M299168 八、新型說明： 【新型所屬之技術領域】 本創作係關於-種電錢系統，更定言之，係關於 不溶性陽極電鍍系統。 、種 【先前技術】 目前已知的電鍍系統，依賊金屬提供方式可分 解性陽極電鍍系統及不溶解性陽極電鍍系统。 係繪知溶解性陽極電鑛系統之示意圖。 =0’一對陽極籃_-陰極_，電贿13()2= ‘ρΓΓΓ中、亥對陽極M110係對立放置於電鑛槽100内二 置於該對陽極籃110之間，與各陽極藍110 ΐ t L該電鍍液13G覆蓋該陰極12G及該對陽極 :被電140形成於陰極一 出速=極Γ之金屬析出速率與陽極籃110之金屬溶 、…5 、、避免無法控制電鍍液中電錢全屬之濃;#， :般多使用大陽極小陰極之方式操作。；;=上 :置:陽1110,作為溶解性陽極，一方面可補充電鑛 則可達到『大陽極小陰極』之目的。隨著雷 f益屬塊溶解而逐漸縮小，陽極籃110會有電解全屬· 解而產生之金屬泥以及光澤劑吸附於陽極籃等問題，使： M299168 電鍍液130的穩定性及潔淨度難以控制。 圖,係繪示一種習知不溶性陽極電鍍系統之剖面示意 圖。請參考@二，不溶性陽極额系統包括_钱槽細二 一對陽極210, 一陰極220, 一電鍍液23〇及一電鍍金屬補 充槽25〇。其中該對陽極210分別對立放置於該電錢槽· 内，該陰極220放置於該對陽極21〇之間並分別與各個陽 極210保持一定距離。電鍍液23〇充滿電鍍槽2〇〇，液面覆 • 蓋陰極所欲電鍍之面積，以在陰極220的兩側上分別一鍍 層240。在該對陽極21〇上端分別設置一導電片2ιι，該導 電片211分別電性連接一電鍍金屬濃度偵測器251，透過電 鑛金屬濃度制ϋ 251 #自動取樣分析來控制㈣金屬的 補充，從一放置於電鍍槽2〇〇外的電鍍金屬溶槽25〇補充。 當電鍍金屬濃度偵測器251偵測到電鍍液内的金屬離子濃 度過低，則立即將已溶解成離子狀態的電鍍金屬補充液加 入該電鑛槽200内。 • 由於不溶性陽極電鍍系統的電鍍金屬供應係來自電鍍 槽之外，因此可藉由過濾來提高電鍍液的潔淨度，且可經 監測分析控制電鍍金屬的添加及電鍍液的穩定性，因此不 溶性陽極電鍍系統非常適合特殊或高階產品。 不溶性1¼極電链系統的陽極本身在進行電鑛時不會溶 解，因此需要另外提供電鍍金屬來源，目前業界所採用的 供應方式大致包括電解方式溶解電解金屬，氧化方式溶解 電解金屬及加入易形成金屬離子的金屬鹽，其中因成本的 考量，最常被採用的是以電解及氧化方式提供金屬來源。 M299168 ^ 以電解方式溶解電鍍金屬的方式而言，通常需要配合 離子交換膜以阻隔電鍍金屬於電鍍金屬溶槽中析出，然 而’卻有不少的副作用，包括無法完全地過濾金屬離子， 導致少數形成金屬粉末，造成不必要的廢棄物；增加了離 f父換膜的更換及維護成本；光澤劑會因電解而消耗，提 高電鍍液成本。 以氧化方式提供電鍍金屬來源的最大優點為沒有金屬 _ 共析的問題產生，然而同樣也有光澤劑被氧化消耗的 問題’且氧化後的裂解產物亦可能造成電鍍品質下降。 、以加入易形成金屬離子之金屬鹽來提供電鍍金屬的方 ^雖然相對上述二種方式而言比較沒有光澤劑消耗的問 通’但疋因為需要外購純度高的電鑛金屬造成整體操作成 本過尚，或者是難以控制使用的回收金屬鹽的雜質含量而 影響锻層品質。 在不溶性陽極電鍍系統中，當電流從陽極頂部流至陽 _ ㉟底部時’其電流量會因電阻而遞減，換言之，在陽極頂 =處，由於通過此處的電流較大，因此較多的金屬離子被 分解釋放，而通過下方部位所通過的電流較通過上方部位 的電流少，因此較少的金屬離子被分解釋放出來。請參考 圖―，M+表示從陽極釋放出的金屬，其箭頭表示金屬離子 行，=方向，箭號的矢的長度表示在該處釋放出的金屬離 子夕券，長者即表示金屬離子多，反之亦然。當金屬離子 又到陰極的吸引而附著於陰極表面上，即形成一鍍層。如 圖二所示，靠近電鍍液液面處的金屬離子濃度較高，越往 ί 7 M299168 兔屬碓子浪度越低，因此鍍層厚度從靠近液 底部處遞滷，、生Λ、处狂r 罪迎履面處往 处邈减，造成鍍層厚度不均勻，使電鍍品質下降。纱 =為了達到最低鑛層厚度之要求，往往需 = 間，造成操作成本增加。 ㈣時 ，鍍品質首重鍍層的厚度均句’尤其對於製 扣、P刷電路板產業而言，更是要求嚴格，如何不 產 金屬來源之限制，提供品質穩定的電鑛產品 供麵 者亟為努力追求之目標。 乃為電麵業 【新型内容】 因此，本創作目的之—在於提供—種不溶性陽極 ，利用本創作之電鍍系統可獲得鍍層厚度均勻之電^ 、本創作另一目的在於提供一種不溶性陽極電鍍系统， 適用於各種電鑛金屬供應來源的電鑛製程。 本創作又-目的在於提供一種不溶性陽極電錢系統， 在不而要雜電鍍彡統既有其他組件之下，可達到鏡展。 質改善、降低電鏡成本之效果。 根據本創作之一觀點，本創作之不溶性陽極電鏡系統 ^括-不溶性陽極結構，該不溶性陽極結構包括—不溶性 陽極主體及分別設置於不溶性陽極主體兩側之侧導電桿。 不溶性陽極本身在電鍍時不會被分解且為良好的電導 體，且包括由一種或多種選自由pb，c, sus, Pt/Ti，ir〇2/Ti， Ru02/Ti所組成之族群所形成者。 M299168 側導電捍的材料兵古 相同或不同。側導雷二门¥電性者，與不溶性陽極之材質 層為銅而外層為其他可為銅合金，較佳為-種内 組合，例如Ti/Cu。 電生且尚耐化學腐蝕性之金屬的 根據本創作之另— 統包括一電鍍槽，—:創作之不溶性陽極電鍍系 對立放置於該卿内極及—陰極’其中該對陽極分別 不溶性陽極主體之二電桿分別緊密連合於每個 分別與各個陽極保持陰極放置於該對陽極之間並 本創作之不溶性陽極電 該電鍍槽，該電:系、、充更包括一電鑛液充滿於 在該陰極上-制。其中，朗妓之面積，以 本創作之不溶性陽極電鍍系統更包括!層全 偵測器，其中該電鑛金屬濃度偵測器係電 極，用以控制電鍍金屬的補充。 μ二除 【實施方式】 由於不溶性陽極電鍍系統中，通過陽極的電流量合因 ，阻而遞減’導致金屬離子的濃度從頂部往底部漸減: 成鍍層厚度從靠近液面處往底部處遞減，使電鍍品質; 降本創作人發現，通過陽極的電流是決定錢層是否均勺 的主要關鍵；當電流可以均勻地通過整個陽極βθ场二 厚度便可均勻。 寸锻層的 有鑑於此，本創作人設計出一新穎的不溶性陽極結 M299168 構。圖二係繪示根據本創作之一具體實施例，一種應用於 不洛性陽極電鍍系統之不溶性陽極結構示意圖。請參考 二，本創作應用於不溶性陽極電鐘系統之不溶性陽極包二 -不溶性陽極主體31G及分別設置於不溶性陽 兩側之側導電桿311。 王體310 ^个巧你电級吋个膂破分解且為肖M299168 VIII. New Description: [New Technology Field] This creation is about the electric money system, more specifically, about the insoluble anodizing system. [Prior Art] Currently known electroplating systems are separable anodizing systems and insoluble anodizing systems provided by thief metal. A schematic diagram of a dissolved anode electrowinning system is depicted. =0'A pair of anode baskets_-cathode_, electric bribes 13 () 2 = 'ρΓΓΓ中, Hai to anode M110 is placed oppositely in the electric ore tank 100 and placed between the pair of anode baskets 110, and each anode Blue 110 ΐ t L The plating solution 13G covers the cathode 12G and the pair of anodes: the electricity is formed at the cathode, the exit speed = the metal deposition rate of the crucible and the metal solution of the anode basket 110, ... 5, to avoid uncontrollable plating The liquid electricity in the liquid is all concentrated; #, : as much as the operation of the large anode and small cathode. ;;=上: Set: Yang 1110, as a soluble anode, on the one hand can supplement the electric ore to achieve the purpose of "large anode and small cathode". As the LeFyi block dissolves and gradually shrinks, the anode basket 110 has problems such as electrolysis of the metal mud and the adsorption of the bright agent to the anode basket, so that the stability and cleanliness of the M299168 plating solution 130 is difficult. control. The figure shows a schematic cross-sectional view of a conventional insoluble anodizing system. Please refer to @二, the insoluble anode system includes _ money tank fine two pairs of anode 210, a cathode 220, a plating solution 23 〇 and a plating metal filling tank 25 〇. The pair of anodes 210 are respectively placed opposite to each other in the money slot, and the cathode 220 is placed between the pair of anodes 21A and kept at a distance from each of the anodes 210, respectively. The plating solution 23 is filled with a plating bath 2, and the liquid surface covers the area to be plated by the cathode to form a plating layer 240 on both sides of the cathode 220. A conductive sheet 2 ιι is respectively disposed on the upper ends of the pair of anodes 21, and the conductive sheets 211 are electrically connected to an electroplated metal concentration detector 251, and are controlled by an automatic metallurgical concentration 251 251 # automatic sampling analysis to control (4) metal replenishment. It is replenished from a plating metal bath 25 placed outside the plating bath. When the plating metal concentration detector 251 detects that the concentration of the metal ions in the plating solution is too low, the plating metal replenishing liquid which has been dissolved into an ion state is immediately added to the electric ore tank 200. • Since the plating metal supply system of the insoluble anodizing system is from the plating bath, the cleaning liquid can be cleaned by filtration, and the addition of the plating metal and the stability of the plating solution can be controlled by monitoring and analysis, so the insoluble anode The plating system is ideal for special or high-end products. The anode of the insoluble 11⁄4 pole electric chain system does not dissolve when it is subjected to electric ore. Therefore, it is necessary to provide an additional source of electroplating metal. At present, the supply methods used in the industry generally include electrolytically dissolving electrolytic metal, oxidizing the electrolytic metal and adding it easily. The metal salt of metal ions, which is most commonly used for the consideration of cost, provides a source of metal by electrolysis and oxidation. M299168 ^ In the way of electrolytically dissolving electroplated metal, it is usually necessary to mix an ion exchange membrane to block the plating of metal in the plating metal bath. However, there are many side effects, including the inability to completely filter the metal ions, resulting in a few The formation of metal powder causes unnecessary waste; the replacement and maintenance cost of the film is changed from the f-family; the gloss agent is consumed by electrolysis, and the cost of the plating solution is increased. The greatest advantage of providing a source of electroplated metal by oxidation is that there is no problem of metal-eutectoidization, but there is also a problem that the gloss agent is consumed by oxidation' and the cracked product after oxidation may also cause a drop in plating quality. The method of adding a metal salt which is easy to form a metal ion to provide a plating metal is relatively inferior to the above two methods. However, the overall operating cost is caused by the need to purchase a high-purity electro-mineral metal. Excessive, or difficult to control the amount of impurities used in the recovery of metal salts affect the quality of the forged layer. In an insoluble anodizing system, when current flows from the top of the anode to the bottom of the anode _35, the amount of current will decrease due to resistance. In other words, at the top of the anode, since the current passing through it is large, it is more The metal ions are decomposed and released, and the current passing through the lower portion is less than the current passing through the upper portion, so that less metal ions are decomposed and released. Please refer to the figure - M+ indicates the metal released from the anode, the arrow indicates the metal ion row, = direction, the length of the arrow vector indicates the metal ion coupon released at the place, the elder indicates that there are more metal ions, and vice versa. Also. When the metal ions are attracted to the cathode and adhere to the surface of the cathode, a plating layer is formed. As shown in Figure 2, the concentration of metal ions near the liquid level of the plating solution is higher. The lower the ί 7 M299168 rabbit is, the lower the wave height, so the thickness of the coating is from the bottom of the liquid to the halogen, oysters, and madness. r Sin is smothered at the face of the face, resulting in uneven coating thickness, which reduces the quality of plating. Yarn = In order to meet the minimum thickness of the ore layer, it is often necessary to increase the operating cost. (4) When the thickness of the first plating of the plating quality is uniform, especially for the buckle and P-brush circuit board industry, it is more demanding, and how to provide a stable quality of electric ore products to the surface. In order to strive for the goal. It is the electric surface industry [new content] Therefore, the purpose of this creation is to provide an insoluble anode, which can obtain a uniform coating thickness by using the electroplating system of the present invention. Another object of the present invention is to provide an insoluble anodizing system. , applicable to the electric ore process of various sources of electric ore metal supply. This creation is also aimed at providing an insoluble anode money system that achieves mirroring without the need for other components of the hybrid plating system. Improve quality and reduce the cost of electron mirrors. According to one aspect of the present invention, the insoluble anodic electron microscope system of the present invention comprises an insoluble anode structure comprising an insoluble anode body and side conductive rods respectively disposed on both sides of the insoluble anode body. The insoluble anode itself is not decomposed during electroplating and is a good electrical conductor, and includes one or more groups selected from the group consisting of pb, c, sus, Pt/Ti, ir〇2/Ti, Ru02/Ti. By. The material of the M299168 side conductive crucible is the same or different. The side-guided two-gate electric material, the material of the insoluble anode and the material of the insoluble anode are copper, and the outer layer may be other copper alloy, preferably in-species combination, such as Ti/Cu. The electrosonic and chemically resistant metal according to the present invention includes an electroplating bath, - the insoluble anodizing is created in opposition to the inner pole and the cathode, wherein the pair of anodes respectively are insoluble anode bodies The second poles are respectively closely connected to each of the anodes, which are respectively placed between the pair of anodes and the anodes, and the insoluble anodes of the present invention are electrically connected to the plating tank. The electric system is filled with an electric mineral liquid. The cathode is on-system. Among them, the area of the recitation, the insoluble anodizing system of the present invention further includes a layer full detector, wherein the electric metal concentration detector is an electrode for controlling the replenishment of the plating metal. μ 二除[Embodiment] In the insoluble anodizing system, the amount of current passing through the anode decreases, and the resistance decreases. The concentration of metal ions decreases from the top to the bottom: the thickness of the plating layer decreases from near the liquid surface to the bottom. The quality of the plating; the author found that the current through the anode is the main key to determine whether the money layer is scooped; when the current can be uniformly passed through the entire anode βθ field two thickness can be uniform. In view of this, the author designed a novel insoluble anode junction M299168 structure. Figure 2 is a schematic view showing the structure of an insoluble anode applied to a non-magnetic anodizing system according to a specific embodiment of the present invention. Please refer to 2. This application is applied to the insoluble anode-two insoluble anode body 31G of the insoluble anode clock system and the side conductive rods 311 respectively disposed on the sides of the insoluble anode. The king body 310 ^ Qiao you electric level 吋 膂 分解 分解 且 且 且 且
好的電導體即可，例如包括由—種或多種選自由pb c = Pt/IXIrC^/TLRuC^/Ti所組成之族群所形成者。，，， 側導電桿311係、緊密連接於不溶 側:連;之方式可為焊接、_或其他可使同材質= 材貝緊讀合之方式。侧導電桿311的材料須為言導= 者，可與不溶性陽極310之材質相同4 、’、、、问導電性 祕料入A 或不同。側導電桿311 =枓g為銅合金，更佳為内層為銅㈣層為其 電性且南耐化學腐錄之金屬的組合，例如Ti/Cu。 圖四係緣示根據本創作之一具體實施例，A good electrical conductor may be, for example, one or more of those selected from the group consisting of pb c = Pt/IXIrC^/TLRuC^/Ti. ,,, the side conductive rod 311, tightly connected to the insoluble side: connected; the way can be welding, _ or other way to make the same material = material shell tightly fit. The material of the side conductive rod 311 must be the same as that of the insoluble anode 310. 4, ',,, the conductivity of the secret material into A or different. The side conductive rod 311 = 枓g is a copper alloy, and more preferably the inner layer is a combination of a copper (four) layer which is electrically and which is resistant to chemical corrosion, such as Ti/Cu. Figure 4 is a diagram showing a specific embodiment according to the present creation,
:極電鍍系統之主要立體結構示意圖。請參考圖四= 作之不溶性陽極紐线包括—電簡则， 及-陰極320。其中該對陽極31〇分卿 3⑻内’二側導電桿311分別緊密連合於每個不溶性= 體310之兩側。該陰極320放置於該對° 別與各個陽極⑽保持一定距離置於咖極训之間並分 為使電流經固定元件進入陽極主 =件的材質需採用高導電性材料，例如銅件 較佳與側導電桿同寬’然而不限於-定要與側導= t: The main three-dimensional structure diagram of the electrode plating system. Please refer to Figure 4 = Insoluble anode wire including - electric outline, and - cathode 320. The two side conductive rods 311 of the pair of anodes 31 are respectively tightly coupled to the sides of each insoluble body 310. The cathode 320 is placed at a distance between the pair of anodes (10) and placed between the poles and is divided into a material that allows current to pass through the fixing member into the anode main member. A material having a high conductivity, such as a copper member, is preferably used. Same width as side conductive rods 'but not limited to - with side guides = t
10 M299168 寬’可視©定元件與側導電桿的材質及其導電性決定固定 元件的寬度。10 M299168 Wide 'visual © fixed material and the material of the side conductive rod and its conductivity determine the width of the fixed element.
^請參考圖四，在該實施例裡，固定元件係為一主要以 高導電性金屬製成的樞㈣固定元件312，該樞軸式導電板 12包括—中”位，中空部位的兩側分別連接-固定板。 在一主導電桿360穿過樞軸式固定元件Μ〕之中空部分 後，分別將該二個固定板固定後即可使陽極就定位:中二 部㈣^恰好與穿過的主導電桿緊密接合，使電流可^ 導電桿360與樞轴式固定元件312，再經陽極兩 的側導電桿311流過整個陽極。 曰圖五係繪示根據本創作之一具體實施例，一種不溶性 陽極電鑛系統之剖面示意圖。請參考圖五，本創作之不溶 性陽極電鑛系統包括電鍍槽300,陽極310及陰極320。一 電鍍液330充滿於電鍍槽3〇〇，電鍍液之液面覆蓋陰極所欲 電鍍之面積，以在陰極320的兩側上分別一鍍層34〇。 然，，利用本創作之不溶性陽極電鍍系統所形成之鍍 層=數量不限於2 ^，可視產品所f決定朗數。若產品 僅需一鍍層，則只要藉由控制電流只通過其中一個陽極， 即可在陰極所欲電鍍的那一面上形成一鍍層。 不洛1± 極電鍵糸統的主導電桿分別電性連接一電鍛 金屬濃度偵測器351，透過電鑛金屬濃度_器351的自動 取樣:析來控制電錢金屬的補充，從一放置於電鑛槽3〇〇 卜的電鑛金屬洛槽350補充。當電鑛金屬濃度偵測器 價測到電艘液内的金屬離子濃度過低，則立即將已溶解成Referring to FIG. 4, in this embodiment, the fixing member is a pivot (four) fixing member 312 mainly made of a highly conductive metal, and the pivotal conductive plate 12 includes a middle position, and both sides of the hollow portion Connect the fixing plate separately. After a main conductive rod 360 passes through the hollow portion of the pivoting fixing member ,, the two fixing plates are respectively fixed to position the anode: the middle two parts (four) ^ just wear and wear The main conductive rods are closely engaged, so that the current can be electrically connected to the conductive rod 360 and the pivotal fixing member 312, and then flow through the anode conductive rod 311 through the anode. The figure 5 shows the implementation according to one of the creations. For example, a schematic cross-sectional view of an insoluble anodic ore system. Referring to Figure 5, the insoluble anode electrowinning system of the present invention comprises a plating tank 300, an anode 310 and a cathode 320. A plating solution 330 is filled in the plating tank 3, the plating solution The liquid surface covers the area to be electroplated by the cathode to be plated on both sides of the cathode 320. However, the plating layer formed by the insoluble anodizing system of the present invention is not limited to 2 ^, visual product F If the product only needs one plating layer, then by controlling the current through only one of the anodes, a plating layer can be formed on the side to be plated by the cathode. The main conductive rods of the Lou 1± pole electric switch system respectively Electrically connected to an electric forging metal concentration detector 351, through the automatic sampling of the electric ore metal concentration _ 351: analysis to control the replenishment of the electric money metal, from a metal mine placed in the electric ore tank 3 The tank 350 is supplemented. When the metal ore concentration detector detects that the metal ion concentration in the battery liquid is too low, it will be dissolved immediately.
Cs 11 M299168 離子狀態的電鍍金屬補充液加入該電鍍槽300内。 電鍍金屬溶槽350中的電鍍金屬補充液可藉由將固體 金屬氧化物或是其他形式的金屬粉末在電鍍金屬溶槽350 内或於加入電鑛金屬溶槽350前先行完全溶解於適當溶劑 中而得。 由於側導電桿之設置，使電流得以均勻地從陽極頂部 流到陽極底部，不會發生有如習知者因電流不均勻所造成 等問題，請續參考圖五，當電流可以均勻地流經整個陽極 主體時，被分解釋放出來的金屬離子濃度從上到下都可以 很均勻，金屬離子可以平均地被吸附到陰極上，因此形成 均勻厚度的鍍層，藉以提高電鍍品質。 在本創作之不溶性陽極電鍍系統裡，只需在既有的陽 極板側邊加裝側導電桿，不需要改變其組件配置即可收改 善電鑛品質之效’因此本創作之不溶性陽極電鑛系統可廣 泛用於目W各種不溶性陽極電鐘系統。 此外，本創作之不溶性陽極電鍍系統可應用於各種金 屬電鑛如錢金，銅，錫，鎳等，尤其是供應電子產業 需求最大的印刷電路板所需的鑛銅製程。 雖然本創作係已參照較佳實施例來加以描述，將為吾 人所瞭解的7C ’、本創作並未受限於其詳細描述内容。替換 方式及修改樣式係已於先前描述中所建議，並且其他替換 方式及修改樣式將為熟習此項技藝之人士所思及。特別 是，根據本創作之裝置結構，所有具有實質上相同於本創 作之組件結合而達成與本_實質上相同絲者皆不脫離 12 M299168 本創作之精神範疇。因此，所有此等替換方式及修改樣式 係意欲落在本創作於隨附申請專利範圍及其均等物所界定 的範疇之中。 【圖式簡单說明】 圖一係繪示一種習知溶解性陽極電鍍系統之示意圖； 圖二係繪示一種習知不溶性陽極電鍍系統之剖面示意 _ 圖； 圖三係繪示根據本創作之一具體實施例，一種應用於 不溶性陽極電鍵系統之不溶性陽極結構示意圖； 圖四係繪示根據本創作之一具體實施例，一種不溶性 陽極電鍍系統之主要立體結構示意圖；及 圖五係繪示根據本創作之一具體實施例，一種不溶性 陽極電鍍系統之剖面示意圖。 _ 【元件標號說明】 電鍍槽100 陽極籃110 陰極120 電鍍液130 電鍍層140 電鍍槽200 陽極210 導電片211 .七 13 M299168 陰極220 電鍍液230 電鍍金屬濃度偵測器251 電鍍槽300 不溶性陽極主體310 側導電桿311 樞軸式固定元件312 陰極320 電鍍液330 鍍層340 電鑛金屬溶槽350 電鍍金屬濃度偵測器351 主導電桿360Cs 11 M299168 An ionic state plating metal replenisher is added to the plating bath 300. The electroplating metal replenishing solution in the electroplating metal bath 350 can be completely dissolved in a suitable solvent by emulating a solid metal oxide or other forms of metal powder in the electroplating metal bath 350 or before adding the electroplating metal bath 350. And got it. Due to the arrangement of the side conductive rods, the current can be uniformly flowed from the top of the anode to the bottom of the anode, and problems such as the current unevenness caused by the conventional ones do not occur. Please refer to FIG. 5, when the current can flow uniformly throughout the whole. In the case of the anode main body, the concentration of the metal ions released and decomposed can be uniform from top to bottom, and the metal ions can be uniformly adsorbed onto the cathode, thereby forming a plating layer having a uniform thickness, thereby improving the plating quality. In the insoluble anodizing system of the present invention, it is only necessary to install a side conductive rod on the side of the existing anode plate, and it is possible to improve the quality of the electric ore without changing the component configuration. Therefore, the insoluble anode electric mine of the present invention The system can be widely used in various insoluble anode clock systems. In addition, the insoluble anodizing system of this creation can be applied to various metal ore deposits such as gold, copper, tin, nickel, etc., especially for the copper ore process required for the most demanding printed circuit boards in the electronics industry. Although the present authoring system has been described with reference to the preferred embodiments, it will be understood that the present invention is not limited by the detailed description thereof. Alternatives and modifications are suggested in the previous description, and other alternatives and modifications will be apparent to those skilled in the art. In particular, according to the structure of the device of the present invention, all of the components having substantially the same composition as the creation of the present invention are substantially the same as those of the present invention. Therefore, all such alternatives and modifications are intended to fall within the scope of the invention as defined by the appended claims and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional dissolved anodizing system; FIG. 2 is a schematic cross-sectional view showing a conventional insoluble anodizing system; FIG. 3 is a diagram showing A specific embodiment, a schematic diagram of an insoluble anode structure applied to an insoluble anode key system; FIG. 4 is a schematic diagram showing the main structure of an insoluble anodizing system according to an embodiment of the present invention; and FIG. A specific embodiment of the present invention is a schematic cross-sectional view of an insoluble anodizing system. _ [Description of component label] Plating tank 100 anode basket 110 cathode 120 plating solution 130 plating layer 140 plating bath 200 anode 210 conductive sheet 211 . seven 13 M299168 cathode 220 plating solution 230 plating metal concentration detector 251 plating tank 300 insoluble anode body 310 Side Conductor Rod 311 Pivot Mounting Element 312 Cathode 320 Plating Solution 330 Plating 340 Electrodepositing Metal Tank 350 Plating Metal Concentration Detector 351 Main Conductor 360
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