JP2004253779A - 光送信器 - Google Patents
光送信器 Download PDFInfo
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- JP2004253779A JP2004253779A JP2003418525A JP2003418525A JP2004253779A JP 2004253779 A JP2004253779 A JP 2004253779A JP 2003418525 A JP2003418525 A JP 2003418525A JP 2003418525 A JP2003418525 A JP 2003418525A JP 2004253779 A JP2004253779 A JP 2004253779A
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- optical transmitter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
Abstract
【解決手段】 本発明に係る光送信器10は、熱電モジュール12と、発光素子25と、受光素子24とを備える。熱電モジュールは、第1の板状体21と、第2の板状体22と、熱電変換素子20とを有する。第1の板状体21は、絶縁性である。第2の板状体22は、第1の領域22aと第2の領域22bとを有し、少なくとも第1の領域22aが第1の板状体21に対向して配置されている。熱電変換素子20は、第1の板状体21と第2の板状体22との間に介在され、第1の板状体21と第1の領域22aとに接触している。発光素子25は、第1の板状体21に支持されている。受光素子24は、第2の板状体22の第2の領域22bに搭載され、発光素子25が出射した光の一部を受ける。
【選択図】 図1
Description
Claims (6)
- 絶縁性の第1の板状体と、
第1の領域と第2の領域とを有し、少なくとも該第1の領域が前記第1の板状体に対向して配置されている第2の板状体と、
前記第1の板状体と前記第2の板状体との間に介在され、前記第1の板状体と前記第1の領域とに接触した熱電変換素子と、を有する熱電モジュールと、
前記第1の板状体に支持される発光素子と、
前記第2の板状体の前記第2の領域に搭載され、前記発光素子が出射した光の一部を受ける受光素子と、
を備える光送信器。 - 前記第1の板状体には、開口が設けられており、
前記発光素子から出射された光の一部は、該開口を通過して前記受光素子に入射する、請求項1に記載の光送信器。 - 前記第1の板状体に交差する所定の面に沿って延びる支持面を有し、前記第1の板状体に搭載されているキャリアを更に備え、
前記発光素子は、前記支持面に搭載されている、請求項1又は2に記載の光送信器。 - 前記発光素子の温度を検知する感温素子が前記キャリアに搭載されている、請求項3に記載の光送信器。
- 前記発光素子は、第1の光出射面と該第1の光出射面に対向する第2の光出射面を有し、
前記受光素子は、該第2の光出射面から出射される光を受光する請求項1〜4のいずれか1項に記載の光送信器。 - CANケースを更に備え、
該CANケースは、前記第1の光出射面と光結合するレンズと、前記第2の板状体を搭載するステムとを有し、
前記発光素子、前記受光素子、及び前記熱電モジュールは、前記CANケースに収納されている、請求項5に記載の光送信器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003418525A JP4114603B2 (ja) | 2003-01-31 | 2003-12-16 | 光送信器 |
US10/766,953 US7342257B2 (en) | 2003-01-31 | 2004-01-30 | Optical transmitter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003024768 | 2003-01-31 | ||
JP2003418525A JP4114603B2 (ja) | 2003-01-31 | 2003-12-16 | 光送信器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007312642A Division JP4586846B2 (ja) | 2003-01-31 | 2007-12-03 | 光送信器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004253779A true JP2004253779A (ja) | 2004-09-09 |
JP4114603B2 JP4114603B2 (ja) | 2008-07-09 |
Family
ID=33032300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003418525A Expired - Fee Related JP4114603B2 (ja) | 2003-01-31 | 2003-12-16 | 光送信器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7342257B2 (ja) |
JP (1) | JP4114603B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7415187B2 (en) | 2005-02-08 | 2008-08-19 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module and a method for manufacturing the same |
US7856038B2 (en) | 2006-03-27 | 2010-12-21 | Sumitomo Electric Industries, Ltd. | Light-emitting module installing thermo-electric controller |
JP2011243819A (ja) * | 2010-05-20 | 2011-12-01 | Opnext Japan Inc | 同軸型光モジュール |
US8816183B2 (en) | 2007-05-10 | 2014-08-26 | Aisin Seiki Kabushiki Kaisha | Thermoelectric module and optical transmission apparatus |
JPWO2018163513A1 (ja) * | 2017-03-06 | 2020-01-16 | 住友電気工業株式会社 | 光モジュール |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059537A (ja) * | 2005-08-23 | 2007-03-08 | Sumitomo Electric Ind Ltd | 光送信器 |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
WO2008103678A1 (en) * | 2007-02-20 | 2008-08-28 | Efw Inc. | Temperature controlled photodetector |
JP6578976B2 (ja) * | 2016-02-05 | 2019-09-25 | 三菱電機株式会社 | 光モジュール |
JP2019186554A (ja) * | 2018-04-17 | 2019-10-24 | 住友電工デバイス・イノベーション株式会社 | 光送信モジュール |
CN115188868A (zh) * | 2021-04-07 | 2022-10-14 | 宁波环球广电科技有限公司 | 内置热电制冷器的to封装光发射器件 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922381A (ja) | 1982-07-29 | 1984-02-04 | Canon Inc | 半導体レ−ザ装置 |
JPH04112591A (ja) | 1990-09-03 | 1992-04-14 | Fujitsu Ltd | 半導体レーザモジュール |
JPH0927655A (ja) | 1995-07-11 | 1997-01-28 | Oki Electric Ind Co Ltd | 光半導体結合器 |
US6155724A (en) * | 1997-03-04 | 2000-12-05 | Hamamatsu Photonics Kk | Light transmitting module for optical communication and light transmitting unit thereof |
US20030053169A1 (en) * | 2001-06-07 | 2003-03-20 | The Furukawa Electric Co., Ltd. | Optical transmitter, WDM optical transmission device and optical module |
US6868104B2 (en) | 2001-09-06 | 2005-03-15 | Finisar Corporation | Compact laser package with integrated temperature control |
US6856475B2 (en) * | 2001-10-31 | 2005-02-15 | The Furukawa Electric Co., Ltd | Optical module having temperature adjustment features |
-
2003
- 2003-12-16 JP JP2003418525A patent/JP4114603B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-30 US US10/766,953 patent/US7342257B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7415187B2 (en) | 2005-02-08 | 2008-08-19 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module and a method for manufacturing the same |
US7856038B2 (en) | 2006-03-27 | 2010-12-21 | Sumitomo Electric Industries, Ltd. | Light-emitting module installing thermo-electric controller |
US8816183B2 (en) | 2007-05-10 | 2014-08-26 | Aisin Seiki Kabushiki Kaisha | Thermoelectric module and optical transmission apparatus |
JP2011243819A (ja) * | 2010-05-20 | 2011-12-01 | Opnext Japan Inc | 同軸型光モジュール |
JPWO2018163513A1 (ja) * | 2017-03-06 | 2020-01-16 | 住友電気工業株式会社 | 光モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP4114603B2 (ja) | 2008-07-09 |
US20040245446A1 (en) | 2004-12-09 |
US7342257B2 (en) | 2008-03-11 |
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