JP2004010961A5 - - Google Patents
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- Publication number
- JP2004010961A5 JP2004010961A5 JP2002166111A JP2002166111A JP2004010961A5 JP 2004010961 A5 JP2004010961 A5 JP 2004010961A5 JP 2002166111 A JP2002166111 A JP 2002166111A JP 2002166111 A JP2002166111 A JP 2002166111A JP 2004010961 A5 JP2004010961 A5 JP 2004010961A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- processing apparatus
- cleaning
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 57
- 238000007747 plating Methods 0.000 claims 32
- 238000004140 cleaning Methods 0.000 claims 18
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000007921 spray Substances 0.000 claims 3
- 239000003054 catalyst Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007781 pre-processing Methods 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002166111A JP3871613B2 (ja) | 2002-06-06 | 2002-06-06 | 無電解めっき装置及び方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002166111A JP3871613B2 (ja) | 2002-06-06 | 2002-06-06 | 無電解めっき装置及び方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004010961A JP2004010961A (ja) | 2004-01-15 |
JP2004010961A5 true JP2004010961A5 (enrdf_load_stackoverflow) | 2005-06-30 |
JP3871613B2 JP3871613B2 (ja) | 2007-01-24 |
Family
ID=30433784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002166111A Expired - Fee Related JP3871613B2 (ja) | 2002-06-06 | 2002-06-06 | 無電解めっき装置及び方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3871613B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7794530B2 (en) * | 2006-12-22 | 2010-09-14 | Lam Research Corporation | Electroless deposition of cobalt alloys |
JP5004611B2 (ja) * | 2007-02-15 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP6560572B2 (ja) * | 2015-09-14 | 2019-08-14 | 株式会社荏原製作所 | 反転機および基板研磨装置 |
KR102584514B1 (ko) | 2020-07-09 | 2023-10-06 | 세메스 주식회사 | 기판 반송 장치, 기판 처리 장치 및 방법 |
JP7663453B2 (ja) * | 2021-08-04 | 2025-04-16 | 株式会社荏原製作所 | 基板処理方法および基板処理装置 |
KR102499962B1 (ko) * | 2021-11-04 | 2023-02-16 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 및 기판 세정 방법 |
CN114351149B (zh) * | 2021-12-07 | 2023-09-26 | 马鞍山市鑫龙特钢有限公司 | 一种40Cr合金钢材加工用表面防氧化处理装置 |
-
2002
- 2002-06-06 JP JP2002166111A patent/JP3871613B2/ja not_active Expired - Fee Related
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