JP2003229359A5 - - Google Patents

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Publication number
JP2003229359A5
JP2003229359A5 JP2002338768A JP2002338768A JP2003229359A5 JP 2003229359 A5 JP2003229359 A5 JP 2003229359A5 JP 2002338768 A JP2002338768 A JP 2002338768A JP 2002338768 A JP2002338768 A JP 2002338768A JP 2003229359 A5 JP2003229359 A5 JP 2003229359A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2002338768A
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Japanese (ja)
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JP2003229359A (ja
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Priority to JP2002338768A priority Critical patent/JP2003229359A/ja
Priority claimed from JP2002338768A external-priority patent/JP2003229359A/ja
Publication of JP2003229359A publication Critical patent/JP2003229359A/ja
Publication of JP2003229359A5 publication Critical patent/JP2003229359A5/ja
Withdrawn legal-status Critical Current

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JP2002338768A 2001-11-29 2002-11-22 半導体装置の作製方法 Withdrawn JP2003229359A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002338768A JP2003229359A (ja) 2001-11-29 2002-11-22 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001365302 2001-11-29
JP2001-365302 2001-11-29
JP2002338768A JP2003229359A (ja) 2001-11-29 2002-11-22 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2003229359A JP2003229359A (ja) 2003-08-15
JP2003229359A5 true JP2003229359A5 (hu) 2007-02-15

Family

ID=27759500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002338768A Withdrawn JP2003229359A (ja) 2001-11-29 2002-11-22 半導体装置の作製方法

Country Status (1)

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JP (1) JP2003229359A (hu)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660103B2 (ja) * 2004-03-09 2011-03-30 三菱電機株式会社 レーザ熱処理方法
CN101667538B (zh) 2004-08-23 2012-10-10 株式会社半导体能源研究所 半导体器件及其制造方法
JP5352040B2 (ja) * 2004-08-23 2013-11-27 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4481347B2 (ja) * 2009-04-24 2010-06-16 シャープ株式会社 多結晶半導体膜の形成方法、半導体デバイスの製造方法及び半導体デバイス製造装置
KR20130044124A (ko) * 2010-05-10 2013-05-02 파나소닉 액정 디스플레이 주식회사 결정성 반도체막의 제조 방법, 결정성 반도체막을 갖는 기판, 박막 트랜지스터
US9111803B2 (en) 2011-10-03 2015-08-18 Joled Inc. Thin-film device, thin-film device array, and method of manufacturing thin-film device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242717A (ja) * 1988-08-03 1990-02-13 Hitachi Ltd エネルギービーム照射方法
JP3431041B2 (ja) * 1993-11-12 2003-07-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH07307304A (ja) * 1994-05-13 1995-11-21 Semiconductor Energy Lab Co Ltd 半導体デバイスのレーザー処理方法
JP3195157B2 (ja) * 1994-03-28 2001-08-06 シャープ株式会社 半導体装置の製造方法およびその製造装置
JPH07302907A (ja) * 1994-04-28 1995-11-14 A G Technol Kk アクティブマトリクス表示素子およびその製造方法
JP3727034B2 (ja) * 1995-01-13 2005-12-14 株式会社半導体エネルギー研究所 レーザー照射装置
JP3343492B2 (ja) * 1997-04-02 2002-11-11 シャープ株式会社 薄膜半導体装置の製造方法
JP4454720B2 (ja) * 1998-07-13 2010-04-21 株式会社半導体エネルギー研究所 光学レンズ、ビームホモジェナイザー、レーザー照射装置、及びレーザー照射方法
JP2000277450A (ja) * 1999-03-24 2000-10-06 Matsushita Electric Ind Co Ltd レーザアニール装置及びこの装置を用いた薄膜トランジスタの製造方法
JP3491571B2 (ja) * 1999-07-13 2004-01-26 日本電気株式会社 半導体薄膜の形成方法
JP4986332B2 (ja) * 2000-03-21 2012-07-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6872607B2 (en) * 2000-03-21 2005-03-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device

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