JP2003243492A5 - - Google Patents

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Publication number
JP2003243492A5
JP2003243492A5 JP2003041373A JP2003041373A JP2003243492A5 JP 2003243492 A5 JP2003243492 A5 JP 2003243492A5 JP 2003041373 A JP2003041373 A JP 2003041373A JP 2003041373 A JP2003041373 A JP 2003041373A JP 2003243492 A5 JP2003243492 A5 JP 2003243492A5
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JP
Japan
Prior art keywords
wafer
wafer stage
processing
stage
semiconductor wafer
Prior art date
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Application number
JP2003041373A
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English (en)
Japanese (ja)
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JP2003243492A (ja
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Publication date
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Priority to JP2003041373A priority Critical patent/JP2003243492A/ja
Priority claimed from JP2003041373A external-priority patent/JP2003243492A/ja
Publication of JP2003243492A publication Critical patent/JP2003243492A/ja
Publication of JP2003243492A5 publication Critical patent/JP2003243492A5/ja
Withdrawn legal-status Critical Current

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JP2003041373A 2003-02-19 2003-02-19 ウエハ処理装置とウエハステージ及びウエハ処理方法 Withdrawn JP2003243492A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003041373A JP2003243492A (ja) 2003-02-19 2003-02-19 ウエハ処理装置とウエハステージ及びウエハ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003041373A JP2003243492A (ja) 2003-02-19 2003-02-19 ウエハ処理装置とウエハステージ及びウエハ処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002040373A Division JP2003243490A (ja) 2002-02-18 2002-02-18 ウエハ処理装置とウエハステージ及びウエハ処理方法

Publications (2)

Publication Number Publication Date
JP2003243492A JP2003243492A (ja) 2003-08-29
JP2003243492A5 true JP2003243492A5 (enExample) 2005-08-18

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JP2003041373A Withdrawn JP2003243492A (ja) 2003-02-19 2003-02-19 ウエハ処理装置とウエハステージ及びウエハ処理方法

Country Status (1)

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JP (1) JP2003243492A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243888A (ja) * 2004-02-26 2005-09-08 Nitto Denko Corp 粘着シート貼付け方法およびこれを用いた装置
JP4499483B2 (ja) * 2004-06-07 2010-07-07 株式会社日本マイクロニクス 検査装置
US8157951B2 (en) 2005-10-11 2012-04-17 Applied Materials, Inc. Capacitively coupled plasma reactor having very agile wafer temperature control
US8034180B2 (en) 2005-10-11 2011-10-11 Applied Materials, Inc. Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor
US8092638B2 (en) 2005-10-11 2012-01-10 Applied Materials Inc. Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution
US7988872B2 (en) 2005-10-11 2011-08-02 Applied Materials, Inc. Method of operating a capacitively coupled plasma reactor with dual temperature control loops
US20070091541A1 (en) 2005-10-20 2007-04-26 Applied Materials, Inc. Method of processing a workpiece in a plasma reactor using feed forward thermal control
JP2008103403A (ja) * 2006-10-17 2008-05-01 Tokyo Electron Ltd 基板載置台及びプラズマ処理装置
JP5255936B2 (ja) * 2008-07-18 2013-08-07 東京エレクトロン株式会社 フォーカスリング及び基板載置台、並びにそれらを備えたプラズマ処理装置
US8270141B2 (en) * 2009-11-20 2012-09-18 Applied Materials, Inc. Electrostatic chuck with reduced arcing
US8608852B2 (en) * 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies
JP6080571B2 (ja) * 2013-01-31 2017-02-15 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9666466B2 (en) * 2013-05-07 2017-05-30 Applied Materials, Inc. Electrostatic chuck having thermally isolated zones with minimal crosstalk
JP2016040800A (ja) * 2014-08-12 2016-03-24 アズビル株式会社 プラズマエッチング装置
KR101758347B1 (ko) 2016-08-01 2017-07-18 주식회사 엘케이엔지니어링 정전 척 및 리페어 방법
CN110911332B (zh) * 2018-09-14 2022-11-25 北京北方华创微电子装备有限公司 静电卡盘
CN114008751B (zh) * 2019-09-17 2025-07-11 株式会社国际电气 基板处理装置、基座罩、半导体器件的制造方法及基板处理方法
JP7762153B2 (ja) * 2020-01-29 2025-10-29 ラム リサーチ コーポレーション 温度調整空洞特徴部を有するウエハチャック
WO2025057308A1 (ja) * 2023-09-12 2025-03-20 日本碍子株式会社 ウエハ載置台
JP7644867B1 (ja) * 2024-09-13 2025-03-12 日本特殊陶業株式会社 保持装置
CN118858906B (zh) * 2024-09-26 2024-11-29 山东强茂电子科技有限公司 一种带有温控载台的晶圆点测机

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