JP2004240412A5 - - Google Patents
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- Publication number
- JP2004240412A5 JP2004240412A5 JP2004005073A JP2004005073A JP2004240412A5 JP 2004240412 A5 JP2004240412 A5 JP 2004240412A5 JP 2004005073 A JP2004005073 A JP 2004005073A JP 2004005073 A JP2004005073 A JP 2004005073A JP 2004240412 A5 JP2004240412 A5 JP 2004240412A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- substrate
- film
- plastic substrate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 82
- 239000004973 liquid crystal related substance Substances 0.000 claims 62
- 239000004065 semiconductor Substances 0.000 claims 57
- 229910044991 metal oxide Inorganic materials 0.000 claims 32
- 150000004706 metal oxides Chemical class 0.000 claims 32
- 229920005989 resin Polymers 0.000 claims 26
- 239000011347 resin Substances 0.000 claims 26
- 239000000853 adhesive Substances 0.000 claims 25
- 230000001070 adhesive effect Effects 0.000 claims 25
- 239000002184 metal Substances 0.000 claims 19
- 238000004519 manufacturing process Methods 0.000 claims 14
- 238000000034 method Methods 0.000 claims 14
- 238000010438 heat treatment Methods 0.000 claims 8
- 239000004988 Nematic liquid crystal Substances 0.000 claims 2
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 claims 2
- 239000004990 Smectic liquid crystal Substances 0.000 claims 2
- 210000002858 crystal cell Anatomy 0.000 claims 2
- 239000005262 ferroelectric liquid crystals (FLCs) Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000002952 polymeric resin Substances 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004005073A JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003007697 | 2003-01-15 | ||
| JP2003007568 | 2003-01-15 | ||
| JP2004005073A JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004240412A JP2004240412A (ja) | 2004-08-26 |
| JP2004240412A5 true JP2004240412A5 (enExample) | 2007-02-15 |
| JP4408044B2 JP4408044B2 (ja) | 2010-02-03 |
Family
ID=32966276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004005073A Expired - Fee Related JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4408044B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334630C (zh) * | 2004-08-31 | 2007-08-29 | 三洋电机株式会社 | 光学拾取装置 |
| KR20080002947A (ko) | 2005-04-27 | 2008-01-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 무선 칩 |
| US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| KR100953654B1 (ko) | 2008-06-26 | 2010-04-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP5287090B2 (ja) * | 2008-09-26 | 2013-09-11 | カシオ計算機株式会社 | 保護板一体型表示パネル |
| JP5710918B2 (ja) * | 2010-09-13 | 2015-04-30 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| JP5877992B2 (ja) | 2010-10-25 | 2016-03-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US8891051B2 (en) | 2010-10-25 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Backlight and display device |
| US8953120B2 (en) | 2011-01-07 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5580842B2 (ja) | 2012-02-29 | 2014-08-27 | 日東電工株式会社 | 光学表示パネルの製造方法および光学表示パネルの製造システム |
| KR20210076177A (ko) | 2013-07-16 | 2021-06-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전자 기기 |
| JP2022138284A (ja) * | 2021-03-10 | 2022-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 半導体チップおよびその製造方法、並びに電子機器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6216989U (enExample) * | 1985-07-17 | 1987-01-31 | ||
| JP2001144333A (ja) * | 1999-11-10 | 2001-05-25 | Sharp Corp | 発光装置とその製造方法 |
| JP3755573B2 (ja) * | 1999-12-06 | 2006-03-15 | セイコーエプソン株式会社 | バックライト内蔵型液晶表示装置及びその製造方法 |
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP3485107B2 (ja) * | 2000-06-13 | 2004-01-13 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び、電子機器 |
| JP2002042525A (ja) * | 2000-07-26 | 2002-02-08 | Toyoda Gosei Co Ltd | 面状光源 |
-
2004
- 2004-01-13 JP JP2004005073A patent/JP4408044B2/ja not_active Expired - Fee Related
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