JPH02228478A - Barrel plating method and inside barrel for barrel plating - Google Patents

Abstract

PURPOSE:To simultaneously work a small quantity of >=2 kinds of plating objects and to eliminate the need for screening after working by charging the plating objects into a rotary barrel and further housing another plating objects into an inside barrel and charging this barrel into the rotary barrel. CONSTITUTION:The plating objects 4 are directly charged into the rotary barrel 6 and another kind of the plating objects 4a are housed into the inside barrel 17 and are charged into the rotary barrel 6. The inside barrel 17 is formed of a nonconductive stock and has an electrode 15 and a communicating part 16 through which a plating liquid can enter and emerge. The outside part 15a of the electrode 15 exposed on the outer side of the inside barrel 17 comes into direct contact with the inside electrode 12 of the rotary barrel 6 when the rotary barrel 6 is agitated in the plating liquid 2. The electrode otherwise comes into contact with stainless steel balls 14 held in contact with the inside electrode 12. Plating current energizes to another kind of the plating objects 4a in this way and a small quantity of another kind of the plating objects 4a are subjected to the plating simultaneously with the ordinary plating objects 4.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a barrel plating method and an inner barrel for barrel plating.

[Conventional technology]

Barrel plating is usually used to apply nickel plating and solder plating to electrodes of relatively small electronic components such as chip resistors. In the barrel plating method, a barrel rotates in a plating solution, and a stainless steel pole is used to spread the current evenly over a large number of objects to be plated, and a non-conductive pole is used to adjust the plating current conducted to the objects to be plated. Along with the ceramic balls, a large number of the above-mentioned small electronic components as objects to be plated were introduced.
This is a method of plating by applying electricity while stirring in the barrel. The barrel used in the above barrel plating method is, for example,
A hexagonal columnar frame made of non-conductive Teflon frame,
It is formed by stretching a net made of non-conductive resin such as Saran resin, and an external T
A t8i connected to the source is provided. Usually, the electrode on the barrel side that comes into contact with the plating object is used as a cathode, while the anode is placed in the plating solution outside the barrel,
When a direct current is passed between these anodes and cathodes, the metal ionized in the plating solution conducts to the cathode and is deposited as a thin film on the metal surface of the object to be plated. be done. The object to be plated is stirred together with the ceramic ball and the stainless steel pole in a rotating barrel that rotates in the plating solution. A nearly uniform plating current is applied. As a result, uniform plating is applied to each object to be plated.

[Problem to be solved by the invention]

By the way, the barrel plating method described above can uniformly plate the same number of small objects to be plated at once, but the number of objects to be plated that should be put into the rotating barrel depends on the number of objects to be plated in the rotating barrel. It is almost determined by the size, and if the amount of the plating object is too small or too large, problems will occur such as the efficiency of the plating process will drop or the desired plating process cannot be performed. For this reason, in general, when plating a small amount of products, a method is often adopted in which two or more types of objects to be plated are processed at the same time. However, if two or more types of plating objects are placed into the rotating barrel at the same time and plated, the optimal plating current may not flow due to differences in shape, etc., and the desired plating process may not be achieved. It may not be possible. In such a case, even if a small amount of the object to be plated is required, it is necessary to process a larger quantity than necessary according to the size of the rotating barrel, which increases costs and reduces the amount of plating. There was a problem that it was not possible to handle multi-product production. In addition, when processing two or more types of plating objects by putting them into one rotating barrel, after plating,
It is necessary to sort out the two types of objects to be plated, which causes a problem in that the efficiency of the plating operation is reduced. The present invention was devised under the above-mentioned circumstances, and solves the above-mentioned conventional problems, and enables plating of a small amount of objects to be plated at the same time as ordinary objects of plating under desired conditions. It is an object of the present invention to provide a barrel plating method that can process two or more types of objects to be plated at the same time and that does not require post-processing sorting, and an apparatus for use in the method.

[Means to solve the problem]

The present invention takes the following technical means to solve the above-mentioned problems. That is, the invention described in claim 1 of the present application provides a barrel plating method in which the object to be plated is placed into a rotating barrel rotating in a plating solution and plating is performed, in which the object to be plated is directly thrown into the rotating barrel, and , Furthermore, another type of plating object is formed of a non-conductive material, and
The object to be plated is housed in an inner barrel that is equipped with an electrode that conducts electricity therein and has a communication part through which the plating solution can enter and exit the interior, and is introduced into the rotating barrel. It is characterized in that the plating process is performed simultaneously on the housed objects to be plated of different types. Furthermore, the invention described in claim 2 of the present application is an invention of an apparatus used for the device described in claim 1 of the present application, which houses the object to be plated and puts it into a rotating barrel that rotates in the plating solution. An inner barrel for barrel plating that can be moved in the rotating barrel at the same time, and has a ball-shaped form made of a non-conductive material and can be opened and closed, and has a plating plate housed inside the periphery of the opening and closing joint. It is characterized in that it includes a removable electrode that energizes the object, and a communication section that allows the plating solution to enter and exit the interior.

[Operation and effects of the invention]

In the present invention, together with the plating target that is directly charged into the rotating barrel, another type of plating target is stored in the inner barrel and is charged into the rotating barrel, and the plating target that is directly charged and the plating target are stored in the inner barrel. The present invention relates to a method for simultaneously plating a different type of object to be plated, and an apparatus used in the method. In conventional barrel plating methods, it was necessary to process the number of objects to be plated, which was determined by the size of the barrel. Furthermore, when two or more types of objects to be plated are input, it is not possible to set conditions suitable for each object to be plated, so that it may not be possible to perform the desired plating process. In the barrel plating method according to the present invention, a normal plating target is put into a rotating barrel, and a different type of plating target is placed in a rotating barrel, which is made of a non-conductive material, has an internally conductive electrode, and is coated with a plating solution. It is housed in an inner barrel equipped with a communication part that allows it to go in and out, and is introduced into the rotating barrel. The inner barrel, which accommodates the different types of plating objects and is introduced into the rotating barrel, is made of a non-conductive material such as Teflon, and is equipped with an electrode for energizing the plating objects housed inside. It also includes a communication portion through which the plating solution can enter and exit. By immersing the inner barrel in the plating solution while stirring the object to be plated in the rotating barrel,
The outer side of the electrode contacts the electrode inside the rotating barrel, or contacts the stainless steel ball that is in contact with the electrode. As a result, a plating current flows to a different type of plating object housed inside the inner barrel, and the plating process is performed. This makes it possible to process a desired quantity of different types of plating objects at the same time as normal plating objects, and
The ratio of ceramic balls and stainless steel poles thrown into the inner barrel can be made different from the ratio of ceramic balls and stainless steel balls thrown into the rotating barrel outside the inner barrel. It is now possible to set the plating current applied to a different type of plating object to a value different from that of the plating object directly input into the rotating barrel, and the plating current applied to the plating object directly input into the rotating barrel and the inner barrel. It becomes possible to perform desired plating processing on each of the different types of plating objects accommodated. As a result, it is possible to significantly increase production efficiency in low-volume, high-mix production, and it is also possible to handle small-volume processing of experiments, sample products, etc., and has the effect of greatly promoting technological development. In addition, in conventional processing methods, when processing two or more types of plating objects by putting them into a rotating barrel, it is necessary to sort out the two or more types of plating objects after processing. Therefore, there was a problem in that the work efficiency of plating work decreased. In the present invention, processing is performed while different types of plating objects are housed in the inner barrel, so there is no need to sort out the plating objects after processing, which dramatically improves work efficiency. can be done. The invention described in claim 2 of the present application relates to an inner barrel for use in the above-mentioned barrel plating method. The inner barrel has a ball-shaped form made of a non-conductive material such as Teflon, so when it is put into the rotating barrel, it is conveniently stirred with the stainless steel pole and ceramic ball, and the plating that is directly put into the barrel is easily stirred with the stainless steel pole and ceramic ball. The plating objects accommodated in the inner barrel are also conveniently agitated inside, while the processing of the objects is not affected. In addition, since the inner barrel is equipped with a communication part through which the plating solution can enter and exit the inner barrel, the plating solution can be sufficiently distributed inside the inner barrel, and the plating solution with high ion concentration can be applied to each plating target. It can be brought into even contact with objects. The communication portion may also be provided by forming a slit or a net-like opening in the outer shell of the inner barrel that communicates with the inside. An electrode for energizing the plating object housed inside is removably provided at the periphery of the opening/closing joint of the shell wall of the inner barrel. Therefore, it is possible to change the number of electrodes attached or to employ electrodes with various current capacities. For this reason, when attaching the electrodes, different processing conditions are set depending on the number of electrodes, electric capacity, etc., for the plating object directly fed into the rotating barrel and a different type of plating object housed in the inner barrel. This makes it easier to perform plating, and plating can be performed under optimal processing conditions depending on each object to be plated.

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to FIGS. 1 to 3. FIG. 1 is a diagram schematically showing an outline of a barrel plating apparatus. As shown in this figure, a barrel plating apparatus 1 (fished by boat) includes a plating M3 filled with a plating solution 2, an anode 5 immersed in the plating solution 2, and an object 4 to be plated in the plating solution 2. a rotating barrel 6 which rotates while accommodating the same, and into which a cathode 12 is introduced; a drive unit W7 which rotates the rotating barrel 6; and a DC power source for passing a current between the anode 5 and the cathode 12. 8. As shown in FIGS. 1 and 2, the rotating barrel 6 used in the barrel plating apparatus fl has a hexagonal column-shaped frame m9 made of a material such as non-conductive Teflon, and a non-conductive saran resin. It is formed by stretching a net 10 made of a material such as. The shaft is immersed in the plating solution 2 filled in the plating tank 3 with its central axis in the horizontal direction, and is rotatably supported by the hexagonal hexagonal side surfaces 20 while extending from one side surface. A driving chino 21 is hooked and rotated between a sprocket 22 provided on the external drive device 7 and a sprocket 11 provided on the external drive device 7. Inside the rotating barrel 6, the rotating barrel 6
An internal electrode 12 as a cathode for passing a current through the plating object 4 which is directly introduced into the interior of the rotating barrel 6 is inserted through an electrode insertion hole 23 on the side surface of the rotating barrel 6. It is connected to the cathode of an external DC power source 8 via the hole 23 and the bracket 7) 20. The rotating barrel 6 is rotated by the driving device 7 while passing a current through nine plating objects 4 housed therein, and performs plating while picking up the plating objects 4. Normally, in order to adjust the plating current flowing to the plating object 4 and distribute it evenly, a non-conductive ceramic ball 13 and a conductive stainless steel pole 14 are used.
The plating object 4 is put into the rotating barrel 6 together with the plating object 4 . The plating object 4 is stirred in the plating solution 2 together with the ceramic ball 13 and the stainless steel pole 14 in the rotating barrel by the rotation of the rotating barrel 6, and the plating object 4 is inside the rotating barrel 6. Each object to be plated is stirred by the rotation of the zero-rotation barrel 6 through which the plating current is passed by directly contacting the provided internal electrode 12 or by contacting the stainless steel pole 14 that is in contact with the internal electrode 12. 4 becomes uniform, and each object 4 to be plated is uniformly plated. Conventionally, when performing barrel plating, the plating target 4
Since the only method available was to directly charge the plating objects 4 into the rotating barrel 6, it was necessary to process the number of plating objects 4 determined by the size of the rotating barrel 6. Further, when two or more types of objects to be plated are input, it is not possible to set the optimum conditions for each object to be plated, and therefore it may not be possible to perform the desired plating process. In the barrel plating method of this embodiment, the rotating barrel 6
A normal plating object 4 is directly thrown into the plating object 4, and a different type of plating object 4a is housed in the inner barrel 17 and thrown into the rotating barrel 6. The inner barrel 17, which accommodates the different type of plating object 4a therein and is introduced into the rotating barrel 6, is made of a non-conductive material such as Teflon. A communication section 1 which is equipped with an electrode 15 for applying electricity and into which the plating solution 2 can enter and exit.
6. The electrode 1 is exposed to the outside of the inner barrel as the inner barrel 17 is stirred in the plating solution 2 together with the plating object 4 directly put into the rotating barrel 6.
The outer portion 15a of the rotating barrel 6 directly contacts the internal electrode 12 provided inside the rotating barrel 6, or contacts the stainless steel ball 14 that is in contact with the internal electrode 12. This causes the plating target 4a of another type housed inside the inner barrel 17 to be coated on the inner side 15b of the electrode 15.
By directly contacting or indirectly contacting through the stainless steel pole 14a inserted into the inner barrel 17, a plating current is applied and plating is performed. Therefore, it is possible to plating a small amount of a different type of plating object 4a at the same time as the normal plating object 4, and the ratio of the ceramic balls 13a and the stainless steel poles 14a to be charged into the inner barrel 17 is adjusted to the outside of the inner barrel. Since the ratio of the ceramic balls 13 and the stainless steel poles 14 that are introduced into the rotating barrel 6 can be made different, the plating current flowing to the different type of plating target 4a housed inside the inner barrel 17 can be changed from the rotating barrel 6 It becomes possible to set a value different from that of the plating target 4 directly charged into the rotating barrel 6 and the different type of plating target 4a accommodated in the inner barrel 17. It becomes possible to perform the desired plating process on the surface. As a result, it is possible to significantly increase production efficiency in low-volume, high-mix production, and
It can also handle small-scale processing of experiments, sample products, etc., and has the effect of greatly promoting technological development. In addition, in conventional processing methods, when processing is performed by directly charging two or more types of plating objects into the rotating barrel 6, it is necessary to sort out the two or more types of plating objects after processing. Therefore, there was a problem in that the efficiency of plating work was reduced. In this embodiment, processing is performed while a different type of plating object 4a is accommodated in the inner barrel, that is, separated from the plating object 4 that is directly thrown into the rotating barrel 6. After processing, the plating object 4 and a different type of plating object 4a are directly put into the rotating barrel 6.
There is no need to sort and separate, and work efficiency can be dramatically improved. FIG. 2 and FIG. 3 show an embodiment of the invention set forth in claim 2 of the present application. The inner barrel 17 of this embodiment is made of a non-conductive material such as Teflon, and has a ball-shaped form that allows upper and lower shell walls 18a, 18b to be opened and closed in half. A lock is connected at the peripheral edge of the opening/closing joint so that it can be opened and closed, while a lock is provided on the opposite side of the rotating joint to prevent the shell walls 18a and 18b from opening during plating. A mechanism 19 is provided. Since the inner barrel 17 has a ball-like shape, when it is placed into the rotating barrel 6, it is conveniently agitated with the plating object 4, the stainless steel pole 14, and the ceramic balls 13 that are directly placed therein. Furthermore, the plating object 4a accommodated in the inner barrel 17 is also stirred inside. Note that the inner barrel 17 in this embodiment was formed so that it could be opened and closed in half, but the wall 18
Opening/closing joints may be formed in parts of a and 18b. The inner barrel 17 has a communication section formed by forming a hole communicating with the inside in a continuous section of the shell walls 18a and 18b in order to bring the different type of plating object 4a housed inside into sufficient contact with the plating solution 2. 16 are provided. This allows the plating solution to freely flow in and out, and a plating solution with a high ionic concentration is supplied to the interior of the inner barrel. The communicating portion 16 can also be provided by forming a slit-like or net-like opening in the shell walls 18a, 18b of the inner barrel 17 to communicate with the inside. Another type of plating object 4 accommodated inside the inner barrel 17
The electrode 15 that energizes a can be removed by being sandwiched between the upper and lower shell walls 18a, 18b at the periphery of the opening/closing joint of the upper and lower shell walls 18a, 18b that open and close in half of the inner barrel 17. It is set in. Therefore, depending on the different type of plating object 4a housed inside, this electrode 1
By changing the number of plating objects 5, it becomes possible to flow an optimum plating current to a different type of plating object 4a housed in the inner barrel 17. Therefore, by adjusting the electrode 15, it is possible to set different processing conditions for the plating object 4 directly charged into the rotating barrel 6 and the different type of plating object 4a accommodated in the inner barrel. , plating can be performed under optimal processing conditions according to each of the objects to be plated 4.4a. The scope of the present invention is not limited to the above-described embodiments. In this embodiment, the method according to the present invention was applied to a barrel plating apparatus equipped with a hexagonal prism-shaped rotating barrel. The method according to the present invention can also be applied to a barrel plating device equipped with a barrel. Further, the size and quantity of the ceramic balls 13 and stainless steel poles 14 in the embodiment can be changed as appropriate depending on the object to be plated. Further, although three electrodes are provided at the opening/closing joint of the inner barrel, the number can be increased or decreased as necessary. Further, in this embodiment, a single inner barrel 17 is inserted into the rotating barrel 6, but a plurality of inner barrels can also be inserted to process a plurality of different types of plating objects.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the outline of a barrel plating apparatus in which the present invention is used, FIG. 2 is a cross-sectional view of the rotating barrel in the direction perpendicular to the axis, and FIG. 3 is an external perspective view of the inner barrel of the present invention. . 2... Plating solution, 4... Plating object, 4a...
・Different type of plating object, 6... Rotating barrel, 15...
- Electrode, 16... Communication portion, 17... Inner barrel. Figure 1 Figure 3 ab

Claims (2)

[Claims] (1) In a barrel plating method in which the object to be plated is put into a rotating barrel that rotates in a plating solution, the object to be plated is directly put into the rotating barrel, and another type of object to be plated is also added. The plating solution was housed in an inner barrel made of a non-conductive material, provided with an electrode that conducts electricity, and provided with a communication part through which the plating solution could enter and exit the interior, and then placed into the rotating barrel, and directly placed into the rotating barrel. A barrel plating method, characterized in that the plating process is performed simultaneously on the plating target and the different type of plating target housed in the inner barrel. (2) An inner barrel for barrel plating that accommodates the object to be plated and can be put into a rotating barrel that rotates in a plating solution and can freely move in the rotating barrel, and is made of a non-conductive material and can be opened and closed. It has a ball-shaped form, and is provided with a removable electrode on the periphery of the opening/closing joint portion for energizing the plating object housed inside, and
An inner barrel for barrel plating, characterized by having a communication part through which a plating solution can enter and exit the interior.