JP2004235652A - 発光ダイオード坦体 - Google Patents
発光ダイオード坦体 Download PDFInfo
- Publication number
- JP2004235652A JP2004235652A JP2004025716A JP2004025716A JP2004235652A JP 2004235652 A JP2004235652 A JP 2004235652A JP 2004025716 A JP2004025716 A JP 2004025716A JP 2004025716 A JP2004025716 A JP 2004025716A JP 2004235652 A JP2004235652 A JP 2004235652A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- diode carrier
- carrier
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】発光ダイオード坦体の裏面上に多数の発光ダイオードが取り付けられている。作動中、発光ダイオードは、発光ダイオード坦体の孔を通って放射する。発光ダイオード坦体の前面上には、箔板が設けられており、この箔板により、発光ダイオードから放射されたビームが透過し、発光ダイオード坦体を周囲環境から保護する。
【選択図】図2
Description
2 孔
3 裏面
4 前面
5 側壁
9 発光ダイオード
Claims (9)
- 多数の発光ダイオード(9)を有する発光ダイオード坦体において、
発光ダイオード坦体(1)は、多数の孔(2)を有しており、前記発光ダイオード坦体(1)の裏面(3)上には、多数の発光ダイオード(9)が設けられており、当該発光ダイオード(9)を設ける際に、当該発光ダイオード(9)は、前記孔(2)内に突入されていて、前記発光ダイオード(9)は、前記発光ダイオード坦体(1)を前記孔を通して前記発光ダイオード坦体の前面(4)の方に放射することができるように構成されていることを特徴とする発光ダイオード坦体。 - 孔の側壁(5)は、反射表面を有している請求項1記載の発光ダイオード坦体。
- 孔(2)は、発光ダイオード坦体(1)の前面(4)に向かって拡張されている請求項1又は2記載の発光ダイオード坦体。
- 孔(2)は、発光ダイオード坦体(1)の前面(4)に向かって拡張されている請求項1又は2記載の発光ダイオード坦体。
- 発光ダイオード坦体(1)の前面(4)に、前記発光ダイオードから放射されたビームに対して透過性の箔板(10)が設けられている請求項1から4迄の何れか1記載の発光ダイオード坦体。
- 各々孔の上側にレンズアレイ(11)のレンズ(12)が設けられているように、当該レンズアレイ(11)が発光ダイオード坦体(1)の前面(4)に設けられている請求項1から5迄の何れか1記載の発光ダイオード坦体。
- レンズアレイ(11)は、所望の放射特性に応じて交換可能に設けられている請求項6記載の発光ダイオード坦体。
- 発光ダイオード坦体(1)は、前面(4)がビームを吸収するように構成されている請求項1から7迄の何れか1記載の発光ダイオード坦体。
- 発光ダイオード坦体(1)は、前面(4)が黒色に着色されているか、又は、所望のコントラストを調整するために別の色で着色されている請求項1から8迄の何れか1記載の発光ダイオード坦体。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003103969 DE10303969B4 (de) | 2003-01-31 | 2003-01-31 | Leuchtdiodenanordnung mit einem Leuchtdiodenträger und einer Mehrzahl von Leuchtdioden |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004235652A true JP2004235652A (ja) | 2004-08-19 |
Family
ID=32730670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004025716A Pending JP2004235652A (ja) | 2003-01-31 | 2004-02-02 | 発光ダイオード坦体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7360923B2 (ja) |
JP (1) | JP2004235652A (ja) |
DE (1) | DE10303969B4 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010181721A (ja) * | 2009-02-06 | 2010-08-19 | Seiwa Electric Mfg Co Ltd | Led発光表示装置 |
WO2011024861A1 (ja) * | 2009-08-25 | 2011-03-03 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2011048958A (ja) * | 2009-08-25 | 2011-03-10 | Toshiba Lighting & Technology Corp | 発光装置 |
CN103574419A (zh) * | 2013-10-25 | 2014-02-12 | 邓放明 | 免焊线镶嵌式整体led灯 |
JP2015019099A (ja) * | 2007-09-27 | 2015-01-29 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 可変の放射特性を有する光源 |
JP2019040996A (ja) * | 2017-08-25 | 2019-03-14 | エーディーワイ株式会社 | 紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法 |
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DE10318026C5 (de) * | 2003-04-19 | 2015-11-12 | Leica Biosystems Nussloch Gmbh | Kryostat mit Beleuchtungseinrichtung |
ES2265780B1 (es) * | 2005-08-04 | 2007-11-16 | Odeco Electronica, S.A. | Valla publicitaria electronica para pie de campo. |
US20070041187A1 (en) * | 2005-08-16 | 2007-02-22 | Cheng T T | Preset welding spot structure of a backlight module |
US20090279295A1 (en) * | 2006-07-11 | 2009-11-12 | Koninklijke Philips Electronics N.V. | Transparent body comprising at least one embedded led |
DE102007003809B4 (de) * | 2006-09-27 | 2012-03-08 | Osram Ag | Verfahren zum Herstellen einer Leuchtdiodenanordnung und Leuchtdiodenanordnung mit einer Mehrzahl von kettenförmig angeordneten LED-Modulen |
US9341328B2 (en) | 2006-09-27 | 2016-05-17 | Osram Gesellschaft Mit Beschrankter Haftung | Method of producing a light emitting diode arrangement and light emitting diode arrangement |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US7952262B2 (en) | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
FR2907958B1 (fr) * | 2006-10-25 | 2009-02-13 | Securite Et Signalisation Ses | Equipement comprenant un afficheur comportant un film transparent fixe sur une plaque rigide perforee, et procede de fabrication dudit equipement. |
GB2446185A (en) * | 2006-10-30 | 2008-08-06 | Sensl Technologies Ltd | Optical assembly and method of assembly |
US7510400B2 (en) * | 2007-03-14 | 2009-03-31 | Visteon Global Technologies, Inc. | LED interconnect spring clip assembly |
US7621752B2 (en) * | 2007-07-17 | 2009-11-24 | Visteon Global Technologies, Inc. | LED interconnection integrated connector holder package |
TWI356486B (en) * | 2007-09-07 | 2012-01-11 | Young Lighting Technology | Led light source module and manufacturing method t |
US7896522B2 (en) * | 2008-02-20 | 2011-03-01 | Formetco, Inc. | Frontal illumination of a surface using LED lighting |
US20090207617A1 (en) * | 2008-02-20 | 2009-08-20 | Merchant Viren B | Light emitting diode (led) connector clip |
CN101566304A (zh) * | 2008-04-23 | 2009-10-28 | 富准精密工业(深圳)有限公司 | 发光二极管照明装置及制造方法 |
US8083372B2 (en) | 2008-04-25 | 2011-12-27 | Epson Imaging Devices Corporation | Illumination system, electro-optic device, and electronic apparatus |
US8378358B2 (en) * | 2009-02-18 | 2013-02-19 | Everlight Electronics Co., Ltd. | Light emitting device |
US8772802B2 (en) * | 2009-02-18 | 2014-07-08 | Everlight Electronics Co., Ltd. | Light emitting device with transparent plate |
US8405105B2 (en) * | 2009-02-18 | 2013-03-26 | Everlight Electronics Co., Ltd. | Light emitting device |
DE102009013811A1 (de) * | 2009-03-18 | 2010-09-23 | Bartenbach, Christian, Ing. | LED-Spiegelkaskade |
US8241044B2 (en) * | 2009-12-09 | 2012-08-14 | Tyco Electronics Corporation | LED socket assembly |
US8845130B2 (en) * | 2009-12-09 | 2014-09-30 | Tyco Electronics Corporation | LED socket assembly |
US8878454B2 (en) | 2009-12-09 | 2014-11-04 | Tyco Electronics Corporation | Solid state lighting system |
US8210715B2 (en) * | 2009-12-09 | 2012-07-03 | Tyco Electronics Corporation | Socket assembly with a thermal management structure |
US8235549B2 (en) * | 2009-12-09 | 2012-08-07 | Tyco Electronics Corporation | Solid state lighting assembly |
AT509676B1 (de) * | 2010-04-08 | 2012-08-15 | Ernst Mag Helldorff | Leuchtkörper mit mindestens einem led-chip |
US8651689B2 (en) * | 2010-09-20 | 2014-02-18 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Light emitting diode light bar structure having heat dissipation function |
US9429309B2 (en) | 2011-09-26 | 2016-08-30 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9249955B2 (en) | 2011-09-26 | 2016-02-02 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9423119B2 (en) | 2011-09-26 | 2016-08-23 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US8568001B2 (en) | 2012-02-03 | 2013-10-29 | Tyco Electronics Corporation | LED socket assembly |
CN104221484B (zh) * | 2012-04-19 | 2017-07-14 | 飞利浦灯具控股公司 | Led网格装置以及led网格装置的制造方法 |
US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
US10527273B2 (en) | 2013-03-15 | 2020-01-07 | Ideal Industries Lighting, LLC | Lighting fixture with branching heat sink and thermal path separation |
US10436432B2 (en) | 2013-03-15 | 2019-10-08 | Cree, Inc. | Aluminum high bay light fixture having plurality of housings dissipating heat from light emitting elements |
US10788177B2 (en) * | 2013-03-15 | 2020-09-29 | Ideal Industries Lighting Llc | Lighting fixture with reflector and template PCB |
US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
USD733669S1 (en) * | 2014-03-28 | 2015-07-07 | General Led, Inc. | LED module |
USD774006S1 (en) * | 2014-08-27 | 2016-12-13 | Mitsubishi Electric Corporation | Light source module |
USD774686S1 (en) * | 2015-02-27 | 2016-12-20 | Star Headlight & Lantern Co., Inc. | Optical lens for projecting light from LED light emitters |
DE102015114842A1 (de) * | 2015-09-04 | 2017-03-09 | Lupyled Gmbh | Folienartige Beleuchtungseinrichtung |
DE102016103370A1 (de) * | 2016-02-25 | 2017-08-31 | Trilux Gmbh & Co. Kg | Invertierte LED-Leiterkarte |
USD805070S1 (en) * | 2016-03-11 | 2017-12-12 | Roe Visual Co., Ltd. | LED display |
DE102016206238A1 (de) * | 2016-04-14 | 2017-10-19 | Osram Gmbh | Beleuchtungseinrichtung |
Citations (5)
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JPS5872857U (ja) * | 1981-11-09 | 1983-05-17 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
JPH04107287U (ja) * | 1991-02-22 | 1992-09-16 | タキロン株式会社 | ドツトマトリクス発光表示体 |
JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
WO2002017405A1 (de) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement und verfahren zu dessen herstellung, modul und vorrichtung mit einem solchen modul |
JP2002304903A (ja) * | 2001-04-04 | 2002-10-18 | Matsushita Electric Works Ltd | 照明器具 |
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-
2003
- 2003-01-31 DE DE2003103969 patent/DE10303969B4/de not_active Expired - Lifetime
-
2004
- 2004-02-02 JP JP2004025716A patent/JP2004235652A/ja active Pending
- 2004-02-02 US US10/770,977 patent/US7360923B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5872857U (ja) * | 1981-11-09 | 1983-05-17 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
JPH04107287U (ja) * | 1991-02-22 | 1992-09-16 | タキロン株式会社 | ドツトマトリクス発光表示体 |
JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
WO2002017405A1 (de) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement und verfahren zu dessen herstellung, modul und vorrichtung mit einem solchen modul |
JP2002304903A (ja) * | 2001-04-04 | 2002-10-18 | Matsushita Electric Works Ltd | 照明器具 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015019099A (ja) * | 2007-09-27 | 2015-01-29 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 可変の放射特性を有する光源 |
JP2010181721A (ja) * | 2009-02-06 | 2010-08-19 | Seiwa Electric Mfg Co Ltd | Led発光表示装置 |
WO2011024861A1 (ja) * | 2009-08-25 | 2011-03-03 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2011048958A (ja) * | 2009-08-25 | 2011-03-10 | Toshiba Lighting & Technology Corp | 発光装置 |
US8963190B2 (en) | 2009-08-25 | 2015-02-24 | Toshiba Lighting & Technology Corporation | Light-emitting device and lighting apparatus |
CN103574419A (zh) * | 2013-10-25 | 2014-02-12 | 邓放明 | 免焊线镶嵌式整体led灯 |
JP2019040996A (ja) * | 2017-08-25 | 2019-03-14 | エーディーワイ株式会社 | 紫外線光素子、紫外線光素子用パッケージ及び紫外線光素子に用いられる光学部材並びにその光学部材の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20040175189A1 (en) | 2004-09-09 |
DE10303969B4 (de) | 2008-11-27 |
DE10303969A1 (de) | 2004-08-19 |
US7360923B2 (en) | 2008-04-22 |
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