JP2004079599A - Small electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide small electronic components which can be mounted in high density by using a versatile mounting machine. <P>SOLUTION: Two individual resistant layers 8 and 9 are formed e.g. on (1005) type insulating substrate 1 standardized as a chip size, and electrodes 4 and 5 and 6 and and many continuous chip resistors of a structure arranging the electrodes 4 and 5 and 6 and 7 are formed on both ends of resistors 8 and 9. High density mounting using a versatile mounting machine can be performed by employing a substrate of such a standardized size. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a small electronic component, for example, a small electronic component such as a chip resistor used for a small electronic device or the like.
[0002]
[Prior art]
With the recent miniaturization of electronic devices and the like, demands for miniaturization and high-density mounting of electronic components such as chip resistors have been increasing. When mounting these electronic components on a circuit board, usually, an automatic mounting machine (chip mounter) is used.
[0003]
In addition, as a chip resistor for use in pull-up / pull-down of a digital circuit constituting an electronic device, a resistor network (network) in which a plurality of resistor elements are integrated on the same substrate and made into a single chip-sized component. Resistors, or chip networks).
[0004]
[Problems to be solved by the invention]
However, when manufacturing devices using small chip components, there are the following problems. That is, a mounting machine having a high mounting position accuracy and a high-level soldering technique are required in correspondence with a miniaturized chip component and a device using (mounting) the chip component. At the same time, the smaller the chip components, the higher the frequency of occurrence of mounting defects.
[0005]
Further, in the conventional multiple chip resistor, for example, as shown in FIG. 9, resistance layers 103 and 104 are arranged on an insulating substrate 101, and each resistance layer has electrodes 111, 112, 115 and 116. The configuration is such that concave portions 121 to 126 are formed around the substrate 101.
[0006]
The reason why there are many such recesses is that the conventional multiple chip resistor has an insulating substrate 201 for multiple chip resistors having a large number of through holes 202 as shown in FIG. Because it is used. Therefore, when mounting such a resistor, there is a problem that the chip components are entangled by these concave portions, and so-called bulk mounting cannot be performed.
[0007]
In addition, since the size (substrate outer shape) of the conventional insulating substrate 201 for a multiple chip resistor is not standardized, a substrate having different external dimensions according to the number of elements formed on the substrate is designed and prepared. This not only increases the manufacturing cost but also makes it impossible to use a general-purpose mounting machine.
[0008]
[Means for Solving the Problems]
The present invention has been made in view of the above-described problem, and an object of the present invention is to provide a small-sized electronic component that enables high-density mounting using a general-purpose mounting machine.
[0009]
Another object of the present invention is to provide a small-sized electronic component in which a plurality of elements can be arranged with a simple structure.
[0010]
For example, the following configuration is provided as a means for achieving the object and solving the above-described problem. That is, the small-sized electronic component of the present invention includes a plurality of functional films that perform a certain electrical function formed on an insulating base material having a dimension corresponding to a standard, and the insulating substrate is formed from an end of each of the plurality of functional films. An electrode for securing electrical connection with the outside is provided for each of the plurality of functional films on an end face of the material.
[0011]
Further, as another means for solving the above-described problem, for example, the following configuration is provided. That is, the small electronic component of the present invention has a second external dimension x, y compliant with the standard, which performs a certain electrical function on the insulating base material having the first external dimensions X, Y compliant with the standard. (X <X, y <Y) forming a plurality of functional films disposed on the insulating base material, and forming an outer portion for each of the plurality of functional films from an end of each of the plurality of functional films to an end face of the insulating base material. And an electrode for ensuring electrical connection with the battery.
[0012]
For example, the plurality of functional films are formed in parallel in the lateral direction of the insulating base. Further, for example, the plurality of functional films are resistance films.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an external perspective view of a multiple chip resistor (hereinafter, also simply referred to as a chip resistor) according to the present embodiment. FIG. 2 shows the multiple chip resistor excluding a protective layer described later. FIG. 5 is a plan view showing the state of the resistor when it is turned off.
[0014]
1 and 2, an insulating substrate 1 is a substrate made of, for example, an electrically insulating ceramic having a shape (a chip having a length L, a width W, and a thickness t) based on a predetermined standard. is there. The size of the chip is standardized as follows, for example.
[0015]
Standard name : L (length) x W (width)
0603: 0.6 mm x 0.3 mm
1005: 1.0 mm x 0.5 mm
1608: 1.6 mm x 0.8 mm
2012: 2.0 mm x 1.25 mm
[0016]
In the present embodiment, since the insulating substrate having the outer dimensions conforming to the standard is used as described above, a general-purpose chip component mounter can be used.
[0017]
A resistor is printed on the insulating substrate 1 by, for example, screen printing, and after drying and firing, a resistive layer (resistive film) is formed on the substrate. Specifically, as shown in FIG. 2, two resistors 8 and 9 are arranged on the insulating substrate 1. After that, electrodes to be described later are provided on both ends of each of the resistors 8 and 9. Therefore, the resistor shown in FIGS. 1 and 2 is a two-element chip resistor having a structure in which two individual resistors are arranged on the same substrate.
[0018]
Further, as shown in FIG. 2, by forming electrodes 4 and 5 and electrodes 6 and 7 at both ends of the resistor, a land pattern on a printed wiring board on which chip components are mounted, and a resistor 8 , 9 are secured. These electrodes are further plated, the details of which will be described later. As shown in FIG. 1, a protective layer (overcoat) 33 functioning as an insulating film or the like is provided on the resistors 8 and 9.
[0019]
In the multiple chip resistor according to the present embodiment, among the above-mentioned standards, a highly versatile “1005” size substrate is used. Therefore, the dimensions shown in FIGS. 1 and 2 are length L = 1.0 mm, width W = 0.5 mm, thickness t = 0.35 mm, and the width of the electrodes is c1, c2 = 0.3 mm. did. Further, the distance between these electrodes was e = 0.2 mm as a sufficient distance that the electrodes did not contact each other.
[0020]
The manufacturing process of the multiple chip resistor according to the present embodiment having the above configuration will be described below with reference to FIGS. FIG. 3 is a flowchart showing a manufacturing process (chip forming process) of the multiple chip resistor according to the present embodiment, and FIG. 4 is a cross-sectional structure of the resistor corresponding to each process of FIG. Is shown.
[0021]
In FIG. 4, the right side is a plan view of the resistor in each step, and the left side is a view of each resistor corresponding to the step in the right figure as viewed from arrows aa ′, bb ′,. The sectional view at the time is shown.
[0022]
First, in step S1 of FIG. 3, an electrode is formed on a substrate. That is, as shown in FIG. 4A, the lower surface of the insulating substrate 1 in which the dividing grooves 13, 14, 15, 16 having a predetermined depth are formed on the surface in advance (when the multiple chip resistor is mounted). On the solder surface), thick film printing of the back electrodes 25, 26 and the like is performed by screen printing, for example, at a position straddling the division grooves 13, 14, and baked at 850 ° C. By this firing, the back electrodes 25, 26 and the like are formed on the lower surface of the insulating substrate 1.
[0023]
As in the case of the back electrode, a thick film printing of the front electrodes 21 and 22 and baking are performed on the upper surface (the side on which the resistor is formed) of the insulating substrate 1. By this baking, surface electrodes 21, 22 and the like are formed on the insulating substrate 1.
[0024]
The thick film printing of the front electrodes 21 and 22 and the back electrodes 25 and 26 on the substrate may be performed by sputtering or the like.
[0025]
Here, as an electrode material formed on the substrate, for example, silver (Ag) on the back surface electrode, also, the surface electrode of silver / palladium (Ag / Pd) was screen-printed, respectively, in the air (O ₂₎ To form an electrode.
[0026]
In step S2, a thick film of the resistor is formed. Specifically, as shown in FIG. 4B, the resistor 8 is printed between the surface electrodes 21 and 22, and the resistor 9 is printed between the surface electrodes 23 and 24, respectively. Then, these resistors are fired, for example, at 850 ° C. in the air (O ₂ ) to form a resistive film. As a material for the resistor, for example, a ruthenium oxide (RuO ₂ ) -based material is used.
[0027]
In a succeeding step S3, a protective film (protective coat) also having a function as an insulating film is formed on the resistor formed in the above process. That is, in step S3, for example, glass is screen-printed on each of the resistors 8 and 9 and baked at 600 ° C. to form the primary protective layers 31 and 32 (see FIG. 4C). . In this step, trimming of the resistance value is performed as necessary. In this trimming, for example, a resistance value of each resistor constituting the multiple chip resistor is adjusted by making a cut in the pattern of the resistor by a laser beam, sand blast, or the like.
[0028]
In step S4, as shown in FIG. 4D, for example, a resin such as epoxy or polyimide is screen-printed (solid-coated) so as to cover the whole of the primary protective layers 31 and 32, and the resin is heated at 200 ° C. By curing, the secondary protective layer 33 is formed.
[0029]
Note that the primary protection layers 31 and 32 may be provided so as to cover the entirety of the two resistors, instead of individually covering the resistors 8 and 9. Alternatively, the primary protective layers 31 and 32 may be omitted, and only the secondary protective layer 33 may be formed on the resistor.
[0030]
In step S5, as shown in FIG. 4E, the insulating substrate 1 is primarily divided according to the division grooves 13 and 14. The primary division is performed by break, laser cut, dicing, or the like. Here, such primary division means that the insulating substrate 1 on which a plurality of resistance layers each having an electrode is formed is divided into strips along the division grooves 13 and 14.
[0031]
In a succeeding step S6, end face electrodes 35, 36, 37, 38 are formed on the end face of each of the substrates divided into strips in the step S5, for example, by sputtering. For example, nickel / chromium (Ni / Cr) is used as a material of the end face electrode.
[0032]
Note that the formation of the end surface electrodes 35, 36, 37, and 38 is not limited to the above-described sputtering, and may be performed by, for example, vapor deposition or coating.
[0033]
In step S7, the substrate divided into strips in step S5 is secondarily divided according to the dividing grooves 15 and 16. This secondary division is performed by break, laser cut, dicing, or the like. Then, in the subsequent step S8, as shown in FIG. 4F, a portion of the front electrodes 21 and 22 not covered by the secondary protective layer 33, the back electrodes 25 and 26, and the end electrode 35. , 36 are subjected to electrolytic plating to form end electrodes 41 and 42.
[0034]
The end surface electrodes 41 and 42 are, for example, plated with nickel (Ni) or the like and then plated with a tin / lead (Sn · Pb) plating layer or Sn It is desirable to form a plating layer (solder plating treatment) to form a laminated structure. The same applies to other electrodes (surface electrodes 23, 24, etc.).
[0035]
As described above, since the multiple chip resistor according to the present embodiment uses the “1005” type substrate, the chip resistor shown in FIG. 4 (b) or the resistors 8 and 9) shown in FIG. 2 that can be used for a chip resistor equivalent to the “0603” type for two elements.
[0036]
As described above, according to the present embodiment, an insulating substrate having a size corresponding to a standard as a chip size is used, a plurality of resistance layers are formed on the substrate, and electrodes are arranged. By using a continuous chip resistor, component cost can be reduced and high-density mounting can be performed using a general-purpose mounting machine. In particular, when a highly versatile “1005” type insulating substrate is used, high-density mounting can be performed while minimizing changes in existing manufacturing equipment.
[0037]
In addition, since a plurality of resistance layers are formed on the same substrate, the number of mounted components in the device and the like is reduced, and as a result, the required mounting area of the wiring substrate is reduced, and the time and cost required for mounting the substrate are reduced. can do.
[0038]
Furthermore, since the multiple chip resistor according to the present embodiment has no concave portion around the substrate and has a general-purpose substrate size, bulk mounting using a general-purpose mounting machine becomes possible.
[0039]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention. In the embodiment described above, a chip resistor in which a plurality of resistance layers are arranged on a single substrate has been described. For example, instead of the plurality of resistance layers, other functional films, for example, inductors, capacitors, etc. A structure in which a plurality of elements having the above function are arranged may be adopted.
[0040]
Further, when a plurality of resistance layers are provided on a single substrate, the number and arrangement of resistors constituting each resistance layer are not limited to the configurations shown in FIGS. 1 and 2. Modifications as described are possible.
[0041]
In the above-described embodiment, an example in which two resistors are arranged on the same substrate (two-element chip resistor) has been described. FIG. 5 shows an example in which the number of resistance elements is further increased. Note that, in order to make the resistor structurally easy to understand, in the following examples, illustration of a protective film covering the resistance layer is omitted.
[0042]
In the chip resistor shown in FIG. 5, for example, four resistor layers 52, 53, 54, and 55 formed by firing a screen-printed resistor are formed on a substrate 51, and both end portions of each resistor layer are formed. Are provided with a pair of electrodes 61-62, 63-64, 65-66, 67-68 in each resistance layer.
[0043]
The chip resistor shown in FIG. 5 is a four-element chip resistor. For example, a resistor used for a chip resistor equivalent to “0603” type on a substrate of “1608” type among the standard chip sizes described above. It has a structure in which four elements are incorporated.
[0044]
On the other hand, the chip resistor shown in FIG. 6 is an example of a multiple chip resistor in which two resistors are arranged on the same substrate, like the multiple chip resistor according to the above-described embodiment. That is, it has a configuration in which two resistors used for a “0603” type chip resistor are arranged as resistors 72 and 73 on a “1005” type substrate 71.
[0045]
However, the two-element chip resistor shown in FIG. 6 is characterized in that the resistors 72 and 73 and the electrodes 81 to 84 are arranged at the longitudinal ends of the substrate 71 in order to avoid mutual electrical contact. And
[0046]
FIG. 7 shows a chip resistor according to another modification example. A resistor element used as a single resistor 86 on a “1005” type substrate 85, for example, for a “0603” type chip resistor 86, and electrodes 87 and 88 connected thereto. With such a structure, the degree of freedom of the land pattern on the printed board on which such a chip component is mounted is improved.
[0047]
The chip resistor shown in FIG. 8 is a multiple chip resistor in which two resistors are arranged on the same substrate, similarly to the resistor according to the above embodiment. Here, on a “1005” type substrate 91, resistors 92 and 93 are arranged in parallel with each other in the longitudinal direction thereof, and electrodes 94 to 97 corresponding to the resistors 92 and 93 are provided at longitudinal ends of the substrate. Having a configuration.
[0048]
【The invention's effect】
As described above, according to the present invention, high-density mounting of small electronic components using a general-purpose mounting machine becomes possible.
[0049]
According to the present invention, a plurality of elements (functional films) can be arranged on an insulating substrate with a simple structure.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a multiple chip resistor according to an embodiment of the present invention.
FIG. 2 is a plan view of the multiple chip resistor according to the embodiment.
FIG. 3 is a flowchart showing a manufacturing process of the multiple chip resistor according to the embodiment.
FIG. 4 is a diagram showing a cross-sectional structure of a multiple chip resistor according to the embodiment.
FIG. 5 is a plan view of a chip resistor according to a modification in which the number of resistive elements is further increased.
FIG. 6 is a plan view of a chip resistor according to another modification.
FIG. 7 is a plan view of a chip resistor according to another modification.
FIG. 8 is a plan view of a chip resistor according to another modification.
FIG. 9 is a diagram showing a configuration of a conventional multiple chip resistor.
FIG. 10 is a view showing a conventional insulating substrate for a multiple chip resistor.
[Explanation of symbols]
1, 51, 71, 85, 91 Insulating substrate 4-7 Electrode 8, 9 Resistance layer 13-16 Dividing groove 21, 22 Front surface electrode 25, 26 Back surface electrode 31, 32 Primary protective layer 33 Secondary protective layer 35, 36 End Partial electrodes 41, 42 End face electrodes

Claims (4)

A plurality of functional films that perform a certain electrical function are formed on an insulating base material having dimensions corresponding to the standard, and the plurality of functional films are formed on an end face of the insulating base material from an end of each of the plurality of functional films. A small electronic component characterized in that an electrode for securing an electrical connection with the outside is provided for each device. A second external dimension x, y (x <X, y <Y) corresponding to the standard, which performs a certain electrical function on an insulating base material having the first external dimension X, Y corresponding to the standard. Forming a plurality of functional films disposed on an insulating base material, and securing an electrical connection to the outside for each of the plurality of functional films from an end of each of the plurality of functional films to an end surface of the insulating base material. A small electronic component characterized by including the above electrodes. The small electronic component according to claim 1, wherein the plurality of functional films are formed in parallel in a lateral direction of the insulating base. The small electronic component according to claim 3, wherein the plurality of functional films are resistance films.

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