|
US6303523B2
(en)
*
|
1998-02-11 |
2001-10-16 |
Applied Materials, Inc. |
Plasma processes for depositing low dielectric constant films
|
|
US6660656B2
(en)
*
|
1998-02-11 |
2003-12-09 |
Applied Materials Inc. |
Plasma processes for depositing low dielectric constant films
|
|
US6902771B2
(en)
*
|
2000-02-01 |
2005-06-07 |
Jsr Corporation |
Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
|
|
US6582777B1
(en)
*
|
2000-02-17 |
2003-06-24 |
Applied Materials Inc. |
Electron beam modification of CVD deposited low dielectric constant materials
|
|
CN1279589C
(zh)
*
|
2001-01-19 |
2006-10-11 |
东京毅力科创株式会社 |
基板的处理方法和基板的处理装置
|
|
US7026053B2
(en)
*
|
2001-01-29 |
2006-04-11 |
Jsr Corporation |
Process for producing silica-based film, silica-based film, insulating film, and semiconductor device
|
|
US7095460B2
(en)
|
2001-02-26 |
2006-08-22 |
Samsung Electronics Co., Ltd. |
Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same
|
|
US7091137B2
(en)
*
|
2001-12-14 |
2006-08-15 |
Applied Materials |
Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
|
|
US6890850B2
(en)
*
|
2001-12-14 |
2005-05-10 |
Applied Materials, Inc. |
Method of depositing dielectric materials in damascene applications
|
|
US6838393B2
(en)
*
|
2001-12-14 |
2005-01-04 |
Applied Materials, Inc. |
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
|
|
US20030211244A1
(en)
*
|
2002-04-11 |
2003-11-13 |
Applied Materials, Inc. |
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
|
|
US6815373B2
(en)
*
|
2002-04-16 |
2004-11-09 |
Applied Materials Inc. |
Use of cyclic siloxanes for hardness improvement of low k dielectric films
|
|
EP1504138A2
(en)
*
|
2002-05-08 |
2005-02-09 |
Applied Materials, Inc. |
Method for using low dielectric constant film by electron beam
|
|
US7060330B2
(en)
*
|
2002-05-08 |
2006-06-13 |
Applied Materials, Inc. |
Method for forming ultra low k films using electron beam
|
|
US6936551B2
(en)
*
|
2002-05-08 |
2005-08-30 |
Applied Materials Inc. |
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
|
|
US7056560B2
(en)
*
|
2002-05-08 |
2006-06-06 |
Applies Materials Inc. |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
|
|
US20040266123A1
(en)
*
|
2002-05-08 |
2004-12-30 |
Applied Materials, Inc. |
Electron beam treatment of SixNy films
|
|
US20040101632A1
(en)
*
|
2002-11-22 |
2004-05-27 |
Applied Materials, Inc. |
Method for curing low dielectric constant film by electron beam
|
|
US7749563B2
(en)
*
|
2002-10-07 |
2010-07-06 |
Applied Materials, Inc. |
Two-layer film for next generation damascene barrier application with good oxidation resistance
|
|
US6790788B2
(en)
*
|
2003-01-13 |
2004-09-14 |
Applied Materials Inc. |
Method of improving stability in low k barrier layers
|
|
US6914014B2
(en)
*
|
2003-01-13 |
2005-07-05 |
Applied Materials, Inc. |
Method for curing low dielectric constant film using direct current bias
|
|
US6897163B2
(en)
*
|
2003-01-31 |
2005-05-24 |
Applied Materials, Inc. |
Method for depositing a low dielectric constant film
|
|
US7011890B2
(en)
*
|
2003-03-03 |
2006-03-14 |
Applied Materials Inc. |
Modulated/composited CVD low-k films with improved mechanical and electrical properties for nanoelectronic devices
|
|
US7098149B2
(en)
*
|
2003-03-04 |
2006-08-29 |
Air Products And Chemicals, Inc. |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
|
|
TWI240959B
(en)
|
2003-03-04 |
2005-10-01 |
Air Prod & Chem |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure
|
|
US6913992B2
(en)
|
2003-03-07 |
2005-07-05 |
Applied Materials, Inc. |
Method of modifying interlayer adhesion
|
|
US7288292B2
(en)
*
|
2003-03-18 |
2007-10-30 |
International Business Machines Corporation |
Ultra low k (ULK) SiCOH film and method
|
|
JP4372442B2
(ja)
*
|
2003-03-28 |
2009-11-25 |
東京エレクトロン株式会社 |
電子ビーム処理方法及び電子ビーム処理装置
|
|
US7091126B2
(en)
*
|
2003-04-24 |
2006-08-15 |
Taiwan Semiconductor Manufacturing Company |
Method for copper surface smoothing
|
|
US20040253378A1
(en)
*
|
2003-06-12 |
2004-12-16 |
Applied Materials, Inc. |
Stress reduction of SIOC low k film by addition of alkylenes to OMCTS based processes
|
|
US20050037153A1
(en)
*
|
2003-08-14 |
2005-02-17 |
Applied Materials, Inc. |
Stress reduction of sioc low k films
|
|
US7147900B2
(en)
*
|
2003-08-14 |
2006-12-12 |
Asm Japan K.K. |
Method for forming silicon-containing insulation film having low dielectric constant treated with electron beam radiation
|
|
US7030041B2
(en)
|
2004-03-15 |
2006-04-18 |
Applied Materials Inc. |
Adhesion improvement for low k dielectrics
|
|
US7060638B2
(en)
*
|
2004-03-23 |
2006-06-13 |
Applied Materials |
Method of forming low dielectric constant porous films
|
|
US20050214457A1
(en)
*
|
2004-03-29 |
2005-09-29 |
Applied Materials, Inc. |
Deposition of low dielectric constant films by N2O addition
|
|
US7611996B2
(en)
*
|
2004-03-31 |
2009-11-03 |
Applied Materials, Inc. |
Multi-stage curing of low K nano-porous films
|
|
US20050227502A1
(en)
*
|
2004-04-12 |
2005-10-13 |
Applied Materials, Inc. |
Method for forming an ultra low dielectric film by forming an organosilicon matrix and large porogens as a template for increased porosity
|
|
US20050233555A1
(en)
*
|
2004-04-19 |
2005-10-20 |
Nagarajan Rajagopalan |
Adhesion improvement for low k dielectrics to conductive materials
|
|
US7229911B2
(en)
*
|
2004-04-19 |
2007-06-12 |
Applied Materials, Inc. |
Adhesion improvement for low k dielectrics to conductive materials
|
|
US7018941B2
(en)
|
2004-04-21 |
2006-03-28 |
Applied Materials, Inc. |
Post treatment of low k dielectric films
|
|
US20050277302A1
(en)
*
|
2004-05-28 |
2005-12-15 |
Nguyen Son V |
Advanced low dielectric constant barrier layers
|
|
US7229041B2
(en)
*
|
2004-06-30 |
2007-06-12 |
Ohio Central Steel Company |
Lifting lid crusher
|
|
US7288205B2
(en)
|
2004-07-09 |
2007-10-30 |
Applied Materials, Inc. |
Hermetic low dielectric constant layer for barrier applications
|
|
JP2006056741A
(ja)
*
|
2004-08-19 |
2006-03-02 |
Sumitomo Electric Ind Ltd |
水素化炭素膜の改質方法および水素化炭素膜
|
|
US7422776B2
(en)
*
|
2004-08-24 |
2008-09-09 |
Applied Materials, Inc. |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
|
|
US20060105106A1
(en)
*
|
2004-11-16 |
2006-05-18 |
Applied Materials, Inc. |
Tensile and compressive stressed materials for semiconductors
|
|
CN1787186A
(zh)
*
|
2004-12-09 |
2006-06-14 |
富士通株式会社 |
半导体器件制造方法
|
|
US7588803B2
(en)
*
|
2005-02-01 |
2009-09-15 |
Applied Materials, Inc. |
Multi step ebeam process for modifying dielectric materials
|
|
US7425350B2
(en)
*
|
2005-04-29 |
2008-09-16 |
Asm Japan K.K. |
Apparatus, precursors and deposition methods for silicon-containing materials
|
|
US7247582B2
(en)
*
|
2005-05-23 |
2007-07-24 |
Applied Materials, Inc. |
Deposition of tensile and compressive stressed materials
|
|
US7777197B2
(en)
|
2005-06-02 |
2010-08-17 |
Applied Materials, Inc. |
Vacuum reaction chamber with x-lamp heater
|
|
US20060289795A1
(en)
*
|
2005-06-02 |
2006-12-28 |
Dubois Dale R |
Vacuum reaction chamber with x-lamp heater
|
|
JP2008546191A
(ja)
*
|
2005-06-03 |
2008-12-18 |
シーエスジー ソーラー アクチェンゲゼルシャフト |
薄膜シリコン・オン・グラスの水素化装置およびその方法
|
|
US20060289966A1
(en)
*
|
2005-06-22 |
2006-12-28 |
Dani Ashay A |
Silicon wafer with non-soluble protective coating
|
|
US20070134435A1
(en)
*
|
2005-12-13 |
2007-06-14 |
Ahn Sang H |
Method to improve the ashing/wet etch damage resistance and integration stability of low dielectric constant films
|
|
US7601651B2
(en)
*
|
2006-03-31 |
2009-10-13 |
Applied Materials, Inc. |
Method to improve the step coverage and pattern loading for dielectric films
|
|
US7780865B2
(en)
*
|
2006-03-31 |
2010-08-24 |
Applied Materials, Inc. |
Method to improve the step coverage and pattern loading for dielectric films
|
|
US20070287301A1
(en)
*
|
2006-03-31 |
2007-12-13 |
Huiwen Xu |
Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
|
|
US7851384B2
(en)
*
|
2006-06-01 |
2010-12-14 |
Applied Materials, Inc. |
Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film
|
|
US7297376B1
(en)
|
2006-07-07 |
2007-11-20 |
Applied Materials, Inc. |
Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers
|
|
CN102047411B
(zh)
*
|
2008-06-17 |
2015-08-05 |
富士通株式会社 |
半导体装置及其制造方法
|
|
US8563095B2
(en)
*
|
2010-03-15 |
2013-10-22 |
Applied Materials, Inc. |
Silicon nitride passivation layer for covering high aspect ratio features
|
|
US8574728B2
(en)
|
2011-03-15 |
2013-11-05 |
Kennametal Inc. |
Aluminum oxynitride coated article and method of making the same
|
|
US8765234B2
(en)
|
2011-07-29 |
2014-07-01 |
Applied Materials, Inc. |
Electron beam plasma chamber
|
|
US9138864B2
(en)
|
2013-01-25 |
2015-09-22 |
Kennametal Inc. |
Green colored refractory coatings for cutting tools
|
|
US9018108B2
(en)
|
2013-01-25 |
2015-04-28 |
Applied Materials, Inc. |
Low shrinkage dielectric films
|
|
US9017809B2
(en)
|
2013-01-25 |
2015-04-28 |
Kennametal Inc. |
Coatings for cutting tools
|
|
US9427808B2
(en)
|
2013-08-30 |
2016-08-30 |
Kennametal Inc. |
Refractory coatings for cutting tools
|
|
US10217704B1
(en)
|
2017-01-05 |
2019-02-26 |
National Technology & Engineering Solutions Of Sandia, Llc |
Method for simultaneous modification of multiple semiconductor device features
|
|
US20180274100A1
(en)
|
2017-03-24 |
2018-09-27 |
Applied Materials, Inc. |
Alternating between deposition and treatment of diamond-like carbon
|
|
KR102271768B1
(ko)
|
2017-04-07 |
2021-06-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
반응성 어닐링을 사용하는 갭충전
|
|
SE543442C2
(en)
|
2019-02-01 |
2021-02-16 |
Ionautics Ab |
A method and apparatus for chemical vapor deposition and a Fin field-effect transistor
|