JPH11195531A - Chip parts and chip network parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide chip parts and chip network parts obtained by making the chip parts multiple, which increases the capacity and facilitate manufacture by using the surface area of the insulated substrate of electronic parts as effectively as possible. SOLUTION: A chip part A3 consists of an insulated substrate 12, upper surface electrode parts 21, 24 and 25 provided on a front surface F on the sides of both end parts L and R, lower surface electrode parts 29, 30 and 31 provided on its rear surface B, a side surface electrode part not shown in figure, an intermediate electrode not shown in figure, an upper layer electrode (not shown), internal through-hole electrodes 60l and 60r formed at two through-holes penetrated from the front surface F to the rear surface B inside of the substrate 12, planar coils 52a, 54a arranged on the front surface F of the substrate 12, a lower layer electrode part (not shown) arranged on the rear surface B side, a dielectric 72 and a protective layer (not shown).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component and a chip network component.

[0002]

2. Description of the Related Art Conventionally, as a noise suppression electronic component, a component having only L alone, for example, a component having only chip inductors C1 and C alone as shown in FIG. In general, a circuit that combines the required number of the components has been used. Also, there is a composite component such as a composite chip component C2 shown in FIGS. 10A and 10B, in which C and R are formed in series on one surface of one substrate.

[0003]

However, in the case of the above-mentioned single electronic component, for example, in the case of the chip inductor C1 shown in FIG.
Since the spiral planar coil 50 is formed only on the surface F of the electronic component substrate 11 using the insulating layer 110, if an attempt is made to obtain a larger inductance, the inductance is reduced by the electronic component substrate 11 of the planar coil 50. Since it is proportional to the area occupied on the surface F, the substrate 1
The size of 1 itself has to be increased. Therefore, it is difficult to respond to the trend of miniaturization of electronic components. Further, in the noise suppression circuit formed by combining the above-mentioned individual electronic components by a required number, a land for connecting to the wiring board is required for each electronic component, and it is difficult to improve the mounting density. Yes, and the implementation cost is higher.

Further, in the composite chip component C2 shown in FIGS. 10 (a) and 10 (b), provided at both ends in the longitudinal direction of the substrate 13 on the surface F side of the substrate 13 and below the protective layer 94. Between the upper surface electrode portions 102 and 104 of the pair of external electrode portions 100l and 100r and the lower layer electrode portion 106 provided substantially at the center of the substrate 13 by connecting the dielectric 78 and the resistor 82 in series. In particular, in order to increase the capacitance of the dielectric 78, the size of the substrate 13 itself of the composite chip component C2 must be increased. However, if the mounting area is limited,
Since the size of the substrate 13 of the composite chip component C2 cannot be larger than the limited area, the dielectric 78
Is limited inevitably, and the capacity thereof is also limited. Therefore, the present invention provides a chip component that can increase the capacity by effectively utilizing the surface area of the insulating substrate of the electronic component as much as possible, and that is easy to manufacture, and a chip network component in which the chip component is multiply connected. The purpose is to:

[0005]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above problems. First, the present invention is directed to a chip component, which comprises an external electrode provided on an insulating substrate; One or more electronic devices provided on one surface of the insulating substrate, one or more electronic devices provided on the other surface of the insulating substrate, and a through hole penetrating between the front surface and the back surface of the insulating substrate And at least one electronic element provided on the front surface of the insulating substrate, and at least one electronic element provided on the back surface of the insulating substrate. It is characterized by being connected.

In the chip component having this configuration, one or a plurality of electronic elements are provided on both surfaces of the insulating substrate, so that the area occupied by the electronic elements on the insulating substrate is reduced by a conventional chip in which the electronic elements are provided only on one surface of the insulating substrate. Since it can be made larger than a part, the effect that occurs can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced.

Secondly, in the chip component having the first configuration, each of the electronic elements is constituted by any one of an inductor, a capacitor, and a resistor. Things. In the chip component of this configuration,
In particular, the noise countermeasure circuit can be composed of one component, so that the area occupied by the electronic component mounting substrate itself during mounting can be reduced, and the mounting cost can be reduced.

Thirdly, there is provided a chip component having the first or second configuration, wherein one electronic element is provided on one surface of the insulating substrate and the other surface of the insulating substrate is provided. Is provided with one electronic element. In the chip component of this configuration, by providing one electronic element on each side of the insulating substrate, the occupied area of the electronic element on the insulating substrate is larger than that of the conventional chip component in which the electronic element is provided on only one side of the insulating substrate. Therefore, the generated effect can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced.

Fourthly, in the chip component having the first or second configuration, one electronic element is provided on one surface of the insulating substrate and the other surface of the insulating substrate is provided. Is characterized in that two electronic elements are provided. In the chip component having this configuration, by providing one electronic element on one surface of the insulating substrate and two electronic elements on the other surface of the insulating substrate, the occupied area of the electronic element on the insulating substrate is reduced. Can be made larger than a conventional chip component in which an electronic element is provided only on one side of the device, so that the effect to be generated can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced.

A fifth aspect is a chip component having the first, second, third, or fourth configuration, wherein a plurality of the through holes are provided. In the chip component of this configuration, in particular, since a plurality of through holes are provided, for example, two through holes are provided inside the insulating substrate, two internal through hole electrodes are formed, and one surface of the insulating substrate is provided. When two electronic devices of the same type are provided on the other surface, and one electronic device of a different type from the electronic device on one surface is provided on the other surface, each of the two electronic devices is provided on one surface of the insulating substrate. Are arranged symmetrically so as to be connected to each of the internal through-hole electrodes and the external electrode, and one electronic element is connected to the other surface of the insulating substrate by two.
By arranging so as to be connected to the two internal through-hole electrodes and the external electrode, a chip component having no left-right directionality can be obtained. Accordingly, high-speed processing can be performed without the need to align the left and right directions of the chip components during characteristic inspection and taping. Also, when replacing chip components due to poor soldering or the like, the left and right directions are not mistaken.

Sixth, a chip component having the first, second, third, fourth, or fifth configuration, wherein a pair of the external electrodes are provided on both end surfaces of the insulating substrate. It is characterized by the following.

A seventh aspect is a chip component having the first or second or third or fourth or fifth configuration, wherein the external electrode is provided on one end surface of the insulating substrate. It has an external electrode and two external electrodes provided on the other end surface. In the chip component having this configuration, one external electrode is provided on one end surface of the insulating substrate, and two external electrodes are provided on the other end surface.
Polarity by function is easy to recognize.

Eighth, a chip component having the first, second, third, fourth, or fifth configuration, wherein the external electrode is provided on one end surface of the insulating substrate. It has an external electrode and two external electrodes provided on the other end surface.

A ninth aspect is a chip component having the first, second, third, fourth, fifth, sixth, seventh, or eighth configuration, wherein the electronic element is a screen printing means. Is provided. In the chip component of the present configuration, in particular, since the electronic element is formed only by the screen printing means without using a dedicated machine, the manufacture of the chip component is simplified, and the manufacturing cost can be reduced.

Tenthly, the present invention relates to a chip network component, wherein the first or second or third or fourth or fifth or fifth
Alternatively, the chip component having the sixth, seventh, eighth, or ninth configuration is multiply connected. In the chip network component having this configuration, the first, second, or third
Alternatively, the chip components having the fourth, fifth, sixth, seventh, eighth, or ninth configurations are connected in series, so that a plurality of noise suppression circuits can be configured with one component. The area occupied by the electronic component mounting substrate itself during mounting can be reduced, and the mounting cost can be reduced.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One specific example of an embodiment of the present invention will be described with reference to the drawings. First, a first specific example will be described with reference to FIGS. 1 (a), 1 (b) and 1 (c). Book first
As shown in FIGS. 1A and 1B, one chip component A1 before being divided from the insulating substrate original plate G in the manufacturing process of the specific example has an insulating substrate 10, upper surface electrode portions 20 and 21, and ,
Lower surface electrode portions 22 and 23 and planar coils 50a and 50b
And an internal through-hole electrode 60. Here, the insulating substrate base plate G is mainly made of alumina, and has a split slit S formed therein. One insulating base plate G is formed by dividing the insulating substrate base plate G along the split slit S. The substrate 10 has a substantially rectangular parallelepiped shape, and has a substantially rectangular shape when viewed in plan.

The upper electrode portions 20 and 21 and the lower electrode portions 22 and 23 are made of a conductive paste such as silver or the like.
Are screen-printed and fired in substantially the same shape and substantially the same thickness on each of the ends L and R sides of the insulating substrate 10
The upper electrode portion 2 is formed in a substantially rectangular shape on the surface F of the
The lower electrode portions 22 and 23 are formed in a substantially rectangular shape on the back surface B. In addition, completed 1
In the individual chip parts, the upper surface electrode portions 20 and 21
And the lower electrode portions 22 and 23 and the upper electrode portion 20
A pair of side surface electrode portions formed to connect the upper surface electrode portion 21 and the lower surface electrode portion 23 with each other;
A pair of external electrodes are formed from a pair of intermediate electrodes formed of a nickel plating layer formed over the pair of side electrode portions and a pair of upper electrodes formed of a solder plating layer formed over the pair of intermediate electrodes. An electrode unit is configured.

Each of the planar coils 50a and 50b is formed by spirally screen-printing and firing a conductive paste on the front surface F or the back surface B of the insulating substrate 10.
One end of the planar coil 50a is connected to the upper electrode section 20, the other end is connected to an internal through-hole electrode 60 described later, and one end of the planar coil 50b is connected to the lower electrode section 23, and the other end is connected to the internal through-hole electrode 60 described later. doing. That is, the planar coil 50a connects the upper surface electrode portion 20 and an internal through-hole electrode 60 described later, and the planar coil 50b connects the lower surface electrode portion 23 and an internal through-hole electrode 60 described later to form two inductor portions. doing.

The internal through-hole electrode 60 is located substantially in the center of the insulating substrate 10 and extends from the front surface F side to the rear surface B side into a through hole having a substantially circular hole. And a conductive paste of silver or the like is embedded and fired.

The connection relationship of the electronic elements in the finished product of the chip part A1 is shown in the equivalent circuit diagram of FIG.
T1 and T4 indicate terminals, and K1 and K2 indicate coils. Terminal T
1 corresponds to the upper electrode section 20, the terminal T4 corresponds to the lower electrode section 23, the coil K1 corresponds to the plane coil 50a, and the coil K2 corresponds to the plane coil 50b.

In the finished product of the chip component A1, the above-mentioned side electrode portion, intermediate electrode, and upper electrode are formed, and the protective layer is made of a glass paste of lead borosilicate glass or the like. Is formed by screen printing and baking so as to cover the entire planar coil 50a on the front surface F side, and is formed by screen printing and baking so as to cover the entire planar coil 50b on the back surface B side of the insulating substrate 10. You.

According to the finished chip component A1 having the above structure, the planar coils 50a and 50b are provided on the insulating substrate 10 by screen printing, that is, the screen is formed without using a special machine for forming electronic elements. Since it can be manufactured only by the printing means, the manufacturing can be simplified and the manufacturing cost can be reduced.
The planar coil 50a on the front surface F side of the insulating substrate 10 and the planar coil 50 on the rear surface B side via the internal through-hole electrode 60
b can be connected, so that one side only
The inductance can be increased as compared with a chip component provided with two inductor portions, and if the same inductance as the inductance generated by one inductor portion provided only on one side of the related art can be obtained, the entire chip component can be obtained. The size can be reduced.

Next, a second specific example will be described with reference to FIGS.
This will be described using (c). The second specific example corresponds to the first example.
Unlike the specific example, one inductor portion is formed on the front surface side of the insulating substrate, and one capacitor portion is formed on the back surface side. Note that the chip component A2 of the second specific example is
Originally, an external electrode portion is formed. The external electrode section includes an upper electrode section, a lower electrode section, a side electrode section, an intermediate electrode, and an upper layer electrode. That is, on both sides L and R of the insulating substrate 12, first, the upper surface electrode portions 21, 24 and 25 are provided on the front surface F side thereof on the back surface B thereof.
On the side, lower surface electrode portions 26, 27 and 28 are respectively formed. Next, each side surface electrode portion is formed to connect between each upper surface electrode portion and each lower surface electrode portion. Next, each intermediate electrode made of a nickel plating layer is formed on each side electrode portion, and each upper electrode made of a solder plating layer is formed on each intermediate electrode. The electronic element mounted on the chip component A2 is actually formed by being covered with a protective layer. However, in order to clarify the connection relationship between each electrode portion and each electronic element, in FIG. 2A and FIG.
Illustration of each intermediate electrode, each upper electrode, and a protective layer is omitted. In other specific examples described below, the above illustrations are omitted from the plan view and the bottom view showing each of the chip components A3, A4, A5 or the chip network component B1 for the same reason.

FIG. 2 shows a chip part A2 of the second embodiment.
As shown in (a) and (b), the insulating substrate 12, the external through hole 62, the upper electrode portions 21, 24, 25 and the lower electrode portions 26, 27, 28 in the external electrode portion,
The plane coil 50a, the internal through-hole electrode 60, and the dielectric 70 are provided. Here, the insulating substrate 1
Reference numeral 2 denotes a substantially rectangular parallelepiped shape mainly made of alumina, and a substantially central portion on the side of the end L when viewed from the side, and one external through hole 62 having a substantially semicircular shape when viewed in plan. ing.

Each of the upper electrode portions 21, 24, and 25 is formed by screen-printing and firing a conductive paste of silver or the like, and as shown in FIG. On the F side, when viewed in a plan view, the upper surface electrode portion 24 is provided in a rectangular shape on the left side with the external through hole 62 interposed therebetween, and the upper surface electrode portion 25 is provided in a rectangular shape on the right side. On the side of the front surface F on the side of the end R, the upper surface electrode portion 21 is provided in a substantially rectangular shape as in the first specific example.

The lower electrode portions 26, 27 and 28 are formed by screen printing and firing a conductive paste such as silver as in the case of the upper electrode portion, and as shown in FIG. On the back surface B side of the end portion L side, when viewed in a plan view, a substantially crank shape is formed on the left side with the external through hole 62 interposed therebetween (in FIG. 2 (b), the exposed portion is substantially L-shaped. The other portion is completely covered by a dielectric 70 described later).
The lower electrode portion 2 is provided on the right side in a rectangular shape.
The lower electrode portion 28 is provided in a substantially convex shape on the back surface B side of the end portion R side of the insulating substrate 12.
The lower electrode portion 26 covers and is connected to the internal through-hole electrode 60, and a dielectric 70 described later overlaps a part of the lower electrode portion 26. The lower surface electrode portion 28 covers and connects to a partial region of a dielectric 70 described later.

The flat coil 50a is formed by spirally screen-printing and firing a conductive paste such as silver on the front surface F of the insulating substrate 12, similarly to the first embodiment, and one end thereof is formed on the upper surface. The electrode part 24 and the other end are connected to the internal through-hole electrode 60. That is, the upper electrode portion 24 and the internal through-hole electrode 60 are connected to form one inductor portion. The internal through-hole electrode 60 is exactly the same as that of the first specific example, and a description thereof will be omitted.

As shown in FIG. 2B, the dielectric material 70 is obtained by screen-printing and firing a dielectric paste in a rectangular shape. And a part of the lower electrode 28 is superposed on the dielectric 70. That is, the dielectric 7
0 is provided between the lower electrode section 26 and the lower electrode section 28 and connected to these to form one capacitor section.

The connection relation of the electronic elements in the chip part A2 is shown in the equivalent circuit diagram of FIG.
8, T10 denotes a terminal, K1 denotes a coil, and E1 denotes a capacitor. The terminal T5 corresponds to the upper electrode portion 24, the terminal T8 corresponds to the lower electrode portion 26, the terminal T10 corresponds to the lower electrode portion 28, the coil K1 corresponds to the planar coil 50a, and the capacitor E1 corresponds to the lower electrode portion 26 and the dielectric. 70 and the lower surface electrode portion 28.

Although not shown, the protective layer is made of a glass paste such as a lead borosilicate glass based on the insulating substrate 12.
Is formed by screen printing and baking so as to cover the entire planar coil 50a.
On the back surface B side of at least the lower electrode portions 26, 2
8 and dielectric 70 exposed from lower electrode portion 28
Is formed by screen printing and baking so as to cover.

According to the chip component A2 having the above structure, the planar coil 50a and the dielectric 70 are provided on the insulating substrate 12 by screen printing, that is, without using a dedicated machine for forming each electronic element. Since it can be manufactured only by the screen printing means, the manufacturing can be simplified and the manufacturing cost can be reduced.
In the insulating substrate 12, a flat coil 5
Since one inductor portion including the capacitor 0a and one capacitor portion including the dielectric 70 are provided on the back surface B side, the noise suppression circuit can be configured by one component, and the noise reduction circuit can be used. The occupied area of the electronic component mounting board itself can be reduced, and the mounting cost can be reduced. Since two external electrode portions are provided on the end portion L side of the insulating substrate 12 and one external electrode portion is provided on the end portion R side, it is easy to recognize the polarity due to the function. By changing the color of the surface of the protective layer formed on each of the front and back surfaces F and B of the insulating substrate 12, for example, by using black and white, the front and back of the chip component A2 can be easily identified.

Next, a third specific example will be described with reference to FIGS.
The description will be made with reference to FIG. 5 from (c). The third example is
Unlike the first or second specific example, two inductor portions are formed on the front surface side of the insulating substrate, and one capacitor portion is formed on the back surface side. As shown in FIGS. 4 and 5, the chip component A3 of the third specific example includes an insulating substrate 12, an external through hole 62, external electrode portions 35,
6, 37, planar coils 52a and 54a, internal through-hole electrodes 60l and 60r, a lower electrode portion 64, a dielectric 72, and protective layers 90a and 90b.
Here, the insulating substrate 12 is exactly the same as the second specific example, and thus the description thereof is omitted.

Each of the external electrode portions 35, 36, and 37 is formed by screen-printing and firing a conductive paste such as silver. Each external electrode portion includes an upper electrode portion, a lower electrode portion, and a side electrode portion. , An intermediate electrode, and an upper electrode. That is, as shown in FIG. 4, on the end L side of the insulating substrate 12, when viewed from the side, the external electrode portion 35 is provided on the left side with the external through hole 62 interposed therebetween.
The external electrode portion 36 is provided on the right side,
The external electrode 3 is provided on the end R side of the insulating substrate 12.
7 Each of the external electrode portions is provided with an upper electrode portion 21, 24, 2
5, lower electrode portions 29, 30, 31 and upper electrode portion 24
And the lower surface electrode portion 29, the upper surface electrode portion 25 and the lower surface electrode portion 30, the upper surface electrode portion 21 and the lower surface electrode portion 31, and the respective side surface electrode portions 3 and 3.
Each of the intermediate electrodes 33 is formed by a nickel plating layer formed by superimposing on each of the intermediate electrodes 2, and each upper electrode 34 is formed by a solder plating layer formed by superimposing on each of the intermediate electrodes 33.

As shown in FIGS. 3A and 3B, the upper electrode portions 24 and 25 and the lower electrode portions 29 and 30 each have a rectangular shape and are formed with substantially the same area. The part 21 is formed in a substantially rectangular shape as in the first specific example. As shown in FIG. 3B, the lower surface electrode portion 31 is formed in a substantially convex shape by overlapping a part of the region from the end R of the insulating substrate 12 on a dielectric 72 described later. .

The planar coils 52a and 54a are
On the surface F side of the insulating substrate 12, a conductive paste such as silver is screen-printed in a spiral shape and baked. One end of the planar coil 52a is connected to the upper electrode portion 24, and the other end is connected to an internal through-hole electrode 60l described later.
That is, the upper electrode portion 24 and the internal through-hole electrode 60
are connected to each other to form one inductor portion.
One end of the planar coil 54a is connected to the upper electrode 25, and the other end is connected to an internal through-hole electrode 60r described later. That is, the upper electrode portion 25 and an internal through-hole electrode 60r described later are connected to form one inductor portion.

The internal through-hole electrodes 60l, 60r
Both have the same structure as the first specific example,
In the longitudinal direction of the insulating substrate 12, provided at a predetermined interval, the one closer to the end L side is the internal through-hole electrode 6.
0l, and the one closer to the end R side is the internal through-hole electrode 60r. The lower electrode portion 64 is formed by screen-printing and firing a conductive paste such as silver into a substantially rectangular shape, and as shown in FIG.
1 and 60r are covered and connected to them, and the insulating substrate 1
2 is disposed substantially at the center on the back surface B side.

As shown in FIG. 3 (b), the dielectric 72 is formed by screen-printing and firing a dielectric paste in a substantially rectangular shape with an area slightly larger than the lower electrode portion 64. The entirety of the portion 64 is polymerized, and a part of the lower electrode portion 31 is polymerized on the dielectric 72. That is, the dielectric 72 is provided between the lower layer electrode portion 64 and the lower surface electrode portion 31 and connected to these to form one capacitor portion.

The connection relation of the electronic elements in the chip part A3 is shown in the equivalent circuit diagram of FIG.
6, T13 indicates a terminal, K3 and K4 indicate coils, and E2 indicates a capacitor. The terminal T5 is connected to the upper electrode portion 24 and the terminal T
6, the terminal T13 corresponds to the lower surface electrode portion 31, the coil K3 corresponds to the planar coil 52a, the coil K4 corresponds to the planar coil 54a, and the capacitor E2 corresponds to the lower electrode portion 64 and the dielectric 72. And lower electrode part 3
This is equivalent to 1.

Each of the protective layers 90a and 90b is formed by screen printing and firing a glass paste of lead borosilicate glass or the like. As shown in FIG. 5, the protective layer 90a
Is a flat coil 52 on the front surface F side of the insulating substrate 12.
a and 54a are formed so as to cover the entirety of the protective layer 90b.
Is formed on the back surface B side of the insulating substrate 12 so as to cover at least a part of the lower electrode portion 31 and the dielectric 72 exposed from the lower electrode portion 31.

According to the chip component A3 having the above structure, the planar coils 52a and 54a and the dielectric 72 are provided on the insulating substrate 12 by screen printing, that is, a dedicated machine for forming each electronic element is used. Since it can be manufactured only by the screen printing means without using it, the manufacturing can be simplified and the manufacturing cost can be reduced. In the insulating substrate 12, two inductor portions each including the planar coils 52a and 54a are provided on the front surface F side, and one capacitor portion including the dielectric 72 is provided on the rear surface B side. The circuit can be composed of one component, the area occupied by the electronic component mounting substrate itself during mounting can be reduced, and the mounting cost can be reduced. A larger capacity can be obtained as compared with the chip component A2 of the second specific example. Since two external electrode portions 35 and 36 are provided on the end portion L side of the insulating substrate 12 and one external electrode portion 37 is provided on the end portion R side of the insulating substrate 12, the polarity due to the function can be easily recognized. By changing the color of the surface of the protective layers 90a and 90b formed on the front and back surfaces F and B of the insulating substrate 12, respectively, for example, by using black and white, it is easy to distinguish between the front and back of the chip component A3. Become.

Next, a fourth specific example will be described with reference to FIGS.
This will be described using (c). The fourth specific example corresponds to the first embodiment.
Alternatively, unlike the second or third specific example, one capacitor section is formed on the front side of the insulating substrate, and one resistor section is formed on the back side thereof. As shown in FIGS. 6A and 6B, the chip component A4 of the fourth specific example includes an insulating substrate 12, an external through hole 62, and upper electrode portions 21, 38, 39 in the external electrode portion. Lower surface electrode part 23, 2
9, 30; an internal through-hole electrode 60;
In addition, a lower electrode portion 68 on the back surface B side of the insulating substrate 12 and a resistor 80 are provided. Here, the insulating substrate 12
Is exactly the same as the second specific example, and the description is omitted here.

As in the second embodiment, the external electrode portion is formed by screen-printing and firing a conductive paste such as silver. The external electrode portion includes an upper surface electrode portion, a lower surface electrode portion, a side surface electrode portion, and an intermediate portion. It is composed of an electrode and an upper electrode. FIG.
As shown in (a), the upper surface electrode portions 21, 38, 39
In the surface F side of the end portion L side of the insulating substrate 12, when viewed in a plan view, on the left side across the external through hole 62, a substantially L-shaped exposed portion and an exposed portion thereof are formed. The upper electrode portion 38 is connected to the end of the narrowed portion, has a substantially rectangular shape, covers the internal through-hole electrode 60, and is completely covered by a dielectric 74 described later. An L-shaped portion and a portion which is connected to the tip of the substantially L-shaped portion and has a substantially rectangular shape having an area slightly smaller than an area of a dielectric 74 described later and is superposed on the dielectric 74. Is the upper surface electrode portion 39, and the surface F on the end R side of the insulating substrate 12
On the side, similarly to the first specific example, the upper surface electrode portion 21 is formed in a substantially rectangular shape. Also, as shown in FIG. 6B, the lower surface electrode portions 23, 29, and 30 have a rectangular lower surface on the back surface B side of the end portion L of the insulating substrate 12 as in the third specific example. The electrode portions 29 and 30 are formed, and on the back surface B side of the end portion R side of the insulating substrate 12,
As in the first specific example, a substantially rectangular lower surface electrode portion 23 is formed. Note that the substantially rectangular portion of the upper surface electrode portion 38 and the substantially rectangular portion of the upper surface electrode portion 39 have substantially the same area, and are disposed substantially in the center on the surface F of the insulating substrate 12. Is what is done. The internal through-hole electrode 60 is exactly the same as that of the first specific example, and a description thereof will be omitted.

As shown in FIG. 6A, the dielectric paste 74 is formed by screen-printing a dielectric paste in a substantially rectangular shape with an area slightly larger than the area of the substantially rectangular portion of the upper electrode portion 38. The baked portion covers the entire substantially rectangular portion (not shown) of the upper surface electrode portion 38 and is polymerized (see FIG. 5), and the substantially rectangular portion of the upper surface electrode portion 39 has a substantially rectangular shape. The dielectric 74 is polymerized. That is, the dielectric 74 is provided between the upper electrode section 38 and the upper electrode section 39 and is connected to these to form one capacitor section. Surface B of the insulating substrate 12
The lower electrode portion 68 provided on the side is provided with a conductive paste of silver or the like in a substantially rectangular shape, in parallel with the longitudinal direction of the lower electrode portion 23 provided, and covering the internal through-hole electrode 60, and is provided with a screen. Printed and fired. Note that one end of the lower electrode portion 68 is connected to one end of a resistor 80 described later.

As shown in FIG. 6B, the resistor 80 is formed by screen-printing and baking a resistive paste in a rectangular shape on the back surface B side of the insulating substrate 12, and one end of the resistor paste is a lower electrode. One end of the portion 68 and the other end are formed by being overlapped with one end of the lower electrode portion 23. That is,
The resistor 80 connects the lower layer electrode portion 68 and the lower surface electrode portion 23 to form one resistor portion.

The connection relationship of the electronic elements in this chip part A4 is shown in the equivalent circuit diagram of FIG.
14, T15 denotes a terminal, W denotes a resistor, and E3 denotes a capacitor. The terminal T14 is connected to the upper electrode 38 by the terminal T15.
Represents the upper electrode 39, the terminal T4 corresponds to the lower electrode 23, the capacitor E3 corresponds to the upper electrode 38, the dielectric 74, and the upper electrode 39, and the resistor W corresponds to the resistor 8
It is equivalent to 0.

Although not shown, the protective layer is made of a glass paste such as a lead borosilicate glass based on the insulating substrate 12.
Is formed by screen printing and baking so as to cover at least a part of the upper surface electrode portion 39 and the dielectric 74 exposed from the upper surface electrode portion 39, and is formed on the back surface B side of the insulating substrate 12. , At least the lower electrode portion 23
Of the resistor 80, the entire resistor 80, and at least the lower electrode portion 6
8 is formed by screen printing and baking so as to cover a part of the region. In addition, a part of the upper electrode portion 38 that is covered by the entire dielectric 74 is also covered by the protective layer.

According to the chip component A4 having the above-described configuration, the dielectric 74 and the resistor 80 are provided on the insulating substrate 12 by screen printing, that is, without using a dedicated machine for forming each electronic element. Since it can be manufactured only by the screen printing means, the manufacturing can be simplified and the manufacturing cost can be reduced. In the insulating substrate 12, one capacitor portion including the dielectric 74 is provided on the front surface F side, and one resistor portion including the resistor 80 is provided on the rear surface B side. It is possible to reduce the mounting area of the electronic component mounting board itself at the time of mounting and reduce the mounting cost. Since two external electrode portions are provided on the end portion L side of the insulating substrate 12 and one external electrode portion is provided on the end portion R side, it is easy to recognize the polarity due to the function. By changing the color of the surface of the protective layer formed on each of the front and back surfaces F and B of the insulating substrate 12, for example, by using black and white, the front and back of the chip component A4 can be easily distinguished.

Next, a fifth specific example will be described with reference to FIGS.
This will be described using (c). The fifth specific example corresponds to the first embodiment.
Alternatively, unlike the second or fourth specific example, as in the third specific example, two inductor portions are formed on the front surface side of the insulating substrate and one capacitor portion is formed on the rear surface side thereof. , The arrangement state of the inductor section, and the connection state between the dielectric in the capacitor section and each upper electrode section. As shown in FIGS. 7A and 7B, the chip component A5 of the fifth specific example has the insulating substrate 14
, External through holes 62, 63, upper electrode portions 24, 25, 40, 41 and lower electrode portion 3 in the external electrode portion
0, 42, and 43, planar coils 56a and 58a, internal through-hole electrodes 60l and 60r, a lower electrode portion (not shown), and a dielectric 76. Here, the insulating substrate 14 has a substantially rectangular parallelepiped shape mainly made of alumina, and has a substantially semicircular outer shape at each of the substantially central portions on the ends L and R sides when viewed from the side. Through holes 62 and 63 are provided one by one.

The external electrode portion is formed by screen-printing and sintering a conductive paste of silver or the like in the same manner as in the second embodiment, and includes an upper electrode portion, a lower electrode portion, a side electrode portion, and an intermediate portion. It is composed of an electrode and an upper electrode. FIG.
As shown in (a), the upper electrode portions 24, 25, 40, 4
Regarding 1, on the surface F side on the end L side of the insulating substrate 14, as in the third specific example, the upper surface electrode portion 24 is provided in a rectangular shape on the left side with the external through hole 62 therebetween when viewed in plan. The upper surface electrode portion 25 is provided on the right side with the rectangular shape on the right side, and is provided on the surface F side on the end R side of the insulating substrate 14 with the rectangular shape on the right side across the external through hole 63 when viewed in plan. Is the upper electrode section 40,
The upper surface electrode portion 41 is provided on the left side in a rectangular shape.
Further, as shown in FIG.
2 and 43, the back surface B on the end L side of the insulating substrate 14
When viewed in a plan view, the left side is disposed diagonally from the left side with the external through hole 62 interposed therebetween, and substantially L on both ends L and R sides.
It is located at the central portion by being connected to the two portions having the letter shape and the two portions having the substantially L shape, and has a substantially rectangular shape having an area slightly smaller than the area of the dielectric 76 to be described later. The lower electrode portion 42 is provided on the lower surface electrode portion 42, and the lower surface electrode portion 30 is provided on the right side in a rectangular shape as in the fourth specific example. In a plan view, the lower electrode portion 43 is provided in a rectangular shape on the right side with the external through hole 63 interposed therebetween. The upper electrode portions 24, 25, 40,
The lower electrode portion 41 and the lower electrode portions 30 and 43 have substantially the same area, and the two substantially L-shaped portions provided at both ends of the lower electrode portion 42 are formed to have substantially the same area.

The planar coils 56a and 58a are
On the surface F side of the insulating substrate 14, a conductive paste such as silver is screen-printed in the same spiral shape and baked. One end of the planar coil 56a is connected to the upper electrode 24,
The other end is connected to the internal through-hole electrode 60l. That is, the upper electrode portion 24 and the internal through-hole electrode 60l are connected to form one inductor portion. One end of the planar coil 58a is connected to the upper electrode 41, and the other end is connected to the internal through-hole electrode 60r. That is, the upper electrode portion 41 and the internal through-hole electrode 60r
The inductors are connected to form one inductor portion. Since the internal through-hole electrodes 60l and 60r are exactly the same as those in the third specific example, description thereof will be omitted.

The lower electrode portion (not shown), which is covered by the whole of the dielectric 76 described later, is made of a conductive paste such as silver in a substantially rectangular shape, and has substantially the same area as the substantially rectangular portion of the lower electrode portion 42. And fired. The lower electrode portion (not shown) covers the two internal through-hole electrodes 60l and 60r, is superimposed on the lower electrode portion, is connected thereto, and is disposed substantially at the center on the back surface B of the insulating substrate 14. As shown in FIG. 7 (b), the dielectric material 76 is obtained by screen-printing and firing a dielectric paste in a substantially rectangular shape with an area slightly larger than the area of the substantially rectangular portion of the lower electrode portion 42. The lower electrode portion (not shown) is polymerized so as to cover the entirety (see FIG. 5), and a substantially rectangular portion of the lower electrode portion 42 is polymerized on the dielectric 76. That is, the dielectric 76 is provided between the lower electrode portion (not shown) and the lower electrode portion 42, and is connected to these to form one capacitor portion.

The connection relationship of the electronic elements in this chip part A5 is shown in the equivalent circuit diagram of FIG.
17, T18 and T20 indicate terminals, K5 and K6 indicate coils, and E4 indicates a capacitor. The terminal T5 is the upper electrode 2
4, the terminal T17 corresponds to the upper electrode section 41, the terminal T18 and the terminal T20 correspond to the lower electrode section 42, respectively.
5 is a plane coil 56a, coil K6 is a plane coil 58
a, and the capacitor E4 corresponds to the lower electrode portion 42
And a dielectric 76 and a lower electrode portion (not shown).

Although not shown, the protective layer is formed by screen printing and firing a glass paste of lead borosilicate glass or the like. On the front surface F side of the insulating substrate 14, it is formed so as to cover the entire planar coils 56 a and 58 a, and on the rear surface B side of the insulating substrate 14, at least a part of the lower electrode portion 42 and exposed from the lower electrode portion 42. It is formed so as to cover the dielectric 76.

According to the chip component A5 having the above structure, the planar coils 56a and 58a and the dielectric 76 are provided on the insulating substrate 14 by screen printing, that is, a dedicated machine for forming each electronic element is used. Since it can be manufactured only by the screen printing means without using it, the manufacturing can be simplified and the manufacturing cost can be reduced. In the insulating substrate 14, two inductor portions each including the planar coils 56a and 58a are provided on the front surface F side, and one capacitor portion including the dielectric 76 is provided on the rear surface B side. The circuit can be composed of one component, and the area occupied by the electronic component mounting substrate itself during mounting can be reduced.
The mounting cost can be reduced. A larger capacity can be obtained as compared with the chip component A2 of the second specific example. By arranging the two inductor portions symmetrically on the surface F of the insulating substrate 14 and arranging the entire shape of the lower electrode portion 42 in one capacitor portion in a symmetrical manner, It is possible to obtain a chip component having no property. Accordingly, high-speed processing can be performed without the need to align the left and right directions of the chip components during characteristic inspection and taping. When replacing the chip components by hand, the left and right directions are not mistaken. By changing the color of the surface of the protective layer formed on each of the front and back surfaces F and B of the insulating substrate 14, for example, by using black and white, the front and back of the chip component A5 can be easily identified.

In this specific example, on the surface F side of the insulating substrate 14, the planar coil 56a is
The planar coil 58a is connected to the upper surface electrode portion 41 so as to be symmetrically disposed, and has a symmetrical overall shape of the lower surface electrode portion 42 on the back surface B side. The present invention is not limited to this specific example as long as the electronic elements are arranged symmetrically on both sides.

Next, a sixth specific example will be described with reference to FIGS.
This will be described using (c). The sixth example is similar to the first example.
Alternatively, unlike the chip component of the second or third or fourth or fifth specific example, the chip network component is a chip network component, in which eight inductor portions are provided on the front side of the sheet-shaped insulating substrate and four capacitor portions are provided on the back side thereof. It is formed. FIG. 8 illustrates the chip network component B1 of the sixth specific example.
(A) and (b), as shown in FIG.
, External through-holes 65, 67, through-hole upper electrode portions 45, 46, 47 and through-hole lower electrode portions 48, 49 in the through-hole electrode portion, and planar coil 5.
2a, 54a and internal through-hole electrodes 60u, 60d
, A lower electrode portion (not shown), and a dielectric 72. Here, the sheet-shaped insulating substrate 16 has a substantially rectangular parallelepiped shape mainly made of alumina, and has a predetermined interval on the end D side when viewed from the side, and has an approximately semicircular shape when viewed from above. Eight through holes 67 are provided,
In addition, four external through holes 65 each having a substantially semicircular shape when viewed in a plan view are arranged at predetermined intervals on the end U side when viewed from the side.

The above-mentioned through-hole electrode portion is formed by screen-printing and firing a conductive paste such as silver. The through-hole upper electrode portion, the through-hole lower electrode portion, the through-hole side electrode portion, and the through-hole intermediate portion. It consists of an electrode and a through-hole upper electrode. FIG. 8 (a)
As shown in FIG.
Regarding 6 and 47, on the surface F side of the end portion U side of the sheet-shaped insulating substrate 16, when viewed in a plan view, each of the four external through holes 65 is provided in a substantially concave shape with substantially the same area. The through-hole upper surface electrode portion 45, on the surface F side on the end portion D side of the sheet-shaped insulating substrate 16, alternately having substantially the same area in a substantially concave shape at each of the positions of the eight external through-holes 67 in plan view. Are provided with through-hole upper surface electrode portions 46 and 47. FIG. 8 (b)
As shown in FIG.
For the back surface B on the end U side of the sheet-shaped insulating substrate 16
On the side, when viewed in plan, four external through holes 65
Are disposed in a substantially central area, and are provided in a band shape with substantially the same area. The through-hole lower surface electrode portion 48 is provided on the rear surface B side of the end portion D side of the sheet-shaped insulating substrate 16 in a plan view. The through hole lower surface electrode portion 49 is provided in each of the positions of the external through holes 67 in a substantially concave shape with substantially the same area. In addition, each through hole lower surface electrode portion 48 is formed by superimposing on each dielectric 72 described later. The respective configurations of the through-hole side-surface electrode portion, the through-hole intermediate electrode, and the through-hole upper-layer electrode are the same as the respective configurations of the side-surface electrode portion, the intermediate electrode, and the upper-layer electrode in the second specific example. The illustration is omitted in FIGS. 8A and 8B to clarify the connection relationship with the electronic element.

Each of the four planar coils 52a, 54a is formed by spirally screen-printing and baking a conductive paste such as silver on the surface F of the sheet-like insulating substrate 16. One end of each planar coil 52a is connected to each through-hole upper electrode section 46, and the other end is connected to each internal through-hole electrode 60d described later. That is, four inductor portions are formed by connecting each of the through-hole upper surface electrode portions 46 and each of the later-described internal through-hole electrodes 60d. One end of each planar coil 54a is connected to each through-hole upper electrode 47, and the other end is connected to each internal through-hole electrode 60u described later. That is,
By connecting between each of the through-hole upper electrode portions 47 and each of the internal through-hole electrodes 60u described later,
Four inductor sections are formed.

Each of the above four internal through-hole electrodes 60
Both u and 60d have exactly the same structure as that of the first embodiment, but are provided at predetermined intervals in the width direction of the sheet-like insulating substrate 16, and the inner through holes are closer to the end U side. Each of the hole electrodes 60u, which is closer to the end D, is an internal through-hole electrode 60d. Further, in the longitudinal direction of the sheet-shaped insulating substrate 16, each internal through-hole electrode 6
A predetermined interval is also provided between 0u and between the internal through-hole electrodes 60d. Each of the four lower electrode portions is covered with a dielectric 72, which will be described later, and is not shown. The conductive paste such as silver is screen-printed in a substantially rectangular shape with substantially the same area and fired. The internal through-hole electrodes 60u and 60d are covered as a set and connected to them, and are disposed at a substantially central portion on the back surface B of the sheet-shaped insulating substrate 16.

Each of the four dielectrics 72 is shown in FIG.
As shown in (b), the dielectric paste is screen-printed in a substantially rectangular shape and baked, each of which is polymerized in an area capable of covering the entire lower electrode portion (not shown) (see FIG. 5). In addition, a part of each through hole lower surface electrode portion 48 is overlapped on each dielectric 72. That is, each dielectric 72 is provided between each lower electrode portion (not shown) and each through-hole lower electrode portion 48, and is connected to each of them to form four capacitor portions.

The connection relationship of the electronic elements in this chip network component B1 is shown in the equivalent circuit diagram of FIG. 8C, where T21, T22 and T23 indicate terminals, K3 and K4 indicate coils, and E5 indicates a capacitor. . The four terminals T21 correspond to the four upper electrode portions 46, the four terminals T22 correspond to the four upper electrode portions 47, and the four terminals T23 correspond to the four lower electrode portions 48, respectively. Coil K3 corresponds to four plane coils 52a, four coils K4 correspond to four plane coils 54a, and four capacitors E5 include four lower electrode portions 48 and four dielectrics 72 and 4 And a lower electrode portion (not shown).

Although not shown, the protective layer is formed by screen printing and firing a glass paste of lead borosilicate glass or the like. Surface F of sheet-like insulating substrate 16
On the side, the rear surface B of the sheet-shaped insulating substrate 16 is formed so as to cover the entire four planar coils 52a and 54a.
On the side, it is formed so as to cover at least a part of each of the four through-hole lower electrode portions 48 and the four dielectrics 72 exposed from the four through-hole lower electrode portions 48.

According to the chip network component B 1 having the above configuration, each planar coil 52 is placed on the sheet-like insulating substrate 16.
Since a and 54a and each dielectric 72 are provided by screen printing, that is, since they can be manufactured only by screen printing means without using a dedicated machine for forming each electronic element, the manufacturing is simplified, and Manufacturing costs can be reduced. Sheet-shaped insulating substrate 1
6, four flat coils 52 are provided on the surface F side.
Since eight inductors each including a and 54a are provided on the back surface B side, and four capacitor units including the dielectric 72 are provided, a plurality of noise suppression circuits can be constituted by one component. In addition to reducing the area occupied by the electronic component mounting board during mounting,
The mounting cost can be reduced.

In each of the above embodiments, the protective layer is formed by screen-printing and firing a glass paste of lead borosilicate glass or the like. However, a resin insulating paste of epoxy, phenol, silicon or the like is screen-printed. It may be cured. In the first to fifth specific examples, the structure of the external electrode portion is a convex electrode shape. However, a concave electrode shape using an external through hole or a side electrode portion is selectively formed on a planar end face. You may. Further, in the sixth specific example, 8
The four inductor portions are provided on the back surface B side of the two inductor portions. However, the type and number of electronic elements provided are not limited to the sixth specific example, and may be arbitrary. For example, four resistor portions may be provided on the front surface F side of the sheet-like insulating substrate 16 and eight inductor portions may be provided on the rear surface B side.

[0065]

According to the chip component of the present invention, one or a plurality of electronic elements are provided on both sides of the insulating substrate, so that the area occupied by the electronic elements on the insulating substrate is reduced. Since the size can be made larger than that of a conventional chip component in which an electronic element is provided only on one side, the effect to be generated can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced. According to the chip component of the second aspect, the noise suppression circuit can be formed of one component, and the occupation area of the electronic component mounting substrate itself during mounting can be reduced. Therefore, the mounting cost can be reduced.

Further, according to the chip component of the third aspect, by providing one electronic element on each side of the insulating substrate, the area occupied by the electronic element on the insulating substrate is limited to only one side of the insulating substrate. Can be made larger than the conventional chip component provided with the above, so that the effect to be generated can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced. According to the chip component of the fourth aspect, one electronic element is provided on one surface of the insulating substrate, and two electronic elements are provided on the other surface of the insulating substrate. Occupied area can be made larger than that of a conventional chip component in which an electronic element is provided only on one side of an insulating substrate, so that the effect to be generated can be increased. When the occupied area of the electronic element on the insulating substrate is equivalent to that of a conventional chip component in which the electronic element is provided only on one surface of the insulating substrate, the size of the chip component itself can be reduced.

According to the chip component of the fifth aspect, in particular, since a plurality of through holes are provided, for example, two through holes are provided inside the insulating substrate to form two internal through hole electrodes. When two electronic devices of the same type are provided on one surface of the insulating substrate and one electronic device of a different type from the electronic device on the other surface is provided on the other surface, two electronic devices are provided. Each of the elements is symmetrically arranged to connect to each of the internal through-hole electrodes and an external electrode on one side of the insulating substrate, and one electronic element is provided on the other side of the insulating substrate by two internal through-hole electrodes. By arranging so as to be connected to the hole electrode and the external electrode, a chip component having no left-right directionality can be obtained. Accordingly, high-speed processing can be performed without the need to align the left and right directions of the chip components during characteristic inspection and taping. Also, when replacing chip components due to poor soldering or the like, the left and right directions are not mistaken.

According to the chip component of the present invention, in particular, one external electrode is provided on one end surface of the insulating substrate.
Since two external electrodes are provided on the other end face, it is easy to recognize the polarity due to the function. Further, according to the chip component of the ninth aspect, since the electronic element is formed by only the screen printing means without using a special machine, the production of the chip component is simplified, and the production cost is reduced. Can be reduced. Further, according to the chip network component of the tenth aspect, the first, second, third, fourth, fifth, sixth, sixth, seventh, eighth, or eighth or eighth or eighth aspect of the present invention is provided. By increasing the number of the chip components described in No. 9, a plurality of noise suppression circuits can be constituted by one component, and the area occupied by the electronic component mounting board itself during mounting can be reduced. In addition, the mounting cost can be reduced.

[Brief description of the drawings]

FIGS. 1A and 1B show chip components in a manufacturing process of a first specific example according to the present invention, wherein FIG. 1A is a perspective view as viewed from the front side of an insulating substrate original plate, and FIG. It is a perspective view seen, and (c) is an equivalent circuit diagram when this chip component is completed.

FIG. 2 shows a chip component of a second specific example according to the present invention, wherein (a) is a plan view, (b) is a bottom view,
(C) is an equivalent circuit diagram.

FIG. 3 shows a chip component of a third specific example according to the present invention, wherein (a) is a plan view, (b) is a bottom view,
(C) is an equivalent circuit diagram.

FIG. 4 is a perspective view showing a chip component of a third specific example based on the present invention.

FIG. 5 is a sectional view taken along line PP of FIG. 4;

FIG. 6 shows a chip component of a fourth specific example according to the present invention, wherein (a) is a plan view, (b) is a bottom view,
(C) is an equivalent circuit diagram.

7A and 7B show a chip component of a fifth specific example according to the present invention, wherein FIG. 7A is a plan view, FIG. 7B is a bottom view,
(C) is an equivalent circuit diagram.

8 shows a chip network component of a sixth specific example according to the present invention, wherein (a) is a plan view, (b) is a bottom view, and (c) is an equivalent circuit diagram.

FIG. 9 is a plan view showing a conventional chip inductor.

10A and 10B show a conventional composite chip component, where FIG. 10A is a plan view, and FIG. 10B is a sectional view taken along line QQ of FIG. 10A.

[Explanation of symbols]

10, 12, 14 Insulating substrate 16 Sheet-shaped insulating substrate 20, 21, 24, 25, 38, 39, 40, 41 Upper electrode portion 22, 23, 26, 27, 28, 29, 30, 31, 4,
2, 43 lower surface electrode portion 32 side surface electrode portion 33 intermediate electrode 34 upper layer electrode 35, 36, 37 external electrode portion 45, 46, 47 through hole upper surface electrode portion 48, 49 through hole lower surface electrode portion 50a, 50b, 52a, 54a, 56a, 58a Planar coil 60, 60d, 60l, 60r, 60u Internal through-hole electrode 64, 68 Lower layer electrode part 70, 72, 74, 76 Dielectric 80 Resistor A1, A2, A3, A4, A5 Chip component B Insulating substrate B1 Chip network component D, U Edge of sheet-shaped insulating substrate F Surface of insulating substrate L, R Edge of insulating substrate

Claims (10)

[Claims] 1. A chip component, comprising: an external electrode provided on an insulating substrate; one or more electronic elements provided on one surface of the insulating substrate; and a chip component provided on the other surface of the insulating substrate. One or more electronic elements, and a through-hole electrode provided in a through-hole penetrating between the front surface and the back surface of the insulating substrate; and at least one electronic element provided on the surface of the insulating substrate. And at least one of the insulating substrates provided on the back surface thereof.
A chip component, wherein two electronic elements are connected by the through-hole electrode. 2. The chip component according to claim 1, wherein each of the electronic elements is formed of any one of an inductor, a capacitor, and a resistor. 3. An electronic device is provided on one surface of the insulating substrate, and one electronic device is provided on the other surface of the insulating substrate. 3. The chip component according to 1 or 2. 4. The electronic device according to claim 1, wherein one electronic element is provided on one surface of the insulating substrate, and two electronic elements are provided on the other surface of the insulating substrate. 3. The chip component according to 1 or 2. 5. The chip component according to claim 1, wherein a plurality of said through holes are provided. 6. The chip component according to claim 1, wherein a pair of the external electrodes is provided on both end surfaces of the insulating substrate. 7. The external electrode according to claim 1, wherein the external electrode includes one external electrode provided on one end surface of the insulating substrate and two external electrodes provided on the other end surface. 6. The chip component according to 3 or 4 or 5. 8. The external electrode having two external electrodes provided on one end surface of the insulating substrate and two external electrodes provided on the other end surface of the insulating substrate. 6. The chip component according to 3 or 4 or 5. 9. The chip component according to claim 1, wherein the electronic element is provided by screen printing means. 10. A chip network component obtained by multiplying the chip component according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9.