JP2003309116A5 - - Google Patents
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- Publication number
- JP2003309116A5 JP2003309116A5 JP2002110940A JP2002110940A JP2003309116A5 JP 2003309116 A5 JP2003309116 A5 JP 2003309116A5 JP 2002110940 A JP2002110940 A JP 2002110940A JP 2002110940 A JP2002110940 A JP 2002110940A JP 2003309116 A5 JP2003309116 A5 JP 2003309116A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- semiconductor device
- frequency power
- reaction chamber
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 6
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- 239000010409 thin film Substances 0.000 claims 6
- 238000007599 discharging Methods 0.000 claims 5
- 239000002245 particle Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002110940A JP4018432B2 (ja) | 2002-04-12 | 2002-04-12 | 半導体装置の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002110940A JP4018432B2 (ja) | 2002-04-12 | 2002-04-12 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003309116A JP2003309116A (ja) | 2003-10-31 |
| JP2003309116A5 true JP2003309116A5 (enExample) | 2005-09-15 |
| JP4018432B2 JP4018432B2 (ja) | 2007-12-05 |
Family
ID=29393921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002110940A Expired - Fee Related JP4018432B2 (ja) | 2002-04-12 | 2002-04-12 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4018432B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6849561B1 (en) * | 2003-08-18 | 2005-02-01 | Asm Japan K.K. | Method of forming low-k films |
| JP4728748B2 (ja) * | 2005-09-05 | 2011-07-20 | 株式会社東芝 | 半導体製造装置の清浄化方法 |
| JP2007287890A (ja) * | 2006-04-14 | 2007-11-01 | Kochi Univ Of Technology | 絶縁膜の成膜方法、半導体装置の製法、プラズマcvd装置 |
| US7855153B2 (en) | 2008-02-08 | 2010-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101759504B1 (ko) | 2009-10-09 | 2017-07-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 표시 장치 및 이를 포함한 전자 기기 |
-
2002
- 2002-04-12 JP JP2002110940A patent/JP4018432B2/ja not_active Expired - Fee Related
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