JP2004142040A5 - - Google Patents
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- JP2004142040A5 JP2004142040A5 JP2002310467A JP2002310467A JP2004142040A5 JP 2004142040 A5 JP2004142040 A5 JP 2004142040A5 JP 2002310467 A JP2002310467 A JP 2002310467A JP 2002310467 A JP2002310467 A JP 2002310467A JP 2004142040 A5 JP2004142040 A5 JP 2004142040A5
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Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002310467A JP4163485B2 (ja) | 2002-10-25 | 2002-10-25 | 両面研磨装置およびこれを用いた研磨加工方法 |
| TW092129198A TWI301092B (en) | 2002-10-25 | 2003-10-21 | Abrasive machine and method of abrading work piece |
| KR1020030073660A KR101051214B1 (ko) | 2002-10-25 | 2003-10-22 | 연마기와 워크피스 연마 방법 |
| MYPI20034051A MY134629A (en) | 2002-10-25 | 2003-10-23 | Abrasive machine and method of abrading work piece |
| DE60306295T DE60306295T2 (de) | 2002-10-25 | 2003-10-23 | Schleifmaschine und Verfahren zum Schleifen von Werkstücken |
| EP03256713A EP1413396B1 (en) | 2002-10-25 | 2003-10-23 | Abrasive machine and method of abrading work piece |
| US10/691,898 US6939204B2 (en) | 2002-10-25 | 2003-10-23 | Abrasive machine and method of abrading work piece |
| CNB2003101029174A CN100400235C (zh) | 2002-10-25 | 2003-10-24 | 研磨机和研磨工件的方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002310467A JP4163485B2 (ja) | 2002-10-25 | 2002-10-25 | 両面研磨装置およびこれを用いた研磨加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004142040A JP2004142040A (ja) | 2004-05-20 |
| JP2004142040A5 true JP2004142040A5 (ja) | 2005-12-08 |
| JP4163485B2 JP4163485B2 (ja) | 2008-10-08 |
Family
ID=32064371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002310467A Expired - Fee Related JP4163485B2 (ja) | 2002-10-25 | 2002-10-25 | 両面研磨装置およびこれを用いた研磨加工方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6939204B2 (ja) |
| EP (1) | EP1413396B1 (ja) |
| JP (1) | JP4163485B2 (ja) |
| KR (1) | KR101051214B1 (ja) |
| CN (1) | CN100400235C (ja) |
| DE (1) | DE60306295T2 (ja) |
| MY (1) | MY134629A (ja) |
| TW (1) | TWI301092B (ja) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007021680A (ja) | 2005-07-19 | 2007-02-01 | Shin Etsu Handotai Co Ltd | ウエーハの両面研磨方法 |
| JP4744250B2 (ja) * | 2005-09-14 | 2011-08-10 | 株式会社岡本工作機械製作所 | 角形状基板の両面研磨装置および両面研磨方法 |
| EP2087965B1 (de) * | 2008-01-16 | 2011-04-27 | WENDT GmbH | Planschleifmaschine |
| JP5408788B2 (ja) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | フロートガラス研磨システム |
| JP5392483B2 (ja) * | 2009-08-31 | 2014-01-22 | 不二越機械工業株式会社 | 研磨装置 |
| DE102009052070A1 (de) * | 2009-11-05 | 2011-05-12 | Peter Wolters Gmbh | Vorrichtung und Verfahren zur Doppelseitenbearbeitung flacher Werkstücke |
| JP5671735B2 (ja) * | 2011-01-18 | 2015-02-18 | 不二越機械工業株式会社 | 両面研磨装置 |
| JP5697207B2 (ja) * | 2011-04-19 | 2015-04-08 | 浜井産業株式会社 | 両面研磨装置および研磨方法 |
| DE102011082777A1 (de) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
| CN103465182A (zh) * | 2013-09-03 | 2013-12-25 | 宇环数控机床股份有限公司 | 一种带分液装置的抛光轮 |
| JP5688820B2 (ja) * | 2013-10-23 | 2015-03-25 | Hoya株式会社 | 研磨装置 |
| JP6197598B2 (ja) * | 2013-11-18 | 2017-09-20 | 株式会社Sumco | ワークの両面研磨装置及び両面研磨方法 |
| JP6255991B2 (ja) * | 2013-12-26 | 2018-01-10 | 株式会社Sumco | ワークの両面研磨装置 |
| CN103878697B (zh) * | 2014-03-06 | 2016-05-18 | 浙江工业大学 | 一种多级研抛盘的磨料导流机构 |
| US10843305B2 (en) | 2014-03-17 | 2020-11-24 | Seagate Technology Llc | Lapping device or carrier with adaptive bending control |
| CN103978410B (zh) * | 2014-04-17 | 2016-06-29 | 宁波鱼化龙机电科技有限公司 | 一种陶瓷插芯毛刷研磨机 |
| CN104128888A (zh) * | 2014-07-25 | 2014-11-05 | 浙江博海金属制品科技有限公司 | 一种平面抛光机 |
| KR101924279B1 (ko) * | 2017-02-16 | 2018-11-30 | 에스케이실트론 주식회사 | 웨이퍼의 양면 연마장치 |
| CN107097120B (zh) * | 2017-05-27 | 2018-11-13 | 上海理工大学 | 多通道磁流变液供给装置 |
| CN107738178A (zh) * | 2017-09-28 | 2018-02-27 | 阜宁浔朋新材料科技有限公司 | 一种单晶硅切片生产用研磨装置 |
| CN107695858A (zh) * | 2017-09-28 | 2018-02-16 | 阜宁浔朋新材料科技有限公司 | 一种单晶硅切片生产用抛光装置 |
| US10792786B2 (en) | 2018-02-12 | 2020-10-06 | Seagate Technology Llc | Lapping carrier system with optimized carrier insert |
| JP2019136837A (ja) * | 2018-02-14 | 2019-08-22 | 信越半導体株式会社 | 両面研磨方法 |
| KR102037746B1 (ko) * | 2018-02-27 | 2019-10-29 | 에스케이실트론 주식회사 | 웨이퍼 양면 연마 장치 |
| JP7032217B2 (ja) * | 2018-04-05 | 2022-03-08 | 株式会社ディスコ | 研磨装置 |
| CN112930248B (zh) * | 2019-04-01 | 2023-05-02 | 株式会社村田制作所 | 研磨剂供给装置、研磨装置以及研磨剂供给方法 |
| JP7464088B2 (ja) | 2022-08-31 | 2024-04-09 | 株式会社Sumco | 半導体ウェーハの両面研磨方法、研磨ウェーハの製造方法、及び半導体ウェーハの両面研磨装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58171255A (ja) * | 1982-03-29 | 1983-10-07 | Toshiba Corp | 両面鏡面研摩装置 |
| JPS58171825A (ja) | 1982-04-01 | 1983-10-08 | Toshiba Mach Co Ltd | 両面ポリシング装置 |
| JPH0655436A (ja) | 1992-08-06 | 1994-03-01 | Speedfam Co Ltd | ワークの付着を防止した平面研磨方法及び装置 |
| JPH0966448A (ja) | 1995-08-31 | 1997-03-11 | Showa Alum Corp | 研磨装置 |
| JP3850924B2 (ja) * | 1996-02-15 | 2006-11-29 | 財団法人国際科学振興財団 | 化学機械研磨装置及び化学機械研磨方法 |
| JPH11179649A (ja) * | 1997-12-16 | 1999-07-06 | Speedfam Co Ltd | ワークの取出方法及びワーク取出機構付き平面研磨装置 |
| JP3891675B2 (ja) | 1998-02-13 | 2007-03-14 | 昭和電工株式会社 | ワークの研磨装置及び研磨方法 |
| JPH11262862A (ja) * | 1998-03-17 | 1999-09-28 | Speedfam Co Ltd | 両面研磨装置及びスラリー供給方法 |
| DE69937181T2 (de) * | 1998-04-28 | 2008-06-19 | Ebara Corp. | Polierschleifscheibe und substrat polierverfahren mit hilfe dieser schleifscheibe |
| JP2001138216A (ja) * | 1999-11-16 | 2001-05-22 | Speedfam Co Ltd | 研磨装置 |
| US6447379B1 (en) * | 2000-03-31 | 2002-09-10 | Speedfam-Ipec Corporation | Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor |
| US6722949B2 (en) * | 2001-03-20 | 2004-04-20 | Taiwan Semiconductors Manufacturing Co., Ltd | Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using |
| US6652366B2 (en) * | 2001-05-16 | 2003-11-25 | Speedfam-Ipec Corporation | Dynamic slurry distribution control for CMP |
| US6641462B2 (en) * | 2001-06-27 | 2003-11-04 | Speedfam-Ipec Corporation | Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing |
| US6706140B2 (en) * | 2001-09-07 | 2004-03-16 | United Microelectronics Corp. | Control system for in-situ feeding back a polish profile |
-
2002
- 2002-10-25 JP JP2002310467A patent/JP4163485B2/ja not_active Expired - Fee Related
-
2003
- 2003-10-21 TW TW092129198A patent/TWI301092B/zh not_active IP Right Cessation
- 2003-10-22 KR KR1020030073660A patent/KR101051214B1/ko not_active IP Right Cessation
- 2003-10-23 EP EP03256713A patent/EP1413396B1/en not_active Expired - Fee Related
- 2003-10-23 DE DE60306295T patent/DE60306295T2/de not_active Expired - Lifetime
- 2003-10-23 US US10/691,898 patent/US6939204B2/en not_active Expired - Fee Related
- 2003-10-23 MY MYPI20034051A patent/MY134629A/en unknown
- 2003-10-24 CN CNB2003101029174A patent/CN100400235C/zh not_active Expired - Fee Related