JP4408044B2 - 液晶表示装置の作製方法 - Google Patents
液晶表示装置の作製方法 Download PDFInfo
- Publication number
- JP4408044B2 JP4408044B2 JP2004005073A JP2004005073A JP4408044B2 JP 4408044 B2 JP4408044 B2 JP 4408044B2 JP 2004005073 A JP2004005073 A JP 2004005073A JP 2004005073 A JP2004005073 A JP 2004005073A JP 4408044 B2 JP4408044 B2 JP 4408044B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid crystal
- film
- metal oxide
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 195
- 238000000034 method Methods 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims description 312
- 239000004065 semiconductor Substances 0.000 claims description 186
- 229910044991 metal oxide Inorganic materials 0.000 claims description 98
- 150000004706 metal oxides Chemical class 0.000 claims description 98
- 239000011347 resin Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 74
- 239000000853 adhesive Substances 0.000 claims description 67
- 230000001070 adhesive effect Effects 0.000 claims description 67
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 210000002858 crystal cell Anatomy 0.000 claims description 50
- 229920003023 plastic Polymers 0.000 claims description 41
- 239000004033 plastic Substances 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000004988 Nematic liquid crystal Substances 0.000 claims description 2
- 239000004990 Smectic liquid crystal Substances 0.000 claims description 2
- 239000005262 ferroelectric liquid crystals (FLCs) Substances 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 296
- 239000010409 thin film Substances 0.000 description 53
- 239000011241 protective layer Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 20
- 238000004544 sputter deposition Methods 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000002425 crystallisation Methods 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 238000005499 laser crystallization Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- -1 Polyethylene terephthalate Polymers 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000000565 sealant Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000013585 weight reducing agent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 4
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 229920002492 poly(sulfone) Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PAJKBYQWGBVBPE-UHFFFAOYSA-N ethene;terephthalic acid Chemical compound C=C.C=C.C=C.OC(=O)C1=CC=C(C(O)=O)C=C1 PAJKBYQWGBVBPE-UHFFFAOYSA-N 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Credit Cards Or The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004005073A JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003007697 | 2003-01-15 | ||
| JP2003007568 | 2003-01-15 | ||
| JP2004005073A JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004240412A JP2004240412A (ja) | 2004-08-26 |
| JP2004240412A5 JP2004240412A5 (enExample) | 2007-02-15 |
| JP4408044B2 true JP4408044B2 (ja) | 2010-02-03 |
Family
ID=32966276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004005073A Expired - Fee Related JP4408044B2 (ja) | 2003-01-15 | 2004-01-13 | 液晶表示装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4408044B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100334630C (zh) * | 2004-08-31 | 2007-08-29 | 三洋电机株式会社 | 光学拾取装置 |
| KR20080002947A (ko) | 2005-04-27 | 2008-01-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 무선 칩 |
| US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| KR100953654B1 (ko) | 2008-06-26 | 2010-04-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP5287090B2 (ja) * | 2008-09-26 | 2013-09-11 | カシオ計算機株式会社 | 保護板一体型表示パネル |
| JP5710918B2 (ja) * | 2010-09-13 | 2015-04-30 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| JP5877992B2 (ja) | 2010-10-25 | 2016-03-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US8891051B2 (en) | 2010-10-25 | 2014-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Backlight and display device |
| US8953120B2 (en) | 2011-01-07 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5580842B2 (ja) | 2012-02-29 | 2014-08-27 | 日東電工株式会社 | 光学表示パネルの製造方法および光学表示パネルの製造システム |
| KR20210076177A (ko) | 2013-07-16 | 2021-06-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전자 기기 |
| JP2022138284A (ja) * | 2021-03-10 | 2022-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 半導体チップおよびその製造方法、並びに電子機器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6216989U (enExample) * | 1985-07-17 | 1987-01-31 | ||
| JP2001144333A (ja) * | 1999-11-10 | 2001-05-25 | Sharp Corp | 発光装置とその製造方法 |
| JP3755573B2 (ja) * | 1999-12-06 | 2006-03-15 | セイコーエプソン株式会社 | バックライト内蔵型液晶表示装置及びその製造方法 |
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP3485107B2 (ja) * | 2000-06-13 | 2004-01-13 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び、電子機器 |
| JP2002042525A (ja) * | 2000-07-26 | 2002-02-08 | Toyoda Gosei Co Ltd | 面状光源 |
-
2004
- 2004-01-13 JP JP2004005073A patent/JP4408044B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004240412A (ja) | 2004-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101072411B1 (ko) | 액정표시장치 및 액정표시장치를 사용한 전자기기 | |
| US11196020B2 (en) | Semiconductor device and method for manufacturing the same | |
| TWI442575B (zh) | 半導體裝置及半導體裝置的製作方法 | |
| KR101013478B1 (ko) | Ｉｃ 카드 및 그 ｉｃ 카드를 사용한 기장(記帳) 시스템 | |
| JP5165080B2 (ja) | Ｉｃカード及びｉｃカードの作製方法 | |
| JP4015003B2 (ja) | 半導体装置の作製方法 | |
| JP2004153021A6 (ja) | 半導体装置の作製方法 | |
| JP4408044B2 (ja) | 液晶表示装置の作製方法 | |
| JP4912835B2 (ja) | 半導体装置の作製方法 | |
| JP2005100380A (ja) | Ｉｃカード |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061222 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061222 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090714 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090825 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090902 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091104 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091105 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121120 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131120 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |