985-10-23 | 1989-02-21 | Pace Incorporated | Method of soldering with heated fluid and device therefor |
US4876437A (en) * | 1988-07-14 | 1989-10-24 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
DE3837531A1 (de) * | 1988-11-04 | 1990-05-10 | Siemens Ag | Heissluft-reflow-ofen |
JPH0763839B2 (ja) | 1989-10-06 | 1995-07-12 | 日立テクノエンジニアリング株式会社 | リフローはんだ付け装置 |
JPH07115166B2 (ja) | 1991-03-26 | 1995-12-13 | 日立テクノエンジニアリング株式会社 | リフローはんだ付け方法およびその装置 |
US5193735A (en) * | 1992-07-13 | 1993-03-16 | Knight Electronics, Inc. | Solder reflow oven |
US5345061A (en) * | 1992-09-15 | 1994-09-06 | Vitronics Corporation | Convection/infrared solder reflow apparatus utilizing controlled gas flow |
EP0598367B1 (en) * | 1992-11-17 | 1998-02-04 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus and method |
US5467912A (en) | 1992-11-27 | 1995-11-21 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus for soldering electronic parts to circuit substrate |
US5358167A (en) | 1992-11-30 | 1994-10-25 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
DE4243127A1 (de) * | 1992-12-19 | 1994-06-23 | Gautschi Electro Fours Sa | Verfahren und Vorrichtung zur Wärmebehandlung von Wärmgut in einem Industrieofen |
US5347103A (en) * | 1993-08-31 | 1994-09-13 | Btu International | Convection furnace using shimmed gas amplifier |
US5577657A (en) * | 1995-09-01 | 1996-11-26 | Ford Motor Company | Method of improved oven reflow soldering |
US6247630B1 (en) | 1997-12-17 | 2001-06-19 | Sun Microsystems, Inc. | Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board |
JP3515058B2 (ja) * | 2000-08-14 | 2004-04-05 | 有限会社ヨコタテクニカ | リフロー半田付け装置 |
US6642485B2 (en) * | 2001-12-03 | 2003-11-04 | Visteon Global Technologies, Inc. | System and method for mounting electronic components onto flexible substrates |
-
2003
- 2003-04-09 US US10/410,081 patent/US6794616B1/en not_active Expired - Fee Related
-
2004
- 2004-04-08 DE DE102004018640A patent/DE102004018640B4/de not_active Expired - Fee Related
- 2004-04-09 JP JP2004115169A patent/JP2004306140A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20040200877A1 (en) | 2004-10-14 |
DE102004018640B4 (de) | 2008-01-10 |
DE102004018640A1 (de) | 2004-11-04 |
US6794616B1 (en) | 2004-09-21 |
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