KR20130121512A

KR20130121512A - Barrel plating apparatus

Info

Publication number: KR20130121512A
Application number: KR1020120044774A
Authority: KR
Inventors: 박진용
Original assignee: 삼성전기주식회사
Priority date: 2012-04-27
Filing date: 2012-04-27
Publication date: 2013-11-06

Abstract

The present invention relates to a barrel plating apparatus, comprising a barrel plating tank filled with an electrolyte, a barrel container settled in the barrel plating tank and rotatable, a barrel container filled with a plated object and a medium, and rotating means for rotating the barrel container. And a cathode portion for transmitting current to the electrolyte of the barrel plating tank and a cathode portion for transmitting current to the barrel container, wherein the cathode portion is vertically formed through the center bar and the center bar formed in the horizontal direction through the barrel container. It includes an anode rod extending to vary in length.

Description

Barrel Plating Apparatus {BARREL PLATING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a barrel plating apparatus, and more particularly, to a barrel plating apparatus capable of plating a large amount of articles such as shaped parts and small chip parts at a time.

In general, plating refers to coating a thin film of a different material on the surface of a material for the purpose of improving the surface condition of the material. The purpose of such plating is various, but is representative to compensate for the lack of corrosion resistance of raw materials. The method of coating a metal thin film that can withstand the environment, the surface hardening of the metal thin film that is harder than the raw material to withstand the wear, the surface beautification of the thin film of the precious metal or the beautiful metal alloy on the surface of the raw material, and increase the reflectance of light or heat It is used for smoothing and improving the reflectance of the surface to which the metal thin film is attached for smooth or smooth surface.

As a kind of plating having such a purpose, plating methods by electroplating and electroless plating are widely known.

Here, electroplating is a process of coating a thin film of another metal on the surface of a metal by using the principle of electrolysis, also referred to as electroplating. Electroless plating does not receive electric energy from the outside, and the metal ions in the aqueous metal salt solution are used as a reducing agent. It is a method of autocatalytic reduction to precipitate a metal on the surface of a workpiece.

The electroplating is filled with an electrolytic solution in a plating bath, followed by electrodeposition of a metal (plating body) to be plated as a cathode (cathode) and a metal (plating material) to be electrodeposited as an anode (anode). It is used in that the desired metal ions are electrolytically precipitated on the surface of the plated object by placing them in an electrolytic solution containing ions of metals to be applied and energizing them.

In addition, the electroplating type is a rack method that varieties a large amount of parts such as automotive pumps and toasters from the plating tank to the rack, and varistors, chip inductors, and multilayer ceramic capacitors. Layer Ceramic (MLCC) is a barrel type that fills small parts and conductive media in a rotating barrel container and rotates in a plating bath.

In particular, the electrolytic plating apparatus adopting the barrel method has a great advantage in terms of labor cost and productivity per unit time compared to the rack method because it is suitable for plating a large number of small parts, but the amount of the plated material to be plated is small so that the cathode If it is not in contact with the fork, a conductive medium is additionally added so that the cathode and the plated object are in contact with each other.

However, when the conductive medium is additionally added, the production cost is increased due to the addition of the conductive medium, and the time for separating the plated material and the conductive medium after plating becomes long, resulting in a problem in that the production efficiency is lowered.

The present invention proposed to solve the above problems is an object of the present invention to provide a barrel plating apparatus that can improve the coating thickness distribution irrespective of the amount of the plated to be plated.

Barrel plating apparatus according to an embodiment of the present invention for achieving the above object is a barrel plating tank filled with an electrolyte, and formed in the barrel plating tank to be rotatable, and a barrel container filled with the plated material and the medium, Rotating means for rotating the barrel container, and an anode portion for transmitting a current to the electrolyte of the barrel plating tank and a cathode portion for transmitting a current to the barrel container, the cathode portion is formed through the inside of the barrel container in a horizontal direction It includes a center bar and a cathode rod extending from the center bar to be variable in length.

Here, the cathode rod may include a body extending vertically from the center bar to be hollow inside, a body having a fixed bar formed on one side thereof, and a movable part inserted to be movable inside the body.

The cathode rod may further include a fixing member inserted into the insertion hole formed in the body horizontal direction to fix the moving part.

In addition, the body may be formed of an insulating material.

On the other hand, the moving part is inserted into the upper portion of the body, the current flows through the moving shaft, and is formed on the upper end of the moving shaft, the moving bar is inserted into contact with the fixed bar and the lower end of the moving shaft is formed to be plated and And a cathode in integrated contact with the medium.

Here, the movable shaft may be formed with an insulating cover to surround the side.

And a plurality of the cathode rods may be formed.

Meanwhile, the medium may be a metal sphere having electrical conductivity.

As described above, in the barrel plating apparatus according to the embodiment of the present invention, since the cathode is always positioned at the center of the plated material regardless of the amount of the plated material to be plated by using a cathode bar having a variable length, The plating thickness distribution can be improved.

In addition, since it is not necessary to add a conductive medium for contacting the cathode and the plated object, the production cost can be reduced, and the production efficiency can be improved.

1 is a cross-sectional view showing the front of the barrel plating apparatus according to an embodiment of the present invention.
2 and 3 are side cross-sectional views showing the barrel container of the barrel plating apparatus shown in FIG.
4 is an enlarged cross-sectional view of a cathode part of the barrel plating apparatus illustrated in FIG. 1.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intentions or customs of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

1 is a cross-sectional view showing the front of the barrel plating apparatus according to an embodiment of the present invention, Figures 2 and 3 is a side cross-sectional view showing a barrel container of the barrel plating apparatus shown in Figure 1, Figure 4 is shown in Figure 1 It is sectional drawing which expanded and showed the cathode part of a barrel plating apparatus.

As shown in Figures 1 to 4, the barrel plating apparatus according to an embodiment of the present invention is a barrel plating tank 110, barrel container 120, rotating means 130, anode portion 140 and cathode portion 200 ).

In this case, the cathode part 200 may include a center bar 210 penetrating in the rotation axis direction of the barrel container 120 and a cathode bar 220 extending vertically from the center bar 210 to vary in length. Can be.

The barrel plating tank 110 is filled with the electrolyte containing a metal component therein, for example, may be in the shape of a hexahedron having an open upper surface. In addition, it is preferable that the barrel plating tank 110 has a sufficient size so that not only the electrolyte but also the barrel container 120 and the anode 140 may be immersed.

The barrel container 120 is a space in which the plated object 121 and the medium 122 are filled and plating is performed. The barrel container 120 is a member immersed in the anode portion 140 and the electrolyte of the barrel plating tank 110. In this case, the plated object 121 may be a chip component for forming an external electrode, and the medium 122 may be a metal sphere having electrical conductivity.

Here, the barrel container 120 may be formed in a polygonal cylinder shape such as a cylinder, a hexagonal cylinder, an octagonal cylinder, etc., in which a plated object 121 and a medium 122 are accommodated therein. At this time, the barrel container 120 of the present embodiment is formed in a hexagonal cylinder shape.

In addition, the barrel container 120 may be formed in a plurality of through-holes or a mesh network shape so that the electrolyte can flow into the barrel container 120. That is, the plated object 121 and the medium 122 may be formed such that only electrolyte is introduced into the barrel container 120 without being leaked to the outside.

In addition, the barrel container 120 may be formed with an opening (not shown) through which one of the six surfaces of the barrel is opened to inject the plated object 121 and the medium 122. Not shown) may be formed and opened and closed.

On the other hand, the barrel container 120 may be rotated in the state immersed in the electrolyte of the barrel plating tank 110 by the rotating means 130 to be described later.

Here, the barrel container 120 is mounted to the bushing shaft 124 and the bushing 125 rotatably assembled to the bushing shaft 124 installed on the side plate frame 123 disposed at predetermined intervals on the left and right sides. Can be rotated by In this case, the bushing shaft 124 is a shaft member through which a hole of a predetermined size is inserted so that the center bar 210 of the cathode portion 200 through which current flows, and the bush 125 is the barrel container 120. It is a rotary member that is integrally assembled to both left and right inner surface of the barrel and rotates together with the barrel container (120).

The rotation means 130 is to generate a rotational force to rotate the barrel container 120 in one direction, it may be formed of a motor.

Here, the rotational force generated by the rotating means 130 is the engagement of the drive gear 131 of the rotating means 130 and the driven gear 132 formed on either side of the left and right sides of the barrel container 120 and the interaction therewith Due to this may be delivered to the barrel container 120.

The cathode part 200 receives a negative electrode from a rectifier (not shown), and may include a center bar 210 and a cathode rod 220.

Here, the center bar 210 is a member connected to the rectifier by the crank 150, may be inserted into the bushing shaft 124 of the barrel container 120 to penetrate the central axis of the barrel container 120. have.

In addition, the center bar 210 is formed of a conductor so that the current flows through the copper pipe 211 and the insulating material formed to surround the outer surface of the copper pipe 211, the current flowing through the copper pipe 211 It may be composed of an insulating member 212 formed so as not to leak to the outside.

The cathode rod 220 is a member extending in the vertical direction from the center bar 210, and may be integrally contacted with the plated object 121 and the medium 122 accommodated in the barrel container 120. Here, a plurality of the cathode rods 220 may be formed along the center bar 210.

In addition, the cathode rod 220 is formed integrally with the center bar 210 to be composed of a hollow body 230 and a moving part 240 inserted to be movable in the interior of the body 230. Can be.

In this case, the body 230 may be formed of an insulating material.

In addition, a fixed bar 231 may be formed at an inner side of the body 230, and an upper portion thereof may be in contact with the copper pipe 211 of the center bar 210 so that a current flows.

In addition, the body 230 may further include a fixing member 233 inserted in the horizontal direction to fix the moving part 240, the fixing member 233 may be a bolt.

On the other hand, the moving part 240 is to be inserted to move up and down inside the body 230, a portion of the upper side is inserted into the body 230, a moving shaft 241 through which current flows can be formed. have. In this case, the moving shaft 241 may be formed with an insulating cover 242 to surround the side.

In addition, a cathode 244 in contact with the plated body 121 and the medium 122 may be formed at a lower end of the movable shaft 241.

In addition, a movement bar 243 inserted into the body 230 may be formed at an upper end of the movement shaft 241 to be in contact with the fixing bar 231 of the body 230.

As shown in FIG. 4A, the cathode rod 220 formed as described above inserts the moving bar 243 of the moving part 240 so as to be in contact with the fixed bar 231 of the body 230, and is fixed. When the member 232 is inserted into the body 230 to press the moving bar 243 toward the fixing bar 231, the moving part 240 is fixed to the body 230 and is fixed to the state of the negative electrode rod 220. The length becomes shorter.

At this time, as shown in Figure 4b, retract the fixing member 232 to loosen and move the moving part 240 to the lower side and then insert the fixing member 232 to the moving bar 243 to the fixed bar 231 side. When pressurized, the moving part 240 is fixed in a state in which only a part is inserted into the body 230, so that the length of the cathode rod 220 is increased.

Therefore, by adjusting the length of the negative electrode rod 220 according to the amount of the plated material 121, the thickness of the negative electrode is always located in the center of the plated material, regardless of the amount of the plated object to be plated, the plating thickness Can improve dispersion.

In addition, when the amount of the plated product is small as in the prior art, it is not necessary to add a conductive medium for contacting the negative electrode and the plated product, thereby reducing the production cost and improving the production efficiency.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. I will understand.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.

110: barrel plating tank 121: plated material
122: medium 123: side plate frame
124: bushing shaft (124) 125: bush
130: rotation means 131: drive gear
132: driven gear 140: anode
200: cathode 210: center bar
211: copper pipe 212: insulating member
220: cathode rod 230: body
231: fixing bar 233: fixing member
240: moving part 241: moving axis
242: insulation cover 243: moving bar
244: cathode

Claims

Barrel plating tank filled with electrolyte;
A barrel container which is formed in the barrel plating tank to be rotatable and is filled with a plated object and a medium;
Rotating means for rotating the barrel container;
An anode portion for transferring current to the electrolyte of the barrel plating tank; And
Including a cathode for transmitting a current to the barrel container,
The cathode portion
A center bar penetrating in the horizontal direction in the barrel container; And
A cathode rod extending vertically from the center bar to be variable in length;
Barrel plating apparatus comprising a.

The method of claim 1,
The cathode rod is
A body extending vertically from the center bar and having a hollow inside and having a fixing bar formed at one side thereof; And
A moving part inserted to be movable in the body;
Barrel plating apparatus comprising a.

3. The method of claim 2,
The cathode rod is
Barrel plating apparatus further comprises a fixing member inserted into the insertion hole formed in the horizontal direction of the body to fix the moving part.

3. The method of claim 2,
The body is a barrel plating apparatus formed of an insulating material.

3. The method of claim 2,
The moving unit
A portion of the upper side inserted into the body and a moving shaft through which current flows;
A moving bar formed at an upper end of the moving shaft and inserted to contact the fixed bar; And
A cathode formed at a lower end of the movable shaft and integrally contacting the plated object with the medium;
Barrel plating apparatus comprising a.

The method of claim 5,
The moving shaft is
Barrel plating device is formed with an insulating cover to surround the side.

The method of claim 1,
Barrel plating apparatus in which a plurality of the cathode rods are formed.

The method of claim 1,
The medium is a barrel plating apparatus which is a metal sphere having electrical conductivity.