JP2004022857A5 - - Google Patents

Download PDF

Info

Publication number
JP2004022857A5
JP2004022857A5 JP2002176769A JP2002176769A JP2004022857A5 JP 2004022857 A5 JP2004022857 A5 JP 2004022857A5 JP 2002176769 A JP2002176769 A JP 2002176769A JP 2002176769 A JP2002176769 A JP 2002176769A JP 2004022857 A5 JP2004022857 A5 JP 2004022857A5
Authority
JP
Japan
Prior art keywords
substrate
hydrophobizing
vaporizing
moisture
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002176769A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004022857A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002176769A priority Critical patent/JP2004022857A/ja
Priority claimed from JP2002176769A external-priority patent/JP2004022857A/ja
Publication of JP2004022857A publication Critical patent/JP2004022857A/ja
Publication of JP2004022857A5 publication Critical patent/JP2004022857A5/ja
Pending legal-status Critical Current

Links

JP2002176769A 2002-06-18 2002-06-18 基板処理装置、基板処理方法及び半導体装置の製造方法 Pending JP2004022857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002176769A JP2004022857A (ja) 2002-06-18 2002-06-18 基板処理装置、基板処理方法及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002176769A JP2004022857A (ja) 2002-06-18 2002-06-18 基板処理装置、基板処理方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2004022857A JP2004022857A (ja) 2004-01-22
JP2004022857A5 true JP2004022857A5 (enExample) 2005-10-13

Family

ID=31174985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002176769A Pending JP2004022857A (ja) 2002-06-18 2002-06-18 基板処理装置、基板処理方法及び半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2004022857A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101526760B (zh) * 2009-04-10 2011-09-07 友达光电股份有限公司 基板处理系统及显影方法
JP5638883B2 (ja) * 2010-09-09 2014-12-10 ラピスセミコンダクタ株式会社 感光性レジストパターンの形成方法、及び半導体装置の製造方法
CN107011719A (zh) * 2017-05-04 2017-08-04 德清美联新材料科技有限公司 一种用于涂敷剂的疏水超细二氧化硅的制备方法

Similar Documents

Publication Publication Date Title
JP2007514327A5 (enExample)
WO2010011515A3 (en) Medical devices having inorganic barrier coatings
JP2010528459A5 (enExample)
WO2002009166A1 (en) Method for manufacturing semiconductor device, substrate treater, and substrate treatment system
JP2003174007A5 (enExample)
KR20120022632A (ko) 기판처리방법 및 기판처리장치
JP2006186112A5 (enExample)
JP2019169555A (ja) 基板処理方法及び基板処理装置
JP2010024484A5 (ja) 表面処理方法
JP2018107426A (ja) 基板処理装置及び基板処理方法
TW200739727A (en) Semiconductor processing system and vaporizer
US6598314B1 (en) Method of drying wafers
WO2007126445A3 (en) Method and system for patterning a dielectric film
JP2004022857A5 (enExample)
JPH05326464A (ja) 基板表面の気相洗浄方法
WO2005123281A3 (en) System and method for carrying out liquid and subsequent drying treatments on one or more wafers
JP2001185491A (ja) 雛壇形シャワーヘッド、及びそのシャワーヘッドを用いた真空処理装置
JP2010170036A5 (ja) 電気光学装置の製造方法および電気光学装置の製造装置
JP2004356486A (ja) 有機物除去方法および装置
JP2004103850A (ja) レジスト塗布方法及び装置
JPS63199423A (ja) 半導体基板表面処理方法
JP2010020255A5 (enExample)
JP2004022857A (ja) 基板処理装置、基板処理方法及び半導体装置の製造方法
JP3893939B2 (ja) レジスト剥離装置、レジスト剥離方法、半導体装置の製造方法
JP4293596B2 (ja) 乾燥処理方法