JP2003209140A - Transfer method for part and its mounting method, transfer substrate, and mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer method for electronic parts capable of excellent transfer and its mounting method, and a transfer substrate and a mounting structure without causing a transfer adhesive, dust and the like to adhere to a transfer plate. <P>SOLUTION: A coated film 21 is formed in the state where the chips 12 are transferred on an adhesive substrate 13 so as to cover an adhesive 10, and the chips 12 are transferred onto the transfer plate 15 in this state. Consequently, the adhesive 10 and dust on the adhesive are covered with the coated film 21, so that, upon the chips 12 being transferred onto the transfer plate 15, the adhesive 10 and dust are prevented from adhering to the transfer plate 15, thus, the unnecessary adhesive 10 and the like are prevented from adhering to the transfer plate 15, so that the transferred chips 12 are prevented from being displaced to ensure the excellent transfer of the chips 12. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suitable transfer method and mounting method for electronic parts, a transfer substrate, and a mounting structure.

[0002]

2. Description of the Related Art Conventionally, a method of mounting a chip-shaped electronic component (hereinafter referred to as a chip component) cut from a semiconductor wafer, for example, has a suction mechanism for mounting each chip component. In general, a method of mounting using a head and a method of bonding and transferring the substrate together are common.

6 and 7 show an example of a chip component transfer process using an adhesive material in a conventional mounting method.

FIG. 6A shows, for example, a state in which a wafer is attached to a dicing tape 11 and diced while being temporarily held, and individual chip components 12 are held at predetermined intervals between the chips. 1 shows a state in which the pressure-sensitive adhesive substrate 13 that is one support is arranged so as to face the surface of the pressure-sensitive adhesive 10.

Next, as shown in FIG. 6B, the chip component 12 attached to the dicing tape 11 is attached to the adhesive substrate 13. The pressure-sensitive adhesive substrate 13 may be a double-sided pressure-sensitive adhesive sheet attached to a metal block, or a block in which the pressure-sensitive adhesive is uniformly applied.

Next, as shown in FIG. 6C, an ultraviolet pulse laser 14 such as a YAG laser or an excimer laser 14 is used.
And the like, the back surface of the chip component 12 (adhesive surface to the dicing tape) is selectively irradiated to ablate the contact surface of the mounted component with the adhesive material, thereby eliminating the adhesive force of the adhesive material of the dicing tape 11. The chip component 12 at that portion is peeled off from the dicing tape 11. Then, when the dicing tape 11 is peeled off, the chip components 12 are selectively transferred onto the adhesive substrate 13 as shown in FIG.

Next, as shown in FIG. 6 (e), the transfer plate 1
5 is placed on the back surface of the chip component 12 transferred to the adhesive substrate 13, and as shown in FIG.
When the adhesive material substrate 13 side is selectively heated with a laser or the like after being adhered to the back surface of the adhesive material substrate 13, the adhesive force of the adhesive material 10 on the adhesive material substrate 13 disappears, and as shown in FIG. It can be peeled off from the adhesive substrate 13. A thermoplastic adhesive is applied to the entire surface of the transfer plate 15 or only to a portion where the chip component 12 is transferred.

Then, as shown in FIG. 7H, the chip component 12 transferred from the adhesive material substrate 13 to the transfer plate 15 is conveyed to the mounting substrate 16 while being adhered to the transfer plate 15 and mounted face down. It FIG. 7I is an enlarged cross-sectional view of a part showing a mounted state of the mounted chip component 12, but as shown in the figure, the electrode 8 (in each of the above drawings, the electrode 8 is provided on the face down of the chip component 12). (Not shown) is formed, and the electrode 8 and the electrode 17 of the mounting substrate 16 are formed.
And are connected by heat reflow of the solder bumps 9,
The other electrode side surfaces of the chip component 12 are adhered to each other by a thermoplastic adhesive material 18 provided in advance on the mounting board 16.

[0009]

As described above, the method of transferring using the adhesive material has a problem that the adhesive material 10 of the adhesive material substrate 13 adheres to the transfer plate 15 at the time of transferring the component. Further, dust on the adhesive material 10 is also transferred to the transfer plate 15.
May be transferred to.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method of transferring a component, a method of mounting the same, a transfer substrate, and a mounting structure that allow good transfer without adhesion of an adhesive material for adhesion fixing, dust and the like to the transfer plate. To provide.

[0011]

That is, according to the present invention, at the time of transferring a component adhesively fixed to a first support to a second support, the first support is coated with at least its adhesive surface. The present invention relates to a method of transferring a component (hereinafter, referred to as a transfer method of the present invention), which comprises forming a coating on the substrate and transferring the component to the second support in this state.

According to the transfer method of the present invention, since the coating is formed on the first support member to which the component is adhered and fixed so as to cover at least the surface of the adhesive material, when transferring the component to the second support member. It is possible to prevent the adhesive material of the first support and other unnecessary substances from adhering to the second support together with the components. Therefore, since unnecessary adhesive material or the like does not adhere to the adhesive surface of the second support, the positional displacement of the components transferred to the second support does not occur, and the adhesive surface of the second support is well maintained. It is possible to prevent the dripping and the decrease in the adhesiveness.

Further, according to the present invention, when the component adhesively fixed to the first support is transferred to the second support, and then the component is transferred from the second support to the mounting board for mounting,
A method for mounting a component, characterized in that a coating is formed on the first support so as to cover at least the surface of the adhesive, and the component is transferred to the second support in this state (hereinafter, referred to as the present invention. This is referred to as the mounting method of.).

According to the mounting method of the present invention, since the components are transferred based on the transfer method of the present invention described above, dust can be attached to the mounting substrate with the effects described in the transfer method of the present invention. Therefore, it is possible to provide a component mounting method capable of reliable transfer onto a mounting substrate.

Further, the present invention is a transfer substrate for temporarily fixing a component by adhesion, which has a coating film which at least partially covers the surface of the adhesive material, and the component is brought into contact with this coating film. The present invention relates to a transfer substrate of a temporarily fixed component (hereinafter, referred to as a transfer substrate of the present invention).

According to the transfer substrate of the present invention, the component is temporarily fixed in contact with the film described in the transfer method of the present invention, so that the transfer substrate capable of effectively implementing the transfer method of the present invention can be obtained. Obtainable.

Further, the present invention is a mounting structure in which the component is transferred and mounted on a mounting substrate, and the back surface and the side surface of the component are the coating film according to any one of claims 14 to 18. The mounting structure of the components covered by (below,
This is referred to as the mounting structure of the present invention. ).

According to the mounting structure of the present invention, since the back surface and the side surface of the component are covered with the film described in the transfer method of the present invention, the mounting structure having the effects described in the mounting method of the present invention can be realized. .

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below.

In the above-mentioned transfer method, mounting method, transfer substrate and mounting structure of the present invention, it is desirable to form the film by vapor deposition or sputtering. In this case, the film is formed using a light-shielding material. By doing
It is desirable to shield the back and side surfaces of the component from the viewpoint that external light can be blocked during manufacturing in the case of a photodegradable component.

Further, by forming a film using an insulating material, the parts can be insulated, which is desirable in that troubles such as a short circuit can be avoided.

Further, it is desirable that the parts can be discriminated at first glance by coloring or marking and patterning the coating.

Further, in carrying out the above-mentioned embodiment, the above-mentioned film is held by holding the above-mentioned parts in a temporary holder, transferring from this temporary holder to the above-mentioned first support, and performing a predetermined process after adhesive fixation. It is desirable that the component is transferred and mounted on the mounting substrate with the presence of.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

The features of the present embodiment are a transfer method and a mounting method for electronic parts, and a transfer substrate and a mounting structure capable of effectively realizing the method. For example, a semiconductor wafer attached to a dicing tape is diced. Since the processes other than the transfer method for mounting the individualized chip parts on the mounting substrate are the same as those described above with reference to FIGS. 6 and 7, the description of the common processes will be omitted and the same parts will be described. Use the same sign.

That is, FIG. 1A shows a state in which the chip components 12 have been selectively transferred to the adhesive substrate 13 in FIG. 6D, and the same process is performed before this.

Next, as shown in FIG. 1B, a coating film 21 is formed on the entire surface so as to cover the chip components 12 and the exposed adhesive material 10 on the adhesive material substrate 13 which is the first support. To do. The coating film 21 has a two-layer structure in which titanium (10 nm thick) and aluminum (0.5 μm thick) are formed in this order by sputtering. As a result, titanium has good adhesiveness to a chip component made of silicon, and a transfer substrate having a coating film 21 having a light-shielding structure can be realized by an aluminum film laminated thereon.

By thus providing the film 21 with a light-shielding property, when the chip component 12 is an active element, external light is blocked during manufacturing, so that photodegradation of the capacitor voltage of the active element can be prevented. it can. Also,
The material that can form the coating film 21 by sputtering is S
The chip part 12 is insulated by forming a film of an insulating material such as iO ₂ or ITO, and can prevent a short circuit and the like, and coloring the film 21 makes it possible to mark the part. It is also possible to increase and use.

Next, as shown in FIG. 1C, the transfer plate 15 as the second support is positioned above the coating film 21,
As shown in (d), the chip component 12 is bonded to the transfer plate 15. The transfer plate 15 has a thermoplastic adhesive (not shown).
Is provided, the chip component 12 covered with the coating film 21 can be bonded.

After the adhesion, the surface of the adhesive material substrate 13 to which the chip component 12 is adhered is irradiated with, for example, a laser from the back surface (lower surface in the figure) of the adhesive material substrate 13 to obtain the chip component 12.
Since the adhesive force of the adhesive material 10 of the adhesive material substrate 13 is reduced by selectively heating the portion where the adhesive sheet exists, the transfer plate 15
Is separated from the adhesive material substrate 13. As a result,
As shown in (e), the film 2 other than the chip component 12 region
1 is left on the adhesive substrate 13 and the back surface 12 of the chip component 12
a and the coating film 21 existing on the side surface 12b thereof are attached to the chip component 12 as well as the transfer plate 15 together with the chip component 12.
Is transcribed to.

As described above, in this embodiment, the chip component 12 is mounted on the adhesive substrate 13,
It is characterized in that sputtering or vapor deposition is performed as it is, and a thin film is coated. By this method, since unnecessary adhesive material and dust are not attached from the adhesive material substrate 13 to the transfer plate 15, the displacement of the chip component 12 to be transferred, etc. It is possible to alleviate the above problem, and since the adhesive or the like does not adhere to the transfer plate 15, the problem of dust and the subsequent mounting process are not affected.

Next, as shown in FIG. 2 (f), the transfer plate 1
5, the chip component 12 is conveyed in a state where it is transferred to the mounting substrate 16, and the solder bump is heated and reflowed at a predetermined position on the mounting substrate 16 so that the chip component 12 is connected, and then the transfer plate 15 is heated. By separating as shown in FIG. 2 (g), the face-down mounting is completed, and the characteristic mounting structure of the present embodiment is realized.

FIG. 2 (h) shows the mounting end state (see FIG. 2).
It is a partial expanded sectional view of (g)), and shows chip part 12 formed as an active element. Note that FIG.
Also in each of the chip components 12 illustrated in FIG.
Although the electrode 8 and the like as shown in (h) are formed, they are omitted in the drawings before FIG. 2 (g).

As described above, this embodiment can be applied to the manufacturing process of active elements. As shown in FIG. 2 (h), the active element is a chip component composed of a transistor 5 and a capacitor 6 formed on a Si (silicon) substrate, but when exposed to light, the voltage of the capacitor 6 is released. It tends to be deteriorated by light. Therefore, a structure for shielding the back surface 12a and the side surface 12b of the element is required. Therefore, by applying this process to the active element, it becomes possible to form the light shielding thin film on the back surface 12a and the side surface 12b of the active element by vapor deposition or sputtering of aluminum or the like.

FIG. 2H shows a mounting state of the chip component 12 as an active element. That is, an insulating layer is provided on the transistor 5 and the capacitor 6 formed on the device on the wafer, and the transistor 5 and the capacitor 6 are connected to the respective electrodes 8 by the plated wiring 7 embedded in the through hole formed therein. The chip component 12 thus formed is in a face-down mounted state. In the same manner as shown in FIG. 7I, the electrode 8 of the chip component 12 is connected to the electrode 17 of the mounting board 16 by heating reflow of the solder bump 9.

An electrode 17 is formed at a predetermined position on the mounting board 16, and a thermoplastic adhesive 18 is provided in a region other than the electrode 17 so as to surround the electrode 17 with a predetermined gap from the electrode 17. The chip part 12 and the coating 2
1 is a thermoplastic adhesive 18 at the same time as heating the solder bumps.
And is bonded to the mounting substrate 16.

The coating 21 may be removed after mounting. The purpose of forming the coating film 21 is to mount the chip component 1 on the transfer plate 15.
At the time of transfer of No. 2, it is intended to prevent the adhesive material and dust from adhering to the transfer plate 15 from the adhesive material substrate 13. Therefore, even if the adhesive material is removed after mounting, it does not hinder the driving of the element. .

Further, since the mounted parts can be colored by the coating film 21 according to the present embodiment, it can be effectively used for marking parts or the like. 3 to 5 show typical examples of marking.

That is, FIG. 3 shows an example in which the mark 3 is made conspicuous by forming the notch 2 around the portion of the film 21 to be the mark 3 by using, for example, a laser.
5 is an example in which the cutout portion 2 is provided in a part of the coating film 21 to make the cutout portion 2 conspicuous. Further, FIG. 5 shows that the mark 3 is removed by removing the coating film 21 while leaving only the mark 3. This is a prominent example.

Therefore, by preliminarily coloring the coating film 21, the mark 3 and the cutout portion 2 can be made more conspicuous, and the kind of parts and the like can be easily identified.

According to the present embodiment, the chip component 12 and the exposed adhesive material 10 and dust on the adhesive material are covered when the chip component 12 is transferred to the adhesive material substrate 13 which is the first support. As described above, since the chip component 12 is transferred to the transfer plate 15 which is the second support after forming the coating film 21,
It is possible to prevent the adhesive material 10 of the adhesive material substrate 13 and the dust on the adhesive material from adhering to the transfer plate 15, whereby the adhesive force of the thermoplastic adhesive of the transfer plate 15 is not lowered and the adhesive is transferred. The chip component 12 can be transferred onto the transfer plate 15 without being displaced. Also, the film 2
It is also possible to use 1 as a marking, and by further coloring the film 21, the marking effect can be further enhanced.

The above-described embodiment can be modified based on the technical idea of the present invention.

For example, the coating film 21 of the embodiment is provided for good transfer when the chip component is mounted.
It is also possible to apply to the transfer of other parts having a transfer process, and by this, equivalent effects can be obtained.

In the embodiment, the entire surface including the chip part 12 is covered, but the surface of the adhesive material other than the chip part 12 may be coated only.

[0045]

As described above, according to the present invention, when the component is transferred to the second support, the adhesive material of the first support and other unnecessary substances adhere to the second support together with the component. Can be prevented. Therefore, since unnecessary adhesive material or the like does not adhere to the adhesive surface of the second support, the positional displacement of the components transferred to the second support does not occur, and the adhesive surface of the second support is well maintained. It is possible to prevent the dripping and the decrease in the adhesiveness.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a process from transfer to mounting of a chip component according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing another process of the same.

FIG. 3 is a schematic sectional view showing an example of marking according to the embodiment.

FIG. 4 is a schematic cross-sectional view showing another example of the marking according to the embodiment.

FIG. 5 is a schematic sectional view showing still another example of the marking according to the embodiment.

FIG. 6 is a schematic cross-sectional view showing a process from transfer to mounting of a chip component according to a conventional example.

FIG. 7 is a schematic cross-sectional view showing another process from transfer to mounting of the chip component.

[Explanation of symbols]

2 ... Notched part, 3 ... Mark, 5 ... Transistor, 6 ... Capacitor, 7 ... Plated wiring, 8, 17 ... Electrode, 9 ... Solder bump, 10 ... Adhesive material, 11 ... Dicing tape (temporary holder), 12 … Chip parts, 12a… Back, 12b…
Side surface, 13 ... Adhesive substrate (first support), 14 ... Laser light, 15 ... Transfer plate (second support), 16 ... Mounting board, 1
8 ... Thermoplastic adhesive, 21 ... Coating

Claims (20)

[Claims] 1. When a component adhesively fixed to a first support is transferred to a second support, a film is formed on the first support so as to cover at least the surface of the adhesive, and in this state, A method for transferring a component, comprising transferring the component to the second support. 2. The method for transferring a component according to claim 1, wherein the coating film is formed by vapor deposition or sputtering. 3. The method of transferring a component according to claim 1, wherein the back surface and the side surface of the component are shielded from light by the coating. 4. The insulation of the component is provided by the coating,
The method of transferring a component according to claim 1. 5. The method of transferring a component according to claim 1, wherein the component can be discriminated by coloring or marking and patterning the coating. 6. The method of transferring a component according to claim 1, wherein the component is held on a temporary holding body, transferred from the temporary holding body to the first support, and fixed by adhesion. 7. A component, which is adhesively fixed to a first support, is transferred to a second support, and thereafter, when the component is transferred from the second support to a mounting board for mounting, the first support is mounted on the first support. A method for mounting a component, characterized in that a coating is formed on at least the adhesive material surface and the component is transferred to the second support in this state. 8. The component mounting method according to claim 7, wherein the coating film is formed by vapor deposition or sputtering. 9. The component mounting method according to claim 7, wherein the back surface and the side surface of the component are shielded from light by the coating. 10. The method of mounting a component according to claim 7, wherein the coating is used to insulate the component. 11. The component mounting method according to claim 7, wherein the component can be identified by coloring or marking and patterning the coating. 12. The component mounting method according to claim 7, wherein the component is transferred and mounted on a mounting substrate while the coating film is present. 13. The component mounting method according to claim 7, wherein the component is held on a temporary holder, transferred from the temporary holder to the first support, and fixed by adhesion. 14. A transfer substrate for temporarily fixing a component by adhesion, comprising a coating film for at least partially covering the surface of the adhesive material, wherein the component is temporarily fixed in contact with this coating film. Substrate for transferring existing parts. 15. The substrate for transferring a component according to claim 14, wherein the coating film is formed by vapor deposition or sputtering. 16. The substrate for transferring a component according to claim 14, wherein the back surface and the side surface of the component are shielded by the coating film. 17. The substrate for transferring a component according to claim 14, wherein the component is insulated by the coating. 18. The substrate for transferring a component according to claim 14, wherein the component can be discriminated by coloring or marking and patterning the coating. 19. The substrate for transferring a component according to claim 14, wherein the component is transferred from a temporary holder that holds the component and is adhesively fixed. 20. A mounting structure in which the component is transferred and mounted on a mounting board, wherein a rear surface and a side surface of the component are:
A component mounting structure, which is covered with the coating according to any one of claims 14 to 18.