JP2003522424A5 - - Google Patents
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- Publication number
- JP2003522424A5 JP2003522424A5 JP2001557972A JP2001557972A JP2003522424A5 JP 2003522424 A5 JP2003522424 A5 JP 2003522424A5 JP 2001557972 A JP2001557972 A JP 2001557972A JP 2001557972 A JP2001557972 A JP 2001557972A JP 2003522424 A5 JP2003522424 A5 JP 2003522424A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing composition
- semiconductor substrate
- siloxane
- soluble silanol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 description 27
- 239000000203 mixture Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- -1 siloxane compound Chemical class 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17967900P | 2000-02-02 | 2000-02-02 | |
| US60/179,679 | 2000-02-02 | ||
| PCT/US2001/003367 WO2001057150A1 (en) | 2000-02-02 | 2001-02-02 | Polishing composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003522424A JP2003522424A (ja) | 2003-07-22 |
| JP2003522424A5 true JP2003522424A5 (https=) | 2008-03-13 |
Family
ID=22657533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001557972A Pending JP2003522424A (ja) | 2000-02-02 | 2001-02-02 | 研磨組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7070485B2 (https=) |
| EP (1) | EP1263906A1 (https=) |
| JP (1) | JP2003522424A (https=) |
| KR (1) | KR100756469B1 (https=) |
| TW (1) | TW572979B (https=) |
| WO (1) | WO2001057150A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7524346B2 (en) * | 2002-01-25 | 2009-04-28 | Dupont Air Products Nanomaterials Llc | Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates |
| US7037184B2 (en) | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| US6852020B2 (en) | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
| WO2004040633A1 (en) * | 2002-10-25 | 2004-05-13 | Intersurface Dynamics, Inc. | Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics |
| US8025808B2 (en) * | 2003-04-25 | 2011-09-27 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machine ceramics |
| JP4339034B2 (ja) * | 2003-07-01 | 2009-10-07 | 花王株式会社 | 研磨液組成物 |
| US20050045852A1 (en) * | 2003-08-29 | 2005-03-03 | Ameen Joseph G. | Particle-free polishing fluid for nickel-based coating planarization |
| US8759216B2 (en) * | 2006-06-07 | 2014-06-24 | Cabot Microelectronics Corporation | Compositions and methods for polishing silicon nitride materials |
| CN101588894B (zh) * | 2006-12-20 | 2013-03-27 | 圣戈本陶瓷及塑料股份有限公司 | 机械加工无机非金属工件的方法 |
| MY150487A (en) * | 2008-09-19 | 2014-01-30 | Cabot Microelectronics Corp | Barrier slurry for low-k dielectrics. |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338377A (en) * | 1979-10-10 | 1982-07-06 | Minnesota Mining And Manufacturing Company | Sulfonato-organosilanol compounds and aqueous solutions thereof |
| US4480009A (en) * | 1980-12-15 | 1984-10-30 | M&T Chemicals Inc. | Siloxane-containing polymers |
| US4537914A (en) * | 1983-07-06 | 1985-08-27 | Creative Products Resource Associates, Ltd. | Floor cleaning and waxing composition |
| JPS61136909A (ja) * | 1984-12-04 | 1986-06-24 | Mitsubishi Chem Ind Ltd | 無水ケイ酸の水分散液組成物 |
| DE3735158A1 (de) | 1987-10-16 | 1989-05-03 | Wacker Chemitronic | Verfahren zum schleierfreien polieren von halbleiterscheiben |
| JP2714411B2 (ja) | 1988-12-12 | 1998-02-16 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | ウェハーのファイン研摩用組成物 |
| US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
| US5391258A (en) | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
| US5614444A (en) | 1995-06-06 | 1997-03-25 | Sematech, Inc. | Method of using additives with silica-based slurries to enhance selectivity in metal CMP |
| US5681055A (en) * | 1995-09-28 | 1997-10-28 | Morton International, Inc. | Side-impact airbag module assembly incorporating combination airbag inflator and module housing |
| US5645736A (en) * | 1995-12-29 | 1997-07-08 | Symbios Logic Inc. | Method for polishing a wafer |
| KR970042941A (ko) * | 1995-12-29 | 1997-07-26 | 베일리 웨인 피 | 기계적 화학적 폴리싱 공정을 위한 폴리싱 합성물 |
| US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
| US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| JPH11345789A (ja) * | 1998-06-01 | 1999-12-14 | Toshiba Corp | 研磨方法 |
| JP4257687B2 (ja) * | 1999-01-11 | 2009-04-22 | 株式会社トクヤマ | 研磨剤および研磨方法 |
| US6582623B1 (en) | 1999-07-07 | 2003-06-24 | Cabot Microelectronics Corporation | CMP composition containing silane modified abrasive particles |
| US6602112B2 (en) * | 2000-01-18 | 2003-08-05 | Rodel Holdings, Inc. | Dissolution of metal particles produced by polishing |
-
2001
- 2001-02-02 EP EP01906896A patent/EP1263906A1/en not_active Withdrawn
- 2001-02-02 JP JP2001557972A patent/JP2003522424A/ja active Pending
- 2001-02-02 TW TW90102235A patent/TW572979B/zh not_active IP Right Cessation
- 2001-02-02 US US09/776,079 patent/US7070485B2/en not_active Expired - Fee Related
- 2001-02-02 KR KR1020027009918A patent/KR100756469B1/ko not_active Expired - Fee Related
- 2001-02-02 WO PCT/US2001/003367 patent/WO2001057150A1/en not_active Ceased
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