JP2003243380A5 - - Google Patents

Download PDF

Info

Publication number
JP2003243380A5
JP2003243380A5 JP2003041345A JP2003041345A JP2003243380A5 JP 2003243380 A5 JP2003243380 A5 JP 2003243380A5 JP 2003041345 A JP2003041345 A JP 2003041345A JP 2003041345 A JP2003041345 A JP 2003041345A JP 2003243380 A5 JP2003243380 A5 JP 2003243380A5
Authority
JP
Japan
Prior art keywords
temperature
electrode block
control means
temperature control
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003041345A
Other languages
English (en)
Japanese (ja)
Other versions
JP4063689B2 (ja
JP2003243380A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003041345A priority Critical patent/JP4063689B2/ja
Priority claimed from JP2003041345A external-priority patent/JP4063689B2/ja
Publication of JP2003243380A publication Critical patent/JP2003243380A/ja
Publication of JP2003243380A5 publication Critical patent/JP2003243380A5/ja
Application granted granted Critical
Publication of JP4063689B2 publication Critical patent/JP4063689B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2003041345A 2003-02-19 2003-02-19 プラズマ処理装置 Expired - Lifetime JP4063689B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003041345A JP4063689B2 (ja) 2003-02-19 2003-02-19 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003041345A JP4063689B2 (ja) 2003-02-19 2003-02-19 プラズマ処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002038915A Division JP3742349B2 (ja) 2002-02-15 2002-02-15 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2003243380A JP2003243380A (ja) 2003-08-29
JP2003243380A5 true JP2003243380A5 (enExample) 2005-08-11
JP4063689B2 JP4063689B2 (ja) 2008-03-19

Family

ID=27785802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003041345A Expired - Lifetime JP4063689B2 (ja) 2003-02-19 2003-02-19 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP4063689B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080073324A1 (en) * 2004-07-09 2008-03-27 Sekisui Chemical Co., Ltd. Method For Processing Outer Periphery Of Substrate And Apparatus Thereof
JP4539245B2 (ja) * 2004-09-06 2010-09-08 横浜ゴム株式会社 樹脂集積配管およびその製造方法
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP7450348B2 (ja) * 2018-11-15 2024-03-15 東京エレクトロン株式会社 真空処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191059A (ja) * 1995-01-09 1996-07-23 Hitachi Ltd プラズマ処理装置
JPH0917770A (ja) * 1995-06-28 1997-01-17 Sony Corp プラズマ処理方法およびこれに用いるプラズマ装置
JPH09167794A (ja) * 1995-12-15 1997-06-24 Sony Corp 静電チャックおよびプラズマ処理方法
JPH1154482A (ja) * 1997-08-05 1999-02-26 Hitachi Ltd 半導体装置の製造方法および装置ならびにワークの処理方法
JP4067633B2 (ja) * 1998-03-06 2008-03-26 東京エレクトロン株式会社 処理装置
JPH11260803A (ja) * 1998-03-13 1999-09-24 Hitachi Ltd ウェハ温度の制御方法
JPH11307513A (ja) * 1998-04-20 1999-11-05 Sony Corp 絶縁体基板対応プラズマ処理装置
JP2000216140A (ja) * 1999-01-20 2000-08-04 Hitachi Ltd ウエハステ―ジおよびウエハ処理装置
EP1098354A2 (en) * 1999-11-08 2001-05-09 Applied Materials, Inc. Apparatus for controlling temperature in a semiconductor processing system

Similar Documents

Publication Publication Date Title
JP6306151B2 (ja) 基板処理装置、断熱構造体及び半導体装置の製造方法
TW201600174A (zh) 噴頭設計
CN102315151B (zh) 基板承载台、基板处理装置及基板处理系统
JP2005328038A5 (enExample)
JP2009507997A5 (enExample)
TW200509182A (en) Substrate support having temperature controlled substrate support surface
TW200616139A (en) Method and apparatus for controlling temperature of a substrate
JP2015511403A5 (enExample)
JP2009188162A5 (enExample)
JP2013232621A5 (enExample)
CN109494172A (zh) 冷却单元、绝热结构体、基板处理装置、以及半导体装置的制造方法
JP2012212882A5 (enExample)
TW200746339A (en) Substrate supporting unit, and substrate temperature control apparatus and method
JP2014522574A5 (enExample)
JP2018206805A5 (enExample)
JPWO2021033461A5 (enExample)
KR20200137118A (ko) 기판처리장치
JP2003243380A5 (enExample)
JP2004119804A5 (enExample)
KR20200077282A (ko) 기판처리장치
CN114535742A (zh) 真空系统的操作方法和真空系统
KR20180021526A (ko) 캐리어 가스 가열장치
KR101546320B1 (ko) 기판 열처리 장치
JP2005243736A5 (enExample)
JP2001237157A (ja) 加熱処理装置