JP2004031561A5 - - Google Patents

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Publication number
JP2004031561A5
JP2004031561A5 JP2002184316A JP2002184316A JP2004031561A5 JP 2004031561 A5 JP2004031561 A5 JP 2004031561A5 JP 2002184316 A JP2002184316 A JP 2002184316A JP 2002184316 A JP2002184316 A JP 2002184316A JP 2004031561 A5 JP2004031561 A5 JP 2004031561A5
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JP
Japan
Prior art keywords
main surface
semiconductor device
connection terminals
back surface
lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002184316A
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English (en)
Japanese (ja)
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JP2004031561A (ja
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Publication date
Application filed filed Critical
Priority to JP2002184316A priority Critical patent/JP2004031561A/ja
Priority claimed from JP2002184316A external-priority patent/JP2004031561A/ja
Publication of JP2004031561A publication Critical patent/JP2004031561A/ja
Publication of JP2004031561A5 publication Critical patent/JP2004031561A5/ja
Pending legal-status Critical Current

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JP2002184316A 2002-06-25 2002-06-25 半導体装置およびその製造方法 Pending JP2004031561A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002184316A JP2004031561A (ja) 2002-06-25 2002-06-25 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002184316A JP2004031561A (ja) 2002-06-25 2002-06-25 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2004031561A JP2004031561A (ja) 2004-01-29
JP2004031561A5 true JP2004031561A5 (enExample) 2005-10-13

Family

ID=31180264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002184316A Pending JP2004031561A (ja) 2002-06-25 2002-06-25 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2004031561A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073586A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置の製造方法
KR100752648B1 (ko) * 2006-01-09 2007-08-29 삼성전자주식회사 솔더 조인트 신뢰성이 개선된 반도체 패키지 및 그제조방법
JP4830884B2 (ja) * 2007-02-06 2011-12-07 ルネサスエレクトロニクス株式会社 半導体装置
CN115321467A (zh) * 2022-09-06 2022-11-11 合肥领航微系统集成有限公司 Mems芯片封装结构、具有其的超声波传感器及封装工艺

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