JP2003255293A5 - - Google Patents

Claims (6)

An upper stage that holds the upper substrate, a lower stage that holds the lower substrate, a sealed container that defines a sealed space in which the upper stage and the lower stage are arranged, and a pressure adjustment device that adjusts the pressure in the sealed container A substrate laminating device for laminating an upper substrate and a lower substrate via an adhesive under reduced pressure in a sealed container by a pressure adjusting device,
A moving device that relatively moves the upper stage and the lower stage at least in the surface direction of the substrate;
A substrate bonding apparatus in which a moving device is supported by a gantry independently of an airtight container.   The moving device and at least one of the upper and lower stages are coupled by a coupling member, and the moving device and the sealed container are coupled by a flexible partition wall around the coupling member, so that the sealed container and the flexible partition member form a partition. The board | substrate bonding apparatus of Claim 1 which arrange | positions an upper and lower stage and a coupling member in sealed space.   The moving device and at least one of the upper and lower stages are coupled by a coupling member, and the sealed container and the at least one stage are coupled by a flexible partition wall around the coupling member. The board | substrate bonding apparatus of Claim 1 which arrange | positions an upper and lower stage in the sealed space which divides and forms. The moving device and the lower stage are coupled by a coupling member, and the lifting device that is coupled to the upper stage by another coupling member to raise and lower the upper stage, and the lifting device and the sealed container are coupled around the coupling member. The substrate bonding apparatus according to claim 2, further comprising another flexible partition wall member. The substrate bonding apparatus according to claim 4, wherein the sealed container includes an upper chamber and a lower chamber, and further includes a chamber lifting cylinder that lifts and lowers the upper chamber. 6. The substrate bonding apparatus according to claim 5, further comprising an elevating frame that can be raised and lowered, wherein the elevating device and the chamber elevating cylinder are supported by the elevating frame.