JP2002105694A - Method and apparatus for barrel plating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for barrel plating of a terminal electrode without using any media by solving problems that, if the shape of chip parts becomes small, not only the terminal electrode but also the medium is barrel-plated in the barrel plating using the medium, and it is difficult to separate the chip parts from the medium after the plating is completed. SOLUTION: In this method and this apparatus for barrel plating, an electric insulation film is formed on an outer side of the barrel 11 comprising a cylindrical body 111 using a wire net or a conductive porous plate, the cylindrical body 111 is connected to a negative (-) terminal of a power source 3, only the chip parts 1 are accommodated within the barrel 11, and the chip parts 1 are agitated by the rotation of the barrel 11. The terminal electrode of the chip parts 1 in contact with the inner side of the cylindrical body 111 is conducted to the negative (-) terminal, and the terminal electrode of other chip parts 1 in contact with the terminal electrode is also conducted to the negative (-) terminal. A conductive chain is formed only by the terminal electrodes of the adjacent chip parts 1, and the terminal electrodes of the chip parts 1 are conducted to the negative (-) terminal to perform the plating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for plating an electronic component, which are used for forming external electrodes of the electronic component. The present invention relates to a barrel plating method and apparatus for forming terminal electrodes and the like by barrel electrolytic plating.

[0002]

2. Description of the Related Art Conventionally, as a barrel plating apparatus for forming terminal electrodes 101 and 102 of a chip component 1 shown in FIG.
A configuration is known in which a plating bath 40 in which the electrolytic plating solution 6 is stored is provided, and the barrel unit 50 is immersed in the plating bath 40. As shown in FIGS. 5 and 6, the barrel unit 5
Numeral 0 contains the chip component 1 and the media 2 in a barrel 51, and each of the barrel units 50 has an anode 4 as a positive electrode (+) and a cathode 5 as a negative electrode (-). Is connected to the external power supply device 3 through the conducting wires 31 and 32 and energized, and a predetermined plating is applied from the plating solution 6 to form the terminal electrodes 101 and 102 of the chip component 1 housed in the barrel 51. The chip component 1 and the media 2 housed in the barrel 51 have minute shapes, and are drawn as an aggregate of many in FIG. 5, so that the line indicating the top surface of the aggregate and the oblique line indicating the cross section Expressed by The barrel 51 is provided with resin lids 512 and 513 at both ends of a resin cylindrical frame 511, and is provided with a resin net 514 for closing an opening of a frame constituting the outer periphery of the cylindrical frame 511.
A resin-made or resin-coated metal shaft 52 is provided through the center of the cylinder 1 and the lids 512 and 513.
The connecting rod 55 and both ends of the shaft 52 are fixed to the base plates 3 and 54, respectively, and pedestal plates 56 and 57 are fixed to the lower ends of the side plates 53 and 54, respectively.
The barrel 51 is rotatably supported by the shaft 52 and rotates in the direction of arrow F. Then, the lid 513 and the sprocket 51
When a rotational drive force is transmitted from the drive chain 7 to the sprocket 515, which shares and fixes the rotation center with the sprocket 5, the sprocket 515 and the barrel 51 are supported by the shaft 52 and rotate.
The cathode 5 is provided with a conductor 520 at the center of a shaft 52 made of resin or coated with resin, and a plurality of electrodes 521 are connected to the conductor 520 and protrude in a direction perpendicular to the conductor 520. The electrode 521 is coated with a resin except that the spherical tip is exposed. The other end of the conductor 520 rises upward inside the side plate 53,
The conductor 32 is connected to the upper end 522 of the conductor 520. In the barrel unit 50, the cathode 5 has a spherical electrode 521.
, And only the upper end 522 is exposed at the top for connection.
The chip component 1 and the media 2 housed in the barrel 51 come into contact with the electrode 521 to conduct. When the conductors 31 and 32 are energized from the power supply device 3 while the barrel 51 is immersed and rotated in the plating solution 6 in the plating bath 40, the body 1 of the chip component 1 is turned on.
A plating current flows from the electrode 521 via the medium 2 or directly to the base of the terminal electrodes 101 and 102 provided in advance at 00 and plating is performed. The size of the chip component 1 is, for example, 3.2 mm × 1.6 m in length × width.
m, 2.0 mm x 1.25 mm, 1.6 mm x 0.8 m
m, a very small shape of 1.0 mm × 0.5 mm, and more recently a more minute shape of 0.6 mm × 0.3 mm. As the shape becomes smaller, the proportion of the terminal electrodes 101 and 102 in the chip component 1 increases. For example,
For a 3.2 mm x 1.6 mm shape, 0.2 m from each end
m, 0.2m for each 2.0mm x 1.25mm shape
m, 0.2mm each for 1.6mm x 0.8mm shape
And for a 1.0 mm × 0.5 mm shape,
mm. Further, in the case of a shape of 0.6 mm × 0.3 mm, each is 0.1 to 0.2 mm, and the ratio of the terminals 101 and 102 from both ends to the element body 100 increases, and the distance between the terminal electrodes 101 and 102 is reduced. You are approaching. This tendency is attributed to the terminal electrodes 101, 1 of the chip component 1.
When forming the layer 02, it is required to apply a more uniform plating to the base of the terminal electrodes 101 and 102, and the media 2 housed together with the chip component 1 also needs to be formed in a finer shape. The time required for plating is affected by the strength of the plating current, but if the plating current is increased, the chip components 1 and the media 2 will adhere to each other, and after the plating is completed, the chip components 1 and the media 2 will be individually separated. If they cannot be separated or can be separated, defects occur in the terminal electrodes 101 and 102 of the chip component 1. Therefore, the plating current is weakened as the shape of the chip component 1 becomes smaller, but the plating becomes more difficult as the shape of the chip component 1 becomes smaller, and the chip component 1 and the media 2 housed in the barrel 51 are rotated by the rotation of the barrel 51. However, there is a problem that the media 2 is plated together with the chip component 1.

[0003]

According to the above-mentioned prior art, a chip containing a chip and a medium is accommodated in a barrel and immersed in a plating bath containing an electrolytic plating solution. When a current flows through the cathode, the chip component and the media come into contact with the cathode electrode while being stirred, and a plating current flows. However, as the shape of chip components becomes smaller and plating becomes more difficult, there are many problems that plating is performed up to the media together with the chip components, and if the plating current is increased and plating is completed in a short time, they will adhere to each other. become. If the plating current is weakened, it takes a long time until the plating is completed, and the shape of the media becomes minute, so that it becomes difficult to separate the chip component from the chip component after the plating is completed. On the other hand, when the shape of the chip component is small, the ratio of the terminal electrode to the element body increases, and when the ratio of the terminal electrode increases, the chip components come into contact with each other to easily conduct electricity. Accordingly, an object of the present invention is to form terminal electrodes of chip components by plating without using media. Therefore, the problem to be solved by the invention is a means for supplying electricity from the cathode side to the base of the terminal electrode of the chip component without using media, and a barrel plating in which plating current is concentrated on the terminal electrode of the chip component without using media. The present invention provides a barrel plating method and apparatus that realizes an apparatus and solves the problem of plating that becomes remarkable when chip parts and media have minute shapes by using no media, and that does not use media for forming terminal electrodes of chip parts. The purpose is to:

[0004] Other objects and novel features of the present invention will become apparent in embodiments described later.

[0005]

According to a first aspect of the present invention, there is provided a cylindrical member having a plurality of gaps through which a plating solution is passed, and the outside of which is electrically insulated. Then, the cylinder is connected to a power source so that the inside of the cylinder becomes a negative electrode, and is electrically connected, a chip component having a terminal electrode is accommodated in a barrel made of the cylinder, and the tip is rotated by rotating the barrel. The barrel plating method is characterized in that the component is agitated, and the terminal electrode of the chip component that contacts the inside of the cylindrical body is plated while being electrically connected to the negative electrode.

According to a second aspect of the present invention, the outside of the cylindrical body which is made of a conductor and has a plurality of gaps through which a plating solution passes is electrically insulated, and the inside of the cylindrical body serves as a negative electrode. The body is connected to a power source to conduct electricity, a chip part having a terminal electrode is accommodated in a barrel made of the cylindrical body, and the chip part is stirred by rotation of the barrel, and a chip part contacting the inside of the cylindrical body is formed. A terminal electrode conducts to the negative electrode, contacts the terminal electrode of the chip component, and a terminal electrode of another chip component also conducts to the negative electrode, and a terminal electrode of the chip component contacts to form a chain of conduction. A barrel plating method is characterized in that the terminal electrode of the chip component is electrically connected to the negative electrode and plated.

According to a third aspect of the present invention, the barrel made of the cylinder rotates about a cylinder center in a substantially horizontal direction as a rotation center axis, and the chip component is filled in the barrel with 30% of the internal volume of the barrel. The barrel plating method according to claim 1 or 2, wherein the barrel plating is carried out within a range not exceeding.

According to a fourth aspect of the present invention, there is provided a cylindrical body having a plurality of gaps through which a plating solution is passed through, an electric insulating film provided on the outside of the cylindrical body, and one end of the cylindrical body. A power supply flange that also serves as a lid that closes the opening, a power supply flange that communicates with the cylindrical body, and a barrel that includes a lid that closes the opening at the other end of the cylindrical body is provided. Provided,
The barrel is rotatably supported with the shaft being rotatable about a substantially horizontal direction as a rotation center axis, and is connected to a power supply device from a sliding piece that is in contact with the power supply flange so that the inside of the cylindrical body becomes a negative electrode, and conducts electricity. A chip component having a terminal electrode is accommodated in the barrel, and a terminal electrode of the chip component that contacts the inside of the cylindrical body conducts to the negative electrode, and contacts another terminal chip of the chip component. Barrel plating wherein the terminal electrodes of the components are also electrically connected to the negative electrodes, the terminal electrodes of the chip components are in contact with each other to form a chain of continuity, and the terminal electrodes of the chip components are electrically connected to the negative electrodes and plated. Equipment.

The invention according to claim 5 is the barrel plating apparatus according to claim 4, wherein the cylinder has a hexagonal, octagonal, or hexagonal cross section orthogonal to the rotation axis.

According to a sixth aspect of the present invention, in the barrel according to the fourth or fifth aspect, the cylindrical body is a cylindrical body using a wire mesh, and an electrical insulating film is applied to an outside of the wire mesh forming the cylindrical body. It is a plating device.

According to a seventh aspect of the present invention, the cylindrical body is a cylindrical body using a perforated plate, and the porous plate is formed by applying an electric insulating film on an outer side of the cylindrical body. Barrel plating equipment.

According to an eighth aspect of the present invention, there is provided the barrel plating apparatus according to the fourth, fifth, sixth or seventh aspect, wherein the electric insulating film is an insulating resin paint applied to the outside of the cylindrical body.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a barrel plating method and apparatus according to the present invention will be described with reference to the drawings.

FIG. 1 shows a barrel unit 1 in a plating bath 40.
FIG. 2 shows a cross-sectional view of the barrel unit 10 immersed therein, and FIG. Parts that are the same as the configuration described in the related art are denoted by the same reference numerals. The electroplating bath 6 is stored in a predetermined position in the plating bath 40, and pedestals 41 and 42 for mounting the barrel unit 10 are provided at the bottom of the plating bath 40. Does not draw only the crossing part. Barrel unit 10 is barrel 1
An anode 4 made of a material such as Ni as a positive electrode (+) for each of the barrel units 10 containing a chip component 1
And a negative electrode (−) side having a cathode configuration described later. The positive electrode is connected to the (+) output terminal of the power supply device 3 via a conductor 31 coated with insulation except for the connection terminal, and the negative electrode side is connected to the connection terminal. , Except that it is connected to the (-) output terminal of the power supply device 3 by a conductive wire 32 coated with insulation.

The barrel unit 10 includes a resin side plate 13,
14, the both ends of the connecting rod 15 are fixed to the side plates 13 and 14, respectively.
Each of the side plates 13 has a bearing hole 131, the side plate 14 has a bearing hole 141, and the bearing hole 131 rotatably supports the shaft 12A. To rotatably support the shaft 12B,
The barrel 11 integrally having the shafts 12A and 12B is the bearing hole 1
31 and 141 are rotatably supported. The barrel 11 is a cylindrical body 11 made of a wire mesh 811 or a perforated plate 911.
The material of the wire netting 811 or the perforated plate 911 provided with the power supply flange 112 and the lid 113 at both ends of 1 is an electric conductor, and is coated with a coating as shown in FIG. 3 or FIG.

FIG. 3 shows an example in which a wire mesh 811 is used for the cylindrical body 111, and is a perspective view in which a part of the wire mesh 811 is cut and enlarged. The wire mesh 811 is formed by knitting a plurality of wires 812 vertically and a plurality of wires 813 horizontally. The direction indicated by an arrow A is inside the cylinder 111, and the direction indicated by an arrow B is the cylinder 111.
Outside. The wires 812 and 813 are selected from stainless steel, titanium or a titanium alloy, copper or a copper alloy, and the like. These materials are conductors whose relationship with the plating solution 6 is stable, but the cost due to the material is low. Considering this, stainless steel is easy to select. Arrow B on wire mesh 811
An electrical insulating resin paint 814 is applied to the half surface in the direction indicated by the arrow. A synthetic resin paint is suitable for the insulating resin paint 814 in consideration of cost.
It is preferable to bake and coat on the arrow B side after knitting. Also, a strong coating film can be obtained by applying electrodeposition coating. The coating should be performed in advance by applying a resist treatment on the arrow A side. May be removed, or an insulating film may be formed by surface treatment of the wires 812 and 813 instead of the insulating resin paint 814.

FIG. 4 shows an example in which a perforated plate 911 is used for the cylinder 111, and is a perspective view in which a part of the cylinder 111 is sectioned. The cylinder 111 is a polygonal cylinder made of a perforated plate 911. The direction indicated by an arrow A is inside the cylinder 111, and the direction indicated by an arrow B is outside the cylinder 111. Perforated plate 911
Is provided with a plurality of holes 913 that penetrate from the inside to the outside of the cylindrical body 111 in a predetermined arrangement. The perforated plate 911 is made of stainless steel, titanium or titanium alloy, copper or copper alloy,
These materials are conductors whose relationship with the plating solution 6 is stable, but stainless steel is easy to select in consideration of the cost due to the material. The porous plate processed into the cylindrical body 111 is formed by applying an electric insulating resin paint 912 on the surface in the direction indicated by the arrow B. The insulating resin paint 912 is preferably made of a synthetic resin in consideration of cost. It is preferable to bake and paint on the arrow B side after processing into the body 111. At this time, the paint is applied while protecting the holes 913 so as not to be blocked, and a strong coating film is obtained by applying electrodeposition coating. Instead of the insulating resin paint 912, the surface of the porous plate 911 may be surface-treated to form an insulating film, or the insulating resin paint 912 may be applied or surface-treated on a half surface of the porous plate 911 in advance to form an insulating film. Using the perforated plate 911, the cylindrical body 111
May be configured.

The chip component 1 housed in the barrel 11 has a minute shape and is drawn as an aggregate of many in FIG. 1, so that a line indicating the top surface of the assembly and a hatched line indicating the cross section Expressed by Barrel 11 is wire mesh 81
A power supply flange 11 having a power supply flange 112 and a lid 113 at both ends of a cylindrical body 111 made of
Reference numeral 2 denotes a lid which also serves as a lid for closing an opening at one end of the cylindrical body 111.
Reference numeral 13 denotes a lid for closing the opening at the other end of the cylindrical body 111. A shaft 12A sharing the center of rotation with the center of the cylinder 111 is fixed to the power supply flange 112, and a shaft 12B sharing the center of rotation with the center of the cylinder 111 is fixed to the lid 113. The bearing hole 1 in which a sprocket 114 is fitted on the shaft 12B while sharing a center of rotation and is fixed by a set screw.
A shaft 12A is rotatably supported at 31 and a shaft 12B is rotatably supported at a bearing hole 141. The barrel 11 is rotatably supported between the side plates 13 and 14, and the drive chain 7
And the sprocket 114 is engaged and driven.

The shafts 12A and 12B are suitably made of a resin or a metal covered with a resin, and the metal is preferably a stainless steel which is low in cost and can be immersed in the plating solution 6. Lid 1
Reference numeral 13 is an electrical insulator made of resin. Power supply flange 1
Reference numeral 12 denotes a conductor 112 such as stainless steel, and has a circumferential surface 112.
An insulating resin coating is applied to the surfaces 112C and 112D excluding A to form an electrically insulating film, but the power supply flange 112 and the cylindrical body 111 are electrically connected. When a wire mesh 811 is used for the cylindrical body 111, the circumferential surface 11 of the power supply flange 112 is used.
2A and the wire mesh 811 are electrically connected to each other.
A and the perforated plate 911 are electrically connected. A block 18 made of an insulating resin or the like is fixed to the connecting rod 15. A sliding piece 20 made of a conductor is attached to the block 18 by pressing it with a holder 19. A lead wire 32 is fixed to the upper end of the sliding piece 20 and connected to an external power supply device 3. The sliding piece 20 is a leaf spring made of a member having a spring property such as phosphor bronze, for example.
The lower end 20A of the sliding piece 20 is pressed into contact with the circumferential surface 112A to be electrically connected to the 2A.
Even if the power supply flange 112 provided with the circumferential surface 112A rotates in the direction of the arrow F, the electrical conduction between the conductor 32, the sliding piece 20, and the power supply flange 112 is always maintained. It has a configuration that includes the shafts 12A and 12B and is electrically insulated from other parts.

FIG. 2 shows a case in which the barrel 11 uses a wire mesh 113.
An example of the barrel unit 10 which is a rectangular cylinder 111 is shown. The cylinder 111 is suitably a hexagon, octagon or hexagon. The chip component 1 on which the terminal electrodes are preliminarily provided is accommodated in the barrel 11, and the accommodated amount is suitably within a range not exceeding 30% of the inner volume of the barrel 11. That is, only the chip component 1 on which the terminal electrode is preliminarily provided is accommodated in the barrel 11, and the barrel unit 10 including the barrel 11 is mounted on the pedestal 4 of the plating bath 40 as shown in FIG.
The plating bath 6, which is placed on the plating baths 1 and 42, is preliminarily filled with a predetermined amount of the plating solution 6, and the barrel 11 containing the chip component 1 is immersed in the plating solution 6.
The anode 4 in the plating bath 40 is connected to the power supply
, The sliding piece 20 of the barrel unit 10 is connected to the (-) output end of the power supply 3 by a conducting wire 32. The sliding piece 20 is pressed into contact with the power supply flange 112 to conduct. The cylindrical body 111 that is electrically connected to the power supply flange 112 contacts the chip component 1 and is electrically connected to complete the configuration on the cathode side. The drive chain 7 rotates the sprocket 114 to rotate the barrel 11, and the barrel 11 rotates around a substantially horizontal direction as a rotation center axis. The chip components 1 accommodated in the barrel 11 fall below the barrel 11 and gather. When the barrel 11 rotates, the aggregate of the chip components 1 is stirred while falling downward. The plating current is the (+) output terminal of the power supply 3 → the conductor 31 → the anode 4 → the plating solution 6 → the terminal electrodes 101 and 102 of the chip component 1 → the cylinder 111 → the power supply flange 112 → the sliding piece 20 → the conductor 32 → the power supply. (-) Of device 3
The plating current flows from the plating solution 6 to the cylinder 1
It is preferable that a shunt plating current that does not flow through the terminal electrodes 101 and 102 of the chip component 1 generate a shunt flowing directly to the power supply flange 11 or the power supply flange 112.
The power supply flange 112 is electrically insulated with insulating resin paint except for the circumferential surface 112A, and the cylindrical body 111 is electrically insulated with insulating resin paint on the outside in the direction indicated by the arrow B.
The configuration in which the inside of the chip component 1 is electrically connected to the plating solution 6 allows the plating current to efficiently flow to the terminal electrodes 101 and 102 of the chip component 1.

In the plurality of chip components 1 housed in the barrel 11, the terminal electrodes 101 and 102 of the chip components 1 that come into contact with the inside of the cylindrical body 111 conduct first to the (−) output end of the power supply device 3, and then to the (−) output terminal. In this way, conduction is made to the terminal electrodes 101 and 102 of another chip component 1 that is in contact with the terminal electrodes 101 and 102 of the chip component 1 that has come into contact with the inside of the cylindrical body 111. Thus, the chain of continuity in which the terminal electrodes 101 and 102 of the adjacent chip component 1 come into contact with each other is suitably in a range where the chip component 1 does not exceed 30% of the inner volume of the barrel 11, and when it exceeds 30%, the chain of continuity. Becomes unstable, and the formation of the terminal electrodes 101 and 102 for each chip component 1 varies. Furthermore, the terminal electrode 10 for each chip component 1
In order to perform the formation of 1,102 without variation, the cylindrical body 1
It is effective to make the cross section orthogonal to the rotation center axis of the cylinder 11 into a hexagon, octagon, or hexagon.
When the rotating tool 11 rotates, the plurality of chip components 1 contained therein are stirred while falling.
The rectangular, octagonal, or hexagonal shape is appropriately implemented, and the terminal electrodes 101 and 102 of the individual chip components 1 are added to the conductive chain on average. The results of trial operation of the barrel plating apparatus of the present invention that does not require media show that the terminal electrodes 101 and 102 of the chip component 1 are used.
Was satisfactory. In addition, the means for stirring the assembly of the chip components 1 is not limited to a hexagonal, octagonal, or hexagonal cross section, and the stirring means may be, for example, a circular cylinder instead of a square cross section. A plurality of protrusions that can stir the assembly of the chip components 1 when the cylinder 111 rotates may be provided inside.

The barrel plating method of the present invention, in which the terminal electrodes 101 and 102 of the chip component 1 are energized in a chain of conduction to form a cathode and a plating current is applied to the cathode to form the terminal electrodes 101 and 102, has no media. Thus, a chain of conduction can be stably obtained. A recent chip component 1 has a shape of, for example, length × width of 0.6 mm × 0.3 mm, and terminal electrodes 101 and 102 are each 0.1 to 0.2 mm from an end.
, The terminal electrodes 101 and 10 occupying the whole
The ratio of 2 is large and suitable for a chain of conduction. Barrel 11
Is made of an electric conductor, and the
Is configured such that the plating solution 6 can easily pass through a net or a perforated plate, and the accommodated chip component 1 cannot pass. Further, the outside of the cylinder 111 is electrically insulated with an insulating resin paint or the like, and is electrically connected to a member that contacts only the inside of the cylinder 111. It is configured to conduct to the terminal electrodes 101 and 102. Further, the cylindrical body 111 is provided with a means for agitating the chip component 1 to be accommodated with the rotation, and prevents the terminal electrodes 101 and 102 of the chip component 1 from adhering to each other during plating.

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims. Would.

[0024]

As described above, according to the present invention,
Electrically insulates the outside of the cylinder, which is made of a conductor and has a plurality of gaps through which the plating solution passes, and connects the cylinder to the negative electrode of the power supply device to conduct electricity. When the barrel is immersed in the plating solution in the plating bath and the plating current is applied while rotating the barrel to agitate the chip components, the plating current is from the power supply device to the positive electrode in the plating solution. Anode → plating solution → terminal electrode of chip component → chain of continuity where the terminal electrode of chip component contacts → terminal electrode of chip component contacting inside the cylinder that becomes the negative electrode → barrel cylinder → power supply device, Plating is applied to terminal electrodes of chip components housed in a barrel formed of a cylindrical body. There are also many terminal electrodes of chip components in which plating current flows directly from conduction that comes into contact with the inside of the cylinder, but in particular, terminals of chip components in which plating current flows in a conduction chain in which terminal electrodes of adjacent chip components come into contact. Electrodes exist as the majority. Conventionally, the plating current flows through the terminal electrodes of the chip components housed in the barrel without using the media required by the barrel plating method and its equipment. Since no media is used, there is no need to perform an operation of separating after plating. In recent years, the shape of chip components has become increasingly smaller, but the disadvantage that handling becomes difficult because the media becomes smaller is also solved at once. Also, when the shape of the chip component becomes minute, the ratio of the terminal electrode to the element body increases, and the degree of contact between the terminal electrodes of adjacent chip components increases,
Since the plating current can easily flow in a chain of conduction by the terminal electrodes of the chip component, the present invention can be implemented more effectively. Further, the outside of the cylinder is electrically insulated so that the plating current flows intensively inside the cylinder. When the cross section of the cylindrical body is any one of hexagons to hexagons, there is an effect that the stirring of the chip component is facilitated by the rotation.
Further, if the chip components are accommodated in a range not exceeding 30% of the barrel inner volume, there is an effect that plating can be performed well.

[Brief description of the drawings]

FIG. 1 is a sectional view in which a barrel unit of the present invention is immersed in a plating bath.

FIG. 2 is a perspective view of a barrel unit of a hexagonal barrel using a wire mesh.

FIG. 3 is a partial perspective view showing a wire mesh used for a barrel cylinder.

FIG. 4 is a partial perspective view showing an example in which a perforated plate is used for a barrel cylinder.

FIG. 5 is a sectional view of a conventional barrel unit immersed in a plating bath.

FIG. 6 is a perspective view of a barrel unit having a conventional configuration.

FIG. 7 is a perspective view showing a chip component and its terminal electrodes.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip component 3 Power supply device 4 Anode 5 Cathode 6 Plating solution 7 Drive chain 10, 50 barrel unit 11, 51 barrel 12A, 12B, 52 Axis 13, 14, 53, 54 Side plate 15, 55 Connecting rod 16, 17, 56, 57 pedestal plate 18 block 20 sliding piece 31, 32 conductive wire 40 plating bath 41, 42 pedestal 100 base body 101, 102 terminal electrode 111 cylindrical body 511 cylindrical frame 112 power supply flange 112A circumferential surface 113, 512, 513 lid 114, 515 Sprocket 131, 141 Bearing hole 811 Wire mesh 812, 813 Wire rod 814 Insulating resin paint 911 Perforated plate 912 Insulating resin paint 913 Hole

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masahiko Konno 1-13-1 Nihombashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Inventor Tadashira Konno 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Inside the corporation

Claims (8)

[Claims] 1. A method of electrically insulating the outside of a cylindrical body made of a conductor and having a plurality of gaps through which a plating solution passes, and connecting the cylindrical body to a power source so that the inside of the cylindrical body becomes a negative electrode. Conductive, a chip component having a terminal electrode is accommodated in a barrel formed of the cylindrical body, and the chip component is agitated by rotation of the barrel, and the terminal electrode of the chip component contacting the inside of the cylindrical body is connected to the negative electrode. A barrel plating method characterized by being plated by conduction. 2. A method for electrically insulating the outside of a cylindrical body made of a conductor and having a plurality of gaps through which a plating solution passes, and connecting the cylindrical body to a power source such that the inside of the cylindrical body serves as a negative electrode. Conductive, a chip component having a terminal electrode is accommodated in a barrel formed of the cylindrical body, and the chip component is agitated by rotation of the barrel, and the terminal electrode of the chip component contacting the inside of the cylindrical body is connected to the negative electrode. When the terminal electrode of the chip component contacts the terminal electrode of the chip component and the terminal electrode of another chip component also conducts to the negative electrode, the terminal electrode of the chip component contacts and forms a chain of continuity. A barrel plating method, wherein plating is performed while conducting to the negative electrode. 3. The barrel made of the cylindrical body rotates about a cylinder center in a substantially horizontal direction as a rotation center axis, and accommodates the chip component in the barrel within a range not exceeding 30% of the barrel internal volume. Item 3. The barrel plating method according to Item 1 or 2. 4. A cylinder which is made of a conductor and has a plurality of gaps through which a plating solution passes, an electric insulating film provided outside the cylinder, and a lid which closes an opening at one end of the cylinder. A power supply flange that conducts to the cylindrical body, and a barrel that includes a lid that closes an opening at the other end of the cylindrical body, a shaft having a center of rotation of the cylindrical body of the cylindrical body is provided in the barrel, and the barrel is substantially horizontal. The shaft is rotatably supported with the direction as a rotation center axis, and connected to a power supply from a sliding piece contacting the power supply flange so that the inside of the cylindrical body becomes a negative electrode, and is electrically connected to the inside of the barrel. A chip component having a terminal electrode is accommodated, and the terminal electrode of the chip component that contacts the inside of the cylindrical body conducts to the negative electrode, and the terminal electrode of another chip component contacts the terminal electrode of the chip component. Conducts to the negative electrode, and the terminal electrode of the chip component contacts A barrel plating apparatus wherein the terminal electrode of the chip component is conductively plated with the negative electrode. 5. The barrel plating apparatus according to claim 4, wherein the cylinder has a hexagonal, octagonal, or hexagonal cross section orthogonal to the rotation axis. 6. The barrel plating apparatus according to claim 4, wherein the tubular body is a tubular body using a wire mesh, and an electrical insulating film is applied to an outside of the wire mesh that forms the tubular body. 7. The cylinder is a cylinder using a perforated plate,
The barrel plating apparatus according to claim 4, wherein the perforated plate is provided with an electric insulating film on an outer side forming the cylindrical body. 8. The barrel plating apparatus according to claim 4, wherein the electric insulating film is an insulating resin paint applied to the outside of the cylindrical body.