JP2004128357A5 - - Google Patents
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- Publication number
- JP2004128357A5 JP2004128357A5 JP2002292868A JP2002292868A JP2004128357A5 JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5 JP 2002292868 A JP2002292868 A JP 2002292868A JP 2002292868 A JP2002292868 A JP 2002292868A JP 2004128357 A5 JP2004128357 A5 JP 2004128357A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- metal nanoparticles
- composite metal
- produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000758 substrate Substances 0.000 claims 13
- 239000002131 composite material Substances 0.000 claims 8
- 239000002082 metal nanoparticle Substances 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 150000003839 salts Chemical class 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 239000003125 aqueous solvent Substances 0.000 claims 2
- 239000003638 chemical reducing agent Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910000000 metal hydroxide Inorganic materials 0.000 claims 1
- 150000004692 metal hydroxides Chemical class 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 239000005416 organic matter Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002292868A JP2004128357A (ja) | 2002-10-04 | 2002-10-04 | 電極配設基体及びその電極接合方法 |
| KR1020047000955A KR20050040812A (ko) | 2002-09-18 | 2003-09-17 | 본딩물질 및 본딩방법 |
| DE60326760T DE60326760D1 (de) | 2002-09-18 | 2003-09-17 | Verfahren zum verbinden |
| US10/484,454 US20040245648A1 (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
| EP03788702A EP1578559B1 (en) | 2002-09-18 | 2003-09-17 | Bonding method |
| PCT/JP2003/011797 WO2004026526A1 (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
| CNB038009056A CN100337782C (zh) | 2002-09-18 | 2003-09-17 | 接合材料 |
| TW092125572A TWI284581B (en) | 2002-09-18 | 2003-09-17 | Bonding material and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002292868A JP2004128357A (ja) | 2002-10-04 | 2002-10-04 | 電極配設基体及びその電極接合方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008002999A Division JP2008098683A (ja) | 2008-01-10 | 2008-01-10 | 電極配設基体の電極接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004128357A JP2004128357A (ja) | 2004-04-22 |
| JP2004128357A5 true JP2004128357A5 (enrdf_load_stackoverflow) | 2005-08-25 |
Family
ID=32283993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002292868A Pending JP2004128357A (ja) | 2002-09-18 | 2002-10-04 | 電極配設基体及びその電極接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004128357A (enrdf_load_stackoverflow) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4378239B2 (ja) | 2004-07-29 | 2009-12-02 | 株式会社日立製作所 | 半導体装置及びそれを使用した電力変換装置並びにこの電力変換装置を用いたハイブリッド自動車。 |
| JP4815800B2 (ja) * | 2004-12-28 | 2011-11-16 | 株式会社大真空 | 圧電振動デバイス |
| JP2006202938A (ja) | 2005-01-20 | 2006-08-03 | Kojiro Kobayashi | 半導体装置及びその製造方法 |
| JP4635230B2 (ja) * | 2005-01-20 | 2011-02-23 | 日産自動車株式会社 | 接合方法及び接合構造 |
| JP2006211089A (ja) * | 2005-01-26 | 2006-08-10 | Daishinku Corp | 圧電振動デバイス |
| US7615476B2 (en) * | 2005-06-30 | 2009-11-10 | Intel Corporation | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
| JP5305148B2 (ja) | 2006-04-24 | 2013-10-02 | 株式会社村田製作所 | 電子部品、それを用いた電子部品装置およびその製造方法 |
| JP4743002B2 (ja) * | 2006-06-13 | 2011-08-10 | 日産自動車株式会社 | 接合方法 |
| JP4873160B2 (ja) * | 2007-02-08 | 2012-02-08 | トヨタ自動車株式会社 | 接合方法 |
| JP5006081B2 (ja) * | 2007-03-28 | 2012-08-22 | 株式会社日立製作所 | 半導体装置、その製造方法、複合金属体及びその製造方法 |
| CN101933129B (zh) * | 2008-02-07 | 2012-03-28 | 株式会社村田制作所 | 电子元件装置的制造方法 |
| WO2011114751A1 (ja) * | 2010-03-19 | 2011-09-22 | 古河電気工業株式会社 | 導電接続部材、及び導電接続部材の作製方法 |
| JP5863323B2 (ja) * | 2011-08-11 | 2016-02-16 | 古河電気工業株式会社 | 半導体装置、及び半導体装置の製造方法 |
| EP3016135A4 (en) | 2013-06-28 | 2017-09-20 | Furukawa Electric Co., Ltd. | Connection structure and semiconductor device |
| JP6387048B2 (ja) * | 2016-06-09 | 2018-09-05 | ローム株式会社 | 半導体装置の製造方法 |
| KR101898647B1 (ko) * | 2017-05-11 | 2018-09-14 | 서울과학기술대학교 산학협력단 | 은코팅 구리 호일을 이용한 접합 소재 및 이를 이용한 접합 방법 |
| JP6927490B2 (ja) * | 2017-05-31 | 2021-09-01 | 株式会社応用ナノ粒子研究所 | 放熱構造体 |
| JP2021072304A (ja) * | 2019-10-29 | 2021-05-06 | ミクロン電気株式会社 | Ｐｔｃサーミスタの接合方法 |
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2002
- 2002-10-04 JP JP2002292868A patent/JP2004128357A/ja active Pending