JP2003526221A5 - - Google Patents

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Publication number
JP2003526221A5
JP2003526221A5 JP2001565717A JP2001565717A JP2003526221A5 JP 2003526221 A5 JP2003526221 A5 JP 2003526221A5 JP 2001565717 A JP2001565717 A JP 2001565717A JP 2001565717 A JP2001565717 A JP 2001565717A JP 2003526221 A5 JP2003526221 A5 JP 2003526221A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001565717A
Other versions
JP2003526221A (ja
Filing date
Publication date
Priority claimed from US09/518,491 external-priority patent/US6404649B1/en
Application filed filed Critical
Publication of JP2003526221A publication Critical patent/JP2003526221A/ja
Publication of JP2003526221A5 publication Critical patent/JP2003526221A5/ja
Pending legal-status Critical Current

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JP2001565717A 2000-03-03 2000-11-21 Ｂｇａパッケージのためのバイパス減結合が改良されたプリント回路基板アセンブリ Pending JP2003526221A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/518,491 US6404649B1 (en) 2000-03-03 2000-03-03 Printed circuit board assembly with improved bypass decoupling for BGA packages
US09/518,491 2000-03-03
PCT/US2000/031960 WO2001067833A1 (en) 2000-03-03 2000-11-21 A printed circuit board assembly with improved bypass decoupling for bga packages

Publications (2)

Publication Number Publication Date
JP2003526221A JP2003526221A (ja) 2003-09-02
JP2003526221A5 true JP2003526221A5 (ja) 2007-12-06

Family

ID=24064157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001565717A Pending JP2003526221A (ja) 2000-03-03 2000-11-21 Ｂｇａパッケージのためのバイパス減結合が改良されたプリント回路基板アセンブリ

Country Status (7)

Country Link
US (1) US6404649B1 (ja)
EP (1) EP1260121B1 (ja)
JP (1) JP2003526221A (ja)
KR (1) KR100747130B1 (ja)
CN (1) CN1204793C (ja)
DE (1) DE60029011T2 (ja)
WO (1) WO2001067833A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247932B1 (en) 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
TW502492B (en) * 2000-05-30 2002-09-11 Alps Electric Co Ltd Electronic circuit unit
US6900991B2 (en) * 2001-12-03 2005-05-31 Intel Corporation Electronic assembly with sandwiched capacitors and methods of manufacture
US20040000704A1 (en) * 2002-07-01 2004-01-01 George Tsao Process for grid array assembly and electronic device made thereby
US7005736B2 (en) * 2002-09-30 2006-02-28 Intel Corporation Semiconductor device power interconnect striping
US20040125580A1 (en) * 2002-12-31 2004-07-01 Intel Corporation Mounting capacitors under ball grid array
US7153723B1 (en) 2003-12-04 2006-12-26 Emc Corporation Method of forming a ball grid array device
US7235875B2 (en) * 2004-12-09 2007-06-26 International Business Machines Corporation Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
KR100714625B1 (ko) * 2005-10-18 2007-05-07 삼성전기주식회사 박막 캐패시터 내장형 인쇄회로기판의 제조방법
US7622325B2 (en) * 2005-10-29 2009-11-24 Stats Chippac Ltd. Integrated circuit package system including high-density small footprint system-in-package
US8222079B2 (en) 2007-09-28 2012-07-17 International Business Machines Corporation Semiconductor device and method of making semiconductor device
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US9607935B2 (en) 2009-04-21 2017-03-28 Ati Technologies Ulc Semiconductor chip package with undermount passive devices
US8289727B2 (en) 2010-06-11 2012-10-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package substrate
US8631706B2 (en) 2010-07-21 2014-01-21 International Business Machines Corporation Noise suppressor for semiconductor packages
US9510448B2 (en) 2014-08-29 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
US9769926B2 (en) * 2015-04-23 2017-09-19 Dell Products L.P. Breakout via system
US11495588B2 (en) 2018-12-07 2022-11-08 Advanced Micro Devices, Inc. Circuit board with compact passive component arrangement

Family Cites Families (28)

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US4734818A (en) * 1985-01-22 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages
GB2176654B (en) 1985-06-11 1988-08-10 Avx Corp Method for optimising the decoupling of integrated circuit devices
US4779164A (en) * 1986-12-12 1988-10-18 Menzies Jr L William Surface mounted decoupling capacitor
JPS63157919U (ja) * 1987-04-01 1988-10-17
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US5010447A (en) * 1988-12-28 1991-04-23 Texas Instruments Incorporated Divided capacitor mounting pads
US4885841A (en) * 1989-02-21 1989-12-12 Micron Technology, Inc. Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
US5272590A (en) * 1990-02-12 1993-12-21 Hernandez Jorge M Integrated circuit package having an internal cavity for incorporating decoupling capacitor
US5309324A (en) * 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
KR0134648B1 (ko) * 1994-06-09 1998-04-20 김광호 노이즈가 적은 적층 멀티칩 패키지
JPH0982557A (ja) 1995-09-18 1997-03-28 Canon Inc バイパスコンデンサ
JPH09102432A (ja) 1995-10-05 1997-04-15 Canon Inc バイパスコンデンサ及びその形成方法
JPH09130031A (ja) * 1995-10-27 1997-05-16 Hitachi Ltd 電子部品の実装方法
JPH09223861A (ja) 1996-02-19 1997-08-26 Canon Inc 半導体集積回路及びプリント配線基板
US5654676A (en) * 1996-06-10 1997-08-05 Motorola, Inc. Shielded VCO module having trimmable capacitor plate external to shield
US5751555A (en) * 1996-08-19 1998-05-12 Motorola, Inc. Electronic component having reduced capacitance
JPH1084011A (ja) 1996-09-06 1998-03-31 Hitachi Ltd 半導体装置及びこの製造方法並びにその実装方法
US5841686A (en) * 1996-11-22 1998-11-24 Ma Laboratories, Inc. Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate
JP2845227B2 (ja) * 1996-11-29 1999-01-13 日本電気株式会社 マルチチップモジュールの実装構造
KR19980084427A (ko) * 1997-05-23 1998-12-05 김영환 패키지장치의 내장형 바이패스 커패시터
US5798567A (en) * 1997-08-21 1998-08-25 Hewlett-Packard Company Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
US6272020B1 (en) * 1997-10-16 2001-08-07 Hitachi, Ltd. Structure for mounting a semiconductor device and a capacitor device on a substrate
JPH11121899A (ja) * 1997-10-20 1999-04-30 Fuji Xerox Co Ltd 電子部品実装体および電子部品の実装方法
US5939782A (en) * 1998-03-03 1999-08-17 Sun Microsystems, Inc. Package construction for integrated circuit chip with bypass capacitor
JPH11260999A (ja) * 1998-03-13 1999-09-24 Sumitomo Metal Ind Ltd ノイズを低減した積層半導体装置モジュール
US5973928A (en) * 1998-08-18 1999-10-26 International Business Machines Corporation Multi-layer ceramic substrate decoupling
US6144559A (en) * 1999-04-08 2000-11-07 Agilent Technologies Process for assembling an interposer to probe dense pad arrays
JP4484176B2 (ja) * 2000-01-21 2010-06-16 イビデン株式会社 ボールグリッドアレイ型パッケージの接続構造

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