JP2582991Y2 - Surface treatment electrode - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode arranged in a tank in electrochemical surface treatment such as electrolytic polishing, electrolytic plating, and electroless plating, and more particularly, to an electrode arranged in a swingable processing tank. And an electrode exhibiting an effect.

[0002]

2. Description of the Related Art In conventional barrel electroplating, for example, as disclosed in Japanese Patent Application Laid-Open No. 53-73433, one electrode is provided on the inner wall surface of an electrolytic cell and the other electrode is provided inside the electrolytic cell. And a contact inserted in a perforated barrel disposed in the tub. In addition, Japanese Patent Application Laid-Open No. 2-1531
Japanese Patent Publication No. 00 discloses that a shaft of a porous barrel provided in a plating solution of a tank is used as one electrode, and a mesh arranged around the inner periphery of the porous barrel is used as the other electrode.

[0003]

However, in the case of using a tank which is settled as described above, the plating solution has low fluidity and a corrosion film such as an oxide film is formed on the electrode surface. There is a problem that efficiency is reduced.

Therefore, the present applicant has previously proposed that the plating solution be largely rocked by rocking the plating bath to increase the plating efficiency. However, there is a problem that the conductivity is deteriorated due to the corrosion film on the electrode surface. was there.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, the present invention provides a surface treatment electrode that can reliably prevent the formation of a corrosive film on the surface of an electrode disposed in a swingable treatment tank and can ensure a long conduction. The purpose is to provide.

[0006]

An electrode for surface treatment according to the present invention is an electrode disposed in a swingable processing tank, wherein an electrode body is disposed at an axial portion in a cylinder having a current-carrying opening. The polishing medium is filled around the electrode body in the cylindrical body.

[0007]

According to the present invention, since the processing liquid in the tank flows through the current-carrying opening of the cylinder as the processing tank oscillates, it is possible to secure electrical conductivity even if the electrode body is arranged in the cylinder, and The polishing media filled in the cylinder moves due to the inertia and the flow of the processing liquid that act when the tank swings, and the surface of the electrode body is polished by the polishing media with the movement. It is removed, and the electrical conductivity can be ensured for a long time.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment in which the surface treatment electrode of the present invention is applied to a barrel plating apparatus will be described below with reference to FIGS.

In FIG. 2 showing the overall structure, reference numeral 1 denotes a plating tank, which is a rocking shaft 2 disposed on both sides of an intermediate portion in the vertical direction.
The frame 3 is swingably supported by the frame 3 via a and 2b. One swing shaft 2 a is configured to be swingably driven by a swing drive unit 4 provided on the frame 3. The plating tank 1 is composed of a polygonal container having an open upper surface, and the inner surface thereof is provided with an insulating and wear-resistant lining. Further, when the lining is degraded or worn, it is replaced or repaired. In order to easily carry out the above, an assembling tank configured by assembling both end plates and a plurality of side plates is used. An anode electrode 5 is provided so as to surround the entire circumference from the middle part to the upper part of the inner wall surface of the plating tank 1, and is connected to a power supply by an appropriate conducting means as appropriate. An electrode 6 for a cathode is disposed at the bottom of the plating tank 1, and a lead wire 7 extending from the electrode 6 is drawn out from the upper end opening of the plating tank 1 and connected to a power source.

A plating bath 1 contains a plating solution 8 and an object 9 to be plated. In addition, a conductive granular material obtained by applying a copper plating to the surface of a granular material made of carbon black, conductive plastic, or synthetic resin is accommodated as a medium as needed. The plating solution 8 is stored to a level at which at least a part of the electrode 5 is always immersed. Further, at least a part of the electrode 5 is always plated with the plating solution 8 while the plating bath 1 swings.
The object 9 to be plated and the electrode 6 are arranged so as not to touch directly.

Although not shown, a lid that can be opened and closed as necessary is provided at the upper opening of the plating tank 1 to prevent the plating solution 8 and the like from scattering to the outside during swinging. be able to.

In FIG. 1 showing the details of the electrode 6, reference numeral 11 denotes a cylindrical body made of an insulating synthetic resin, and a large number of conducting openings 12 are formed in the peripheral wall except for both ends. End members 13 made of insulating synthetic resin are provided at both ends of the cylindrical body 11.
Are inserted and fixed detachably by screws 14.
A conductive sleeve 15 made of copper is integrally provided on the shaft core of the end member 13. The end of the lead wire 7 is connected to the conductive sleeve 15 and sealed with a filler 16. A conductive sleeve 1 is provided on the inner end of the cylindrical member 11 of the end member 13.
5 is formed, and the end 18 a of the rod-shaped electrode body 18 is inserted and connected to the conductive sleeve 15. In the illustrated example, the rod-shaped electrode bodies 18 are divided into a plurality in the axial direction, and are connected to each other at fitting connection portions 18b. Then, the gap between the rod-shaped electrode body 18 and the cylindrical body 11 is filled with the polishing medium 19 so as to be freely movable.

Next, the plating operation using the above-described apparatus will be described. The plating solution 8 and the object 9 to be plated are accommodated in the plating tank 1, and while the voltage is applied to the electrodes 5 and 6, the swing drive unit 4 is operated to swing the plating tank 1, and Then, a plating process is performed.

During the plating process, the plating solution 8 and the object 9 to be plated flow greatly while being disturbed together with the swinging of the plating tank 1, so that the plating solution 8 flows in all directions with respect to the object 9 to be plated. I do. Further, since the plating solution 8 in the tank flows through the energizing opening 12 of the cylinder 11 as the plating tank 1 swings, sufficient electrical conductivity is ensured even if the rod-shaped electrode body 18 is arranged in the cylinder 11. Is done. Thus, the state of current supply to the plating object 9 becomes uneven, or the plating solution 8
The electrochemical reaction is carried out efficiently and uniformly without the non-uniformity of the concentration of, and a high-quality plating process is performed with good productivity.

In addition, the polishing medium 19 filled in the cylindrical body 11 constantly moves due to the inertia acting when the plating tank 1 swings and the flow of the plating solution 8, and the surface of the rod-shaped electrode body 18 is accordingly polished. Is polished by the use medium 19. Therefore, even if a corrosion film is formed on the surface of the rod-shaped electrode body 18, the corrosion film is immediately removed, so that a long conduction can be ensured. Further, when the rod-shaped electrode body 18 is worn,
The screw 14 is removed, the end member 13 is extracted, and the rod-shaped electrode body 1 is removed.
8 can be easily replaced by replacing it and assembling it in the reverse order.

In the above-described embodiment, the embodiment in the plating process is described. However, the present invention can be effectively applied to various surface treatment apparatuses in which a processing solution is accommodated in a swingable processing tank and an electrochemical reaction is performed.

[0017]

According to the electrode for surface treatment of the present invention, the processing liquid in the tank flows through the current-carrying opening of the cylinder with the swing of the processing tank, so that the electrode is energized even if the electrode is arranged in the cylinder. The polishing medium filled in the cylinder moves due to the inertia and the flow of the processing liquid acting when the processing tank swings, and the surface of the electrode body is polished by the polishing medium accordingly. Even if a corrosion film is formed, it is immediately removed,
Therefore, a long conduction can be ensured, and high plating efficiency can be maintained.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional front view of a surface treatment electrode according to an embodiment of the present invention.

FIG. 2 is a front view showing the overall configuration of the barrel plating apparatus of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plating tank (processing tank) 6 Electrode body 8 Plating liquid (processing liquid) 11 Cylindrical body 12 Power supply opening 18 Rod electrode body 19 Polishing media

Claims (1)

(57) [Scope of request for utility model registration] 1. An electrode disposed in a swingable processing tank, wherein an electrode body is disposed at an axial portion of a cylinder having a current-carrying opening, and a polishing medium is filled around the electrode body in the cylinder. An electrode for surface treatment, characterized in that: