JP2003506833A - コンプライアンスを制御したファインピッチ配線 - Google Patents

コンプライアンスを制御したファインピッチ配線

Info

Publication number
JP2003506833A
JP2003506833A JP2001514505A JP2001514505A JP2003506833A JP 2003506833 A JP2003506833 A JP 2003506833A JP 2001514505 A JP2001514505 A JP 2001514505A JP 2001514505 A JP2001514505 A JP 2001514505A JP 2003506833 A JP2003506833 A JP 2003506833A
Authority
JP
Japan
Prior art keywords
electrical
flexible circuit
circuit member
electrical contact
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001514505A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003506833A5 (enExample
Inventor
ジェームス ジェイ． ラスバーン
Original Assignee
グリフィクス インコーポレーティッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by グリフィクス インコーポレーティッド filed Critical グリフィクス インコーポレーティッド
Publication of JP2003506833A publication Critical patent/JP2003506833A/ja
Publication of JP2003506833A5 publication Critical patent/JP2003506833A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Wire Bonding (AREA)
JP2001514505A 1999-08-02 2000-07-31 コンプライアンスを制御したファインピッチ配線 Pending JP2003506833A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14682599P 1999-08-02 1999-08-02
US60/146,825 1999-08-02
PCT/US2000/020748 WO2001009980A2 (en) 1999-08-02 2000-07-31 Controlled compliance fine pitch interconnect

Publications (2)

Publication Number Publication Date
JP2003506833A true JP2003506833A (ja) 2003-02-18
JP2003506833A5 JP2003506833A5 (enExample) 2007-06-14

Family

ID=22519150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001514505A Pending JP2003506833A (ja) 1999-08-02 2000-07-31 コンプライアンスを制御したファインピッチ配線

Country Status (4)

Country Link
EP (1) EP1204988A2 (enExample)
JP (1) JP2003506833A (enExample)
AU (1) AU6750900A (enExample)
WO (1) WO2001009980A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008032667A (ja) * 2006-08-01 2008-02-14 Nidec-Read Corp 基板検査用治具及び基板検査用治具の電極部構造
JP2010145381A (ja) * 2008-12-22 2010-07-01 Nippon Mektron Ltd 基板検査装置及び検査治具の製造方法
JP2013002976A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニット、回路基板検査装置およびプローブユニット製造方法
JP2014038091A (ja) * 2012-08-10 2014-02-27 Samsung Electro-Mechanics Co Ltd 電気検査用治具の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
DE60016563T2 (de) 1999-02-02 2005-05-12 Gryphics, Inc., Plymouth Verbinder mit geringer oder niedriger einsteckkraft für leiterplatten und elektrische vorrichtungen
US6830460B1 (en) 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
JP2003520454A (ja) 2000-01-20 2003-07-02 グリフィクス インコーポレーティッド フレキシブルなコンプライアンス相互連結アセンブリ
US6957963B2 (en) 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
JP2003315361A (ja) * 2002-04-26 2003-11-06 Japan Electronic Materials Corp プローブの製造方法、このプローブの製造用マスク及びプローブ
EP1642364A1 (en) 2003-07-07 2006-04-05 Gryphics, Inc. Normally closed zero insertion force connector
DE102004027886A1 (de) * 2004-05-28 2005-12-22 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118090A (en) * 1977-05-23 1978-10-03 Luigi Giovanni Del Mei Electrical contact devices
JPS61118977A (ja) * 1984-11-13 1986-06-06 シチズン時計株式会社 多電極コネクタ−構造
JPH07161400A (ja) * 1993-11-10 1995-06-23 Whitaker Corp:The 異方性導電膜、その製造方法及びそれを使用するコネ クタ
JPH07169542A (ja) * 1993-12-17 1995-07-04 Yamaichi Electron Co Ltd Ｉｃソケット
JPH0973934A (ja) * 1995-09-01 1997-03-18 Whitaker Corp:The コネクタ
JPH09115577A (ja) * 1995-10-06 1997-05-02 Whitaker Corp:The コネクタ及びコネクタ製造方法
JP2000311731A (ja) * 1999-04-28 2000-11-07 Shin Etsu Polymer Co Ltd 電気コネクタ
JP2001503512A (ja) * 1996-09-26 2001-03-13 デラウェア キャピタル フォーメーション，インコーポレイティド グリッドアレイパッケージ試験接触機

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
KR100196195B1 (ko) * 1991-11-18 1999-06-15 이노우에 쥰이치 프로우브 카드
US5252916A (en) * 1992-01-27 1993-10-12 Everett Charles Technologies, Inc. Pneumatic test fixture with springless test probes
US5521519A (en) * 1992-07-30 1996-05-28 International Business Machines Corporation Spring probe with piloted and headed contact and method of tip formation
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
JP2710544B2 (ja) * 1993-09-30 1998-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プローブ構造、プローブ構造の形成方法
US5637539A (en) * 1996-01-16 1997-06-10 Cornell Research Foundation, Inc. Vacuum microelectronic devices with multiple planar electrodes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118090A (en) * 1977-05-23 1978-10-03 Luigi Giovanni Del Mei Electrical contact devices
JPS61118977A (ja) * 1984-11-13 1986-06-06 シチズン時計株式会社 多電極コネクタ−構造
JPH07161400A (ja) * 1993-11-10 1995-06-23 Whitaker Corp:The 異方性導電膜、その製造方法及びそれを使用するコネ クタ
JPH07169542A (ja) * 1993-12-17 1995-07-04 Yamaichi Electron Co Ltd Ｉｃソケット
JPH0973934A (ja) * 1995-09-01 1997-03-18 Whitaker Corp:The コネクタ
JPH09115577A (ja) * 1995-10-06 1997-05-02 Whitaker Corp:The コネクタ及びコネクタ製造方法
JP2001503512A (ja) * 1996-09-26 2001-03-13 デラウェア キャピタル フォーメーション，インコーポレイティド グリッドアレイパッケージ試験接触機
JP2000311731A (ja) * 1999-04-28 2000-11-07 Shin Etsu Polymer Co Ltd 電気コネクタ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008032667A (ja) * 2006-08-01 2008-02-14 Nidec-Read Corp 基板検査用治具及び基板検査用治具の電極部構造
JP2010145381A (ja) * 2008-12-22 2010-07-01 Nippon Mektron Ltd 基板検査装置及び検査治具の製造方法
JP2013002976A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニット、回路基板検査装置およびプローブユニット製造方法
JP2014038091A (ja) * 2012-08-10 2014-02-27 Samsung Electro-Mechanics Co Ltd 電気検査用治具の製造方法

Also Published As

Publication number Publication date
WO2001009980A2 (en) 2001-02-08
EP1204988A2 (en) 2002-05-15
WO2001009980A3 (en) 2001-08-30
AU6750900A (en) 2001-02-19

Similar Documents

Publication Publication Date Title
US7160119B2 (en) Controlled compliance fine pitch electrical interconnect
US5838160A (en) Integral rigid chip test probe
US7900347B2 (en) Method of making a compliant interconnect assembly
EP0925509B1 (en) Probe structure having a plurality of discrete insulated probe tips
US6329827B1 (en) High density cantilevered probe for electronic devices
US6939143B2 (en) Flexible compliant interconnect assembly
US6722032B2 (en) Method of forming a structure for electronic devices contact locations
US8754666B2 (en) Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US6392429B1 (en) Temporary semiconductor package having dense array external contacts
US5914614A (en) High density cantilevered probe for electronic devices
US5811982A (en) High density cantilevered probe for electronic devices
US6483328B1 (en) Probe card for probing wafers with raised contact elements
US20080088332A1 (en) High density cantilevered probe for electronic devices
JPH0619371B2 (ja) 電気コネクタ
KR100337588B1 (ko) 반도체 검사장치 및 이를 사용한 검사방법
KR20010070133A (ko) 실리콘 핑거 콘택터를 구비한 콘택트 구조물과 이를이용한 토탈 스택-업 구조물
WO1998014998A1 (en) Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication
WO1998014998A9 (en) Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication
JP2001524256A (ja) マルチモードコンプライアンスのコネクタと当該コネクタを用いる取り替え可能なチップモジュール
JP2003506833A (ja) コンプライアンスを制御したファインピッチ配線
US5568057A (en) Method for performing a burn-in test
US20040124507A1 (en) Contact structure and production method thereof
US6433565B1 (en) Test fixture for flip chip ball grid array circuits
JP2979289B2 (ja) 高密度アレイ外部コンタクトを有する半導体試験用パッケージ
JPH09197006A (ja) 半導体ダイをパッケージし試験する方法及び装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070425

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090901

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091130

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091207

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091228

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100108

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100129

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100205

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100713