JP2004186686A - 光電検出装置及びその製造方法 - Google Patents
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- 238000001514 detection method Methods 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 12
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
【解決手段】 絶縁基板(1)上に検出要素のマトリックスを備えた光電検出装置であって、検出器のそれぞれは、下部電極(2)と感光性材料層(3)と光透過性上部電極(4)とからなる積層体を備え、上部電極は、全ての検出要素に共通であり、下部電極(2)のそれぞれは、センス回路に対して互いに独立して接続されている。本発明によれば、下部電極(2)は、それぞれが絶縁基板(1)よりも高い個別化された絶縁区域(6)上に位置している。その上、上部電極(4)は、平らではなく、かつその上さらに、下部電極の高さよりも下の高さに到達するまで、2つの隣接する区域(6)の間に挿入されている。
【選択図】 図2
Description
2 下部電極
3 感光性材料層
4 光透過性上部電極
5 内部検出器領域
6 絶縁区域(電気的絶縁材料層)
8 電気的導電性材料
9 金属被覆層
Claims (10)
- 絶縁基板(1)上に検出要素のマトリックスを備えた光電検出装置であって、前記検出要素のそれぞれは、下部電極(2)と感光性材料層(3)と光透過性上部電極(4)とからなる積層体を備え、前記上部電極は、全ての前記検出要素に共通であり、前記下部電極(2)のそれぞれは、センス回路に対して互いに独立して接続されている、光電検出装置において、
前記下部電極(2)は、それぞれが前記絶縁基板(1)よりも高い個別化された絶縁区域(6)上に位置しており;
前記上部電極(4)は、平らではなく、かつその上さらに、前記下部電極の高さよりも下の高さに到達するまで、2つの隣接する区域(6)の間に挿入されている;
ことを特徴とする光電検出装置。 - 請求項1記載の光電検出装置において、
前記絶縁基板(1)は、信号処理回路上に堆積された絶縁材料層からなることを特徴とする光電検出装置。 - 請求項1又は2記載の光電検出装置において、
前記区域(6)はそれぞれ、前記絶縁基板(1)上に堆積された個別化された追加絶縁層からなることを特徴とする光電検出装置。 - 請求項1又は2記載の光電検出装置において、
前記区域(6)は、前記絶縁基板(1)の構成部分を形成することを特徴とする光電検出装置。 - 請求項1から4のいずれか一項に記載の光電検出装置において、
前記区域(6)は突出形状を有し、その結果2つの隣接するピクセルの感光性材料層(3)が、厳密に異極性を有して前記ピクセルの端縁部で実質的に垂直に互いに向かい合うことを特徴とする光電検出装置。 - 請求項1から5のいずれか一項に記載の光電検出装置において、
前記光電検出装置は、PINダイオード、NIPダイオード、PIダイオード、NIダイオード、IPダイオード、又はINダイオードから構成されていることを特徴とする光電検出装置。 - 請求項1から5のいずれか一項に記載の光電検出装置において、
前記感光性材料層(3)は、シリコンをベースにしていることを特徴とする光電検出装置。 - 請求項1から5のいずれか一項に記載の光電検出装置において、
前記感光性材料層(3)は、水素、ゲルマニウム、又は炭素と混ぜられたシリコンをベースにしていることを特徴とする光電検出装置。 - 絶縁基板(1)上に堆積され、センス回路に結び付けられた検出要素のマトリックスからなる検出回路の製造方法であって、
前記検出要素のそれぞれに対して、前記絶縁基板を通過する導体によって前記センス回路へ接続された金属被覆層(9)を形成する段階と;
前記金属被覆層(9)を囲むように、前記絶縁基板上に区域を形成する電気的絶縁材料層(6)を堆積する段階と;
前記金属被覆層(9)に到達するまで前記層(6)にホールを形成し、このようにして形成された前記ホールを電気的導電性材料(8)で充填することで該電気的導電性材料が前記金属被覆層(9)と電気的に接触するようになる段階と;
前記絶縁材料層(6)の上部表面上に、下部電極となるように前記電気的導電性材料(8)と電気的に接触する電極(2)を堆積する段階と;
前記絶縁材料層及び前記下部電極からなる複数の基本組立体のそれぞれの形状に実質的に従って、このようにして形成された全てのマトリックス上に感光性材料層(3)を堆積する段階と;
同様にまた前記絶縁材料層(6)の形状に従って、このようにして形成された積層体上に単一の光透過性上部電極(4)を堆積し、その結果このようにして形成された内部検出器領域(5)で前記光透過性上部電極が前記下部電極の高さよりも下の高さに下がる段階と;
からなることを特徴とする検出回路の製造方法。 - 絶縁基板(1)上に堆積され、センス回路に結び付けられた検出要素のマトリックスからなる検出回路の製造方法であって、
導電性金属層を堆積し、導体によって前記導電性金属層を前記センス回路へ接続する段階と;
リソグラフィーを実施して前記金属層をエッチングし、個別化された下部電極を形成する段階と;
前記絶縁基板内に深いエッチングを実施する段階と;
前記絶縁基板がエッチングされた箇所を含めて感光性層を堆積し、その結果前記感光性層がこのようにして形成された特定のプロファイルに従う段階と;
前記絶縁基板がエッチングされた箇所を含めて単一の光透過性上部電極を堆積し、その結果前記上部電極が前記下部電極の高さよりも下の高さまで下がるように、前記上部電極が内部ピクセル空間に挿入される段階と;
からなることを特徴とする検出回路の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0215023A FR2848027B1 (fr) | 2002-11-29 | 2002-11-29 | Dispositif de detection photo-electrique et procede pour sa realisation |
Publications (2)
Publication Number | Publication Date |
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JP2004186686A true JP2004186686A (ja) | 2004-07-02 |
JP4629328B2 JP4629328B2 (ja) | 2011-02-09 |
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JP2003396263A Expired - Fee Related JP4629328B2 (ja) | 2002-11-29 | 2003-11-26 | 光電検出装置及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7049673B2 (ja) |
EP (1) | EP1434270B1 (ja) |
JP (1) | JP4629328B2 (ja) |
AT (1) | ATE336078T1 (ja) |
DE (1) | DE60307408T2 (ja) |
FR (1) | FR2848027B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100920542B1 (ko) * | 2007-12-24 | 2009-10-08 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
Families Citing this family (9)
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KR100837556B1 (ko) * | 2007-03-19 | 2008-06-12 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 그의 제조방법 |
US20100044676A1 (en) | 2008-04-18 | 2010-02-25 | Invisage Technologies, Inc. | Photodetectors and Photovoltaics Based on Semiconductor Nanocrystals |
US8525287B2 (en) | 2007-04-18 | 2013-09-03 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
CN102017147B (zh) | 2007-04-18 | 2014-01-29 | 因维萨热技术公司 | 用于光电装置的材料、系统和方法 |
KR100877293B1 (ko) * | 2007-08-31 | 2009-01-07 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
US8203195B2 (en) | 2008-04-18 | 2012-06-19 | Invisage Technologies, Inc. | Materials, fabrication equipment, and methods for stable, sensitive photodetectors and image sensors made therefrom |
FR2944140B1 (fr) | 2009-04-02 | 2011-09-16 | Commissariat Energie Atomique | Dispositif de detection d'image electronique |
US8916947B2 (en) | 2010-06-08 | 2014-12-23 | Invisage Technologies, Inc. | Photodetector comprising a pinned photodiode that is formed by an optically sensitive layer and a silicon diode |
CN113188655A (zh) * | 2021-04-09 | 2021-07-30 | 广州市艾佛光通科技有限公司 | 基于体声波的光传感器及其制备方法 |
Citations (1)
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JPH0883895A (ja) * | 1994-09-14 | 1996-03-26 | Toshiba Corp | 固体撮像素子 |
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EP0517208A1 (en) * | 1991-06-05 | 1992-12-09 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US6448579B1 (en) * | 2000-12-06 | 2002-09-10 | L.G.Philips Lcd Co., Ltd. | Thin film transistor array substrate for liquid crystal display and a method for fabricating the same |
US6396118B1 (en) * | 2000-02-03 | 2002-05-28 | Agilent Technologies, Inc. | Conductive mesh bias connection for an array of elevated active pixel sensors |
US20040113220A1 (en) * | 2000-12-21 | 2004-06-17 | Peter Rieve | Optoelectronic component for conversion electromagnetic radiation into an intensity-dependent photocurrent |
US6759262B2 (en) * | 2001-12-18 | 2004-07-06 | Agilent Technologies, Inc. | Image sensor with pixel isolation system and manufacturing method therefor |
US6798033B2 (en) * | 2002-08-27 | 2004-09-28 | E-Phocus, Inc. | Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
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2002
- 2002-11-29 FR FR0215023A patent/FR2848027B1/fr not_active Expired - Fee Related
-
2003
- 2003-11-14 AT AT03104193T patent/ATE336078T1/de not_active IP Right Cessation
- 2003-11-14 EP EP03104193A patent/EP1434270B1/fr not_active Expired - Lifetime
- 2003-11-14 DE DE60307408T patent/DE60307408T2/de not_active Expired - Lifetime
- 2003-11-20 US US10/718,150 patent/US7049673B2/en not_active Expired - Fee Related
- 2003-11-26 JP JP2003396263A patent/JP4629328B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0883895A (ja) * | 1994-09-14 | 1996-03-26 | Toshiba Corp | 固体撮像素子 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100920542B1 (ko) * | 2007-12-24 | 2009-10-08 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조방법 |
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Publication number | Publication date |
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JP4629328B2 (ja) | 2011-02-09 |
ATE336078T1 (de) | 2006-09-15 |
FR2848027A1 (fr) | 2004-06-04 |
EP1434270B1 (fr) | 2006-08-09 |
US7049673B2 (en) | 2006-05-23 |
FR2848027B1 (fr) | 2006-02-10 |
DE60307408T2 (de) | 2006-12-07 |
US20040108517A1 (en) | 2004-06-10 |
DE60307408D1 (de) | 2006-09-21 |
EP1434270A1 (fr) | 2004-06-30 |
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