JP2004250716A - Barrel plating method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform a plating treatment good in yield and reliability and capable of improving the uniformity of plating film thicknesses of chip parts and eliminating the occurrence of a so-called "carbon trumpet phenomenon of plating" on the electrode surface in a barrel cylindrical member. <P>SOLUTION: A plurality of electrode bodies 60 are disposed within the barrel cylindrical member 40 having a nonconductive internal surface in the positions parallel to a horizontal central axis of rotation of the barrel cylindrical member 40 and offcentered from the central axis of rotation and a barrel unit 30 freely rotatably having the barrel cylindrical member 40 is used. Chip part groups are housed in the barrel cylindrical member 40 and the electrode bodies 60 are rotated together with the barrel cylindrical member 40 and are moved in the chip part groups. Electricity preferably fed only to the electrode bodies 60 passing he region where the chip part groups are stored among the plurality of the electrode bodies. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a barrel plating method and apparatus for forming terminal electrodes of chip-shaped electronic components (chip components), and in particular, to barrel plating that enables electrolytic plating of terminal electrodes of small chip components without using media. Method and apparatus.
[0002]
[Prior art]
Conventionally, as a barrel plating method of this type, a horizontal parallel barrel unit in which a cathode electrode body is fixedly arranged in a direction parallel to a rotation center axis direction in a barrel cylinder is used, and the cathode electrode body is used as a chip component group. There is known a configuration in which a barrel cylinder is rotated in a state of being inserted into a lump, and a plating current density is made as uniform as possible in a rotation center axis direction (see FIG. 5 of Patent Document 1 below). In this case, while the barrel cylinder rotates, the cathode electrode body is fixed, and a typical example of the shape is a loop-shaped (or strip-shaped) cathode electrode shape. Then, a medium (a metal sphere of a conductive medium) is housed and used in the barrel cylinder.
[0003]
Patent Literature 2 below has a cathode fixed to a rotating barrel cylinder. In this case, conical or pyramid-shaped attachment members are provided on both inner end surfaces of the barrel cylinder for the purpose of preventing stagnation of the object to be plated and achieving a uniform plating thickness.
[0004]
Further, a configuration is known in which a cylindrical member for housing a chip component group forms a cathode, an anode is disposed inside the cylindrical member, and plating is performed while rotating the cylindrical member serving as the cathode (see Patent Document 3 below). .
[0005]
Further, there has been known an apparatus which uses a mesh contact medium as a cathode and accommodates a chip component group on the mesh contact medium (see Patent Document 4).
[0006]
[Patent Document 1] JP-A-9-137296
[Patent Document 2] JP-A-2001-279498
[Patent Document 3] JP-A-7-278896
[Patent Document 4] JP-A-9-87895
[0007]
As shown in FIG. 5 of Patent Document 1 and Patent Document 2, when a stationary cathode electrode body is used for a rotating barrel cylinder, a small-sized, for example, 1005 type (length 1 mm, width 0.5 mm, thickness 0) 0.50 mm), 0603 type (0.6 mm long, 0.3 mm wide, 0.3 mm thick), 0402 type (0.4 mm long, 0.2 mm wide, 0.2 mm thick) In the barrel plating method, the media is not used, and a chain of continuity is formed by the contact between the terminal electrodes of the chip components housed in the barrel cylinder, and the terminal electrodes of the chip components in the continuity chain contact with each other. A medialess barrel unit that leads the conducting cathode electrode body to the outside of the barrel cylinder is used.
[0008]
7 and 8 show a conventional medialess barrel unit. In these figures, reference numeral 1 denotes a barrel tubular body, a rectangular tubular portion is made of an insulating mesh such as nylon, and both end faces are closed by a resin plate. A horizontal shaft 2 serving as a rotation center of the barrel 1 penetrates the barrel 1, and a loop-shaped cathode (cathode) electrode 3 is fixed to the horizontal shaft 2. The barrel cylinder 1 rotates, while the horizontal shaft body 2 and the cathode electrode body 3 are fixed (stationary).
[0009]
An anode (anode) electrode 4 is disposed at a lower position outside the barrel cylinder 1, and the barrel cylinder 1 and the anode electrode 4 are immersed in a plating solution.
[0010]
By rotating the barrel 1, the chip component group 10 accommodated therein is agitated and mixed by the cathode electrode body 3, the contact between the cathode electrode body 3 and the terminal electrodes of the chip component group, and the contact between the terminal electrodes. Plating is performed by a chain of conduction due to contact.
[0011]
[Problems to be solved by the invention]
In the fixed type cathode electrode body shown in FIGS. 7 and 8, the following problems and problems occur in principle. In particular, it becomes noticeable as a problem in medialess plating.
[0012]
{Circle around (1)} In the fixed cathode electrode body, the plating film thickness may vary among chip components.
The outer barrel cylinder rotates and stirs and mixes the stored chip components.However, the fixed cathode electrode itself inhibits the fluidity of the chip components in the plating solution, and in some cases, the stagnation phenomenon of the chip components. As a result, the agitation and mixing property (mixing ratio) of the chip components are reduced, so that variations in energization between the chip components may cause variations in the plating film thickness.
[0013]
{Circle around (2)} In the fixed type cathode electrode body, when used continuously for a long time, plating scum is generated, and a state in which the plating scum is deposited and grown on the surface of the cathode electrode body, so-called “plating flowering phenomenon” occurs.
When medialess plating is performed in a general fixed cathode method, when a cathode electrode body where a current flows is in direct contact with a plating solution for a certain period of time (the chip component stays without flowing because the chip component stays without flowing). This “plating flower blooming” is extremely likely to occur in a portion where the current does not easily contact (a portion where no contact is made) or a portion where the current in the cathode electrode body tends to concentrate (a portion where the current density is high). FIG. 9 shows a state in which “the flowering phenomenon of plating” has occurred on the cathode electrode body 3. Then, the grown plating residue is peeled off from the cathode electrode body and mixed into the chip component group, and the plating residue 13 adheres to the terminal electrode 12 of the chip component 11 as shown in FIG. It may cause product failure.
[0014]
When the above (1) and (2) occur, defective chip components are removed in a later inspection step, so that not only the yield is reduced, but also the burden of equipment costs and manufacturing costs is increased.
[0015]
In view of the above, the present invention can improve the uniformity of the plating film thickness of a chip component, and eliminates the occurrence of the so-called "plating flowering phenomenon" on the surface of the electrode body in the barrel cylinder. It is an object of the present invention to provide a barrel plating method and apparatus capable of performing plating processing with good yield and reliability.
[0016]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0017]
[Means for Solving the Problems]
In order to achieve the above object, a barrel plating method according to the invention of claim 1 of the present application provides a barrel plating method in which the inner side surface is parallel to the horizontal rotation axis of the barrel cylinder and the rotation center in the non-conductive barrel cylinder. While providing the electrode body at a position eccentric with respect to the axis, using a barrel unit having the barrel cylinder rotatably,
A chip component group is housed in the barrel body, and the electrode body is rotated together with the barrel body to move in the chip part group.
[0018]
The barrel plating method according to claim 2 of the present application is the barrel plating method according to claim 1, wherein the plurality of electrode bodies are arranged, and among the plurality of electrode bodies, the electrode body passing through a region where a chip component group is stored. Only the power is selectively supplied.
[0019]
A barrel plating method according to a third aspect of the present invention is characterized in that, in the first or second aspect, plating is performed by storing only a chip component group in the barrel cylinder.
[0020]
The barrel plating apparatus according to the invention of claim 4 of the present application is arranged such that the inside surface is non-conductive and is parallel to the horizontal rotation axis of the barrel cylinder and to the rotation center axis in the barrel cylinder housing the chip component group. Along with providing the electrode body at an eccentric position, a barrel unit having the barrel cylinder rotatably provided,
The electrode body rotates together with the barrel cylinder.
[0021]
A barrel plating apparatus according to a fifth aspect of the present invention is the barrel plating device according to the fourth aspect, wherein a plurality of the electrode bodies are disposed, and among the plurality of the electrode bodies, an electrode body passing through a region where a chip component group is stored. It is characterized by having an energizing means for selectively supplying power only.
[0022]
In the barrel plating apparatus according to claim 6 of the present application, in claim 4 or 5, the electrode body is provided at an end surface of the barrel cylinder at equal angular intervals on a concentric circle of a rotation center axis of the barrel cylinder. It is characterized in that a plurality are attached.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a barrel plating method and apparatus according to the present invention will be described with reference to the drawings.
[0024]
An embodiment of a barrel plating method and apparatus according to the present invention will be described with reference to FIGS. FIG. 1 shows an overall schematic configuration of the present embodiment, and FIG. 2 shows a specific configuration of a barrel unit. 3 shows a barrel cylinder and a cathode electrode body included in the barrel unit, FIG. 4 shows a means for supplying electricity to the cathode electrode body (power supply mechanism), FIG. 5 shows an arrangement of the cathode electrode body and the electricity supply block, and FIG. Indicates the positional relationship among the barrel cylinder, the cathode electrode, and the chip component group.
[0025]
In FIG. 1, reference numeral 20 denotes a plating bath in which a plating solution 21 is filled up to a position of a virtual line W. A plate-like anode electrode 22 is arranged on the inner bottom of the plating bath 20.
[0026]
As shown in FIGS. 1 and 2, the barrel unit 30 includes a barrel cylinder 40 (a basket portion through which a plating solution passes), and a plurality of cathode electrode bodies 60 attached and fixed to a lid body 50 forming the end face. And a pair of unit side plates 31 and 32 and a connecting rod 33 forming a holding frame for rotatably holding the barrel cylinder 40. As will be described later, since the barrel cylinder 40 is immersed in the plating solution, its constituent members are formed of the insulating resin itself, or the surface is insulated and coated with the insulating resin or the like. Further, portions of the unit side plates 31 and 32 that are immersed in the plating solution are provided with an insulating coating.
[0027]
As shown in FIG. 3, the barrel cylinder 40 has a cylinder main body 41 formed of a bottomed polygonal cylindrical container having one opening, and a lid 50 made of insulating resin for closing the opening. Both the inner and outer surfaces of the body 40 are insulative (non-conductive).
[0028]
The cylindrical body 41 has a flange portion 42, an end surface portion 43, a connecting portion 44 (along the ridge line of the polygonal cylinder) connecting the two, and a shaft portion 45 integrally formed at the center of the outer surface of the end surface portion 44. (A rotation center on the right side of the barrel cylinder 40) is formed integrally with an insulating resin, and a window 47 of the barrel frame 46 is provided with an insulating resin mesh 48. The mesh 48 allows a plating solution to pass therethrough, but does not allow a chip component group housed inside the barrel cylinder 40 to pass therethrough.
[0029]
Although not shown in FIG. 3, the cylinder main body 41 (flange 42) and the lid 50 can be integrated and separated from each other by the engaging member 51 of FIG. For example, a structure in which the lid 50 and the flange portion 42 of the cylinder main body 41 are aligned, and then the two are relatively turned to be locked by the engaging member 51. An insulating resin flange 52 is fixed to the outside of the insulating resin lid 50.
[0030]
A plurality of round bar-shaped cathode electrode bodies 60 are arranged and fixed at equal angular intervals on a concentric circle of the rotation center axis of the barrel cylinder 40, on the lid 50 serving as an end surface of the barrel cylinder 40. In other words, a round bar-like shape is provided at a position (between the inner periphery of the barrel cylinder 40 and the rotation center axis) parallel to the horizontal (horizontal) rotation center axis of the barrel cylinder 40 and eccentric with respect to the rotation center axis. The cathode electrode bodies 60 are respectively arranged. The cathode electrode body 60 may be a metal rod such as titanium, stainless steel (SUS304), or copper, but in principle, it is sufficient that at least the surface is conductive.
[0031]
As shown in FIG. 2, a shaft part 45 is rotatably supported on the right side of the barrel cylinder 40 by an insulating resin bush 34 as a bearing part of the unit side plate 32. Further, a cylindrical support member 35 made of an insulating resin is fixed to the unit side plate 31 with a fixing nut 38 made of an insulating resin, and a metal conductor shaft 37 is fixed to a central portion inside the cylindrical support member 35 with a metal bolt 72. I have. The metal conductor shaft 37 serves as a fixed shaft portion rotatably supporting the left side of the barrel cylinder 40, and an insulating resin bush 36 is rotatably fitted to the outside of the metal conductor shaft 37 in a watertight manner. Around the bush 36, a flange 52 fixed to the lid 50 is attached. The bush 36 covers the outer peripheral surface of the metal conductor shaft 37 so as not to come into contact with the plating solution, the space between the bush 36 and the flange portion 52 is sealed in a watertight manner, and the inner space of the flange portion 52 (the metal conductor shaft 37 described later). (Including the contact portion 37a, the energizing block 61, etc.).
[0032]
Thereby, the barrel cylinder 40 is rotatably supported by the left and right unit side plates 31 and 32. Also, as shown in FIG. 1, a sprocket 54 made of an insulating resin as a rotation transmitting means fixed to the flange 52 on the barrel cylinder 40 side engages with a chain 55 provided on the plating bath 20 side, so that FIG. The sprocket 54 is driven to rotate by a chain 55 running perpendicular to the plane of the drawing, and the barrel cylinder 40 rotates (rotates).
[0033]
Power supply to the cathode electrode body 60 will be described with reference to FIG. A current collector 70 for receiving power from the outside is fixed to an upper portion of the unit side plate 31. 73 is a collector base cover. The current collector 70 is electrically connected to the metal conductor shaft 37 to which the bolt 72 is screwed via a lead wire 71 covered with an insulating material and a metal bolt 72. The metal conductor shaft 37 is fixed to the inside of the cylindrical support member 35 with bolts 72, and as shown in FIG. 6, a region where the chip component group 10 is stored in the barrel cylinder 40 among the plurality of cathode electrode bodies 60. A contact portion 37a (partially convex surface) is formed for the purpose of selectively supplying power only to the electrode body 60 passing therethrough. In FIG. 4, the contact portion 37a is a fan-shaped convex surface protruding in the range of the angle θ ° (see FIG. 6).
[0034]
On the other hand, as shown in FIGS. 4 and 5, an energizing block 61 is fixed to the outer surface of the lid 50 on the barrel cylinder 40 side, and the base of the cathode electrode body 60 penetrating through the lid 50 is connected and fixed. Have been. As shown in FIG. 5, the energizing blocks 61 are attached to the lid 50 at equal angular intervals corresponding to the respective cathode electrode bodies 60. In the case shown, the number of the cathode electrode bodies 60 is 12, and they are arranged at equal angular intervals (every 30 °) on the concentric circle of the rotation center axis of the barrel cylinder 40, and the energizing blocks 61 are also arranged at intervals of 30 °. Are arranged. A current-carrying block contact portion 62 is fixed to each of the current-carrying blocks 61 so as to be bent by a flexible conductor piece capable of contacting the contact portion 37a of the metal conductor shaft 37 so as to exert a spring action. The contact portion 37a on the metal conductor shaft 37 side and the energizing block contact portion 62 constitute an energizing means for selectively supplying power only to the electrode body 60 passing through the area where the chip component group 10 is stored in FIG. ing.
[0035]
The contact portion 37a of the metal conductor shaft 37 is fixedly arranged, and the energizing block contact portion 62 on the barrel cylinder 40 rotates together with the barrel cylinder 40. Therefore, in FIG. Electricity is supplied only to the energizing block contact portion 62 that is in contact with the convex contact portion 37a and the corresponding cathode electrode body 60. In the state of FIG. 6, electricity is supplied to the two black cathode electrode bodies 60. The angle θ ° is an energized area, and 360 ° −θ ° is a non-energized area.
[0036]
In the barrel unit 30 of FIG. 2, a unit seat 75 for transport is fixed below the unit side plates 31, 32. Since the unit seat 75 is supported by the transporting means 80 on the plating bath 20 side, the barrel unit 30 is transported while being supported at a fixed height in the plating bath 20, and the current collector 70 receives power from an external power feeding means. Stop at a predetermined position.
[0037]
Next, a plating operation using the barrel unit 30 will be described. With the lid 50 of the barrel cylinder 40 removed, the chip component group 10 is stored in the cylinder main body 41 (no media is used), and the lid 50 is held by the engagement member 51 of FIG. And the opening of the cylinder body 41 is closed. Then, the barrel cylinder 40 is rotatably mounted between the unit side plates 31 and 32 (this can be performed by disconnecting the connection rod 33 from one of the unit side plates 31 and 32). In addition, the volume of the chip component housed in the barrel cylinder 40 is about several tens of percent (preferably about 30%) of the storage volume of the barrel cylinder 40.
[0038]
The barrel unit 30 holding the barrel body 40 in this manner is immersed in the plating solution 21 of the plating bath 20 as shown in FIG. 1, and the unit seat 75 is placed on the transport means 80 in FIG. The transport unit 80 transports the barrel unit 30 to a predetermined position and stops, and sets the current collector 70 to a position where power is supplied from an external power supply unit. As shown in FIG. 1, the positive side of the external DC power supply unit 90 is connected to the anode electrode 22, and the negative side is connected to the current collector 70 which contacts the power supply unit. Therefore, the plating current passes through the anode electrode 22, the plating solution 21, the terminal electrode of the chip component group 10, the cathode electrode body 60, the energizing block 61, the energizing block contact portion 62, the contact portion 37a of the metal conductor shaft 37, and the lead wire 71. Electroplating of the metal on the anode electrode side is performed by a chain of conduction caused by contact between the terminal electrodes of the chip component group 10, flowing on the path leading to the current collector 70.
[0039]
At this time, the sprocket 54 as the rotation transmitting means is rotationally driven by the chain 55, so that the barrel cylinder 40 rotates as shown by the arrow P in FIG. 6, and extends inside the barrel cylinder 40 in parallel with the rotation center axis. By moving the existing cathode electrode body 60 together with the barrel cylinder 40, the chip component group 10 in the barrel cylinder 40 can be stirred and mixed. In addition, by limiting the energizing range of the cathode electrode body 60 to the range of θ ° in FIG. 6, the cathode electrode body 60 that is immersed in the plating solution but does not contact the chip component group 10 or has a low probability of contact is provided. It can be set so as not to energize, and it is possible to suppress unnecessary metal deposition on the cathode electrode body 60.
[0040]
In this embodiment, a large number of rod-shaped cathode electrode bodies 60 move in a chip component group 10 accommodated in a barrel cylinder 40 in a plating solution and supply power to terminal electrodes of the chip components while stirring. . Since the above-described problem in the case of using the conventional fixed cathode electrode body is solved, the following effects are obtained.
[0041]
(1) In medialess plating, the uniformity of plating film thickness is greatly improved.
[0042]
(2) In the medialess plating, the occurrence of the so-called “flowering phenomenon of plating” on the surface of the cathode electrode body 60 in the barrel cylinder 40 is eliminated. In addition, the phenomenon that the plating residue peeled from the surface of the cathode electrode body 60 adheres to the chip component or mixes into the chip component group is eliminated.
[0043]
(3) As a result, the number of defects and the defect rate in the plating step are reduced, and the yield is improved.
[0044]
(4) That is, the cost of manufacturing equipment and manufacturing cost is reduced.
[0045]
These effects are attributable to the following configuration and operation according to the present embodiment.
The effect (1) mainly depends on (a), (b), and (c).
The effect (2) mainly depends on (d), (e), and (f).
[0046]
(A) Bar-shaped cathode electrode body 60
A bar-shaped cathode electrode body 60 is arranged in parallel with the rotation center axis over the longitudinal direction of the barrel cylinder in the direction of the rotation center axis of the barrel cylinder 40, and between the anode electrode 22 outside the barrel unit 30. The current density is uniform. The cross-sectional shape and dimensions of the cathode electrode body 60 can correspond to various shapes depending on the chip type and size.
[0047]
(B) Stirring of the chip parts group 10 and improvement of the mixing property (mixing ratio) by the simultaneous rotation of the barrel cylinder 40 and the cathode electrode body 60
By rotating the barrel cylinder 40 and the cathode electrode body 60 together, the inside of the lump of the chip parts group 10 is positively stirred by the cathode electrode body 60 itself, and the mixing property (mixing ratio) of the stored chip parts is improved. In addition, variations in current distribution between chip components are suppressed, and uniformity of plating film thickness in medialess plating is obtained.
[0048]
(C) Mobile power supply within a block of chip components
When the lump of the chip component group 10 is considered as one conductor, the cathode electrode body 60 passes through the lump of the chip component group. The lump of the chip component group 10 accommodated in the barrel cylinder 40 has a roughly crescent-shaped cross-sectional shape of the barrel cylinder 40, while supplying a current so that the cathode electrode body 60 squeezes substantially the center of the lump. pass. That is, it functions as a stirring and mixing member that stirs and mixes the chip component group 10 and also moves the current supply source, so that variation in energization between the stored chips is reduced.
[0049]
(D) Prevents the growth of plating residue on the cathode surface
Since the power is supplied while the cathode electrode body 60 itself moves, a state in which the plating state near the cathode electrode body is out of balance does not occur continuously for a long time, and the growth of plating residue is not promoted. The flowering phenomenon in medialess plating can be prevented.
[0050]
(E) Using a large number of cathode electrode bodies to reduce the power supply load factor per cathode
Since a large number of cathode electrode bodies 60 are used and power is supplied so as to successively make a baton touch, the load of generating plating scum per cathode electrode body is low.
[0051]
(F) Chip escape phenomenon does not occur in the stirring and mixing operation of the chip component group
Since the mixing and stirring operation is not performed by inserting the cathode electrode body 60 from the outside into the chip mass but by rotating and moving the cathode electrode body with respect to the rotation center axis in the barrel cylinder, there is no portion where a chip component escape phenomenon occurs, and the cathode There is no portion where the electrode body 60 is directly immersed in the plating solution for a long time.
[0052]
When no media is used, the following effects can be obtained in addition to the above.
[0053]
(I) The cost of the media itself is eliminated
(Ii) Reduction of work process
Eliminates the step of separating chips and media.
Eliminates media weighing, loading, and post-use processing.
Eliminates media management.
(Iii) Downsizing of barrel barrel 40
Since no media space is required in the barrel cylinder, miniaturization is possible.
(Iv) Reduction of auxiliary materials
Since there is no plating on the media, the amount of plating material is reduced.
Since there is no plating on the media, power consumption is reduced.
(V) Reduction in the amount of plating solution used
Due to the above (iii) and the processing of only the product, the amount of the plating solution to be brought out is reduced.
(Vi) Shortening of cleaning time and cleaning water by cleaning only products
(Vii) Reduction of equipment space
The above (iii), (v), and (vi) make it possible to reduce the size of the plating apparatus.
Due to the miniaturization, the multi-stage structure of the plating line apparatus is further facilitated, and the equipment space can be significantly reduced.
The plating work space can be made smaller than the above (ii).
(Viii) The number of workers and the burden on the workers are reduced as compared with the above (ii) and (iii).
(Ix) The safety measures at the time of work can be more easily taken than (ii), (iii) and (vii).
(X) The above (i) to (iX) make it possible to greatly reduce equipment and manufacturing costs.
(Xi) Improvement of plating efficiency by enlarging the mesh of the barrel cylinder 40
By not using media smaller than the product, the mesh size can be increased to a size where the product will not spill. That is, by improving the aperture ratio, the fluidity of the plating solution can be improved and the voltage drop can be reduced.
(Xii) Plating at low current is possible
The power consumption can be further reduced.
Plating material loss can be further reduced.
It is possible to reduce the purchase cost by reducing the output of the rectifier.
By reducing the capacity of the wiring, the diameter of the wiring can be reduced, the wiring space in the device can be reduced, and the size of the device can be further reduced.
Work safety is improved.
[0054]
In the above embodiment, the case where the medium is not used has been described. However, the present invention can be applied not only to the case where the medium is not used but also to the case where the medium is used (for example, 1608 size (1.6 mm in height, 0.1 mm in width). 8 mm and a thickness of 0.8 mm or more).
[0055]
The barrel body 40 has a structure in which an opening for inserting and removing chip components is provided at the end face of the barrel body 41 in FIG. 3 and the lid 50 is detachable to close the opening. A structure in which an opening is provided and the opening and closing lid is closed may be used.
[0056]
Furthermore, although the arrangement of the cathode electrode body 60 of the barrel cylinder 40 is set on a concentric circle of the rotation center axis of the barrel cylinder 40, it is sufficient if it is substantially concentric. Alternatively, the cathode electrode body 60 may be arranged on a plurality of concentric circles having different diameters. Further, it is preferable that the plurality of cathode electrode bodies 60 have substantially equal angular intervals, but the present invention is not limited to equal angular intervals.
[0057]
The cathode electrode body 60 preferably has a rod shape, but may have a portion deformed in a loop shape.
[0058]
Although the barrel cylinder 40 is a cage part having a polygonal cross section, the barrel cylinder 40 may be applied even if the cross section is circular.
[0059]
FIG. 4 shows an example of the energizing means for selectively supplying power only to the cathode electrode body 60 passing through the area where the chip component group 10 in the barrel cylinder 40 of FIG. 6 is stored. The means can be changed as appropriate.
[0060]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims.
[0061]
【The invention's effect】
As described above, according to the present invention, the cathode electrode body is configured to supply power to the terminal electrodes of the chip parts while moving and stirring through the group of chip parts housed in the barrel cylinder in the plating solution. Problems in the case of using the conventional fixed cathode electrode body can be solved, and the following effects can be obtained.
[0062]
(1) The uniformity of the plating thickness of the terminal electrode is greatly improved.
(2) The occurrence of the so-called “flowering phenomenon of plating” on the surface of the cathode electrode body in the barrel cylinder is eliminated. In addition, the phenomenon that the plating residue peeled off from the surface of the cathode electrode body adheres to the chip component or mixes into the chip component group is eliminated.
(3) As a result, the number of defects and the defect rate in the plating step are reduced, and the yield is improved.
(4) That is, cost reduction of manufacturing equipment and manufacturing cost can be realized.
[Brief description of the drawings]
FIG. 1 is an embodiment of a barrel plating method and apparatus according to the present invention, and is a front sectional view showing a schematic configuration of the whole.
FIG. 2 is a front sectional view showing details of a barrel unit in the embodiment of the present invention.
FIG. 3 is an exploded perspective view of a barrel cylinder included in the barrel unit.
FIG. 4 is a perspective view showing a means for selectively energizing a cathode electrode body in the barrel unit.
FIG. 5 is a left side view of a lid portion of the barrel cylinder, showing an arrangement of an energizing block to which a cathode electrode body is attached.
FIG. 6 is a side sectional view of the barrel cylinder showing a positional relationship among the barrel cylinder, the cathode electrode body, and a chip component group.
FIG. 7 is a perspective view showing a conventional barrel plating apparatus using a fixed cathode electrode body.
FIG. 8 is a side sectional view of a barrel cylinder showing a positional relationship among a barrel cylinder, a cathode electrode body, and a chip component group in a conventional barrel plating apparatus using a fixed cathode electrode body.
FIG. 9 is an explanatory diagram showing a state of occurrence of a “flowering phenomenon of plating” on a cathode electrode body.
FIG. 10 is a perspective view of the chip component showing a situation where plating scum adheres to the chip component.
[Explanation of symbols]
1,40 barrel cylinder
3,60 cathode electrode body
4,22 anode electrode
10 Chip parts group
11 Chip components
12 terminal electrode
13 Plating residue
20 Plating bath
21 Plating solution
30 barrel unit
31, 32 unit side plate
37 metal conductor shaft
37a, 62 contact part
41 cylinder body
45 Shaft
48 mesh
50 Lid
52 Flange
54 sprockets
55 chains
61 Electric block
70 current collector
71 Lead wire
72 volts
75 Unit seat
80 Conveying means
90 External DC power supply

Claims (6)

An inner surface is provided in a non-conductive barrel cylinder, and an electrode body is provided at a position parallel to a lateral rotation center axis of the barrel cylinder and eccentric with respect to the rotation center axis, and the barrel cylinder is rotatable. Using a barrel unit that has
A barrel plating method, wherein a chip component group is housed in the barrel cylinder, and the electrode body is rotated together with the barrel cylinder to move through the chip component group. 2. The barrel plating method according to claim 1, wherein a plurality of the electrode bodies are arranged, and a power is selectively supplied only to an electrode body passing through a region where a chip component group is stored among the plurality of the electrode bodies. The barrel plating method according to claim 1, wherein plating is performed by housing only the chip component group in the barrel cylinder. An electrode body is provided at a position parallel to the lateral rotation axis of the barrel cylinder and eccentric with respect to the rotation center axis, and the barrel is provided in the barrel cylinder inside which the inner surface is nonconductive and stores the chip component group. A barrel unit having a cylinder rotatably provided,
The said electrode body rotates with the said barrel cylinder, The barrel plating apparatus characterized by the above-mentioned. 5. The barrel plating apparatus according to claim 4, wherein a plurality of the electrode bodies are arranged, and a current supply means for selectively supplying power only to the electrode bodies passing through a region where the chip component group is stored among the plurality of the electrode bodies. . The barrel plating apparatus according to claim 4, wherein a plurality of the electrode bodies are attached to end faces of the barrel cylinder at equal angular intervals on a concentric circle of a rotation center axis of the barrel cylinder.

Images