KR102430630B1 - Appararus for electroplating of metal powder - Google Patents

Abstract

The present invention relates to an electroplating apparatus for metal powder which is capable of plating a small object to be plated and has excellent plating quality. According to one embodiment of the present invention, the electroplating apparatus for metal powder comprises: a plating bath; a reactor of a hollow ring shape provided in the plating bath; an anode arranged on one side of the plating bath; and a cathode coming in contact with a material circulating in the reactor. A mesh unit for discharging and introducing a plating solution to the inside and preventing metal powder in the reactor from leaking is provided on the upper surface of the reactor. The reactor includes a first inlet and a second inlet introducing air thereinto, and a first outlet and a second outlet discharging air to the outside. The first inlet and the second inlet and the first outlet and the second outlet are at positions facing each other. At least one between the first inlet and the second inlet is connected to a pump to pump air into the reactor.

Description

Metal powder electroplating device {APPARARUS FOR ELECTROPLATING OF METAL POWDER}

The present invention relates to a metal powder electroplating apparatus.

Electroplating is a method of forming a plating layer on the surface of a conductive material (subject to be plated) by applying an electric potential to give functionality to the surface of the material or to improve appearance. Specifically, in electrolytic plating, a material (reduction electrode) and an anode (oxidation electrode) are immersed in a plating solution containing metal ions, and a certain level of potential (overpotential) is applied by applying power to the surface of the material by an electrochemical reduction reaction. A plating layer is formed.

As a type of electroplating, a barrel plating method is widely used. Barrel plating is a method of electroplating a material by putting a material into a barrel. Barrel plating has a fast plating speed and allows plating of several materials at once, enabling mass production and relatively low cost.

Specifically, barrel plating has a cylindrical shape inside the plating bath, and after mounting a barrel having a mesh structure, electrode rods (positive electrode and negative electrode rod) are placed inside the barrel, and then the body to be plated is put in and the plating solution is applied. supplied and plated. At this time, as the barrel rotates, the objects to be plated inside are in contact with each other, and grinding by friction occurs.

However, in case of electrolytic plating and barrel plating, small-sized powder-type objects such as micrometers (㎛) cannot be plated due to poor contact with the cathode, and micron-sized objects pass through the mesh structure of the barrel wall As a result, the yield is reduced.

In this regard, an electrolytic plating device that performs barrel plating by stirring the inside of the barrel with an impeller is used, but in the process of stirring the metal powder particles with the impeller, a spark is generated when the anode and the metal powder particles come into contact with the metal powder. There was a problem that the phenomenon of burning (dendrite) particles occurred.

In addition, when the barrel is rotated at a low rotation speed (RPM), the aggregation of the powder-sized object increases and the plating quality deteriorates. It could be performed only on the body to be plated, and electrolytic plating had problems in that it was difficult to remove the particles adsorbed on the cathode, resulting in decreased productivity and increased maintenance cost.

Background art related to the present invention is disclosed in Japanese Patent Laid-Open No. 1993-044083 (published on February 23, 1993, title of the invention: powder electroplating method).

One object of the present invention is to provide a metal powder electroplating apparatus capable of plating a small-sized object to be plated and having excellent plating quality.

Another object of the present invention is to provide a metal powder electroplating apparatus having excellent yield by preventing dispersion and agglomeration of a plated body and preventing non-plating.

Another object of the present invention is to provide a metal powder electroplating apparatus that prevents electrode damage and plating defects, has excellent stability, and has excellent productivity and economic feasibility because process automation is possible.

One aspect of the present invention relates to a metal powder electroplating apparatus. In one embodiment, the metal powder electroplating apparatus includes a plating bath; a hollow ring-shaped reactor provided in the plating bath; an anode disposed on one side of the plating bath; and a cathode in contact with the material circulating in the reactor; but, the upper surface of the reactor is provided with a mesh portion for introducing and discharging the plating solution into and from the inside, and preventing the metal powder from flowing out of the reactor, the reactor includes, a first inlet and a second inlet through which air is introduced, and a first outlet and a second outlet through which air is discharged to the outside, wherein the first inlet and the second inlet and the first outlet and the second outlet are provided. are positioned opposite to each other, and at least one of the first inlet and the second inlet is connected to a pump to pump air into the reactor.

Using the metal powder electroplating apparatus of the present invention, micron-sized objects can be plated during electrolytic plating, and the plating quality is excellent, and dispersion and aggregation of the objects to be plated during the plating process are prevented, and the non-plating phenomenon is prevented. Thus, the yield is excellent, electrode damage and plating defects such as dendrites are prevented, stability is excellent, and process automation is possible, so productivity and economy can be excellent.

1 shows a metal powder electroplating apparatus according to an embodiment of the present invention.
2 is a cross-sectional view of a metal powder electroplating apparatus according to an embodiment of the present invention.
3 shows a cross-section of a reactor of an electrolytic plating apparatus according to an embodiment of the present invention.
Figure 4 (a) is a scanning electron microscope (SEM) photograph of the comparative example, Figure 4 (b) is an example SEM photograph.
Fig. 5 (a) is a SEM photograph of a comparative example, and Fig. 5 (b) is an SEM photograph of an embodiment.
Figure 6 (a) is a SEM photograph showing the cross section of the plating product of the embodiment, Figure 6 (b) is an enlarged SEM photograph of the cross section of the embodiment of Figure 6 (a).

In describing the present invention, if it is determined that a detailed description of a related known technology or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

And the terms described below are terms defined in consideration of functions in the present invention, which may vary depending on the intention or custom of the user or operator, so the definition should be made based on the content throughout this specification describing the present invention.

Metal powder electroplating device

One aspect of the present invention relates to a metal powder electroplating apparatus.

1 shows a metal powder electroplating apparatus according to an embodiment of the present invention. Referring to FIG. 1 , the electrolytic plating apparatus 1000 includes a plating bath 100 ; A hollow ring-shaped reactor 200 provided in the plating bath 100; an anode 310 disposed on one side of the plating bath 100; and a cathode 320 in contact with the material circulating inside the reactor 200 .

2 is a cross-sectional view showing a metal powder electroplating apparatus according to an embodiment of the present invention. 1 and 2, the reactor 200 has a first inlet 210 and a second inlet 220 through which air is introduced, and a first outlet 212 and a second outlet through which air is discharged to the outside. 2 outlets 222 are included. The first inlet 210 and the second inlet 220 , and the first outlet 212 and the second outlet 222 are positioned to face each other. Under the above conditions, air is introduced into the reactor in opposite directions, so that the plating solution and the metal powder inside circulate easily, and the metal powder is stacked in one direction inside the reactor to prevent agglomeration or micro-dispersion. The yield may be excellent.

In one embodiment, at least one of the first inlet and the second inlet is connected to a pump to pump air into the reactor. When the air is pumped, the circulation speed of the metal powder inside the reactor is improved to prevent agglomeration, so that the yield during electroplating can be excellent. The pumping pressure conditions may be adjusted in consideration of the particle size and specific gravity of the metal powder. For example, as shown in FIG. 2 , the first inlet 210 and the second inlet 220 may be connected to the first pump 240 and the second pump 242 , respectively.

As another example, the pump may also be connected to one or more of the first outlet and the second outlet. Under the above conditions, the circulation speed of the metal powder in the reactor is improved, and aggregation is prevented, so that the yield during electroplating can be excellent.

Referring to FIG. 1 , a third inlet 120 and a third outlet 122 for discharging air inside the plating bath to the outside may be provided on both sides of the plating bath, respectively, in order to improve circulation efficiency of the plating solution. . The third inlet 120 may be connected to a pump to pump air into the plating solution. The circulation of the plating solution may be easy under the above conditions.

As the plating bath 100, a normal one may be used. In one embodiment, the plating bath may further include a sound wave excitation unit or an ultrasonic excitation unit for applying sound waves and ultrasonic waves to the plating solution and the reactor on one side. It is possible to prevent micro-dispersion and agglomeration of the metal powder inside the reactor when the sound waves and ultrasonic waves are applied.

The reactor 200 is formed of a transparent material. The transparent material may include a material having a light transmittance of 70% or more. Conventional electrolytic plating was impossible to check the inside using a reactor made of an opaque metal material, but in the present invention, the electrolytic plating process inside the reactor can be confirmed by applying a reactor made of a transparent material. For example, the reactor may comprise glass. Under the above conditions, it is possible to check the internal electrolytic plating process due to excellent transparency, and excellent corrosion resistance and alkali resistance, thereby preventing corrosion to the plating solution.

Referring to FIG. 2 , the reactor 200 may have an overall length L of 20 to 50 cm. Under the above conditions, the plating solution and the metal powder easily circulate, so that the electrolytic plating can be easily performed. For example, it may be 20-30 cm.

In one embodiment, the reactor 200 may have a circular or elliptical internal cross-section. For example, it may be circular. Under the above conditions, agglomeration and micro-dispersion of the metal powder may be prevented, so that the yield during electroplating may be excellent.

Referring to FIG. 1 , the upper surface of the reactor 200 is provided with a mesh portion 230 for introducing and discharging a plating solution P to and from the inside of the reactor 200 and preventing the metal powder from flowing out of the reactor. For example, the plating solution may be introduced into the reactor by charging the plating solution up to the portion of the reactor where the mesh portion is formed. When the reactor of the above structure is applied, a plating layer is formed while the plating solution and the metal powder are circulated in the lower part of the reactor, and the outflow of the metal powder in the reactor can be prevented when discharged.

The mesh portion may include a plurality of pores. The pore size may be smaller than that of the metal powder. As the plating solution flows into the coagulator under the above conditions, the metal powder inside the reactor flows out into the plating solution outside the reactor, thereby preventing a decrease in the yield of the plating product. For example, the mesh portion may have a pore size of 30 μm or less. For example, the mesh portion may have a pore size of 0 to 1 to 30 μm.

3 is a cross-section of a reactor (A-A' in FIG. 2) of an electrolytic plating apparatus according to an embodiment of the present invention. Referring to FIG. 3 , the reactor 200 may have an inner diameter (or height, H) of 1 to 10 cm in cross section. Under the above conditions, the plating solution and the metal powder easily circulate, so that the electrolytic plating can be easily performed. For example, it may be 2-3 cm.

Referring to FIG. 3 , the reactor 200 may further include an outlet 230 for recovering a plating product having a plating layer formed thereon.

The anode and the cathode may use a conventional metal material. In one embodiment, the positive electrode may have a plate shape, a rod shape, or a rod shape.

In one embodiment, the anode is disposed inside the plating bath and immersed in the plating solution to perform electroplating, and according to electroplating conditions such as applied voltage, the depth of immersion in the plating solution may be adjusted to perform electroplating.

Referring to FIG. 3 , the negative electrode 320 is inserted into the upper part of the reactor 200 , and the reactor inner diameter (H) and the insertion depth (D) of the negative electrode may satisfy Equation 1 below:

[Equation 1]

0.5H ≤ D ≤ 0.85H

(In Equation 1, D is the insertion depth (mm) of the cathode, and H is the inner diameter (mm) of the reactor).

When the condition of Equation 1 is satisfied, the electrolytic plating yield can be excellent by easily contacting the metal powder circulating inside the reactor. The anode inserted into the reactor as described above is detachable, so that the metal powder adsorbed to the cathode inside the reactor can be easily removed after electroplating, so that maintenance/repair can be easy. For example, Equation 1 may be 0.55H ≤ D ≤ 0.65H.

Referring to FIG. 3 , the reactor has a ring-shaped structure having a circular longitudinal cross-section, and the width W and the reactor inner diameter H of the cathode 320 inserted from the top of the reactor may satisfy Equation 2 below. .

[Equation 2]

0.1H ≤ W ≤ 0.7H

(In Equation 1, W is the width (mm) of the cathode, and H is the inner diameter (mm) of the reactor).

When the condition of Equation 2 is satisfied, the metal powder and the cathode easily contact without disturbing the circulation of the plating solution and the metal powder circulating inside the reactor, and the electrolytic plating yield can be excellent. The anode inserted into the reactor as described above is detachable, so that the metal powder adsorbed to the cathode inside the reactor can be easily removed after electroplating, so that maintenance/repair can be easy. For example, Equation 2 may be 0.15H ≤ W ≤ 0.45H.

In one embodiment, an insulating coating layer may be formed on the surface of the negative electrode except for a portion inserted into the reactor. When the insulating coating layer is formed, it is possible to prevent the metal contained in the plating solution from being deposited on the surface of the anode.

In one embodiment, the negative electrode may have a plate shape, a rod shape, or a rod shape.

The electrolytic plating apparatus of the present invention has a structure in which the anode and the metal powder cannot contact because the metal powder inside the reactor is not discharged to the external plating solution, and the anode and the metal powder particles come into contact to generate sparks, or metal powder particles There is no dendrite phenomenon.

In one embodiment, the metal powder may have an average size of 1-50 μm. The size may mean the maximum length of the metal powder. In the above average size, electrolytic plating reactivity and yield may be excellent. For example, the metal powder may have an average particle diameter (d50) of 1 to 50 µm.

In one embodiment, the metal powder may include a conventional metal or an alloy of two or more metals.

In one embodiment, the plating solution may include a metal salt and water. The content of the components of the plating solution can be easily adjusted by those skilled in the art according to the purpose and purpose of use.

The plating solution may be introduced through the mesh portion of the reaction tank.

In one embodiment, the metal powder may be filled to a height of 0.5 to 20% based on the inner diameter (H) of the reaction tank. Under the above conditions, the electroplating efficiency may be excellent. In addition, the mixture of the plating solution and the metal powder may be filled to a height of 30 to 85% based on the inner diameter (H) of the reaction tank. Under the above conditions, the electroplating efficiency may be excellent.

In one embodiment, the metal powder and the plating solution in the reactor may be included in a weight ratio of 1:2 to 1:6. Under the above conditions, the metal powder has excellent dispersibility to prevent agglomeration, and when air is pumped into the reactor, the plating solution and the metal powder circulate inside the reactor and easily contact the cathode, so the plating product yield can be excellent. have.

Electrolytic plating method of metal powder using electrolytic plating device

Another aspect of the present invention relates to an electrolytic plating method of metal powder using the electrolytic plating apparatus. In one embodiment, the electrolytic plating method includes a plating bath; a hollow ring-shaped reactor provided in the plating bath; an anode disposed on one side of the plating bath; and a cathode in contact with the material circulating in the reactor; but, the upper surface of the reactor is provided with a mesh portion for introducing and discharging the plating solution into and from the inside, and preventing the metal powder from flowing out of the reactor, the reactor includes, a first inlet and a second inlet through which air is introduced, and a first outlet and a second outlet through which air is discharged to the outside, wherein the first inlet and the second inlet and the first outlet and the second outlet are provided. is a metal powder electroplating method using an electrolytic plating device in which at least one of the first inlet and the second inlet is connected to a pump to pump air into the reactor, (S10) inside the reactor accommodating the metal powder in the, and introducing a plating solution from the mesh portion; and (S20) applying power to the anode and the cathode to perform electrolytic plating.

(S10) Step of introducing metal powder and plating solution

The step is a step of accommodating the metal powder inside the reactor, and introducing a plating solution from the mesh part.

In one embodiment, the metal powder 10 may be polyhedral, ellipsoidal, or spherical. For example, it may be spherical.

In one embodiment, the metal powder may have an average size of 1-50 μm. The size may mean the maximum length of the metal powder. In the above average size, electrolytic plating reactivity and yield may be excellent. For example, the metal powder may have an average particle diameter (d50) of 1 to 50 µm.

In one embodiment, the metal powder may include a conventional metal or an alloy of two or more metals.

In one embodiment, the plating solution may include a metal salt and water. The content of the components of the plating solution can be easily adjusted by those skilled in the art according to the purpose and purpose of use.

The plating solution may be introduced through the mesh portion of the reaction tank.

In one embodiment, the metal powder may be filled to a height of 0.5 to 20% based on the inner diameter (H) of the reaction tank. Under the above conditions, the electroplating efficiency may be excellent. In addition, the mixture of the plating solution and the metal powder may be filled to a height of 30 to 85% based on the inner diameter (H) of the reaction tank. Under the above conditions, the electroplating efficiency may be excellent.

In one embodiment, the metal powder and the plating solution in the reactor may be included in a weight ratio of 1:2 to 1:6. Under the above conditions, the metal powder has excellent dispersibility to prevent agglomeration, and when air is pumped into the reactor, the plating solution and the metal powder circulate inside the reactor and easily contact the cathode, so the plating product yield can be excellent. have.

(S20) electrolytic plating step

The step is a step of performing electroplating by applying power to the anode and the cathode. The electrolytic plating may be carried out under normal conditions.

During the electroplating, air is pumped into the reactor in opposite directions through the first inlet and the second inlet and is introduced, and the metal powder is circulated inside the reactor by the introduced air and the plating solution, and the inside of the reactor A plating layer may be formed on the surface in contact with the protruding cathode.

Referring to FIG. 3 , the particles of the metal powder 10 may be in contact with the negative electrode 320 and negatively charged (-) on the surface thereof. The plated product 20 in which the plating layer 12 is formed on the surface of the metal powder 10 by contacting the negatively charged metal powder particles with the metal ions (M ⁺ ) in the plating solution P may be manufactured.

In one embodiment, by introducing air through the first inlet and the second inlet during the electrolytic plating, the plating solution and the metal powder may circulate in the reactor at a speed of 1 to 1000 rpm. In the above conditions, aggregation and micro-dispersion of the metal powder is prevented, and the plating layer is formed with a uniform thickness, so that the plating quality is excellent, and the plating product yield can be increased. For example, it can cycle at 200-500 rpm.

In one embodiment, the plating layer 12 may have a thickness of 0.001 to 10 μm.

Using the metal powder electroplating apparatus of the present invention, micron-sized objects can be plated during electrolytic plating, and the plating quality is excellent, and dispersion and aggregation of the objects to be plated during the plating process are prevented, and the non-plating phenomenon is prevented. Thus, the yield is excellent, electrode damage and plating defects such as dendrites are prevented, stability is excellent, and process automation is possible, so productivity and economy can be excellent.

Hereinafter, the configuration and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, these are presented as preferred examples of the present invention and cannot be construed as limiting the present invention in any sense. Content not described here will be omitted because it can be technically inferred sufficiently by those skilled in the art.

Examples and Comparative Examples

Example

(1) Preparation of electroplating apparatus: as shown in FIGS. 1 to 3 , a plating bath 100 in which a plating solution P is filled; A hollow ring-shaped reactor 200 provided in the plating bath 100; an anode 310 disposed on one side of the plating bath 100; and a cathode 320 which is inserted into the reactor 200 and is inserted so that the end protrudes into the reactor and is in contact with the material circulating therein; an electroplating apparatus 1000 comprising a.

The reactor 200 is formed of a transparent glass material having a length (L): 30 cm and a longitudinal cross-sectional diameter (H): 3 cm, and the plating solution is introduced and discharged inside the upper part of the reactor, and the metal powder is prevented from flowing out from the inside of the reactor A mesh unit 230 was provided.

The positive electrode and the negative electrode are formed of a metal material, and the negative electrode 320 is in the form of a rod having a width (W, or diameter) of 1 cm, and is inserted to protrude to a length of 2 cm based on the longitudinal cross-section of the reactor. An insulating coating layer was formed on the surface of the negative electrode except for the protruding portion. The reactor 200 is formed diagonally symmetrically with each other on the upper side to face the first inlet 210 and the second inlet 220 and the first inlet 210 and the second inlet 220 through which air is introduced into the interior, respectively. It is formed and includes a first outlet 212 and a second outlet 222 for discharging air to the outside, wherein the first inlet and the second inlet are respectively connected to the first pump 240 and the second pump 242 to pump air into the reactor. In addition, as shown in FIG. 1 , the plating bath 100 was connected to a sound wave excitation unit to apply sound waves to the plating solution and the reactor, and a third inlet and a third outlet connected to a pump were formed on both sides of the plating solution to circulate the plating solution. The plating solution contained a metal salt and distilled water.

(2) Electrolytic plating: accommodating metal powder (metal powder having an average particle diameter (d50) of 16 to 45 μm) in the reactor 100, and filling the plating solution up to the portion where the mesh part of the reactor is formed, and the plating solution inside the reactor was introduced. The metal powder and the plating solution inside the reactor were introduced to maintain a weight ratio of 1:4 to 1:6, and the total amount of the metal powder and the plating solution was introduced to satisfy a height of 60 to 75% based on the diameter of the reactor longitudinal section.

Then, power was applied to the anode and the cathode to perform electrolytic plating. During the electroplating, air is pumped into the reactor in opposite directions through the first inlet 210 and the second inlet 220 and introduced into the reactor, and the metal powder flows into the reactor by the introduced air and the plating solution. cycled. The metal powder and the plating solution were circulated inside the reactor at 200 to 500 rpm, and contacted with the anode protruding inside the reactor to form a plating layer having a thickness of 0.01 to 10 μm on the surface to prepare a plating product. The manufactured plating product was recovered through the outlet 230 formed at the bottom of the reactor.

comparative example

An electrolytic plating apparatus was prepared in which an anode and a cathode were disposed to face each other in the plating bath, and an impeller was interposed between the anode and the cathode. Then, the same metal powder as in the above example was accommodated in the plating bath, and a plating solution was introduced so that a part of the anode and the cathode were immersed. Then, while rotating the impeller at 200 to 500 rpm, power was applied to the anode and the cathode under the same conditions as in the above embodiment, and electrolytic plating was performed to form a plating layer on the surface of the metal powder to prepare a plating product.

Experimental example

The dispersibility of the electrolytically plated plated products of the Examples and Comparative Examples, the yield of the plated products, and whether the electrodes (anode or cathode) were damaged during electroplating were evaluated, and the results are shown in Table 1 below.

(1) Dispersibility: Dispersibility was evaluated by observing the plating products of Examples and Comparative Examples with a scanning electron microscope (◎: very good dispersibility, ○: some fine dispersion and agglomeration, △: severe fine dispersion and agglomeration Occurrence, X: hardly dispersed and severe agglomeration occurs).

(2) Plating quality: The quality of the surface plating layer was evaluated by observing the plating products of Examples and Comparative Examples with a scanning electron microscope (◎: good surface quality, ○: some surface scratches and some non-plating occurred, △: some non-plating Plating, poor surface shape of the plating layer, X: most of the particles are not plated).

(3) Whether or not the electrode is damaged: After electroplating, the damage of the anode and the cathode was visually evaluated using Examples and Comparative Examples.

Referring to the results of Table 1, the example of the present invention has excellent dispersibility of the metal powder, so that agglomeration of the plating product does not occur and a homogeneous plating layer is formed, and the surface quality of the plating layer is excellent, which makes the plating product high It was obtained in yield. In addition, since the metal powder flows out of the reactor and does not come into contact with the anode, damage to the anode did not occur during electroplating.

On the other hand, in the case of the comparative example in which no reactor was applied, aggregation and micro-dispersion of metal powder in the plating solution occurred during electrolytic plating. Could know. In addition, it was found that during electroplating, metal powder came into contact with the anode to generate sparks and a dentrite plating layer was formed, thereby causing damage to the anode.

In addition, the plating products of the Examples and Comparative Examples were analyzed with a scanning electron microscope, and the results are shown in FIGS. 4 to 6 below. 4(a) is a scanning electron microscope (SEM) photograph of the plated product of Comparative Example, FIG. 4(b) is a SEM photograph of the plated product of Example, and FIG. 5(a) is a scanning electron microscope (SEM) of the plated product of Comparative Example (SEM) is a photograph, Figure 5 (b) is a SEM photograph of the plating product of Example. Referring to FIG. 4, in the embodiment of the present invention, the negative electrode and the metal powder come into contact with the metal powder to form a homogeneous plating layer on the surface of the metal powder, so the plating quality is excellent, whereas in the comparative example, the metal powder does not easily contact the negative electrode The non-plating phenomenon occurred in which the plating layer was not properly formed on the surface of the metal powder, and the yield of the plated product was lowered.

Referring to FIG. 5, it can be seen that the Example has excellent dispersibility of the metal powder, so that the agglomeration of the plated product does not occur, whereas in the Comparative Example, particle agglomeration occurs. In addition, FIG. 6(a) is a scanning electron microscope (SEM) photograph showing a cross section of the plating product of Example, and FIG. 6(b) is an enlarged SEM photograph of the cross-section of the plating product of the example of FIG. 6(a). Referring to FIG. 6 , it can be seen that the plating product of Example had a plating layer having a uniform thickness formed on the surface, and the plating quality was excellent.

Up to now, the present invention has been looked at focusing on examples. Those of ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments are to be considered in an illustrative rather than a restrictive sense. The scope of the present invention is indicated in the claims rather than the foregoing description, and all differences within the scope equivalent thereto should be construed as being included in the present invention.

10: metal powder 12: plating layer
20: plating product 100: plating tank
120: third inlet 122: third outlet
200: reactor 210: first inlet
212: first outlet 220: second inlet
222: second outlet 230: outlet
240: first pump 242: second pump
310: anode 320: cathode

Claims (1)

plating bath; a hollow ring-shaped reactor provided in the plating bath; an anode disposed on one side of the plating bath; and a cathode in contact with the material circulating inside the reactor;
The upper surface of the reactor is provided with a mesh portion for introducing and discharging the plating solution into and out of the reactor, and preventing the metal powder from flowing out of the reactor,
The reactor includes a first inlet and a second inlet through which air is introduced, and a first outlet and a second outlet through which air is discharged to the outside, the first inlet and the second inlet and the first outlet and the second outlet is located opposite to each other,
At least one of the first inlet and the second inlet is connected to a pump to pump air into the reactor.

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