JP2004010466A5 - - Google Patents

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Publication number
JP2004010466A5
JP2004010466A5 JP2002170520A JP2002170520A JP2004010466A5 JP 2004010466 A5 JP2004010466 A5 JP 2004010466A5 JP 2002170520 A JP2002170520 A JP 2002170520A JP 2002170520 A JP2002170520 A JP 2002170520A JP 2004010466 A5 JP2004010466 A5 JP 2004010466A5
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JP
Japan
Prior art keywords
heating
material substrate
region
temperature
brittle material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002170520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004010466A (ja
JP4408607B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002170520A priority Critical patent/JP4408607B2/ja
Priority claimed from JP2002170520A external-priority patent/JP4408607B2/ja
Priority to TW092113548A priority patent/TW200307586A/zh
Priority to KR1020030034598A priority patent/KR100925287B1/ko
Priority to CNB031412890A priority patent/CN100431108C/zh
Publication of JP2004010466A publication Critical patent/JP2004010466A/ja
Publication of JP2004010466A5 publication Critical patent/JP2004010466A5/ja
Application granted granted Critical
Publication of JP4408607B2 publication Critical patent/JP4408607B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002170520A 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置 Expired - Fee Related JP4408607B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置
TW092113548A TW200307586A (en) 2002-06-11 2003-05-20 Scribing method and scribing device
KR1020030034598A KR100925287B1 (ko) 2002-06-11 2003-05-30 스크라이브 방법 및 스크라이브 장치
CNB031412890A CN100431108C (zh) 2002-06-11 2003-06-11 划线方法和划线装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Publications (3)

Publication Number Publication Date
JP2004010466A JP2004010466A (ja) 2004-01-15
JP2004010466A5 true JP2004010466A5 (https=) 2005-09-29
JP4408607B2 JP4408607B2 (ja) 2010-02-03

Family

ID=29996454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002170520A Expired - Fee Related JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Country Status (4)

Country Link
JP (1) JP4408607B2 (https=)
KR (1) KR100925287B1 (https=)
CN (1) CN100431108C (https=)
TW (1) TW200307586A (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
EP1747867A1 (en) * 2004-05-20 2007-01-31 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard cutting method, motherboard scribing apparatus, program and recording medium
KR100602623B1 (ko) * 2004-05-31 2006-07-19 윤종진 덩어리 고무의 절단장치
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
US7423818B2 (en) * 2005-07-15 2008-09-09 Electro Scientific Industries, Inc. Method of suppressing distortion of a working laser beam of a laser link processing system
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
JP4251203B2 (ja) 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
CN101687686A (zh) * 2007-04-30 2010-03-31 康宁股份有限公司 用于刻划移动玻璃带的装置、系统和方法
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8051679B2 (en) 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
JP5202595B2 (ja) 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
WO2012075097A1 (en) * 2010-11-30 2012-06-07 Corning Incorporated Methods for separating a sheet of brittle material
US8978528B2 (en) 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
US20200324429A1 (en) * 2016-05-31 2020-10-15 Faurecia (China) Holding Co., Ltd. Release agent supply device for cold knife weakening and a cold knife system comprising such a device
CN107336369B (zh) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 玻璃瓶分割回收环保装置
CN108032354B (zh) * 2017-10-25 2020-03-17 苏州三鑫时代新材料股份有限公司 一种光扩散板的切边自动分离方法及自动分离装置
CN113751789B (zh) * 2021-09-29 2022-11-11 南通东海机床制造集团有限公司 一种剪板机剪切快速定位装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP3895179B2 (ja) * 1999-11-24 2007-03-22 アプライド・フォトニクス・インコーポレーテッド 非金属基板を分離する方法及び装置
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

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