JP2003503840A5 - - Google Patents

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Publication number
JP2003503840A5
JP2003503840A5 JP2001506575A JP2001506575A JP2003503840A5 JP 2003503840 A5 JP2003503840 A5 JP 2003503840A5 JP 2001506575 A JP2001506575 A JP 2001506575A JP 2001506575 A JP2001506575 A JP 2001506575A JP 2003503840 A5 JP2003503840 A5 JP 2003503840A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001506575A
Other versions
JP2003503840A (ja
Filing date
Publication date
Priority claimed from US09/346,564 external-priority patent/US6257168B1/en
Application filed filed Critical
Publication of JP2003503840A publication Critical patent/JP2003503840A/ja
Publication of JP2003503840A5 publication Critical patent/JP2003503840A5/ja
Pending legal-status Critical Current

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JP2001506575A 1999-06-30 2000-06-29 高位置固定均一化リング Pending JP2003503840A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/346,564 1999-06-30
US09/346,564 US6257168B1 (en) 1999-06-30 1999-06-30 Elevated stationary uniformity ring design
PCT/US2000/018233 WO2001001444A1 (en) 1999-06-30 2000-06-29 Elevated stationary uniformity ring

Publications (2)

Publication Number Publication Date
JP2003503840A JP2003503840A (ja) 2003-01-28
JP2003503840A5 true JP2003503840A5 (ja) 2007-11-15

Family

ID=23360003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001506575A Pending JP2003503840A (ja) 1999-06-30 2000-06-29 高位置固定均一化リング

Country Status (8)

Country Link
US (1) US6257168B1 (ja)
EP (1) EP1108263B1 (ja)
JP (1) JP2003503840A (ja)
KR (1) KR100743874B1 (ja)
CN (1) CN1150593C (ja)
AU (1) AU5908500A (ja)
TW (1) TW464924B (ja)
WO (1) WO2001001444A1 (ja)

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Publication number Priority date Publication date Assignee Title
JP7437985B2 (ja) 2020-03-16 2024-02-26 東京エレクトロン株式会社 基板処理装置および基板処理方法

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US6838387B1 (en) 2001-06-21 2005-01-04 John Zajac Fast etching system and process
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US20030070620A1 (en) 2001-10-15 2003-04-17 Cooperberg David J. Tunable multi-zone gas injection system
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US20120083129A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Apparatus and methods for focusing plasma
JP6054314B2 (ja) 2011-03-01 2016-12-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板搬送及びラジカル閉じ込めのための方法及び装置
WO2012118897A2 (en) 2011-03-01 2012-09-07 Applied Materials, Inc. Abatement and strip process chamber in a dual loadlock configuration
US11171008B2 (en) 2011-03-01 2021-11-09 Applied Materials, Inc. Abatement and strip process chamber in a dual load lock configuration
JP6046128B2 (ja) * 2011-05-31 2016-12-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 誘導結合プラズマ（ｉｃｐ）リアクタ用動的イオンラジカルシーブ及びイオンラジカルアパーチャ
CN104137248B (zh) 2012-02-29 2017-03-22 应用材料公司 配置中的除污及剥除处理腔室
JP5917477B2 (ja) * 2013-11-29 2016-05-18 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
US9829790B2 (en) * 2015-06-08 2017-11-28 Applied Materials, Inc. Immersion field guided exposure and post-exposure bake process
KR102553629B1 (ko) * 2016-06-17 2023-07-11 삼성전자주식회사 플라즈마 처리 장치
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CN110911303B (zh) * 2018-09-14 2022-05-27 北京北方华创微电子装备有限公司 易碎管件的固定组件及半导体加工设备
WO2020257095A1 (en) * 2019-06-18 2020-12-24 Lam Research Corporation Reduced diameter carrier ring hardware for substrate processing systems

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7437985B2 (ja) 2020-03-16 2024-02-26 東京エレクトロン株式会社 基板処理装置および基板処理方法

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