KR20210017191A - Barrel plating apparatus and electrode structure used for the same - Google Patents

Abstract

The present invention relates to a barrel plating apparatus capable of improving the distribution of a plating thickness and an electrode structure used for the same. The barrel plating apparatus comprises a barrel container and a first electrode member of which at least a portion is arranged in the barrel container. The first electrode member includes: a first bar which has a prescribed length in a first direction and is arranged to pass both ends of the barrel container in the first direction; a second bar which has a prescribed length in the first direction and is arranged and separated from the first bar in a second direction perpendicular to the first direction; and a plurality of third bars arranged and separated from each other in the first direction, and connected to the first and second bars at different positions in the second directions.

Description

Barrel plating apparatus and electrode structure used therein {BARREL PLATING APPARATUS AND ELECTRODE STRUCTURE USED FOR THE SAME}

The present disclosure relates to a barrel plating apparatus and an electrode structure used therein.

Plating by electrolytic plating and plating by electroless plating are largely mentioned as types of plating. Electroplating is the coating of a thin film of another metal on the surface of a metal using the principle of electrolysis, and is also called electroplating. Electroless plating is a method of depositing metal on the surface of an object to be treated by self-catalytic reduction of metal ions in an aqueous metal salt solution without supplying electrical energy from the outside. Types of electroplating include, for example, a rack method in which parts of considerable size, such as a car pump or toaster, are plated and plated from a tank to a rack, a varistor, a chip inductor, and a laminated ceramic. There is a 　barrel 　 method of filling small parts and conductive media such as capacitors (Multi Layer Ceramic: MLCC) in a rotating 　 barrel container 　 rotating in a plating tank 　 plating.

On the other hand, the electrolytic plating device adopting the barrel 　 method is suitable for plating small chip parts in large quantities, so it has advantages in terms of labor cost and productivity per unit time compared to the rack method. However, in the barrel method in which tens to millions of chip components are plated at a time, there is inevitably a problem of spreading the plating thickness.

One of the various objects of the present disclosure is to provide a barrel plating apparatus capable of improving the distribution of plating thickness and an electrode structure used therein.

One of the various solutions proposed through the present disclosure is to control the shape of an electrode member, such as an electrode structure, that can be used as a cathode electrode, thereby minimizing the dead zone, which is a region with a low local current density in the barrel container. Is to do.

For example, the barrel plating apparatus according to an example includes a barrel container and a first electrode member having at least a part disposed inside the barrel container, and the first electrode member has a predetermined length based on a first direction And a first bar disposed to pass through both ends of the barrel container in the first direction, the first bar having a predetermined length with respect to the first direction, and the first bar with respect to a second direction perpendicular to the first direction A second bar disposed at intervals, and a plurality of third bars disposed at intervals with respect to the first direction and connected to the first and second bars at different positions based on the second direction. I can.

For example, the electrode structure according to an example includes a first bar having a predetermined length in a first direction, and the first bar having a predetermined length in the first direction and a second direction perpendicular to the first direction. A second bar disposed at an interval of the bar, and a plurality of third bars disposed at a distance from each other based on the first direction and connected to the first and second bars at different positions based on the second direction, and , In the first direction, the first bar may be longer than the second bar.

As one of the various effects of the present disclosure, a barrel plating apparatus capable of improving the dispersion of plating thickness and an electrode structure used therein may be provided.

1 is a schematic cross-sectional view of a barrel plating apparatus according to an example viewed from the front.
2 is a schematic cross-sectional view of a barrel plating apparatus according to an example as viewed from the side.
3 is a perspective view schematically showing a barrel container according to an example.
4 is a perspective view schematically showing a first electrode member according to an example.
5 is a schematic cross-sectional view of a first electrode member according to an example viewed from the front.
6 is a schematic perspective view of an enlarged area A of the first electrode member of FIG. 5.
7 is a schematic cross-sectional view of a first electrode member according to an example as viewed from the side.
8 is a schematic perspective view of the first electrode member of FIG. 7.
9 is a schematic cross-sectional view illustrating a case in which a second bar of a first electrode member according to an example has various positions when viewed from the side.
10 is a cross-sectional view schematically illustrating a case in which a second bar of the first electrode member according to an example has a different shape when viewed from the side.
11 schematically shows the effect of the presence or absence of the second bar of the first electrode member according to an example.

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation.

1 is a schematic cross-sectional view of a barrel plating apparatus according to an example viewed from the front.

2 is a schematic cross-sectional view of a barrel plating apparatus according to an example as viewed from the side.

Referring to the drawings, the barrel plating apparatus 500 according to an example basically includes a barrel container 120 and a first electrode member 200. The barrel plating apparatus 500 according to an example includes a plating bath 110, a support member 130, a driving member 140, a second electrode member 150, a connection member 160, and a power member, as necessary. One or more of 170 may be further included.

The plating bath 110 is another configuration of the barrel plating apparatus 500, such as the barrel container 120, the first electrode member 200, the support member 130, the second electrode member 150, the connection member 160, etc. It can accommodate at least some of each of the elements. The plating bath 110 may be filled with an electrolyte solution 111, for example, a plating solution containing metal ions to be plated. In this respect, the plating bath 110 may have, for example, a hexahedral shape with an open surface, but is not limited thereto. The plating bath 110 may perform functions such as circulation, alternating, filtration, and temperature maintenance of the electrolyte solution 111.

When the electrolytic solution 111 is filled in the plating bath 110, the barrel container 120, the first electrode member 200, the support member 130, the second electrode member 150, the connection member 160, etc. At least a portion of each may be immersed in the electrolyte solution 111. At this time, as described later, when electrons and/or current are supplied to the first and second electrode members 200 and 150 by the power member 170, the first and second electrode members 200 and 150 are respectively It can be used as an electrode and an anode electrode. In this case, a plating reaction may occur through oxidation and reduction reactions. Therefore, when a plurality of chip parts 121 are accommodated in the barrel container 120, a plating layer may be formed on each of the chip parts 121.

The barrel container 120 can accommodate a plurality of chip parts 121 that are plated objects and a plurality of media 122 that assist the electric current to the plated object, and the plating of these chip parts 121 is It may be a space to be implemented. The chip component 121 may be a known chip type component such as a varistor, a chip inductor, and a multilayer ceramic capacitor, and the medium 122 may be a known conductor mass such as a steel ball, but is not limited thereto. In addition, plating may be performed to form external electrodes of the chip components 121, for example, but is not limited thereto. Since the barrel container 120 can accommodate a plurality of chip components 121 and a plurality of media 122 therein, the barrel container 120 may have a hollow container shape with sufficient internal space. For example, the barrel container 120 may have a polygonal cylindrical shape as will be described later. If necessary, the barrel container 120 may have a plurality of holes penetrating between the outer wall and the inner wall, as described later. For example, the sidewall of the barrel container 120 may have a mesh shape. Through this, the electrolyte 111 of the plating bath 110 may be filled in the inside of the barrel container 120.

The barrel container 120 may be supported to be rotatable. For example, the barrel container 120 may be supported so as to be rotatable by support members 130 provided at both ends of the barrel container 120. In addition, a rotational force may be provided through the driving member 140 connected to the support member 130 to rotate. As the barrel container 120 rotates, a plurality of chip components 121 and a plurality of media 122 in the barrel container 120 may be mixed, and contact with the first electrode member 200 together with the electrolyte 111 , Plating can be performed.

The support member 130 is disposed at both ends of the barrel container 120 and may function as an axis of the barrel container 120. The barrel container 120 may be rotatably supported by the support member 130. The support member 130 is a side plate frame 131 disposed at regular intervals on the left and right ends of the barrel container 120, and a fixing member installed on the side plate frame 131 and/or a hollow bushing shaft ( 132). In addition, the support member 130 may include a bush 133 which is a rotating member disposed on the outer surface of the bushing shaft 132. The bush 133 is integrally assembled with the barrel container 120 at the left and right ends of the inside of the barrel container 120, and can be rotated together when the barrel container 120 is rotated. The first bar 210 of the first electrode member 200 to be described later may be inserted into the hollow 132h inside the bushing shaft 132.

The driving member 140 may provide a rotational force for rotating the barrel container 120. The driving member 140 may include, for example, a known motor 141. The rotational force generated by the motor 141 of the driving member 140, etc., can be transmitted to the barrel container 120 through the engagement of the driving gear 142 and the driven gear 143 of the driving member 140 and interactions therewith. have. The driving gear 142 may be connected to the motor 141, and the driven gear 143 may be connected to the support member 130, for example, the bushing shaft 132.

The power member 170 may supply electrons and/or current to the first and second electrode members 200 and 150. The power member 170 may be a rectifier that converts AC current into DC current and serves as an external power source. The first bar 210 may be connected to the power member 170 through the connection member 160. The first electrode member 200 may receive a negative electrode from the power member 170. Through this, electricity or current may be delivered into the barrel container 120. The first electrode member 200 may function as a cathode electrode for an oxidation-reduction reaction. The second electrode member 150 may be connected to the power member 170. The second electrode member 150 may receive a (+) electrode from the power member 170. When the electrolytic solution 111 is filled in the plating bath 100, the second electrode member 150 may be at least partially immersed in the electrolytic solution 111. The second electrode member 150 may function as an anode electrode for redox reaction.

The first bar 210 may be long disposed to have a predetermined length along the central axis of the barrel container 120. The left and right ends of the first bar 210 may be inserted into the hollow 132h inside the bushing shaft 132 of the support member 130. Most of the first bar 210 is disposed in the barrel container 120, but some of the left and right ends may be out of the barrel container 120. The second bar 220 may also be elongated to have a predetermined length in substantially the same direction as the first bar 210. The second bar 220 may serve to minimize a dead-zone, which is a region in the barrel container 120 in which the local current density is low, as described later. The third bar 230 is in contact with the plurality of chip parts 121 and the plurality of media 122 in the barrel container 120, thereby agitating them, and also transferring the second insulating cover 232 to them. I can. There may be a plurality of third bars 230. Each of the third bars 230 may extend from the first bar 210 in a direction substantially perpendicular to the length direction of the first bar 210 to be connected to the second bar 220. An electrode terminal may be disposed at an end of each third bar 230 as a conductor portion exposed to the outside. As described above, the second insulating cover 232 may be transferred to the chip component 121 and/or the medium 122 through the electrode terminal.

A method of performing plating using the barrel plating apparatus 500 according to an example may be, for example, as follows. However, it is not limited thereto. First, the door provided in the barrel container 120 is disassembled, and a plurality of chip parts 121 and a plurality of media 122 are put therein. Next, the barrel container 120 is immersed in the electrolytic solution 111 of the plating bath 110, and while rotating the barrel container 120 using the support member 130 and the driving member 140, the power member 170 ) To generate electrons and/or currents. Accordingly, electrons and/or current may be supplied to the first and second electrode members 200 and 150, and the electrode terminals 233 of each of the plurality of third bars 230 of the first electrode member 200 The chip component 121 may be plated by contacting the chip component 121. For example, as the chip component 121 becomes a cathode, the medium 122 becomes an anode, and the electrolyte 111 is electrolyzed, the metal ions contained in the electrolyte 111 are separated, and the chip component ( Attached to the surface of 121), a plating layer may be formed on the chip component 121.

3 is a perspective view schematically showing a barrel container according to an example.

Referring to the drawings, the barrel container 120 according to an example includes a body portion 128 having a polygonal shape, for example, a hexagonal cylindrical shape, and a first portion disposed at one end and the other end of the body portion 128 in the first direction. And second ends 129a and 129b. The first and second ends 129a and 129b may block both ends of the barrel container 120, respectively. If necessary, a plurality of holes 128h penetrating between the outer wall and the inner wall of the body portion 128 may be present in the body portion 128. For example, the body portion 128 may have a mesh shape. In this case, when the barrel container 120 is immersed in an electrolyte or the like, the electrolyte may flow into the barrel container 120.

At least a part of the first electrode member 200 may be disposed inside the barrel container 120. Based on the arrangement inside the barrel container 120, the first electrode member 200 has a predetermined length with respect to the first direction and is disposed so as to pass through both ends of the barrel container 120 in the first direction. The bar 210, a second bar 220 having a predetermined length with respect to the first direction and spaced apart from the first bar 210 based on a second direction perpendicular to the first direction, and a first It may include a plurality of third bars 230 that are disposed at a distance from each other based on the direction and connected to the first and second bars 210 and 220 at different positions based on the second direction.

In the arrangement of the inside of the barrel container 120, if the first electrode member 200 does not have the second bar 220, as will be described later, the chip components and the medium are injected when the barrel container 120 is rotated. Due to the difference in specific gravity depending on the ratio or input amount, the binary supply cannot be performed smoothly, and a dead zone with a low current density may occur. As a result, thickness distribution of the plated film may occur. On the other hand, when the second bar 220 is present in the first electrode member 200 as in one example, the dead zone is mostly blocked by the second bar 220, so that the dead zone can be minimized. As a result, the thickness distribution of the plated film can be improved.

4 is a perspective view schematically showing a first electrode member according to an example.

5 is a schematic cross-sectional view of a first electrode member according to an example viewed from the front.

6 is a schematic perspective view of an enlarged area A of the first electrode member of FIG. 5.

7 is a schematic cross-sectional view of a first electrode member according to an example as viewed from the side.

8 is a schematic perspective view of the first electrode member of FIG. 7.

Referring to the drawings, a first electrode member 200 according to an example, for example, an electrode structure for barrel plating, has a first bar 210 having a predetermined length in a first direction, and has a predetermined length in the first direction. The second bar 220 is disposed at a distance from the first bar 210 based on the second direction perpendicular to the first direction, and the second bar 220 is disposed at a distance from each other based on the first direction. It includes a plurality of third bars 230 connected to the first and second bars 210 and 220 respectively at the location. In the first direction, the length L1 of the first bar 210 is longer than the length L2 of the second bar 220.

The first bar 210 may include a first conductor bar 211 and a first insulating cover 212 surrounding at least a portion of the first conductor bar 211. Since the first conductor bar 211 includes a known conductor, electrons and/or electric current for a redox reaction may flow. The first conductor bar 211 may be, for example, a copper pipe. Since the first insulating cover 212 includes a known insulating material, current flowing through the first conductor bar 211 may be prevented from leaking to the outside. The first insulating cover 212 may be, for example, polyvinyl chloride (PVC).

If necessary, the first bar 210 may further include a hump 213 disposed on the first insulating cover 212. Through the hump 213, it is possible to prevent the chip parts or media from being settled. The material of the hump 213 is not particularly limited. That is, a conductive material may be included or an insulating material may be included. The hump 213 may be fixed to the first insulating cover 212 with a bond. The bond can be, for example, a polyvinylchloride (PVC) bond.

If necessary, the first bar 210 may further include a sensor wire disposed inside the first insulating cover 212. The sensor line may be connected to a Hall current sensor that may be additionally disposed on the third bar 230 to exchange signals with an external control unit. The sensor wire may include a known conductor.

The third bar 230 includes a second conductor bar 231 connected to the first conductor bar 211, a second insulating cover 232 surrounding at least a portion of the second conductor bar 231, and a second conductor bar. An electrode terminal 233 connected to the end of 231 and exposed from the second insulating cover 232 may be included. The second conductor bar 231 includes a known conductor, and, like the first conductor bar 211, electrons and/or electric current for redox reaction may flow. Such electrons and/or current may be provided to the electrode terminal 313 through the second conductor bar 231. The second conductor bar 231 may be, for example, a copper pipe. The first and second conductor bars 211 and 231 may each have a concave portion and a convex portion, and they may be connected to each other by being combined. Since the second insulating cover 232 includes a known insulating material, it is possible to prevent a current flowing through the second conductor bar 231 from leaking to the outside. The second insulating cover 232 may be, for example, polyvinyl chloride (PVC). The first and second insulating covers 212 and 232 may be connected by welding, for example, polyvinyl chloride (PVC) melting point processing. The electrode terminal 233 includes a known conductor and may directly contact a chip component or a medium. Accordingly, electrons and/or current may be transmitted to the chip component or medium through the electrode terminal 233. The electrode terminal 233 may be, for example, a mushroom-shaped conductor screw. The electrode terminal 233 may be connected to the second conductor bar 231 by coupling a pillar portion having a screw wire to the second conductor bar 231.

If necessary, the third bar 230 may further include a Hall current sensor disposed inside the second insulating cover 232. The Hall current sensor may measure the current flowing through the second conductor bar 231. The Hallyu sensor may be electrically connected to the control unit through the above-described sensor line. The Hall current sensor may be, for example, a ring-type permanent magnet. If necessary, a separate circuit for amplifying the electrical signal may be further configured in the Hall current sensor.

When the first electrode member 200 is viewed from the side, for example, when the first electrode member 200 is disposed in the barrel container 120, the left and right ends of the barrel container 120 in the above-described first direction When viewing the first electrode member 200 from any one of them, the second bar 220 has a shape protruding out of the side surfaces of each of the plurality of third bars 230. By having such a protruding shape, the above-described dead zone can be effectively reduced, and as a result, the plating thickness distribution can be effectively improved.

When the first electrode member 200 is viewed from the side, for example, when the first electrode member 200 is disposed in the barrel container 120, the left and right ends of the barrel container 120 in the above-described first direction When looking at the first electrode member 200 from either one, the second bar 220 has a length L3 in the third direction perpendicular to the second direction longer than the length L4 in the second direction. I can. In this case, the effect according to the above-described protruding shape can be more easily obtained.

9 is a schematic cross-sectional view illustrating a case in which a second bar of a first electrode member according to an example has various positions when viewed from the side.

Referring to the drawings, a first bar 210 is connected to one end of each of a plurality of third bars 230 of the first electrode member 200, and an electrode terminal 233 is disposed at each other end. In this case, the second bar 220 may be arranged such that the center C2 of the second bar 220 coincides with the center C1 of each of the plurality of third bars 230 as shown in (a). Alternatively, as in (b) and (c), the center C2 may be disposed closer to the other end where the electrode terminal 233 is disposed than to one end where the first bar 210 is disposed. For example, the center C2 of the second bar 220 may be disposed farther from the first bar 210 than the center C1 of each of the plurality of third bars 230. If necessary, as in (c), the lowermost side of the second bar 220 may be arranged to be connected to the uppermost side of the electrode terminals 233 of each of the plurality of third bars 230 or to be in contact with each other. On the other hand, the dead zone usually occurs in an area far from the first bar 210, that is, at the bottom of each of the third bars 230, so that the second bar 220 is disposed at the bottom in this way. When the plating thickness dispersion improvement effect can have a more excellent effect. For example, from (a) to (c), that is, as the position of the second bar 220 moves downward, the effect of improving the distribution of plating thickness may be more excellent.

10 is a cross-sectional view schematically illustrating a case in which a second bar of the first electrode member according to an example has a different shape when viewed from the side.

Referring to the drawings, when the first electrode member 200 is viewed from the side, for example, when the first electrode member 200 is disposed in the barrel container 120, the above-described first When looking at the first electrode member 200 from either of the left and right ends in the direction, the second bar 220 may have a rhombus shape, an oval shape, or a polygonal shape such as a hexagonal shape or an octagonal shape. . In addition, if necessary, it may have a shape such as a circle, a triangle, or a square. On the other hand, the closer the shape of the second bar 220 is to the elliptical shape, for example, when the shape is an elliptical shape or at least a rhombus shape, the stagnant section of the chip is relatively small as described later, and the movement motion of the chip is also relatively ideal. Can be As a result, it is possible to have a better effect of improving the plating thickness distribution.

11 schematically shows an effect according to the presence or absence of a second bar of the first electrode member according to an example.

Referring to the drawing, as shown in the left drawing, when only the first bar 210 ′ and the third bar 230 ′ exist in the first electrode member, and the second bar does not exist, when the barrel container is rotated Due to the difference in specific gravity depending on the input ratio or input amount of the chip part 121 and the medium 122, the binary supply may not be smoothly performed, and a dead zone R having a low current density may occur. As a result, thickness distribution of the plated film may occur. On the other hand, as shown in the right figure, when the second bar 220 is further present in the first electrode member in addition to the first bar 210 and the third bar 230, such a dead zone R is the second bar. By being mostly blocked by 220, the dead zone R can be minimized. As a result, the thickness distribution of the plated film can be improved.

Experimental example

All other conditions are the same, but the case where there is no second bar of the first electrode member is used as a reference, and the case where the second bar is approximately located at the center of the third bar is regarded as the first embodiment. A case where the second bar is located below the center of the third bar is regarded as the second embodiment, and a case where the second bar of the first electrode member is located at the bottom so as to contact the terminal electrode terminal is the third embodiment. , A simulation was performed on the plating thickness dispersion. On the other hand, as the second bar, a rhombus shape in which the length L3 in the third direction perpendicular to the above-described second direction is longer than the length L4 in the second direction was used. At this time, to compare the thickness distribution, the plating thickness of 200 chips for each condition was measured to verify the improvement of the thickness distribution.

As a result of the verification, it was confirmed that, while the average plating thickness was formed at a similar level, the coefficient of variation in thickness CV (Coefficient of Variation) was improved by about 10% or more compared to the reference in the case of Examples 1 to 3 in which the second bar was present. It was confirmed that the improvement effect was excellent as the second bar went downward. Through this, if the chip component is prevented from moving to a region with a low local current density through the second bar, effective results can be obtained in terms of dispersion as shown in the drawing. This effect is that the position of the second bar is located on the electrode terminal. It can be seen that the closer it is, the better it is.

In the present disclosure, the lower side, the lower side, the lower side, etc. are used to mean the downward direction based on the cross section of the drawing for convenience, and the upper side, the upper side, the upper surface, etc. are used to mean the opposite direction. However, this has defined the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of this direction, and the upper/lower concept may be changed at any time.

In the present disclosure, the meaning of connection is a concept including not only direct connection but also indirect connection through an adhesive layer. In addition, the meaning of being electrically connected is a concept that includes both physically connected and unconnected cases. In addition, expressions such as first and second are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of the rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

The expression example used in the present disclosure does not mean the same embodiment as each other, and is provided to emphasize and describe different unique features. However, the examples presented above are not excluded from being implemented in combination with other example features. For example, even if a matter described in a specific example is not described in another example, it may be understood as a description related to another example unless there is a description contradicting or contradicting the matter in another example.

The terms used in the present disclosure are used only to describe an example, and are not intended to limit the present disclosure. In this case, the singular expression includes a plural expression unless it clearly means differently in the context.

Claims (16)

Barrel container; And
A first electrode member having at least a portion disposed inside the barrel container; Including,
The first electrode member,
A first bar having a predetermined length with respect to the first direction and disposed to pass through both ends of the barrel container in the first direction,
A second bar having a predetermined length with respect to the first direction and disposed at a distance from the first bar with respect to a second direction perpendicular to the first direction, and
A plurality of third bars disposed at intervals from each other based on the first direction and connected to the first and second bars at different positions based on the second direction, including,
Barrel plating device.
The method of claim 1,
When looking at the first electrode member from either end of the barrel container,
The second bar protrudes out of the side surfaces of each of the plurality of third bars,
Barrel plating device.
The method of claim 2,
When looking at the first electrode member from either end of the barrel container,
The second bar has a length in a third direction perpendicular to the second direction is longer in the second direction,
Barrel plating device.
The method of claim 2,
When looking at the first electrode member from either end of the barrel container,
The second bar has an oval shape, a rhombus shape, or a polygonal shape,
Barrel plating device.
The method of claim 1,
The first bar is connected to one end of each of the plurality of third bars,
An electrode terminal is disposed at the other end of each of the plurality of third bars,
Barrel plating device.
The method of claim 5,
The second bar has a center disposed closer to the electrode terminal than the first bar,
Barrel plating device.
The method of claim 1,
In the first direction, the length of the first bar is longer than the length of the second bar,
Barrel plating device.
The method of claim 1,
The barrel container includes a body portion having a polygonal cylindrical shape, and first and second ends respectively disposed at one end and the other end of the body portion in the first direction,
Barrel plating device.
The method of claim 8,
The barrel container has a plurality of holes respectively penetrating between the outer wall and the inner wall of the body portion,
Barrel plating device.
The method of claim 1,
The barrel container is supported to be rotatable,
Barrel plating device.
The method of claim 10,
A support member connected to the both ends of the barrel container and supporting the barrel container so that the barrel container is rotatable; And
A driving member connected to the support member and providing a rotational force for rotating the barrel container; Further comprising,
Barrel plating device.
The method of claim 1,
Plating bath;
A second electrode member disposed outside the barrel container; And
A power member connected to the first and second electrode members; It further includes,
At least a portion of each of the barrel container, the first electrode member, and the second electrode member is disposed in the plating bath,
Barrel plating device.
The method of claim 12,
The plating bath is filled with an electrolyte solution containing metal ions,
At least a portion of each of the barrel container, the first electrode member, and the second electrode member is immersed in the electrolyte solution,
Electrons and current are supplied to the first and second electrode members by the power member so that the first and second electrode members respectively provide a cathode electrode and an anode electrode,
Barrel plating device.
A first bar having a predetermined length in the first direction;
A second bar having a predetermined length in the first direction and disposed at a distance from the first bar based on a second direction perpendicular to the first direction; And
A plurality of third bars disposed at intervals with respect to the first direction and connected to the first and second bars at different positions based on the second direction; Including,
In the first direction, the first bar is longer than the second bar,
Electrode structure.
The method of claim 14,
The first bar includes a first conductor bar and a first insulating cover surrounding at least a portion of the first conductor bar,
The third bar is connected to a second conductor bar connected to the first conductor bar, a second insulating cover surrounding at least a part of the second conductor bar, and an end of the second conductor bar and exposed from the second insulating cover. Including the electrode terminal,
Electrode structure.
The method of claim 15,
The first bar further comprises a hump disposed on the first insulating cover,
Electrode structure.

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