JP2003272945A - Laminated ceramic electronic component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which can be easily and variously changed in electrostatic capacity by changing the overlap of an internal electrode in one pattern even if an internal electrode is reduced in its connection with an external electrode, and to provide its manufacturing method. <P>SOLUTION: The internal electrode is composed of first internal electrodes 110 to 140 located on one side and second internal electrodes 210 to 240 located on the other side, and the first internal electrodes 110 to 140 and the second internal electrodes 210 to 240 are separated from each other by a dielectric layer 100. The first electrodes and the second electrodes are equipped with capacity forming electrodes 110a and 210a, leading electrodes 110b and 210b connecting the capacity forming electrodes 110a and 210a to an external electrode, and dummy electrodes 110c and 210c which are not connected to the capacity forming electrodes 110a and 210a but connected to the external electrode, and the leading electrodes and the dummy electrodes are nearly equal to each other and smaller in width than the capacity forming electrodes. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic electronic component such as a monolithic ceramic capacitor and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the recent miniaturization of information communication equipment typified by computers and mobile phones, miniaturization of laminated ceramic electronic components is desired as high-density mounting of electronic components progresses. In particular, in a monolithic ceramic capacitor, which is a typical monolithic ceramic electronic component, it is desired to reduce the size and increase the capacity.

In order to reduce the mounting area and cost by reducing the number of times of mounting, a multi-layer type monolithic ceramic capacitor in which a plurality of capacitors are arranged side by side in a single element has been developed and used. There is also a demand for miniaturization and large capacity in multilayer ceramic capacitors.

A conventional multi-layer type monolithic ceramic capacitor will be described with reference to FIG. FIG. 13 is a schematic exploded perspective view showing a structure of an internal electrode of a conventional multi-layer type monolithic ceramic capacitor.

As shown in FIG. 13, in a conventional multi-layer type monolithic ceramic capacitor, a first internal electrode 1 and a second internal electrode 2 are alternately laminated with a dielectric layer 3 sandwiched between them.
A plurality of internal electrodes 1 and second internal electrodes 2 (4 in FIG. 13) are formed on the same plane, and a plurality of pairs of internal electrodes are alternately exposed on the end faces of the element body facing each other. A plurality of pairs of external electrodes (not shown) are formed so as to connect to the internal electrodes. Further, in the multi-layer type monolithic ceramic capacitor, it is necessary to reduce the shape of the external electrodes, and therefore, as shown in FIG.
The internal electrode 2 has capacitance forming electrode portions 1a, 2a and lead electrode portions 1b, 2b, and the width dimensions of the lead electrode portions 1b, 2b are made smaller than those of the capacitance forming electrode portions 1a, 2a, so The size of the connecting part is reduced.

On the other hand, the electrostatic capacitance of the monolithic ceramic capacitor is determined by the overlapping area of the internal electrodes, the number of effective layers of the dielectric layers sandwiched by the internal electrodes, the thickness of the dielectric layers and the relative dielectric constant of the dielectric layers. It Therefore, in order to obtain a desired capacitance, one or more of the above factors are changed.

However, it is cumbersome to produce a great variety of types of dielectric ceramic materials having different relative dielectric constants, or to produce a ceramic green sheet as a dielectric layer having a great variety of thicknesses, and the production efficiency is poor. . In addition, the capacitance cannot be finely adjusted by adjusting the number of effective layers. Therefore, in general, prepare conductor layer patterns that will be various types of internal electrodes with different areas, change the thickness of the dielectric layer and the number of effective layers, and use conductor layer patterns according to the capacitance design. It is common to obtain a desired capacitance by changing the overlapping area of the internal electrodes. However, arranging printing plates with a great variety of conductor layer patterns also increases plate making costs,
There is a problem that it becomes difficult to reduce the cost of the product.

Therefore, in a conventional multi-layer type monolithic ceramic capacitor, a method of changing the overlapping area of the internal electrodes by using one kind of conductor layer pattern and obtaining a large number of kinds of electrostatic capacitance is disclosed in Japanese Patent Laid-Open No. 2001-2001. As disclosed in Japanese Patent Application Laid-Open No.-203122, by using a conductor layer pattern serving as an internal electrode provided with first and second lead portions extending from two sides of the capacitance forming portion to opposite end faces thereof, The first and second lead portions of one type of conductor layer pattern are alternately staggered in the facing direction so that they are exposed from the end faces that are facing each other, and the amount of shift is adjusted to overlap the internal electrodes. There is also proposed a method of adjusting the electrostatic capacity by changing.

[0009]

However, in the method of the above-mentioned Japanese Patent Application Laid-Open No. 2001-203122, the first and second lead portions extending from the two sides of the capacitance forming portion to the opposite end surfaces thereof are respectively provided. Since the provided conductor layer pattern is used, the area of the capacitance forming portions facing each other across the dielectric layer is limited, and the overlapping area of the internal electrodes cannot be increased, which is not suitable for increasing the capacitance. There is.

The present invention solves the above-mentioned problems of the prior art. It is possible to change the overlap of the internal electrodes by using one type of conductor layer pattern and easily obtain a large number of types of capacitances, and at the same time, to obtain the internal electrodes. It is an object of the present invention to provide a monolithic ceramic electronic component capable of increasing the overlapping area by increasing the capacity and a manufacturing method thereof.

[0011]

In order to achieve the above object, the present invention has the following constitution.

The invention according to claim 1 of the present invention comprises: a laminated sintered body in which dielectric layers and internal electrodes are alternately laminated; and a first external electrode facing the surface of the laminated sintered body. A multilayer ceramic electronic component including a second external electrode, comprising:
The internal electrode includes a first internal electrode and a second internal electrode that are provided with a dielectric layer sandwiched therebetween, and the first and second internal electrodes are respectively formed with a capacitance forming electrode and a capacitance forming electrode in the same layer. An extraction electrode connecting the electrode and one external electrode and a dummy electrode connected to the other external electrode without being connected to the capacitance forming electrode, and the extraction electrode and the dummy electrode have substantially the same width and The second internal electrode is smaller than the capacitance forming electrode, and the shape of the second internal electrode is the same as the first internal electrode rotated by approximately 180 degrees. In order to obtain a desired capacitance even when the internal electrode has a shape in which the width dimension of the extraction electrode portion needs to be smaller than the capacitance forming electrode portion to reduce the dimension of the connection portion with the external electrode. Changing the overlapping area of internal electrodes Since it can be made with a minimum of one kind of conductor layer pattern, it becomes a multilayer ceramic electronic component that can easily obtain many kinds of capacitances, and the overlapping area of the internal electrodes can be made larger and the overlapping area width that can be changed compared to the conventional one. That is, it is possible to obtain the function and effect that the multilayer ceramic electronic component can have a large electrostatic capacitance range.

Further, as the internal electrode connected to the external electrode, in addition to the extraction electrode connected to the capacitance forming electrode, a dummy electrode not connected to the capacitance forming electrode is provided, so that the connection strength between the external electrode and the internal electrode is improved. It is possible to obtain the function and effect that the multilayer ceramic electronic component is improved and has high reliability.

The invention according to claim 2 of the present invention is
The distance between the dummy electrode and the capacitance forming electrode is three times or more the thickness per one dielectric layer, which provides sufficient electrical insulation between the dummy electrode and the capacitance forming electrode. Not only can it be ensured, but the gap between the external electrode and the internal electrode facing the dielectric layer 1 due to stacking deviation, cutting deviation, etc.
When it is close to 3 times or less of the thickness per layer, it can be selectively removed by capacitance measurement. Therefore, a product having a high risk of dielectric breakdown between the external electrode and the facing internal electrode can be removed in advance, and a highly reliable laminated ceramic electronic component can be obtained.

According to a third aspect of the present invention, there is provided a laminated sintered body in which dielectric layers and internal electrodes are alternately laminated, and a plurality of pairs of opposing first laminated bodies provided on the surface of the laminated sintered body. A multi-layered laminated ceramic electronic component including an external electrode and a second external electrode, wherein the internal electrode includes a first internal electrode and a second internal electrode sandwiching a dielectric layer. The first and second internal electrodes are respectively connected to a capacitance forming electrode in the same layer, a lead-out electrode connecting the capacitance forming electrode and one external electrode, and the other external electrode not connected to the capacitance forming electrode. A dummy electrode to be connected, the widths of the extraction electrode and the dummy electrode are substantially the same and smaller than that of the capacitance forming electrode, and the shape of the second internal electrode is the first internal The electrode has a shape substantially the same as that of the electrode rotated by about 180 degrees. Each of the first and second internal electrodes has a structure in which a plurality of them are arranged side by side in the same layer, which makes the width of the extraction electrode portion of the internal electrode smaller than that of the capacitance forming electrode portion and reduces the width of the connection portion with the external electrode. Even in the case of a shape that needs to be reduced in size, it is possible to change the overlapping area of the internal electrodes in order to obtain the desired capacitance with at least one type of conductor layer pattern, so that it is possible to easily use various types of capacitance. In addition to being a multi-layer type monolithic ceramic electronic component that can be obtained, the overlapping area of internal electrodes can be increased compared to conventional products,
In addition, it is possible to obtain the operational effect that the multi-layered monolithic ceramic electronic component in which the width of the overlapping area that can be changed, that is, the electrostatic capacitance range can be increased.

Further, as the internal electrode connected to the external electrode, in addition to the extraction electrode connected to the capacitance forming electrode, a dummy electrode not connected to the capacitance forming electrode is provided, so that the connection strength between the external electrode and the internal electrode is increased. It is possible to obtain the function and effect that the multi-layered ceramic electronic component is improved and has high reliability.

The invention according to claim 4 of the present invention is
A multi-layered laminated ceramic electronic component having a plurality of pairs of external electrodes, wherein the distance between the dummy electrode and the capacitance forming electrode is at least three times the thickness of one dielectric layer. As a result, not only sufficient electrical insulation between the dummy electrode and the capacitance forming electrode can be ensured, but also the distance between the external electrode and the internal electrode opposed to each other due to stacking error, cutting error, etc. When it is close to 3 times or less of the thickness, it can be selectively removed by capacitance measurement.
Therefore, a product having a high risk of dielectric breakdown between the external electrode and the facing internal electrode can be removed in advance, and a highly reliable multi-layered multilayer ceramic electronic component can be obtained.

The invention according to claim 5 of the present invention is
A plurality of pairs of external electrodes and a plurality of internal electrodes arranged side by side in the same layer have a configuration in which the pitch of the external electrodes and the pitch of the capacitance forming electrodes of the internal electrodes are different, and thus a plurality of external electrodes are formed in the same layer. Since it is not necessary to match the pitch of the capacitance forming electrodes of the internal electrodes arranged in parallel with the pitch of the external electrodes, the degree of freedom in arranging the capacitance forming electrodes is increased, and the area of the capacitance forming electrodes can be increased without increasing the external dimensions, It is possible to obtain a function and effect that it becomes a multi-layer type monolithic ceramic electronic component capable of being downsized and having a large capacity.

According to a sixth aspect of the present invention, the first step of producing a laminated body block by alternately laminating a ceramic green sheet and a conductor layer to be an internal electrode, and separating the laminated body block into individual pieces. The method further comprises a second step of manufacturing a laminated sintered body by cutting and separating into a plurality of layers, firing, a third step of forming an external electrode on the laminated sintered body, and a fourth step of inspecting the external electrode.
In the step, the formation of the conductor layer serving as the internal electrode is performed by arranging a large number of conductor layer patterns, each of which is composed of a rectangular pattern serving as a capacitance forming electrode and a strip pattern serving as a lead electrode and a dummy electrode connected to the conductor pattern, vertically and horizontally. A laminated ceramic in which a first electrode forming step performed using a layer pattern group and a second electrode forming step performed by rotating a conductor layer pattern group substantially the same as the conductor layer pattern group by about 180 degrees are alternately repeated. It is a method of manufacturing electronic parts, and
The desired capacitance can be obtained even in a monolithic ceramic electronic component in which the internal electrode has a shape in which the width of the extraction electrode portion needs to be smaller than that of the capacitance forming electrode portion to reduce the dimension of the connection portion with the external electrode. Because the overlapping area of the internal electrodes can be changed with at least one type of conductor layer pattern, plate making cost can be reduced, product cost can be reduced, and desired multilayer ceramic electronic parts with various capacitances can be easily manufactured. The effect that it can be manufactured is obtained.

In addition, the overlapping area of the internal electrodes can be increased and the width of the overlapping area that can be changed, that is, the range of the electrostatic capacity can be increased as compared with the conventional case, so that the capacity of the laminated ceramic electronic component can be increased. To be

The invention according to claim 7 of the present invention is
In the second electrode forming step, the same conductor layer pattern group as in the first electrode forming step is used, and the conductor layer pattern group is rotated about 180 degrees to form a conductor layer to be an internal electrode. The conductor layer pattern is formed even in a multilayer ceramic electronic component in which the internal electrode has a shape in which the width dimension of the extraction electrode section needs to be smaller than that of the capacitance forming electrode section to reduce the dimension of the connection section with the external electrode. The number of printing plates required for this is one, and since the overlapping area of the internal electrodes can be changed with one printing plate,
The plate-making cost can be reduced to the utmost limit and the cost of the product can be reduced.

The invention according to claim 8 of the present invention is
In the second electrode forming step, a multilayer ceramic electronic component for forming a conductor layer to be an internal electrode by using a conductor layer pattern group having a shape obtained by rotating the same shape as the conductor layer pattern group in the first electrode forming step by about 180 degrees In the multilayer ceramic electronic component in which the internal electrode has a shape in which it is necessary to reduce the width dimension of the extraction electrode section and the dimension of the connection section with the external electrode as compared with the capacitance forming electrode section, However, the number of printing plates required to form the conductor layer pattern is two, and because the overlapping area of the internal electrodes can be changed with only two printing plates, the plate making cost can be significantly reduced and the product cost can be reduced. It is possible to obtain the action and effect.

The invention according to claim 9 of the present invention is
This is a method to measure and remove the defective product in which the distance between the external electrode and the facing internal electrode is close, and to remove the defective product, which may cause dielectric breakdown between the external electrode and the facing internal electrode. It is possible to remove expensive products in advance and easily manufacture a highly reliable multilayer ceramic electronic component.

[0024]

DETAILED DESCRIPTION OF THE INVENTION (Embodiment 1) In the following, the first embodiment will be used to particularly claim 1, claim 2, claim 3, claim 4, claim 6, claim 7 of the present invention. The invention described in claim 9 will be described by taking a multilayer ceramic capacitor as an example.

The first embodiment of the present invention will be described with reference to the drawings. 1 is a schematic exploded perspective view showing a structure of internal electrodes of a monolithic ceramic capacitor according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view of a laminated sintered body of a monolithic ceramic capacitor according to Embodiment 1 of the present invention, FIG. 3 is a perspective view of the monolithic ceramic capacitor according to the first embodiment of the present invention.

1 to 3, 10 is a laminated sintered body,
11 to 14 are first external electrodes, 21 to 24 are second external electrodes, 100 is a dielectric layer, 110 to 140 are first internal electrodes, and 210 to 240 are second internal electrodes.

As shown in FIG. 3, the monolithic ceramic capacitor according to the first embodiment includes a monolithic sintered body 10 in which dielectric layers and internal electrodes are alternately laminated, and the monolithic sintered body 10.
Of the four pairs of opposing external electrodes provided on the surface of the
External electrode 11 and second external electrode 21, first external electrode 12 and second external electrode 22, first external electrode 13 and second external electrode
The external electrodes 23 and the first external electrode 14 and the second external electrode 24 are provided in four pairs. Then, as shown in FIGS. 1 to 3, four internal electrodes are arranged in parallel on one layer with the dielectric layer 100 sandwiched therebetween, and four internal electrodes are arranged on the other layer in parallel. The second internal electrodes 210 to 240, and the first internal electrode 110 and the second internal electrode 21.
0, the first internal electrode 120 and the second internal electrode 220, the first internal electrode 130 and the second internal electrode 230, and the first internal electrode 130.
Each of the internal electrodes 140 and the second internal electrodes 240 constitutes one capacitor, and four stacked monolithic ceramic capacitors in which four capacitors are incorporated in the multilayer sintered body 10 which is one element. Is.

Each of the internal electrodes has a capacitance forming electrode, a lead electrode connecting the capacitance forming electrode and one external electrode, and a dummy electrode not connected to the capacitance forming electrode but connected to the other external electrode. Each unit has the same layer. Specifically, as shown in FIG.
The first internal electrode 110 is connected to the second external electrode 21 without being connected to the capacitance forming electrode 110a, the extraction electrode 110b connecting the capacitance forming electrode 110a and the first external electrode 11, and the capacitance forming electrode 110a. The second inner electrode 210 has a dummy electrode 110c, and the second inner electrode 210 is the capacitance forming electrode 210.
a, a lead-out electrode 210b for connecting the capacitance forming electrode 210a and the second external electrode 21, and a capacitance forming electrode 210a.
The dummy electrode 2 that is connected to the first external electrode 11 without being connected to
10c and. The widths of the extraction electrode and the dummy electrode are substantially the same and smaller than that of the capacitance forming electrode. For example, the lead electrode 110b and the dummy electrode 110c have substantially the same width and are smaller than the capacitance forming electrode 110a.

Further, as shown in FIG. 1, the shape of the second internal electrodes 210, 220, 230 and 240 is the first.
The internal electrodes 140, 130, 120 and 110 have a shape substantially the same as that of the internal electrodes 140, 130, 120 and 110 rotated by 180 degrees.

With the above-described structure, in the monolithic ceramic capacitor according to the first embodiment, the width of the extraction electrode portion of the internal electrode is smaller than that of the capacitance forming electrode portion, and the dimension of the connection portion with the external electrode is reduced. Even if the shape is required to be small, it is possible to change the overlapping area of the internal electrodes in order to obtain a desired capacitance with at least one type of conductor layer pattern, so that it is possible to easily obtain many types of capacitance. In addition to the obtained monolithic ceramic capacitor, the monolithic ceramic capacitor can have a larger overlapping area of the internal electrodes and a wider range of the overlapping area that can be changed, that is, a range of electrostatic capacitance, as compared with the related art. Specifically, description will be given together with the method for manufacturing a monolithic ceramic capacitor according to the first embodiment of the present invention.

The method of manufacturing the monolithic ceramic capacitor according to the first embodiment of the present invention will be described below.
FIG. 4 is a pattern diagram of a printing plate for forming a conductor layer pattern group used as the internal electrodes used in the first embodiment of the present invention. A rectangular pattern 501 serving as a capacitance forming electrode and a lead electrode connected to the rectangular pattern 501 are provided. And a conductor layer pattern group in which a large number of conductor layer patterns 500 each including a strip-shaped pattern 502 serving as a dummy electrode are arranged in a matrix. In addition, the arrangement of the conductor layer patterns 500 shown in FIG. 4 is a strip-shaped pattern 50 to be a dummy electrode so that the distance between the dummy electrode and the capacitance forming electrode after firing becomes three times or more the thickness per one dielectric layer.
2 and the space D between the rectangular pattern 501 serving as the capacitance forming electrode
1 was 4 times the thickness of the ceramic green sheet described later.

First, a ceramic green sheet composed of a ceramic powder containing barium titanate as a main component and an organic binder was prepared and prepared. At this time, the thickness of the green ceramic sheet was about 15 μm.

Then, a plurality of the above-mentioned ceramic green sheets were laminated on the support plate via an adhesive sheet to form a lower ineffective layer. Then, a metal paste containing nickel as a main component is formed on the ineffective layer by a screen printing method using a printing plate having the pattern shown in FIG. 4 to form the first inner electrodes 110 to 140 of the lower outermost layer. A conductor layer was formed.

Next, the above-mentioned first internal electrodes 110-14
A laminated body on which a conductor layer having a thickness of 0 is formed is approximately 1 together with a supporting plate.
The printing plate is aligned by rotating it by 80 degrees, a ceramic green sheet is laminated on this laminate, and nickel is used as a main component on this ceramic green sheet by the screen printing method using the same printing plate as above. With the metal paste,
A conductor layer to be the second inner electrodes 210 to 240 was formed.

Furthermore, the above-mentioned second internal electrodes 210-2
The laminated body on which the conductor layer to be 40 is formed is rotated about 180 degrees together with the support plate, the printing plate is aligned, and the ceramic green sheet is laminated on the laminated body. Using the same printing plate, a conductor layer to be the first internal electrodes 110 to 140 was formed by a screen printing method using a metal paste containing nickel as a main component.

Subsequently, the above-mentioned first internal electrodes 110-1
The laminated body on which the conductor layer to be 40 is formed is rotated about 180 degrees together with the support plate, the printing plate is aligned, and the ceramic green sheet is laminated on the laminated body. Using the same printing plate, a conductor layer to be the second internal electrodes 210 to 240 was formed by a screen printing method using a metal paste containing nickel as a main component.

The above-mentioned first internal electrodes 110 to 14
Printing of 0 conductor layer, rotation of approximately 180 degrees, alignment of printing plates, lamination of ceramic green sheets, second internal electrode 2
Printing of the conductor layers of 10 to 240, rotation of about 180 degrees, alignment of the printing plate, and lamination of the ceramic green sheets were repeated a desired number of times. Then, a plurality of the above-mentioned ceramic green sheets were laminated on this to form an ineffective layer on the upper side to obtain a laminated body block. In the above, the rotation of about 180 degrees and the alignment of the printing plate were performed by rotating the laminated body together with the support plate by about 180 degrees.
It is only necessary to rotate it by 0 degrees, and fix the laminate side to make the printing plate approximately 1
It may be rotated by 80 degrees.

Next, the laminate block was cut and separated into desired dimensions at cutting positions 510 and 520 shown in FIG. 4 to obtain individual raw chips. The raw chips were heated in nitrogen gas to remove the binder, and then heated to 1300 ° C. in a nitrogen-hydrogen mixed gas atmosphere in which nickel was not oxidized, and fired to obtain a sintered body.

Next, the sintered body was chamfered to completely expose the internal electrodes on the surface of the sintered body to obtain a laminated sintered body 10 shown in FIG. Subsequently, an electrode paste containing copper as a main component is applied to both end faces of the laminated sintered body 10 and baked in a nitrogen atmosphere at 800 ° C., and nickel plating and solder plating are applied to the electrode paste to form a first external layer. The electrodes 11 to 14 and the second external electrodes 21 to 24 were formed, and the monolithic ceramic capacitor according to the first embodiment shown in FIG. 3 was produced.

The produced monolithic ceramic capacitor according to the first embodiment had a lengthwise dimension of 3.2 mm, a widthwise dimension of 1.6 mm, and a thicknesswise dimension of 0.85 mm.

Next, in the monolithic ceramic capacitor and the manufacturing method thereof according to the first embodiment, one printing plate for forming the conductor layer pattern group shown in FIG. 4 can change the overlapping area of the internal electrodes. It will be described in detail with reference to FIGS. 4 to 6 that the multilayer ceramic capacitor can easily obtain various kinds of capacitances.

FIG. 5 is a plan perspective view showing an example of the overlapping state of the internal electrodes of the monolithic ceramic capacitor according to Embodiment 1 of the present invention, and FIG. 6 is the interior of the monolithic ceramic capacitor according to Embodiment 1 of the present invention. It is a plane perspective view which shows the other example of the overlapping state of an electrode. Note that, in order to make the description easy to understand, only one layer of each of the first internal electrode and the second internal electrode is shown in FIGS. 5 and 6.

First, as an example of the overlapped state of the internal electrodes, FIG. 5 shows the case where the overlapped area is maximum and the obtained electrostatic capacitance is maximum. As shown in FIG. 5, the shapes of the second internal electrodes 210 to 240 are the same as those of the first internal electrodes 110 to 14.
0 is a shape obtained by rotating the same shape as that of 0 by about 180 degrees, and the overlapping area of the capacitance forming electrode of the first internal electrode and the capacitance forming electrode of the second internal electrode, for example, the first internal electrode 1
The capacitance forming electrodes 110a of 10 and the capacitance forming electrodes 210a of the second internal electrodes 210 are aligned so that the overlapping area is maximized.

By changing the overlapping area of the capacitance forming electrodes,
In order to change the obtained capacitance, the second internal electrode 2
When printing the conductor layers to be 10 to 240, they may be formed by rotating the first inner electrodes 110 to 140 by approximately 180 degrees and aligning them by shifting them in the vertical direction of FIG. For example, when printing the conductor layer, the marks 530 and 550 are aligned with each other, and the marks 540 and 56 are aligned.
When 0 is aligned, 531 of the mark 530 and 551 of the mark 550 are aligned, and 5 of the mark 540 is aligned.
When 41 and 561 of the mark 560 are aligned, the overlapping area of the capacitance forming electrode is maximized, the 531 of the mark 530 and the 555 of the mark 550 are aligned, and the 541 of the mark 540 and the 565 of the mark 560 are aligned. If combined, the overlapping area of the capacitance forming electrodes is minimized.

Then, for example, as shown in FIG. 6, the overlapping area of the capacitance forming electrode 110a of the first internal electrode 110 and the capacitance forming electrode 210a of the second internal electrode 210 can be reduced, and the electrostatic capacitance can be reduced. It becomes a small monolithic ceramic capacitor.

Next, in the monolithic ceramic capacitor according to the first embodiment of the present invention, the distance between the dummy electrode and the capacitance forming electrode is set to be three times or more the thickness per one dielectric layer, whereby the lamination deviation and cutting deviation, etc. When the distance between the external electrode and the opposing internal electrode is close to 3 times or less of the thickness per one dielectric layer, it can be selectively removed by capacitance measurement. Therefore, the internal electrode facing the external electrode can be removed. The effect that a product having a high risk of dielectric breakdown between and can be removed in advance to form a highly reliable multilayer ceramic capacitor will be described. It should be noted that there is a high risk that a product in which the distance between the external electrode and the facing internal electrode is close to 3 times or less the thickness of one dielectric layer is dielectric breakdown between the external electrode and the facing internal electrode. This is because the results of various studies have been made, because the internal electrodes are more likely to cause dielectric breakdown in the same layer than between the layers of the internal electrodes.

FIG. 7 is a cross-sectional view of the monolithic ceramic capacitor when it is cut at the desired cutting position 510 in FIG. 4, and FIG. 8 is an undesired cutting position 5 in FIG.
FIG. 11 is a cross-sectional view of the monolithic ceramic capacitor when cut at 11. In order to make the description easy to understand, only one layer of each of the first internal electrode and the second internal electrode is shown in FIGS. 7 and 8.

As shown in FIG. 7, the desired cutting position 510
In the monolithic ceramic capacitor manufactured by cutting in step 1, the first internal electrode 110 is not connected to the capacitance forming electrode 110a, the extraction electrode 110b connecting the capacitance forming electrode 110a and the first outer electrode 11, and the capacitance forming electrode 110a. A dummy electrode 110c connected to the second external electrode 21 by connection, and the second internal electrode 210 is the capacitance forming electrode 210a.
And a dummy electrode 21 that is connected to the first external electrode 11 without being connected to the lead electrode 210b that connects the capacitance forming electrode 210a and the second external electrode 21 and the capacitance forming electrode 210a.
And 0c. The capacitance of the monolithic ceramic capacitor is the capacitance C formed at the overlapping portion of the capacitance forming electrode 110a of the first internal electrode 110 and the capacitance forming electrode 210a of the second internal electrode 210.
It becomes 1.

However, as shown in FIG. 8, in the monolithic ceramic capacitor manufactured by cutting at an undesired cutting position 511, the first internal electrode 110 includes the capacitance forming electrode 110a, the extraction electrode 110b, and the dummy electrode 110.
None of the electrodes that should be c are connected to either the first external electrode 11 or the second external electrode 21 and are in a state of being extremely close to three times or less the thickness per one dielectric layer, In the second internal electrode 210, the capacitance forming electrode 210a is connected to the second external electrode 21, and a part of the capacitance forming electrode 210a connected to the lead electrode 210b and the electrode to be the dummy electrode 210c is the first external electrode. It is configured to be connected to 11. The capacitance of the monolithic ceramic capacitor is the capacitance forming electrode 110a of the first internal electrode 110.
And the capacitance C1 formed at the overlapping portion of the capacitance forming electrode 210a of the second internal electrode 210, the extraction electrode 110b of the first internal electrode 110, and the dummy electrode 110c.
Electrode to be used as the extraction electrode 2 of the second internal electrode 210
10b and the capacitance C2 formed in the overlapping portion of the electrode to be the dummy electrode 210c are connected in series, and this capacitance is (C1 × C2) /
(C1 + C2), which is an extremely small electrostatic capacitance as compared with C1.

Therefore, by measuring the electrostatic capacitance, it is possible to selectively remove defective products in which the distance between the external electrode and the facing internal electrode is extremely close due to the stacking deviation, cutting deviation, etc. as shown in FIG. , A product with a high risk of dielectric breakdown between the external electrode and the opposing internal electrode can be removed in advance, and a highly reliable multilayer ceramic capacitor can be obtained.

(Embodiment 2) Hereinafter, with reference to Embodiment 2, the present invention, particularly the inventions described in claims 5 and 8, will be described by taking a multilayer ceramic capacitor as an example.

The second embodiment of the present invention will be described below with reference to the drawings.

FIG. 9 is a plan perspective view showing an example of the overlapping state of the internal electrodes of the laminated ceramic capacitor according to the second embodiment of the present invention, and FIG. 10 is the second embodiment of the present invention.
6 is a plan perspective view showing another example of the overlapping state of the internal electrodes of the monolithic ceramic capacitor in FIG. Note that, in order to make the description easy to understand, only one layer of each of the first internal electrode and the second internal electrode is shown in FIGS. 9 and 10.

In FIGS. 9 and 10, 15 is a laminated sintered body, 16 to 19 are first external electrodes, and 26 to 29 are second.
External electrodes, 160 to 190 are first internal electrodes, 260
˜290 are second internal electrodes.

The monolithic ceramic capacitor according to the second embodiment is particularly different from the above-described first embodiment in that first internal electrodes 160 to 190 and second internal electrodes 260 to 260 are included.
290, and as shown in FIGS. 9 and 10,
The multilayer ceramic capacitor according to the second embodiment is
The pitch P2 of the capacitance forming electrodes of the internal electrodes arranged in parallel in the same layer is different from the pitch P1 of the plurality of pairs of external electrodes, and the pitch P2 of the capacitance forming electrodes of the internal electrodes is set to the pitch P1 of the external electrodes.
It has a smaller size than the above.

Thus, as is clear from comparison between FIG. 5 in the first embodiment and FIG. 9 in the second embodiment, the laminated ceramic capacitor in the second embodiment has the arrangement of the capacitance forming electrodes. Since the degree of freedom is increased and the space between the capacitance forming electrodes in the same layer can be reduced, the external dimensions,
A multi-layer type multilayer ceramic capacitor in which the area of the capacitance forming electrode can be increased and the size and size of the capacitor can be increased without changing the pitch of the external electrodes and the interval between the capacitance forming electrode.

As shown in FIGS. 9 and 10, the laminated ceramic capacitor according to the second embodiment includes a laminated sintered body 15 in which dielectric layers and internal electrodes are alternately laminated, and this laminated sintered body 15. Of the four internal electrodes 16 to 19 and 26 to 29 facing each other provided on the surface of the first internal electrode 160- 190 and the second one with four in parallel
Similar to the above-described first embodiment in that it is a quadruple-type monolithic ceramic capacitor which is composed of the internal electrodes 260 to 290 of FIG. Is.

In each internal electrode, a capacitance forming electrode, a lead electrode connecting the capacitance forming electrode and one external electrode, and a dummy electrode not connected to the capacitance forming electrode but connected to the other external electrode are connected to each other. Units are provided in the same layer, and the widths of the extraction electrode and the dummy electrode are substantially the same and smaller than that of the capacitance forming electrode. Furthermore, the shapes of the second internal electrodes 260 to 290 are the same as those of the first internal electrode. Electrode 160
Like 190 to 190, the same shape as that of 190 is rotated by 180 degrees, which is the same as the first embodiment.

Therefore, the monolithic ceramic capacitor according to the second embodiment also has the same effect as that of the first embodiment.

The method of manufacturing the laminated ceramic capacitor according to the second embodiment of the present invention will be described below.

FIG. 11 is a pattern diagram of a printing plate for forming a conductor layer pattern group which becomes the first internal electrodes used in the second embodiment of the present invention, and a rectangular pattern 601 which becomes the capacitance forming electrodes. This is a conductor layer pattern group in which a large number of conductor layer patterns 600 each including a lead-out electrode connected to this and a strip-shaped pattern 602 serving as a dummy electrode are arranged vertically and horizontally. Further, as in the first embodiment, the conductor layer pattern 600 is arranged with dummy electrodes such that the distance between the dummy electrode and the capacitance forming electrode after firing is three times or more the thickness per dielectric layer. The interval between the strip-shaped pattern 602 and the rectangular pattern 601 serving as the capacitance forming electrode was set to 4 times the thickness of the ceramic green sheet.

FIG. 12 is a pattern diagram of a printing plate for forming a conductor layer pattern group used as the second internal electrode in the second embodiment of the present invention. The first internal electrode of FIG. It is a pattern obtained by rotating a pattern diagram of a printing plate for forming a conductor layer pattern group to be 180 degrees.

The manufacturing method of the laminated ceramic capacitor according to the second embodiment is particularly different from that of the above-mentioned first embodiment in that the two printing plates shown in FIGS. 11 and 12 are used to form the conductor layer pattern group. The other point is that the laminated body block is manufactured by forming a conductor layer to be an internal electrode, and the other details are the same as those in the above-described first embodiment, and therefore detailed description thereof is omitted.

First, two screen printing machines, a screen printing machine having a pattern printing plate shown in FIG. 11 and a screen printing machine having a pattern printing plate shown in FIG. 12, were prepared.

Next, a plurality of the above-mentioned ceramic green sheets were laminated on the support plate via an adhesive sheet to form a lower ineffective layer. Then, a metal paste containing nickel as a main component is formed on the ineffective layer to form the first inner electrodes 160 to 190 of the lower outermost layer by a screen printing method using the printing plate having the pattern shown in FIG. A conductor layer was formed.

Next, the alignment marks 630 to 660 shown in FIG. 11 and the alignment marks 730 to 760 shown in FIG. 12 are provided on the laminated body, and the marks 630 and 730, the marks 640 and 740, and the mark 650. Mark 75
No. 0, the mark 660 and the mark 760 are respectively aligned and a ceramic green sheet is laminated, and nickel is a main component by a screen printing method using a printing plate having the pattern shown in FIG. 12 on the ceramic green sheet. A conductor layer to be the second internal electrodes 260 to 290 was formed with a metal paste.

Further, the printing plate shown in FIG. 11 is aligned on this laminated body, and a ceramic green sheet is laminated thereon,
The first internal electrodes 160 to 1 are formed on the ceramic green sheet by a screen printing method using a printing plate having the pattern shown in FIG.
A conductor layer of 90 was formed.

Subsequently, the printing plate shown in FIG. 12 is aligned on this laminated body, and a ceramic green sheet is laminated thereon,
The second internal electrodes 260 to 2 are formed on the ceramic green sheet by a screen printing method using a printing plate having the pattern shown in FIG. 12 with a metal paste containing nickel as a main component.
A conductor layer of 90 was formed.

The above-mentioned first internal electrodes 160 to 19
Printing of a conductor layer to be 0, alignment of a printing plate, lamination of a ceramic green sheet, printing of a conductor layer to be the second internal electrodes 260 to 290, alignment of a printing plate, lamination of a ceramic green sheet a desired number of times. I repeated. Then, a plurality of the above-mentioned ceramic green sheets were laminated on this to form an ineffective layer on the upper side to obtain a laminated body block. The thickness of the ceramic green sheet, the thickness of the conductor layer, and the number of laminated layers were the same as those in the first embodiment.

Then, the laminate block is cut and separated,
After binder removal treatment, firing, chamfering, and laminated sintered body 1
5 and then the first outer electrodes 16-19 and the second
The external electrodes 26 to 29 were formed to produce the monolithic ceramic capacitor according to the second embodiment.

The produced monolithic ceramic capacitor according to the second embodiment has a lengthwise dimension of 3.2 mm, a widthwise dimension of 1.6 mm, and a thicknesswise dimension of 0.85 mm.
The external shape and dimensions are the same as those in the first embodiment.

The laminated ceramic capacitor and the manufacturing method thereof according to the second embodiment using the two printing plates having the patterns shown in FIGS. 11 and 12 have the same overlapping area of the internal electrodes as the first embodiment. It will be described with reference to FIG. 9 and FIG. 10 that the laminated ceramic capacitor can be changed to easily obtain various kinds of electrostatic capacitance.

First, as an example of the overlapping state of the internal electrodes, FIG. 9 shows the case where the capacitance obtained when the overlapping area is maximum is maximum. As shown in FIG. 9, the shapes of the second internal electrodes 260 to 290 are the same as those of the first internal electrodes 160 to 19.
It is the same shape as 0 but rotated 180 degrees, and
The overlapping area of the capacitance forming electrode of the first internal electrode and the capacitance forming electrode of the second internal electrode, for example, the first internal electrode 160
The capacitance forming electrode 160a and the capacitance forming electrode 260a of the second internal electrode 260 are aligned so that the overlapping area is maximized.

By changing the overlapping area of the capacitance forming electrodes,
In order to change the obtained capacitance, the alignment marks 630 to 630 in FIG. 11 are printed when the conductor layer to be the second internal electrodes 260 to 290 is printed using the printing plate having the pattern in FIG.
Alignment marks 730 to 76 of FIG.
It may be formed by shifting 0 in the vertical direction and aligning it.
For example, as shown in FIG. 10, the overlapping area of the capacitance forming electrode 160a of the first internal electrode 160 and the capacitance forming electrode 260a of the second internal electrode 260 can be reduced,
It becomes a multilayer ceramic capacitor with a small capacitance.

Further, in the laminated ceramic capacitor according to the second embodiment of the present invention, the distance between the dummy electrode and the capacitance forming electrode is set to be three times or more the thickness per one dielectric layer, so that the lamination deviation and the cutting deviation may occur. When the distance between the external electrode and the facing internal electrode is close to 3 times or less of the thickness per one dielectric layer, it can be selectively removed by capacitance measurement. Therefore, the internal electrode facing the external electrode can be removed. Since the product having a high risk of dielectric breakdown between them can be removed in advance and a highly reliable multilayer ceramic capacitor can be obtained, it is the same as that of the first embodiment.
The description is omitted.

In the above-described first and second embodiments, as a method of manufacturing the laminated block, a method of sequentially laminating the ceramic green sheets and screen-printing the conductor layers has been described, but the method is not limited to this. However, it can be performed by various known methods such as a method of laminating a ceramic green sheet on which a conductor layer is printed and formed in advance, or a method of transferring and laminating a ceramic green sheet and a conductor layer.

As a method of forming a conductor layer to be an internal electrode, in the first embodiment, one printing plate having the pattern shown in FIG. 4 is alternately and relatively rotated by approximately 180 degrees to form a conductor layer. In the second embodiment, the method of forming the conductor layer by alternately using the two printing plates having the patterns shown in FIGS. 11 and 12 has been described. It is not limited by the pattern of the conductor layer, and may be selected in consideration of productivity, quality, etc. in the manufacturing process of the laminated body block.

Furthermore, in the printing plates of the patterns shown in FIGS. 4, 11 and 12, the conductor layer patterns are arranged such that the strip-shaped patterns are all in the same direction, but they are not necessarily arranged in this way. When the conductor layer pattern group serving as the first internal electrode is rotated by approximately 180 degrees, the strip-shaped pattern of the conductor layer pattern group serving as the first internal electrode and the conductor layer pattern serving as the second internal electrode are not necessary. The band-shaped patterns of the groups may be arranged alternately.

In Embodiments 1 and 2 described above, a quadruple type monolithic ceramic capacitor in which four capacitors are incorporated in one monolithic sintered body has been described, but a plurality of pairs of external electrodes are used. By adopting the configurations described in the above-described first and second embodiments, except for the configuration in which the pitch of P and the pitch of the capacitance forming electrodes of the plurality of internal electrodes are different, The same effect can be obtained in a general monolithic ceramic capacitor containing only a capacitor.

Further, in the above-described first and second embodiments, the monolithic ceramic capacitor has been described as an example, but similarly in a monolithic ceramic electronic component such as a monolithic varistor and a monolithic thermistor, a desired electrical property is obtained. Minimal change in overlapping area of internal electrodes to obtain characteristics 1
It is possible to use various types of conductor layer patterns, and it is possible to easily obtain a multilayer ceramic electronic component having various types of electrical characteristics.

[0081]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, a laminated sintered body in which dielectric layers and internal electrodes are alternately laminated, a first outer electrode and a second external electrode provided on the surface of the laminated sintered body and facing each other. A multilayer ceramic electronic component, the internal electrode comprising a first internal electrode and a second internal electrode sandwiching a dielectric layer.
Internal electrodes, and the first and second internal electrodes are not connected to the capacitance forming electrode and the lead electrode connecting the capacitance forming electrode and one external electrode in the same layer, respectively. A dummy electrode connected to the other external electrode, the extraction electrode and the dummy electrode have substantially the same width and are smaller than the capacitance forming electrode, and the shape of the second internal electrode is A multilayer ceramic electronic component having a shape substantially the same as the first internal electrode rotated by approximately 180 degrees, wherein the internal electrode has a width dimension of the extraction electrode portion smaller than that of the capacitance forming electrode portion, Even if the size of the connection part needs to be reduced, the overlapping area of the internal electrodes can be changed with a minimum of one type of conductor layer pattern to obtain the desired capacitance, and various types of static layers can be easily formed. Capacitance stacking With ceramic electronic component can be obtained, it can be increased overlapping area of the internal electrodes as compared with the conventional, and the range of the width, i.e. the capacitance of the overlapping area can be changed in which an effect that it greatly.

[Brief description of drawings]

FIG. 1 is a schematic exploded perspective view showing a structure of internal electrodes of a monolithic ceramic electronic component according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a multilayer sintered body of the multilayer ceramic capacitor.

FIG. 3 is a perspective view of the monolithic ceramic capacitor.

FIG. 4 is a pattern diagram of a printing plate for forming a conductor layer pattern group used as the internal electrodes used in the first embodiment of the present invention.

FIG. 5 is a plan perspective view showing an example of an overlapping state of internal electrodes of the monolithic ceramic capacitor according to the first embodiment of the present invention.

FIG. 6 is a perspective plan view showing the other example.

FIG. 7 is a cross-sectional view of a monolithic ceramic capacitor when cut at a desired cutting position.

FIG. 8 is a cross-sectional view of a monolithic ceramic capacitor when cut at an undesired cutting position.

FIG. 9 is a plan perspective view showing an example of an overlapping state of internal electrodes of a laminated ceramic capacitor according to a second embodiment of the present invention.

FIG. 10 is a perspective plan view showing the other example.

FIG. 11 is a pattern diagram of a printing plate for forming a conductor layer pattern group used as the first internal electrodes used in Embodiment 2 of the present invention.

FIG. 12 is a pattern diagram of a printing plate for forming a conductor layer pattern group serving as the second internal electrode.

FIG. 13 is a schematic exploded perspective view showing the structure of internal electrodes of a conventional multi-layered monolithic ceramic capacitor.

[Explanation of symbols]

10, 15 Laminated sintered bodies 11-14, 16-19 First external electrodes 21-24, 26-29 Second external electrode 100 Dielectric layers 110-140, 160-190 First internal electrodes 110a, 160a , 210a, 260a Capacitance forming electrodes 110b, 210b Lead-out electrodes 110c, 210c Dummy electrodes 210-240, 260-290 Second inner electrodes 500,600 Conductor layer patterns 501,601 Rectangular patterns 502,602 Strip patterns

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E082 AB03 BC40 CC03 EE04 EE11                       EE35 FG06 FG26 FG54 GG10                       JJ03 JJ23 LL01 LL02 LL03                       MM19 MM24 MM36 PP09

Claims (9)

[Claims] 1. A laminated body comprising a laminated sintered body in which dielectric layers and internal electrodes are alternately laminated, and a first external electrode and a second external electrode facing each other provided on the surface of the laminated sintered body. In the ceramic electronic component, the internal electrode includes a first internal electrode and a second internal electrode provided with a dielectric layer sandwiched therebetween, and the first and second internal electrodes are formed in the same layer. A capacitance forming electrode, a lead-out electrode connecting the capacitance forming electrode and one external electrode, and a dummy electrode not connected to the capacitance forming electrode and connected to the other external electrode, and the lead-out electrode and the dummy electrode The width is substantially the same and smaller than that of the capacitance forming electrode, and the shape of the second internal electrode is a shape obtained by rotating the same shape as the first internal electrode by about 180 degrees. Electronic components. 2. The monolithic ceramic electronic component according to claim 1, wherein the distance between the dummy electrode and the capacitance forming electrode is three times or more the thickness per one dielectric layer. 3. A laminated sintered body in which dielectric layers and internal electrodes are alternately laminated, and a plurality of pairs of opposing first external electrodes and second external electrodes provided on the surface of the laminated sintered body. In the multi-layered multilayer ceramic electronic component, the internal electrode includes a first internal electrode and a second internal electrode sandwiching a dielectric layer, and the first and second internal electrodes are provided. The electrodes each have a capacitance forming electrode in the same layer, a lead electrode connecting the capacitance forming electrode and one external electrode, and a dummy electrode not connected to the capacitance forming electrode and connected to the other external electrode, The width of the lead electrode and the width of the dummy electrode are substantially the same and smaller than that of the capacitance forming electrode.
The shape of the internal electrode is a shape obtained by rotating the substantially same shape as the first internal electrode by approximately 180 degrees, and a plurality of the first and second internal electrodes are arranged side by side in the same layer. Multilayer ceramic electronic components. 4. The monolithic ceramic electronic component according to claim 3, wherein the distance between the dummy electrode and the capacitance forming electrode is three times or more the thickness per one dielectric layer. 5. The monolithic ceramic electronic component according to claim 3, wherein a plurality of pairs of outer electrodes and a plurality of inner electrodes arranged in parallel in the same layer have different pitches of the outer electrodes and pitches of the capacitance forming electrodes of the inner electrodes. . 6. A first block for producing a laminate block by alternately laminating a ceramic green sheet and a conductor layer to be an internal electrode.
A step, a second step of cutting and separating the laminate block into individual pieces, and firing to produce a laminate sintered body; a third step of forming external electrodes on the laminate sintered body; and a step of inspecting this. In the first step, the formation of the conductor layer serving as the internal electrode includes the formation of a rectangular pattern serving as a capacitance forming electrode and a strip pattern serving as a lead electrode and a dummy electrode connected thereto. A first electrode forming step performed by using a conductor layer pattern group in which a large number of patterns are arranged vertically and horizontally, and a second electrode forming step performed by rotating a conductor layer pattern group substantially the same as the conductor layer pattern group by about 180 degrees. A method for manufacturing a monolithic ceramic electronic component, which is alternately and repeatedly performed. 7. The second electrode forming step uses substantially the same conductor layer pattern group as in the first electrode forming step,
7. A conductor layer to be an internal electrode is formed by rotating the conductor layer by 6 degrees.
A method for manufacturing a monolithic ceramic electronic component according to. 8. In the second electrode forming step, a conductor layer to be an internal electrode is formed by using a conductor layer pattern group having a shape obtained by rotating the same shape as the conductor layer pattern group in the first electrode forming step by about 180 degrees. The method for manufacturing a monolithic ceramic electronic component according to claim 6. 9. The method of manufacturing a multilayer ceramic electronic component according to claim 6, wherein in the fourth step, the capacitance is measured to screen and remove defective products in which the distance between the external electrode and the facing internal electrode is close.