JP2004023096A - ヒートシンク装置 - Google Patents

ヒートシンク装置 Download PDF

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Publication number
JP2004023096A
JP2004023096A JP2003140844A JP2003140844A JP2004023096A JP 2004023096 A JP2004023096 A JP 2004023096A JP 2003140844 A JP2003140844 A JP 2003140844A JP 2003140844 A JP2003140844 A JP 2003140844A JP 2004023096 A JP2004023096 A JP 2004023096A
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JP
Japan
Prior art keywords
heat sink
conductive layer
attached
protrusion
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003140844A
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English (en)
Japanese (ja)
Other versions
JP2004023096A5 (enExample
Inventor
Lewis R Dove
ルイス・アール・ドーヴ
Marvin G Wong
マーヴィン・ジー・ワング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
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Agilent Technologies Inc
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Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2004023096A publication Critical patent/JP2004023096A/ja
Publication of JP2004023096A5 publication Critical patent/JP2004023096A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003140844A 2002-06-20 2003-05-19 ヒートシンク装置 Pending JP2004023096A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/176,025 US6625028B1 (en) 2002-06-20 2002-06-20 Heat sink apparatus that provides electrical isolation for integrally shielded circuit

Publications (2)

Publication Number Publication Date
JP2004023096A true JP2004023096A (ja) 2004-01-22
JP2004023096A5 JP2004023096A5 (enExample) 2006-06-08

Family

ID=28041306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003140844A Pending JP2004023096A (ja) 2002-06-20 2003-05-19 ヒートシンク装置

Country Status (4)

Country Link
US (2) US6625028B1 (enExample)
JP (1) JP2004023096A (enExample)
SG (1) SG103383A1 (enExample)
TW (1) TW200400606A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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JP2018097312A (ja) * 2016-12-16 2018-06-21 カシオ計算機株式会社 電子装置、投影装置及び電子装置の製造方法
KR20190111675A (ko) * 2018-03-23 2019-10-02 주식회사 네패스 전력 반도체 패키지 및 그 제조 방법

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US6625028B1 (en) 2003-09-23

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