JP2003209312A5 - - Google Patents

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Publication number
JP2003209312A5
JP2003209312A5 JP2002007815A JP2002007815A JP2003209312A5 JP 2003209312 A5 JP2003209312 A5 JP 2003209312A5 JP 2002007815 A JP2002007815 A JP 2002007815A JP 2002007815 A JP2002007815 A JP 2002007815A JP 2003209312 A5 JP2003209312 A5 JP 2003209312A5
Authority
JP
Japan
Prior art keywords
semiconductor package
metal case
holding body
optical module
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002007815A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003209312A (ja
JP4196564B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002007815A priority Critical patent/JP4196564B2/ja
Priority claimed from JP2002007815A external-priority patent/JP4196564B2/ja
Priority to US10/193,065 priority patent/US6744961B2/en
Publication of JP2003209312A publication Critical patent/JP2003209312A/ja
Publication of JP2003209312A5 publication Critical patent/JP2003209312A5/ja
Application granted granted Critical
Publication of JP4196564B2 publication Critical patent/JP4196564B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002007815A 2002-01-16 2002-01-16 光モジュール Expired - Fee Related JP4196564B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002007815A JP4196564B2 (ja) 2002-01-16 2002-01-16 光モジュール
US10/193,065 US6744961B2 (en) 2002-01-16 2002-07-12 Optical module with metal casing accommodating electrically insulative holder for holding semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002007815A JP4196564B2 (ja) 2002-01-16 2002-01-16 光モジュール

Publications (3)

Publication Number Publication Date
JP2003209312A JP2003209312A (ja) 2003-07-25
JP2003209312A5 true JP2003209312A5 (enExample) 2005-08-18
JP4196564B2 JP4196564B2 (ja) 2008-12-17

Family

ID=19191363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002007815A Expired - Fee Related JP4196564B2 (ja) 2002-01-16 2002-01-16 光モジュール

Country Status (2)

Country Link
US (1) US6744961B2 (enExample)
JP (1) JP4196564B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223189A (ja) * 2004-02-06 2005-08-18 Yamaha Corp 光半導体モジュール
JP2010129613A (ja) * 2008-11-25 2010-06-10 Fujitsu Ltd 取付部品及びそれを備えた電子装置
US11437774B2 (en) 2015-08-19 2022-09-06 Kyocera Sld Laser, Inc. High-luminous flux laser-based white light source
US11239637B2 (en) * 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
WO2021053764A1 (ja) * 2019-09-18 2021-03-25 日本電信電話株式会社 光モジュール用パッケージ
TWI776601B (zh) * 2021-07-22 2022-09-01 先豐通訊股份有限公司 具有波導管的線路板結構及其製作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2161718A1 (en) * 1994-10-31 1996-05-01 Hiromi Kurashima Optical module having structure for defining fixing position of sleeve
JPH08248277A (ja) * 1995-01-09 1996-09-27 Fujitsu Ltd 光装置
JPH09260693A (ja) 1996-03-19 1997-10-03 Fujitsu Ltd 高速光モジュール
JP3624360B2 (ja) 1996-04-24 2005-03-02 富士通株式会社 光モジュール
US20030118293A1 (en) * 2001-12-21 2003-06-26 Tyco Electronics Corporation Snap together optoelectronic module

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