JP2004131623A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP2004131623A
JP2004131623A JP2002298465A JP2002298465A JP2004131623A JP 2004131623 A JP2004131623 A JP 2004131623A JP 2002298465 A JP2002298465 A JP 2002298465A JP 2002298465 A JP2002298465 A JP 2002298465A JP 2004131623 A JP2004131623 A JP 2004131623A
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JP
Japan
Prior art keywords
anhydride
resin composition
vinyl
alkyl
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002298465A
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English (en)
Japanese (ja)
Other versions
JP2004131623A5 (cg-RX-API-DMAC7.html
Inventor
Shunichi Murayama
村山　俊一
Harufumi Hagino
萩野　治文
Satoshi Moriyama
森山　聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KH Neochem Co Ltd
Original Assignee
Kyowa Yuka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyowa Yuka Co Ltd filed Critical Kyowa Yuka Co Ltd
Priority to JP2002298465A priority Critical patent/JP2004131623A/ja
Publication of JP2004131623A publication Critical patent/JP2004131623A/ja
Publication of JP2004131623A5 publication Critical patent/JP2004131623A5/ja
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2002298465A 2002-10-11 2002-10-11 樹脂組成物 Pending JP2004131623A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002298465A JP2004131623A (ja) 2002-10-11 2002-10-11 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002298465A JP2004131623A (ja) 2002-10-11 2002-10-11 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2004131623A true JP2004131623A (ja) 2004-04-30
JP2004131623A5 JP2004131623A5 (cg-RX-API-DMAC7.html) 2005-07-28

Family

ID=32287875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002298465A Pending JP2004131623A (ja) 2002-10-11 2002-10-11 樹脂組成物

Country Status (1)

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JP (1) JP2004131623A (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206827A (ja) * 2005-01-31 2006-08-10 Matsushita Electric Works Ltd 液状封止用エポキシ樹脂組成物及び半導体装置
JP2007161878A (ja) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd ポリカルボン酸樹脂、感光性樹脂組成物及びその硬化物
WO2014038446A1 (ja) * 2012-09-07 2014-03-13 株式会社ダイセル 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置
JP2014095051A (ja) * 2012-11-12 2014-05-22 Shin Etsu Chem Co Ltd 熱硬化性エポキシ樹脂組成物、該組成物を用いたｌｅｄ用リフレクター及びｌｅｄ装置
US9062380B2 (en) * 2006-04-13 2015-06-23 Ntn Corporation Pore sealing agent, member for coating spray deposit, and bearing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006206827A (ja) * 2005-01-31 2006-08-10 Matsushita Electric Works Ltd 液状封止用エポキシ樹脂組成物及び半導体装置
JP2007161878A (ja) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd ポリカルボン酸樹脂、感光性樹脂組成物及びその硬化物
US9062380B2 (en) * 2006-04-13 2015-06-23 Ntn Corporation Pore sealing agent, member for coating spray deposit, and bearing
WO2014038446A1 (ja) * 2012-09-07 2014-03-13 株式会社ダイセル 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置
JP2014095051A (ja) * 2012-11-12 2014-05-22 Shin Etsu Chem Co Ltd 熱硬化性エポキシ樹脂組成物、該組成物を用いたｌｅｄ用リフレクター及びｌｅｄ装置

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