JP2019183186A - Barrel plating conductor and barrel plating method - Google Patents

Abstract

To provide the barrel plating conductor and the barrel plating method, that can improve uniformity of plating on an enclosure terminal.SOLUTION: The barrel plating conductor used to form a plating film on the first and second exterior terminals provided in an electronic component by barrel plating comprises: a trunk part that is electrically conductive and extends linearly with a length that allows contact with both the first and second exterior terminals, and a convex part that is electrically conductive, is provided at one end in an extending direction of the trunk part, and protrudes in a direction intersecting the extending direction with respect to an outer peripheral surface of the trunk part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a conductor for barrel plating and a barrel plating method.

  Conventionally, barrel plating has been adopted for plating external terminals (for example, anode terminals and cathode terminals) of individual electronic parts such as diodes because of the advantage that a large number of electronic parts can be processed together. .

  In barrel plating, an electronic component is stirred by rotating the barrel in a state where the barrel into which the electronic component has been put is immersed in a solution. While stirring the electronic component, a voltage of a power source is applied between an anode electrode (that is, a plating material) arranged outside the barrel and a cathode electrode arranged inside the barrel. As a result, the metal ion of the plating material ionized from the anode electrode penetrates into the barrel through innumerable small holes provided in the barrel and moves to the exterior terminal of the electronic component, so that the exterior terminal of the electronic component Is plated.

  Conventionally, in barrel plating on an exterior terminal of an electronic component, a sufficient current cannot be passed through the exterior terminal with only the electronic component. Therefore, a conductive medium (conductive body) having conductivity is provided inside the barrel. It was thrown in and plated with electronic parts.

  Conventionally, fine iron balls have been used as conductive media. Such a conductive medium can contact the exterior terminal of an electronic component, and can make it easy to send an electric current from a power supply to an exterior terminal.

Japanese Patent Laid-Open No. 5-222592

  However, conventionally, due to the characteristics of electronic components, there are many opportunities for the plating film to deposit on any of the plurality of exterior terminals, and there are few opportunities for the plating film to deposit on other exterior terminals. For example, in a diode, due to the characteristics of the diode, there are many opportunities for the plating film to deposit on the anode terminal, and there are few opportunities for the plating film to deposit on the cathode terminal.

  And, since the plating film has different opportunities to be deposited between the plurality of exterior terminals, the plating thickness becomes non-uniform and it is difficult to improve the uniformity of plating on the exterior terminals. .

  Then, an object of this invention is to provide the conductor for barrel plating which can improve the uniformity of the plating to an exterior terminal, and the barrel plating method.

The conductor for barrel plating according to one aspect of the present invention is:
A conductor for barrel plating used for forming a plating film by barrel plating on a first exterior terminal and a second exterior terminal provided in an electronic component,
A body portion that has conductivity and extends linearly with a length that allows contact with both the first and second exterior terminals;
And a convex portion provided at one end in the extending direction of the trunk portion and protruding in a direction intersecting the extending direction with respect to the outer peripheral surface of the trunk portion.

In the barrel plating conductor,
The said convex part may protrude in all the directions which cross | intersect the said extension direction with respect to the outer peripheral surface of the said trunk | drum.

In the barrel plating conductor,
The said convex part may protrude in the said all direction with the same protrusion amount with respect to the outer peripheral surface of the said trunk | drum.

In the barrel plating conductor,
The trunk portion has a circular shape in a cross section perpendicular to the extending direction;
The convex portion may have a circular shape that is concentric with the trunk portion and has a larger diameter than the trunk portion in a cross section perpendicular to the extending direction.

In the barrel plating conductor,
You may further provide the electroconductive 2nd convex part provided in the other end of the said extending direction of the said trunk | drum, and protruded in the direction which cross | intersects the said extending direction with respect to the outer peripheral surface of the said trunk | drum.

In the barrel plating conductor,
The body portion may have a polygonal shape in a cross section perpendicular to the extending direction.

In the barrel plating conductor,
The convex portion may have a polygonal shape in a cross section perpendicular to the extending direction.

The barrel plating method according to one aspect of the present invention is:
A barrel plating method for forming a plating film by barrel plating on a first exterior terminal and a second exterior terminal provided in an electronic component,
A body portion that has conductivity and extends linearly with a length that can contact both of the first and second exterior terminals; and a conductive body portion that is electrically connected to one end in the extending direction of the body portion. A barrel plating conductor provided with a protruding portion provided in a direction intersecting the extending direction with respect to the outer peripheral surface of the barrel portion, and a step of throwing the barrel plating conductor together with the electronic component into the barrel;
Immersing the barrel in a plating solution;
The barrel is rotated to agitate the barrel plating conductor and the electronic component, and the electronic component is hooked on the convex portion during the agitation to attach the first and second exterior terminals to the body portion. And a step of bringing into contact with the barrel plating method.

In the barrel plating method,
The first exterior terminal may be an anode terminal of a diode, and the second exterior terminal may be a cathode terminal of the diode.

The barrel plating conductor according to an aspect of the present invention is a barrel plating conductor used to form a plating film on a first exterior terminal and a second exterior terminal provided in an electronic component by a barrel plating method. A body portion that has conductivity and extends linearly with a length that allows contact with both the first and second exterior terminals, and one end in the extending direction of the body portion that has conductivity. And a convex portion protruding in a direction intersecting the extending direction with respect to the outer peripheral surface of the trunk portion.
The conductor for barrel plating according to the present invention includes a linear body having a length that can contact both the first exterior terminal and the second exterior terminal, and a convex portion provided at one end of the body. By having the electronic component in the barrel, the first external terminal and the second external terminal are in contact with the body at the same time by the electronic component being caught by the convex portion. easy.
Accordingly, the first exterior terminal and the second exterior terminal can be short-circuited through the trunk portion so as to have the same potential.
Since the first exterior terminal and the second exterior terminal have the same potential, the amount of current flowing through both terminals can be made uniform, so that the plating thickness of one terminal is thicker than the other terminal. Can be suppressed.
Therefore, according to the present invention, the uniformity of plating on the exterior terminal can be improved.

It is a side view which shows the conductor for barrel plating which concerns on 1st Embodiment. It is a front view which shows the conductor for barrel plating which concerns on 1st Embodiment. It is sectional drawing which shows the barrel plating method which concerns on 1st Embodiment. It is an enlarged view which shows the barrel plating method which concerns on 1st Embodiment. It is a schematic diagram which shows the barrel plating method which concerns on a comparative example. It is a schematic diagram which shows the barrel plating method which concerns on 1st Embodiment. It is a front view which shows the conductor for barrel plating which concerns on 2nd Embodiment. It is a side view which shows the conductor for barrel plating which concerns on 3rd Embodiment.

  Embodiments according to the present invention will be described below with reference to the drawings. The embodiments do not limit the present invention.

(First embodiment)
FIG. 1 is a side view showing a barrel plating conductor 1 according to the first embodiment. FIG. 2 is a front view showing the barrel plating conductor 1 according to the first embodiment.

  The barrel plating conductor 1 according to the first embodiment is applied to a first exterior terminal such as an anode terminal and a second exterior terminal such as a cathode terminal provided on an electronic component such as a diode product by a barrel plating method. It is a conductor used for forming a plating film. The conductor 1 for barrel plating can be comprised with metals, such as iron, for example.

  As shown in FIG. 1, the barrel plating conductor 1 includes a body portion 11 and a convex portion 12.

  The trunk | drum 11 has electroconductivity, and extends linearly with the length which can contact both the 1st and 2nd exterior terminals of an electronic component. 1 indicates the extending direction of the body 11.

  The convex portion 12 has conductivity and is provided at one end of the trunk portion 11 in the extending direction D1.

  The convex part 12 protrudes in a direction D2 orthogonal to the extending direction D1 with respect to the outer peripheral surface 11a of the body part 11 (that is, intersecting).

  As shown in FIG. 2, the convex part 12 protrudes in all directions D2 intersecting the extending direction D1 with respect to the outer peripheral surface 11a of the body part 11.

  Specifically, as shown in FIG. 2, the protrusion 12 protrudes with the same protrusion amount in all directions with respect to the outer peripheral surface 11 a of the body 11.

  More specifically, as shown in FIG. 2, the trunk portion 11 has a circular shape in a cross section perpendicular to the extending direction D1, and the convex portion 12 has a trunk portion 11 in a cross section perpendicular to the extending direction D1. And a circular shape having a diameter larger than that of the body portion 11. FIG. 2 is a front view of the trunk portion 11 and the convex portion 12, but the cross-sectional shapes of the trunk portion 11 and the convex portion 12 perpendicular to the extending direction D1 are the front shapes of the trunk portion 11 and the convex portion 12. Are the same.

  Hereinafter, the barrel plating method according to the first embodiment using the barrel plating conductor 1 of FIG. 1 will be described.

  FIG. 3 is a cross-sectional view showing the barrel plating method according to the first embodiment. FIG. 4 is an enlarged view showing the barrel plating method according to the first embodiment.

  In the barrel plating method according to the first embodiment, first, a plurality of barrel-plating conductors 1 are placed in a barrel 5 together with a plurality of diodes 6 which are examples of electronic components.

  After introducing the diode 6 and the barrel plating conductor 1 into the barrel 5, the barrel 5 is immersed in the plating solution 3 stored in the bathtub 4, as shown in FIG. As the plating solution 3, for example, a carboxylic acid Sn bath for Sn plating or a watt bath for Ni plating can be used.

  When the barrel 5 is immersed in the plating solution 3, the plating solution 3 penetrates into the barrel 5 through a large number of small holes 51 provided in the barrel 5.

  After the barrel 5 is immersed in the plating solution 3, the barrel 5 is rotated in the direction R around the axis of the barrel 5 shown in FIG.

  By rotating the barrel 5, the diode 6 and the barrel plating conductor 1 are stirred in the barrel 5.

  While agitating the diode 6 and the barrel plating conductor 1, a later-described anode electrode (that is, a plating material) disposed outside the barrel 5 and a later-described cathode electrode disposed inside the barrel 5. Apply power supply voltage.

  Thereby, the metal ions of the plating material ionized from the anode electrode penetrate into the barrel 5 through the small holes 51 provided in the barrel 5. And the metal ion which penetrate | infiltrated the inside of the barrel 5 moves to the anode terminal or cathode terminal of the diode 6, and deposits as a plating film, and plating to an anode terminal and a cathode terminal is performed.

  At this time, the barrel plating conductor 1 is put in the barrel 5 together with the diode 6 so that the barrel plating conductor 1 contacts the anode terminal A and the cathode terminal K of the diode 6 as shown in FIG. Can be made.

  When the barrel plating conductor 1 is in contact with the anode terminal A and the cathode terminal K, it is possible to easily flow current from the power source to the anode terminal A and the cathode terminal K. Thereby, deposition of the plating film on the anode terminal A and the cathode terminal K can be promoted.

  More specifically, the conductor 1 for barrel plating includes a linear body 11 having a length that can contact both the anode terminal A and the cathode terminal K, and a protrusion 12 provided at one end of the body 11. Thus, the diode 6 can be hooked on the convex portion 12 when being stirred together with the diode 6 inside the barrel 5.

  By hooking the diode 6 on the convex portion 12, the anode terminal A and the cathode terminal K can be brought into contact with the body portion 11 simultaneously as shown in FIG.

  By bringing the anode terminal A and the cathode terminal K into contact with the body portion 11 at the same time, the anode terminal A and the cathode terminal K can be short-circuited through the body portion 11 to have the same potential.

  Since the anode terminal A and the cathode terminal K are at the same potential, the amount of current flowing through both terminals A and K can be made uniform, so that the plating thickness of one terminal is thicker than the other terminal. Can be suppressed.

  Thus, according to the barrel plating method according to the first embodiment, the uniformity of plating on the anode terminal A and the cathode terminal K can be improved.

  Hereinafter, the effect | action by the barrel plating method which concerns on 1st Embodiment is demonstrated in more detail, comparing with a comparative example. FIG. 5 is a schematic view showing a barrel plating method according to a comparative example. FIG. 6 is a schematic diagram illustrating a barrel plating method according to the first embodiment.

  As shown in FIG. 5, if barrel plating is performed using a fine iron ball (Fe) 10 instead of the barrel plating conductor 1 according to the first embodiment, the anode 6 has an anode characteristic due to the characteristics of the diode 6. The chance that the plating film is deposited on the cathode terminal K of the terminal A and the cathode terminal K is reduced.

Specifically, as shown in FIG. 5, when the anode terminal and the cathode electrode are short-circuited via the iron ball 10, the movement of the metal ion (Sn ⁺ ) of the plating material from the anode electrode to the anode terminal A, A short circuit by the iron ball 10 causes a current to flow from the power source via the anode terminal A between the anode electrode and the cathode electrode. As a result, plating is deposited on the anode terminal A.

  At this time, since no current flows through the diode 6 due to the reverse characteristic between K and A of the diode 6 at the cathode terminal K, no current flows through the cathode terminal K between the anode electrode and the cathode electrode. As a result, no plating film is deposited on the cathode terminal K.

On the other hand, as shown in FIG. 5, when the cathode terminal K and the cathode electrode are short-circuited through the iron ball 10, the movement of metal ions (Sn ⁺ ) from the anode electrode to the cathode terminal K and the short circuit by the iron ball 10. As a result, a current flows between the anode electrode and the cathode electrode via the cathode terminal K. Thereby, a plating film is deposited on the cathode terminal K.

  At this time, for the anode terminal A, a current flows between the anode terminal A and the cathode terminal K even if the anode terminal A and the cathode electrode are open due to the forward characteristics between the diodes A and K of the diode 6. Thus, a current flows between the anode electrode and the cathode electrode via the anode terminal A and the cathode terminal K. Such a phenomenon becomes more remarkable in a Schottky diode having a low forward voltage. Thereby, a plating film is deposited also on the anode terminal A.

  As described above, in the barrel plating method using the iron ball 10, when the anode terminal A and the cathode electrode are short-circuited via the iron ball 10, no plating film is deposited on the cathode terminal K. The opportunity for film deposition is reduced.

  On the other hand, when barrel plating is performed using the barrel plating conductor 1 according to the first embodiment, there is an opportunity to deposit a plating film on the anode terminal A and the cathode terminal K regardless of the characteristics of the diode 6. Can be even.

Specifically, as shown in FIG. 6, when the anode terminal A and the cathode electrode are short-circuited via the barrel plating conductor 1, the metal ion (Sn ⁺ ) of the plating material from the anode electrode to the anode terminal A And a short circuit by the barrel plating conductor 1 cause a current to flow between the anode electrode and the cathode electrode via the anode terminal A. As a result, a plating film is deposited on the anode terminal A.

  At this time, no current flows through the diode 6 from the cathode terminal K toward the anode terminal A due to the reverse characteristics between the K and A of the diode 6 at the cathode terminal K.

  However, as shown in FIG. 6, when the barrel plating conductor 1 is in contact with both the anode terminal A and the cathode terminal K, the anode terminal A and the cathode terminal K are connected via the barrel plating conductor 1. Short circuit (that is, the same potential). In FIG. 6, the barrel plating conductor 1 in contact with the diode 6 is illustrated exaggeratedly larger than the barrel plating conductor 1 in which the anode terminal A and the cathode electrode are short-circuited.

  As described above, when the anode terminal A and the cathode terminal K are short-circuited through the conductor for barrel plating 1, a current passing through the cathode terminal and the anode terminal can flow between the anode electrode and the cathode electrode. it can. Thereby, the plating film can be deposited also on the cathode terminal K.

On the other hand, as shown in FIG. 6, when the cathode terminal K and the cathode electrode are short-circuited via the barrel plating conductor 1, the movement of metal ions (Sn ⁺ ) from the anode electrode to the cathode terminal K and the barrel plating are performed. A current flows through the cathode terminal K between the anode electrode and the cathode electrode due to the short circuit by the conductor 1. Thereby, a plating film is deposited on the cathode terminal K.

  At this time, for the anode terminal A, a current flows between the anode terminal A and the cathode terminal K even if the anode terminal A and the cathode electrode are open due to the forward characteristics between the diodes A and K of the diode 6. Thus, a current flows between the anode electrode and the cathode electrode via the anode terminal A and the cathode terminal K. Thereby, a plating film is deposited also on the anode terminal A.

  At this time, as shown in FIG. 6, when the barrel plating conductor 1 is in contact with both the anode terminal A and the cathode terminal K, the anode terminal A and the cathode terminal K are connected via the barrel plating conductor 1. Short circuit.

  As described above, when the anode terminal A and the cathode terminal K are short-circuited through the barrel plating conductor 1, a current passing through the anode terminal and the cathode terminal can flow between the anode electrode and the cathode electrode. it can. Thereby, a plating film can be efficiently deposited by the anode terminal A.

  Thus, in the barrel plating method using the barrel plating conductor 1, the anode terminal A and the cathode terminal K can be short-circuited via the barrel plating conductor 1. Therefore, the chances of depositing the plating film on the anode terminal A and the cathode terminal K can be made uniform.

  As described above, the barrel plating conductor 1 according to the first embodiment is used to form a plating film on the first exterior terminal and the second exterior terminal provided in the electronic component by the barrel plating method. A conductor for barrel plating, which has conductivity and has a body portion 11 extending linearly with a length capable of contacting both the first and second exterior terminals; And a convex portion 12 provided at one end in the extending direction of the portion 11 and protruding in a direction intersecting the extending direction with respect to the outer peripheral surface 11a of the body portion 11.

  Thus, the barrel plating conductor 1 according to the first embodiment has a length capable of contacting both the first exterior terminal (anode terminal A) and the second exterior terminal (cathode terminal K). By having the straight body part 11 and the convex part 12 provided at one end of the body part 11, the electronic part (diode 6) is agitated together with the electronic part (diode 6) inside the barrel 5. As a result, it is easy to form a state in which the first exterior terminal and the second exterior terminal are in contact with the body portion 11 at the same time. As a result, the first exterior terminal and the second exterior terminal can be short-circuited through the trunk portion 11 to have the same potential. Since the first exterior terminal and the second exterior terminal have the same potential, the amount of current flowing through both terminals can be made uniform, so that the plating thickness of one terminal is thicker than the other terminal. Can be suppressed.

  Therefore, according to the first embodiment, the uniformity of plating on the exterior terminal can be improved.

  Further, as described above, in the first embodiment, the convex portion 12 protrudes in all directions orthogonal to the extending direction D1 with respect to the outer peripheral surface 11a of the body portion 11.

  According to such a configuration, the electronic component can be more easily hooked on the convex portion 12 when being stirred together with the electronic component inside the barrel 5. This further facilitates the formation of a state in which the first exterior terminal and the second exterior terminal are in contact with the body portion 11 at the same time, so that the first exterior terminal and the second exterior terminal are short-circuited through the body portion 11. It becomes easy to let. Therefore, the uniformity of plating on the exterior terminal can be further improved.

  Further, as described above, in the first embodiment, the convex portion 12 protrudes from the outer peripheral surface 11a of the body portion 11 with the same protrusion amount in all directions.

  According to such a configuration, since the electronic component can be easily hooked on the convex portion 12 regardless of the relative position of the electronic component to the barrel plating conductor 1, the uniformity of plating on the exterior terminal is further improved. be able to.

  Further, as described above, in the first embodiment, the trunk portion 11 has a circular shape in a cross section perpendicular to the extending direction D1, and the convex portion 12 has a trunk in a cross section perpendicular to the extending direction D1. It has a circular shape that is concentric with the part 11 and has a larger diameter than the body part 11.

  According to such a configuration, it is possible to make it easier to hook the electronic component on the convex portion 12 regardless of the relative position of the electronic component with respect to the conductor 1 for barrel plating, thereby further improving the uniformity of plating on the exterior terminal. Can be made.

(Second Embodiment)
Next, 2nd Embodiment of the conductor for barrel plating provided with the polygonal trunk | drum is demonstrated. FIG. 7 is a front view showing the conductor for barrel plating 1 according to the second embodiment.

  In FIG. 1, the embodiment of the conductor 1 for barrel plating provided with the trunk portion 11 and the convex portion 12 having a circular cross section has been described.

  On the other hand, as shown in FIG. 7, the barrel plating conductor 1 according to the second embodiment has a body portion 11 having a polygonal shape in a cross section perpendicular to the extending direction. More specifically, in the example of FIG. 7, the body portion 11 has a rectangular shape in a cross section perpendicular to the extending direction. In other words, the trunk | drum 11 is flat form.

  Moreover, as shown in FIG. 7, the convex part 12 has a polygonal shape in the cross section perpendicular | vertical to the extending direction. More specifically, in the example of FIG. 7, the convex portion 12 has a rectangular shape in a cross section perpendicular to the extending direction.

  The cross-sectional shape of the trunk | drum 11 and the convex part 12 may be polygonal shapes other than rectangular shapes, such as square shape, pentagon shape, hexagon shape, and octagon shape.

  According to the second embodiment, since the contact area between the exterior terminal of the electronic component and the body portion 11 can be increased and the electrical resistance of the body portion 11 can be reduced, between the exterior terminals via the barrel plating conductor 1. Thus, the current can flow efficiently.

Therefore, according to the second embodiment, the uniformity of plating on the exterior terminals can be further improved.
(Third embodiment)
Next, 3rd Embodiment of the conductor 1 for barrel plating provided with the 2nd convex part is described. FIG. 8 is a side view showing the conductor for barrel plating 1 according to the third embodiment.

  In FIG. 1, the embodiment of the conductor 1 for barrel plating provided with the convex portion 12 at one end of the trunk portion 11 has been described.

  On the other hand, the barrel plating conductor 1 according to the third embodiment further includes a second convex portion 13 in addition to the convex portion 12, as shown in FIG.

  As shown in FIG. 8, the second convex portion 13 is provided at the other end in the extending direction D <b> 1 of the trunk portion 11.

  The 2nd convex part 13 protrudes in the direction D2 orthogonal to the extension direction D1 with respect to the outer peripheral surface 11a of the trunk | drum 11, and has electroconductivity. The more specific shape of the second convex portion 13 may be the same as that of the convex portion 12.

  According to the third embodiment, by providing the second convex portion 13 in addition to the convex portion 12, it is possible to further easily hook the electronic component to the convex portions 12 and 13. This further facilitates the formation of a state in which the first exterior terminal and the second exterior terminal are in contact with the body portion 11 at the same time, so that the first exterior terminal and the second exterior terminal are short-circuited through the body portion 11. It becomes easy to let. Therefore, the uniformity of plating on the exterior terminal can be further improved.

  The barrel plating conductor 1 can also be applied to perform barrel plating on the exterior terminals of electronic components other than the diode 6.

  The above-described embodiment is merely an example, and does not limit the scope of the invention. Various modifications can be made to the above-described embodiment without departing from the scope of the invention. The modified embodiments are included in the inventions described in the claims and their equivalents.

1 Barrel Plating Conductor 11 Body 12 Protrusion

Claims (9)

A conductor for barrel plating used for forming a plating film by barrel plating on a first exterior terminal and a second exterior terminal provided in an electronic component,
A body portion that has conductivity and extends linearly with a length that allows contact with both the first and second exterior terminals;
And a convex portion provided at one end in the extending direction of the body portion and protruding in a direction intersecting the extending direction with respect to the outer peripheral surface of the body portion. Barrel plating conductor.   The conductor for barrel plating according to claim 1, wherein the convex portion protrudes in all directions intersecting the extending direction with respect to the outer peripheral surface of the body portion.   The conductor for barrel plating according to claim 2, wherein the protrusion protrudes with the same protrusion amount in all directions with respect to the outer peripheral surface of the body portion. The trunk portion has a circular shape in a cross section perpendicular to the extending direction;
The conductor for barrel plating according to claim 3, wherein the convex portion has a circular shape that is concentric with the trunk portion and has a diameter larger than that of the trunk portion in a cross section perpendicular to the extending direction.   It is further provided with the electroconductive 2nd convex part which was provided in the other end of the extension direction of the trunk part, and protruded in the direction which intersects the extension direction with respect to the outer peripheral surface of the trunk part. The conductor for barrel plating according to claim 1.   2. The barrel plating conductor according to claim 1, wherein the body portion has a polygonal shape in a cross section perpendicular to the extending direction.   The conductor for barrel plating according to claim 1, wherein the convex portion has a polygonal shape in a cross section perpendicular to the extending direction. A barrel plating method for forming a plating film by barrel plating on a first exterior terminal and a second exterior terminal provided in an electronic component,
A body portion that has conductivity and extends linearly with a length that can contact both of the first and second exterior terminals; and a conductive body portion that is electrically connected to one end in the extending direction of the body portion. A barrel plating conductor provided with a protruding portion provided in a direction intersecting the extending direction with respect to the outer peripheral surface of the barrel portion, and a step of throwing the barrel plating conductor together with the electronic component into the barrel;
Immersing the barrel in a plating solution;
The barrel is rotated to agitate the barrel plating conductor and the electronic component, and the electronic component is hooked on the convex portion during the agitation to attach the first and second exterior terminals to the body portion. And a step of bringing into contact with the barrel plating method.   The barrel plating method according to claim 8, wherein the first exterior terminal is an anode terminal of a diode, and the second exterior terminal is a cathode terminal of the diode.

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