JP2004084069A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004084069A5 JP2004084069A5 JP2003183688A JP2003183688A JP2004084069A5 JP 2004084069 A5 JP2004084069 A5 JP 2004084069A5 JP 2003183688 A JP2003183688 A JP 2003183688A JP 2003183688 A JP2003183688 A JP 2003183688A JP 2004084069 A5 JP2004084069 A5 JP 2004084069A5
- Authority
- JP
- Japan
- Prior art keywords
- powder
- metal powder
- crystallite diameter
- coated
- inorganic oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 description 131
- 229910052751 metal Inorganic materials 0.000 description 96
- 239000002184 metal Substances 0.000 description 96
- 239000002245 particle Substances 0.000 description 78
- 229910052809 inorganic oxide Inorganic materials 0.000 description 67
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 60
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 58
- 238000004519 manufacturing process Methods 0.000 description 52
- 238000010438 heat treatment Methods 0.000 description 50
- 238000000034 method Methods 0.000 description 49
- 238000009826 distribution Methods 0.000 description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 28
- 229910052814 silicon oxide Inorganic materials 0.000 description 28
- 239000010410 layer Substances 0.000 description 26
- 230000001186 cumulative effect Effects 0.000 description 22
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 22
- 230000008602 contraction Effects 0.000 description 20
- 239000000395 magnesium oxide Substances 0.000 description 20
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 20
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- 239000000919 ceramic Substances 0.000 description 19
- 238000000691 measurement method Methods 0.000 description 14
- 239000011162 core material Substances 0.000 description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 230000002776 aggregation Effects 0.000 description 7
- 238000004220 aggregation Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229940112669 cuprous oxide Drugs 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229960002449 glycine Drugs 0.000 description 1
- 235000013905 glycine and its sodium salt Nutrition 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003183688A JP4150638B2 (ja) | 2002-06-28 | 2003-06-27 | 無機酸化物コート金属粉及びその無機酸化物コート金属粉の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002190996 | 2002-06-28 | ||
| JP2003183688A JP4150638B2 (ja) | 2002-06-28 | 2003-06-27 | 無機酸化物コート金属粉及びその無機酸化物コート金属粉の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004084069A JP2004084069A (ja) | 2004-03-18 |
| JP2004084069A5 true JP2004084069A5 (enrdf_load_stackoverflow) | 2005-05-12 |
| JP4150638B2 JP4150638B2 (ja) | 2008-09-17 |
Family
ID=32071841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003183688A Expired - Lifetime JP4150638B2 (ja) | 2002-06-28 | 2003-06-27 | 無機酸化物コート金属粉及びその無機酸化物コート金属粉の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4150638B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2006070572A1 (ja) * | 2004-12-27 | 2008-06-12 | 国立大学法人京都大学 | 規則合金相ナノ微粒子及びその製造方法、並びに超高密度磁気記録用媒体及びその製造方法 |
| JP2006183076A (ja) * | 2004-12-27 | 2006-07-13 | Nippon Atomized Metal Powers Corp | アトマイズ金粉末並びにそれを用いた導電性金ペーストおよび装飾用金粘土 |
| JP2006299385A (ja) * | 2005-04-25 | 2006-11-02 | Noritake Co Ltd | 白金粉末、その製造方法、および圧電セラミック材用白金ペースト |
| JP6186156B2 (ja) * | 2013-03-30 | 2017-08-23 | Ｄｏｗａエレクトロニクス株式会社 | 銀粉およびその製造方法並びにペースト、電子回路部品、電気製品 |
| JP6900570B2 (ja) * | 2017-07-18 | 2021-07-07 | 納獅新材料有限公司Ｎａｘａｕ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｃｏ．， Ｌｔｄ． | 機能性複合粒子及びその製造方法 |
| CN115815587B (zh) * | 2022-12-05 | 2023-11-28 | 深圳众诚达应用材料股份有限公司 | 一种叠层片式电感内电极银浆用改性银粉及其制备方法 |
| WO2024204211A1 (ja) * | 2023-03-29 | 2024-10-03 | 昭栄化学工業株式会社 | 金属粉末の製造方法及び金属粉末 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2508847B2 (ja) * | 1989-07-20 | 1996-06-19 | 株式会社ハイミラー | ＳｉＯ２被膜が形成された銀コ―トガラスフレ―クの製造法 |
| JP4001438B2 (ja) * | 1999-05-31 | 2007-10-31 | 三井金属鉱業株式会社 | 複合銅微粉末の製造方法 |
| JP4480884B2 (ja) * | 1999-12-22 | 2010-06-16 | 三井金属鉱業株式会社 | 表面修飾銀粉の製造方法 |
| JP3945740B2 (ja) * | 2000-11-09 | 2007-07-18 | 三井金属鉱業株式会社 | ニッケル粉 |
-
2003
- 2003-06-27 JP JP2003183688A patent/JP4150638B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wu | Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC | |
| KR101236253B1 (ko) | 구리 분말의 제조방법 및 구리 분말 | |
| TWI778997B (zh) | 銅粉、該銅粉的製造方法、使用該銅粉之導電性糊、及使用該導電性糊之導電性膜的製造方法 | |
| JP2007270312A (ja) | 銀粉の製造方法及び銀粉 | |
| JP2007126744A (ja) | 微粒ニッケル粉末及びその製造方法 | |
| KR101236246B1 (ko) | 구리 분말 | |
| JP2007126750A (ja) | 複合ニッケル粒子及びその製造方法 | |
| TWI284069B (en) | Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste | |
| JP4149353B2 (ja) | 二層コート金属粉及びその二層コート金属粉の製造方法並びにその二層コート金属粉を用いた導電性ペースト | |
| JP4879762B2 (ja) | 銀粉の製造方法及び銀粉 | |
| WO2015087967A1 (ja) | 銀粒子の製造方法及び当該方法により製造される銀粒子 | |
| JP4197151B2 (ja) | 二層コート銅粉及びその二層コート銅粉の製造方法並びにその二層コート銅粉を用いた導電性ペースト | |
| JP4150638B2 (ja) | 無機酸化物コート金属粉及びその無機酸化物コート金属粉の製造方法 | |
| JP2004084069A5 (enrdf_load_stackoverflow) | ||
| JP2007297671A (ja) | 銀粉及びその製造方法、該銀粉を含有する導電性ペースト | |
| Wu | Preparation of ultra-fine copper powder and its lead-free conductive thick film | |
| JP6186156B2 (ja) | 銀粉およびその製造方法並びにペースト、電子回路部品、電気製品 | |
| JP2009079269A (ja) | 導電性ペースト用銅粉およびその製造方法、並びに、導電性ペースト | |
| JP4164010B2 (ja) | 無機超微粒子コート金属粉及びその製造方法 | |
| JP3474170B2 (ja) | ニッケル粉及び導電ペースト | |
| JP4957465B2 (ja) | 酸化物被覆銅微粒子とその製造方法 | |
| JP2006183076A (ja) | アトマイズ金粉末並びにそれを用いた導電性金ペーストおよび装飾用金粘土 | |
| KR100508693B1 (ko) | 니켈 나노분말의 합성 방법 | |
| JP6179423B2 (ja) | 硫黄含有ニッケル粉末の製造方法 | |
| JP5003648B2 (ja) | 酸化物被覆銅微粒子の製造方法 |